CN106785824B - 一种高效率全固态铥激光封装模块 - Google Patents
一种高效率全固态铥激光封装模块 Download PDFInfo
- Publication number
- CN106785824B CN106785824B CN201611167571.XA CN201611167571A CN106785824B CN 106785824 B CN106785824 B CN 106785824B CN 201611167571 A CN201611167571 A CN 201611167571A CN 106785824 B CN106785824 B CN 106785824B
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- Prior art keywords
- heat
- laser
- heat sink
- crystal
- solid state
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910052775 Thulium Inorganic materials 0.000 title claims abstract description 30
- FRNOGLGSGLTDKL-UHFFFAOYSA-N thulium atom Chemical compound [Tm] FRNOGLGSGLTDKL-UHFFFAOYSA-N 0.000 title claims abstract description 28
- 239000007787 solid Substances 0.000 title claims abstract description 19
- 239000013078 crystal Substances 0.000 claims abstract description 54
- 238000001816 cooling Methods 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims abstract description 9
- 238000005057 refrigeration Methods 0.000 claims abstract description 7
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 3
- 229920005830 Polyurethane Foam Polymers 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 claims description 2
- 239000004033 plastic Substances 0.000 claims description 2
- 229920003023 plastic Polymers 0.000 claims description 2
- 239000011496 polyurethane foam Substances 0.000 claims description 2
- 230000005494 condensation Effects 0.000 abstract description 11
- 238000009833 condensation Methods 0.000 abstract description 11
- 238000005086 pumping Methods 0.000 abstract description 8
- 230000008646 thermal stress Effects 0.000 abstract description 3
- 238000010521 absorption reaction Methods 0.000 abstract description 2
- 235000012149 noodles Nutrition 0.000 abstract 1
- 229910019655 synthetic inorganic crystalline material Inorganic materials 0.000 description 21
- 230000035882 stress Effects 0.000 description 11
- 230000006378 damage Effects 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000446 fuel Substances 0.000 description 2
- 125000005842 heteroatom Chemical group 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009414 blockwork Methods 0.000 description 1
- 230000009172 bursting Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 230000002277 temperature effect Effects 0.000 description 1
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/0405—Conductive cooling, e.g. by heat sinks or thermo-electric elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/042—Arrangements for thermal management for solid state lasers
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Lasers (AREA)
Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201611167571.XA CN106785824B (zh) | 2016-12-16 | 2016-12-16 | 一种高效率全固态铥激光封装模块 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201611167571.XA CN106785824B (zh) | 2016-12-16 | 2016-12-16 | 一种高效率全固态铥激光封装模块 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106785824A CN106785824A (zh) | 2017-05-31 |
CN106785824B true CN106785824B (zh) | 2019-01-04 |
Family
ID=58893147
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201611167571.XA Active CN106785824B (zh) | 2016-12-16 | 2016-12-16 | 一种高效率全固态铥激光封装模块 |
Country Status (1)
Country | Link |
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CN (1) | CN106785824B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109144137A (zh) * | 2018-07-27 | 2019-01-04 | 北京量子体系科技股份有限公司 | 一种温度控制装置及激光器 |
CN112103757A (zh) * | 2020-09-01 | 2020-12-18 | 西安电子科技大学 | 一种固体激光块材料的模块化热管理装置及其控制方法 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6144484A (en) * | 1998-05-01 | 2000-11-07 | Light Solutions Corporation | CW laser amplifier |
CN1845399A (zh) * | 2006-05-17 | 2006-10-11 | 中国科学院上海光学精密机械研究所 | 减小热容激光介质热应力的方法 |
CN201008073Y (zh) * | 2006-12-13 | 2008-01-16 | 中国科学院上海光学精密机械研究所 | 倍频晶体温度梯度补偿法控温装置 |
CN101252248A (zh) * | 2007-11-30 | 2008-08-27 | 西安电子科技大学 | 二极管泵浦固体激光器中晶体热管热沉制冷方法 |
WO2010058315A1 (en) * | 2008-11-18 | 2010-05-27 | Laserwave S.R.L. | A secondary laser source and a laser device |
CN102790346A (zh) * | 2012-07-17 | 2012-11-21 | 湖北工业大学 | 一种ld泵浦高功率铥激光模块 |
CN104852265A (zh) * | 2015-06-10 | 2015-08-19 | 湖北工业大学 | 一种高效率钬激光器 |
CN204989714U (zh) * | 2015-09-23 | 2016-01-20 | 中国工程物理研究院应用电子学研究所 | 一种半导体控温片状晶体和频器 |
-
2016
- 2016-12-16 CN CN201611167571.XA patent/CN106785824B/zh active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6144484A (en) * | 1998-05-01 | 2000-11-07 | Light Solutions Corporation | CW laser amplifier |
CN1845399A (zh) * | 2006-05-17 | 2006-10-11 | 中国科学院上海光学精密机械研究所 | 减小热容激光介质热应力的方法 |
CN201008073Y (zh) * | 2006-12-13 | 2008-01-16 | 中国科学院上海光学精密机械研究所 | 倍频晶体温度梯度补偿法控温装置 |
CN101252248A (zh) * | 2007-11-30 | 2008-08-27 | 西安电子科技大学 | 二极管泵浦固体激光器中晶体热管热沉制冷方法 |
WO2010058315A1 (en) * | 2008-11-18 | 2010-05-27 | Laserwave S.R.L. | A secondary laser source and a laser device |
CN102790346A (zh) * | 2012-07-17 | 2012-11-21 | 湖北工业大学 | 一种ld泵浦高功率铥激光模块 |
CN104852265A (zh) * | 2015-06-10 | 2015-08-19 | 湖北工业大学 | 一种高效率钬激光器 |
CN204989714U (zh) * | 2015-09-23 | 2016-01-20 | 中国工程物理研究院应用电子学研究所 | 一种半导体控温片状晶体和频器 |
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CN106785824A (zh) | 2017-05-31 |
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Effective date of registration: 20201009 Address after: Room 501, industrial building, Xinte Optoelectronic Industrial Park, No. 18, liufangyuan South Road, Donghu New Technology Development Zone, Wuhan, Hubei Province Patentee after: WUHAN LEIJIAN TECHNOLOGY Co.,Ltd. Address before: 430068 Wuhan Province, Wuchang District, South Lake, Lee Ka pier village, No. 1, No. 1, No. Patentee before: HUBEI University OF TECHNOLOGY |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A high-efficiency solid-state thulium laser packaging module Effective date of registration: 20231227 Granted publication date: 20190104 Pledgee: Industrial Bank Limited by Share Ltd. Wuhan branch Pledgor: WUHAN LEIJIAN TECHNOLOGY Co.,Ltd. Registration number: Y2023980074639 |