CN106793461A - A kind of circuit board cooling structure - Google Patents

A kind of circuit board cooling structure Download PDF

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Publication number
CN106793461A
CN106793461A CN201611206098.1A CN201611206098A CN106793461A CN 106793461 A CN106793461 A CN 106793461A CN 201611206098 A CN201611206098 A CN 201611206098A CN 106793461 A CN106793461 A CN 106793461A
Authority
CN
China
Prior art keywords
copper bar
radiating copper
circuit board
radiating
line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201611206098.1A
Other languages
Chinese (zh)
Inventor
徐文赋
任素云
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huizhou Blueway New Energy Technology Co Ltd
Original Assignee
Huizhou Blueway New Energy Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huizhou Blueway New Energy Technology Co Ltd filed Critical Huizhou Blueway New Energy Technology Co Ltd
Priority to CN201611206098.1A priority Critical patent/CN106793461A/en
Publication of CN106793461A publication Critical patent/CN106793461A/en
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB

Abstract

The present invention discloses a kind of circuit board cooling structure, including circuit board, and circuit board is provided with high current metal-oxide-semiconductor and sampling resistor, and circuit board cooling structure also includes：First radiating copper bar, the second radiating copper bar, the 3rd radiating copper bar and the 4th radiating copper bar；First radiating copper bar and the second radiating copper bar are individually fixed in high current metal-oxide-semiconductor both sides；3rd radiating copper bar and the 4th radiating copper bar are individually fixed in sampling resistor both sides；First radiating copper bar is also fixedly connected with anode line, and the second radiating copper bar is also fixedly connected with load electrode line, and the 3rd radiating copper bar is also fixedly connected with GND line, and the 4th radiating copper bar is also fixedly connected with load negative line.The present invention is to be provided with four radiating copper bars, when battery management system high current charge-discharge, electric current can be radiated by four radiating copper bars, and because the thickness of copper bar can be considerably more than circuit plate thickness, internal resistance very little, significantly enhances the radiating effect of circuit board.

Description

A kind of circuit board cooling structure
Technical field
The present invention relates to heat dissipation for circuit board field, more particularly to a kind of circuit board cooling structure.
Background technology
In accumulation energy type BMS, pcb board generally needs super-high-current, general 50-100A, not only including high current power MOS Pipe group, the current acquisition resistance of also big encapsulation, so when pcb board works, the device heating of pcb board upstream super-high-current is very Seriously, longevity of service, and pcb board can be damaged if radiating effect is bad.Existing PCB heat dissipating methods generally by The region of heating element carries out applying copper, and the heat produced when allowing electric current by pcb board conducts to Copper Foil, radiated, also The method of some radiating is by opening up louvre on pcb board, accelerating the efficiency of radiating.
However, above-mentioned radiating effect is unsatisfactory, and first, due to the finite thickness of pcb board, copper is applied on pcb board, lead The internal resistance increase of circuit board is caused, so when by high current, heating can be than more serious, and radiating effect is poor.Second, in electricity The limited amount of perforate on the plate of road, it is impossible to effectively carry out radiating work on circuit boards, reduces radiating efficiency.
The content of the invention
The purpose of the present invention is to overcome weak point of the prior art, there is provided a kind of circuit board cooling structure, the structure The radiating effect of circuit board can be improved.
The purpose of the present invention is achieved through the following technical solutions：
A kind of circuit board cooling structure, including circuit board, the circuit board are provided with high current metal-oxide-semiconductor and sampling resistor, The circuit board cooling structure also includes：First radiating copper bar, the second radiating copper bar, the 3rd radiating copper bar and the 4th radiating copper Bar；
The first radiating copper bar and the second radiating copper bar are individually fixed in the high current metal-oxide-semiconductor both sides；It is described 3rd radiating copper bar and the 4th radiating copper bar are individually fixed in the sampling resistor both sides；
It is described first radiating copper bar be also fixedly connected with anode line, it is described second radiating copper bar also with load electrode line Be fixedly connected, it is described 3rd radiating copper bar be also fixedly connected with GND line, it is described 4th radiating copper bar also with load negative pole Line is fixedly connected.
As further preferred scheme, the first radiating copper bar, the second radiating copper bar, the 3rd radiating copper Article, it is described 4th radiating copper bar screwed togather with the circuit board.
As further preferred scheme, the first radiating copper bar, the second radiating copper bar, the 3rd radiating copper Article, it is described 4th radiating copper bar offer installation through-hole.
Used as further preferred scheme, the first radiating copper bar is additionally provided with the first line end location hole, and the battery is just Polar curve wears the first line end location hole and is fixed on the first radiating copper bar by screw.
Used as further preferred scheme, the second radiating copper bar is additionally provided with the second line end location hole, and the load is just Polar curve wears the second line end location hole and is fixed on the second radiating copper bar by screw.
Used as further preferred scheme, the 3rd radiating copper bar is additionally provided with the 3rd line end location hole, and the battery is born Polar curve wears the 3rd line end location hole and is fixed on the 3rd radiating copper bar by screw.
Used as further preferred scheme, the 4th radiating copper bar is additionally provided with the 4th line end location hole, and the load is born Polar curve wears the 4th line end location hole and is fixed on the 4th radiating copper bar by screw.
As further preferred scheme, the first radiating copper bar, the second radiating copper bar, the 3rd radiating copper Article, the 4th radiating copper bar include a front copper bar and a reverse side copper bar, the front copper bar and the reverse side copper bar point The tow sides of the circuit board are not fixed on.
Used as further preferred scheme, the front copper bar and the reverse side copper bar are screwed together in the circuit board respectively Tow sides.
The present invention compared to prior art advantage and have the beneficial effect that：
1st, the present invention is a kind of circuit board cooling structure, is provided with the first radiating copper bar, the second radiating copper bar, the 3rd radiating copper Article and the 4th radiating copper bar, when battery management system high current charge-discharge, electric current can by four radiating copper bars enter Row radiating, and because the thickness of copper bar can significantly enhance circuit board considerably more than circuit plate thickness, internal resistance very little Radiating effect.
2nd, the thickness of four radiatings copper bar of the invention typically can reach 5-8mm depending on the size of outer casing space, increase The area of radiating copper bar, that is, increase area of dissipation, and radiating effect further increases；And combine dissipating for the deposited copper of traditional circuit board Thermal means, radiating effect more preferably, can solve the problems, such as that the radiating effect of high current is not good.
3rd, four radiatings copper bar of the invention is screwed on circuit board, and compact conformation installs simpler, side Just, fast；Also, anode line, GND line, load electrode line, load negative line this four great current power lines point It is not external on four radiating copper bars, without installing four hardware terminals of energy super-high-current additional on circuit boards, not only saves The space of circuit board, also causes that the installation of four great current power lines is simpler, convenient, attractive in appearance.
4th, four radiatings copper bar of the invention includes a front copper bar and a reverse side copper bar, the face of the circuit board of occupancy Product is small, but increases the area of dissipation of circuit board, further improves heat dissipation for circuit board effect.
Brief description of the drawings
Fig. 1 is the structure chart of circuit board cooling structure of the invention；
Fig. 2 is the structure chart of another angle of circuit board cooling structure of the invention；
Fig. 3 is the structure chart of the another angle of circuit board cooling structure of the invention.
Specific embodiment
For the ease of understanding the present invention, the present invention is described more fully below with reference to relevant drawings.In accompanying drawing Give better embodiment of the invention.But, the present invention can be realized in many different forms, however it is not limited to herein Described implementation method.On the contrary, the purpose for providing these implementation methods is to make to understand more the disclosure Plus it is thorough comprehensive.
It should be noted that when element is referred to as " being fixed on " another element, it can directly on another element Or can also there is element placed in the middle.When an element is considered as " connection " another element, it can be directly connected to To another element or may be simultaneously present centering elements.Term as used herein " vertical ", " level ", " left side ", For illustrative purposes only, it is unique implementation method to be not offered as " right side " and similar statement.
Unless otherwise defined, all of technologies and scientific terms used here by the article with belong to technical field of the invention The implication that technical staff is generally understood that is identical.The term for being used in the description of the invention herein is intended merely to description tool The purpose of the implementation method of body, it is not intended that in the limitation present invention.Term as used herein " and/or " include one or more The arbitrary and all of combination of related Listed Items.
Embodiment
Fig. 1 is referred to, the present invention provides a kind of circuit board cooling structure 10, including circuit board 20, set on the circuit board There are high current metal-oxide-semiconductor 21 and sampling resistor 22, the circuit board cooling structure 10 also includes：First radiating copper bar 100, second dissipates The radiating radiating copper bar 400 of copper bar 300 and the 4th of hot copper bar the 200, the 3rd.
The first radiating copper bar 100 and the second radiating copper bar 200 are individually fixed in 21 liang of the high current metal-oxide-semiconductor Side；The 3rd radiating copper bar 300 and the 4th radiating copper bar 400 are individually fixed in the both sides of the sampling resistor 22.
It is described first radiating copper bar 100 be also fixedly connected with anode line (B+), it is described second radiating copper bar 200 also with Load electrode line (P+) is fixedly connected, and the 3rd radiating copper bar 300 is also fixedly connected with GND line (B-), and the described 4th Radiating copper bar 400 is also fixedly connected with load negative line (P-).
The first radiating copper bar 100, the second radiating copper bar 200, the 3rd radiating copper bar 300, the described 4th Radiating copper bar 400 is screwed togather with the circuit board 20.Specifically, the first radiating copper bar 100, the second radiating copper bar 200th, the 3rd radiating copper bar 300, the 4th radiating copper bar 400 offer installation through-hole.On the circuit board 20 Installation screw corresponding with the installation through-hole is offered, described first is radiated by installation through-hole and installation screw with screw Copper bar 100, the second radiating copper bar 200, the 3rd radiating copper bar 300, the 4th radiating copper bar 400 are fixed on circuit On plate 20.
The first radiating copper bar 100, the second radiating copper bar 200, the 3rd radiating copper bar 300, the described 4th Radiating copper bar 400 includes a front copper bar and a reverse side copper bar, and the front copper bar and the reverse side copper bar are individually fixed in The tow sides of the circuit board 20.Specifically, the front copper bar and the reverse side copper bar are screwed together in the circuit board respectively Tow sides.
Refer to Fig. 2.The first radiating copper bar 100 includes the first front copper bar 101 and the first reverse side copper bar 102, institute State the first front copper bar and the first reverse side copper bar is individually fixed in the tow sides of the circuit board.Second radiating copper Bar 200 includes the second front copper bar and the second reverse side copper bar, and second front copper bar and the second reverse side copper bar are solid respectively Due to the tow sides of the circuit board.The 3rd radiating copper bar 300 includes the 3rd front copper bar 301 and the 3rd reverse side copper bar 302, the 3rd front copper bar and the 3rd reverse side copper bar are individually fixed in the tow sides of the circuit board.Described 4th Radiating copper bar 400 includes the 4th front copper bar and the 4th reverse side copper bar, the 4th front copper bar and the 4th reverse side copper bar It is individually fixed in the tow sides of the circuit board.
The first radiating copper bar 100 is additionally provided with the first line end location hole, and the anode line (B+) is worn by screw If the first line end location hole is fixed on the first radiating copper bar 100.The second radiating copper bar 200 is additionally provided with the second line End location hole, the load electrode line (P+) wears the second line end location hole and is fixed on second radiating copper by screw Bar 200.
The 3rd radiating copper bar 300 is additionally provided with the 3rd line end location hole, and the GND line (B-) is worn by screw If the 3rd line end location hole is fixed on the 3rd radiating copper bar 300.The 4th radiating copper bar 400 is additionally provided with the 4th line End location hole, the load negative line (P-) wears the 4th line end location hole and is fixed on the 4th radiating copper by screw Bar 400.
Refer to Fig. 3.Wherein in an implementation method, the front copper bar of the first radiating copper bar 100 is provided with " L " type The first connection sheet 110, first connection sheet 110 offers the first line end location hole, and the anode line (B+) passes through Screw wears the first line end location hole and is fixed on first connection sheet 110.The front copper of the second radiating copper bar 200 Bar is provided with second connection sheet 210 of " L " type, and second connection sheet 210 offers the second line end location hole, the load positive pole Line (P+) wears the second line end location hole and is fixed on second connection sheet 210 by screw.The 3rd radiating copper bar 300 front copper bar is provided with the 3rd connection sheet 310 of " L " type, and the 3rd connection sheet 310 offers the 3rd line end location hole, The GND line (B-) wears the 3rd line end location hole and is fixed on the 3rd connection sheet 310 by screw.It is described The front copper bar of the 4th radiating copper bar 400 is provided with the 4th connection sheet 410 of " L " type, and the 4th connection sheet 410 offers the 4th Line end location hole, the load negative line (P-) wears the 4th line end location hole and is fixed on the 4th connection by screw Piece 410.
In another embodiment, the reverse side copper bar of the first radiating copper bar 100 is provided with first connection of " L " type Piece, first connection sheet offers the first line end location hole, and the anode line (B+) wears described first by screw Line end location hole is fixed on first connection sheet.The reverse side copper bar of the second radiating copper bar 200 is provided with second company of " L " type Contact pin, second connection sheet offers the second line end location hole, and the load electrode line (P+) wears described by screw Two wire terminal location hole is fixed on second connection sheet.The reverse side copper bar of the 3rd radiating copper bar 300 is provided with the 3rd of " L " type Connection sheet, the 3rd connection sheet offers the 3rd line end location hole, and the GND line (B-) is worn described by screw 3rd line end location hole is fixed on the 3rd connection sheet.The reverse side copper bar of the 4th radiating copper bar 400 is provided with the of " L " type Four connection sheets, the 4th connection sheet offers the 4th line end location hole, and the load negative line (P-) wears institute by screw State the 4th line end location hole and be fixed on the 4th connection sheet.
These anode lines (B+), GND line (B-), load electrode line (P+), load negative line (P-) this four Great current power line is external on four radiating copper bars respectively, without installing four hardware ends of energy super-high-current additional on circuit boards Son, not only saves the space of circuit board, also causes that the installation of four great current power lines is simpler, convenient, attractive in appearance.
The above implementation method only expresses several embodiments of the invention, and its description is more specific and detailed, but Therefore the limitation to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that for the ordinary skill people of this area For member, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to of the invention Protection domain.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.

Claims (9)

1. a kind of circuit board cooling structure, including circuit board (20), the circuit board is provided with high current metal-oxide-semiconductor (21) and sampling Resistance (22), it is characterised in that the circuit board cooling structure also includes：First radiating copper bar (100), the second radiating copper bar (200), the 3rd radiating copper bar (300) and the 4th radiating copper bar (400)；
First radiating copper bar (100) and second radiating copper bar (200) are individually fixed in the high current metal-oxide-semiconductor (21) Both sides；3rd radiating copper bar (300) and the 4th radiating copper bar (400) are individually fixed in the sampling resistor (22) two Side；
It is described first radiating copper bar (100) be also fixedly connected with anode line, it is described second radiating copper bar (200) also with load Electrode line is fixedly connected, and the 3rd radiating copper bar (300) is also fixedly connected with GND line, the 4th radiating copper bar (400) also it is fixedly connected with load negative line.
2. circuit board cooling structure according to claim 1, it is characterised in that first radiating copper bar (100), described Second radiating copper bar (200), it is described 3rd radiating copper bar (300), it is described 4th radiating copper bar (400) with the circuit board spiral shell Close.
3. circuit board cooling structure according to claim 2, it is characterised in that first radiating copper bar (100), described Second radiating copper bar (200), the 3rd radiating copper bar (300), the 4th radiating copper bar (400) offer installation and lead to Hole.
4. circuit board cooling structure according to claim 3, it is characterised in that first radiating copper bar (100) also sets There is the first line end location hole, the anode line wears the first line end location hole and be fixed on described first and dissipates by screw Hot copper bar (100).
5. circuit board cooling structure according to claim 3, it is characterised in that second radiating copper bar (200) also sets There is the second line end location hole, the load electrode line wears the second line end location hole and be fixed on described second and dissipates by screw Hot copper bar (200).
6. circuit board cooling structure according to claim 3, it is characterised in that the 3rd radiating copper bar (300) also sets There is a 3rd line end location hole, the GND line wears the 3rd line end location hole and be fixed on the described 3rd and dissipates by screw Hot copper bar (300).
7. circuit board cooling structure according to claim 3, it is characterised in that the 4th radiating copper bar (400) also sets There is a 4th line end location hole, the load negative line wears the 4th line end location hole and be fixed on the described 4th and dissipates by screw Hot copper bar (400).
8. circuit board cooling structure according to claim 3, it is characterised in that first radiating copper bar (100), described Second radiating copper bar (200), the 3rd radiating copper bar (300), the 4th radiating copper bar (400) include a front copper bar With a reverse side copper bar, the front copper bar and the reverse side copper bar are individually fixed in the tow sides of the circuit board.
9. circuit board cooling structure according to claim 8, it is characterised in that the front copper bar and the reverse side copper bar The tow sides of the circuit board are screwed together in respectively.
CN201611206098.1A 2016-12-23 2016-12-23 A kind of circuit board cooling structure Withdrawn CN106793461A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201611206098.1A CN106793461A (en) 2016-12-23 2016-12-23 A kind of circuit board cooling structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201611206098.1A CN106793461A (en) 2016-12-23 2016-12-23 A kind of circuit board cooling structure

Publications (1)

Publication Number Publication Date
CN106793461A true CN106793461A (en) 2017-05-31

Family

ID=58919383

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201611206098.1A Withdrawn CN106793461A (en) 2016-12-23 2016-12-23 A kind of circuit board cooling structure

Country Status (1)

Country Link
CN (1) CN106793461A (en)

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Application publication date: 20170531