CN106784374A - A kind of resistant to elevated temperatures microcavity OLED screen body and its production technology - Google Patents
A kind of resistant to elevated temperatures microcavity OLED screen body and its production technology Download PDFInfo
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- CN106784374A CN106784374A CN201611225310.9A CN201611225310A CN106784374A CN 106784374 A CN106784374 A CN 106784374A CN 201611225310 A CN201611225310 A CN 201611225310A CN 106784374 A CN106784374 A CN 106784374A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/856—Arrangements for extracting light from the devices comprising reflective means
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/87—Arrangements for heating or cooling
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/302—Details of OLEDs of OLED structures
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Electroluminescent Light Sources (AREA)
Abstract
The invention provides a kind of resistant to elevated temperatures microcavity OLED screen body and its production technology, the screen body includes substrate and is sequentially connected anode, luminescent layer, negative electrode and the cap of setting thereon, also include the metal level being located between anode and substrate, the metal level has the part for extending cap.OLED screen body of the present invention extends outside cap by by its metal layer part, and so this partial metal layers just in open environment to be conducive to radiating in time, the radiating effect of body is shielded so as to enhance after packaging is accomplished.OLED screen body of the present invention further by setting the metal level of high reflectance between anode and substrate, thus can form micro-cavity structure between anode and cathode, and the microcavity effect possessed using micro-cavity structure can effectively lift screen body efficiency.Production technology of the present invention is easy, workable, is suitable to large-scale production.
Description
Technical field
The invention belongs to field of organic electroluminescence, and in particular to a kind of resistant to elevated temperatures microcavity OLED screen body and its production work
Skill.
Background technology
Organic electroluminescence device (English full name is Organic Light Emitting Device, referred to as OLED)
As lighting engineering of future generation, there is face luminous, low heat emission, low energy consumption, light, thin.Importantly, China shines every year
Bright power consumption is about 600,000,000,000 degree, accounts for the 12% of national year electricity, 5.98 hundred million tons of carbon dioxide of annual illumination discharge.According to
OLED illuminations replace existing illumination, every year can 400,000,000,000 degree of using electricity wisely, 3.99 hundred million tons of CO2 emission of reduction thus has
Important application value.
However, because OLED material therefor is generally organic material, its to the pollutant in air, oxygen and steam all
It is very sensitive, easily corroded by water oxygen, therefore requirement of the OLED to encapsulation performance is very high.Existing OLED encapsulation technologies are usual
It is packaged using cap, that is to say the interior cap with drier in device substrate upper cover, recycling fluid sealant will
Substrate is sealed with cap.It is incomplete existing that opto-electronic conversion often occurs in use in OLED after completion encapsulation
As, cause part energy to be changed into heat, damage will be produced to OLED if heat can not shed in time, enter
And influence the service life of device.Therefore, prior art proposes that heat dissipating layer can be set inside encapsulating structure to weaken heat
Damage to OLED, but because heat dissipating layer is located in encapsulating structure, cause its radiating effect unsatisfactory.Further, since
There are various modes in the light radiation of OLED, cause the light extraction efficiency of device relatively low, further as restriction OLED
The bottleneck of development.
The content of the invention
The technical problems to be solved by the invention be overcome the screen body efficiency existing for existing OLED screen body it is low, radiating
The problem of effect difference, and then provide a kind of screen body light extraction efficiency high and high temperature resistant microcavity OLED screen body of good heat dissipation effect and its life
Production. art.
Therefore, the present invention realizes that the technical scheme of above-mentioned purpose is：
A kind of resistant to elevated temperatures microcavity OLED screen body, including substrate and anode, luminescent layer, the negative electrode of setting are sequentially connected thereon
And cap, also including metal level, the metal level is located between the anode and the substrate, the metal level have prolong
Stretch out the part of the cap.
Preferably, the thermal conductivity factor of the metal level is not less than 100W/ (mK).
Further, the reflectivity of the metal level is more than 85%.
Preferably, the metal level extends the partially surrounding in the surrounding of the cap of the cap.
Preferably, the thickness of the metal level is 1nm-100nm.
Preferably, the material of the metal level is gold, silver, copper or aluminium.
It is highly preferred that the part that the metal level extends the cap has nonplanar structure.
Preferably, the nonplanar structure includes some lug bosses and/or depressed part.
Preferably, the nonplanar structure is waveform curved surface.
A kind of production technology of resistant to elevated temperatures microcavity OLED screen body, comprises the following steps：
S1, a substrate is provided, on the substrate forming metal layer, anode, luminescent layer and negative electrode successively, the anode,
The area of luminescent layer and negative electrode is respectively less than the area of the metal level；
Cap is pressed with the substrate under S2, vacuum condition so that the complete position of the anode, luminescent layer and negative electrode
In the inside of the cap, the metal level is not located in the cap entirely；
S3, the metal level being pointed to outside the cap are surface-treated to form nonplanar structure.
Preferably, the surface treatment is carried out by the way of wet etching or dry etching in step S3.
Above-mentioned technical proposal of the invention has the following advantages that：
1st, resistant to elevated temperatures microcavity OLED screen body of the present invention, including substrate and be sequentially connected thereon setting anode,
Luminescent layer, negative electrode and cap, also including the metal level being located between anode and substrate, the metal level have extend encapsulation
The part of lid.Metal level in OLED screen body of the present invention have part extend cap, so after packaging is accomplished this
Partial metal layers shield the radiating effect of body so as to enhance just in open environment to be conducive to radiating in time so that this
The described OLED screen body of invention has resistant to elevated temperatures advantage.
2nd, resistant to elevated temperatures microcavity OLED screen body of the present invention, 100W/ (mK) is not less than by using thermal conductivity factor
Metal be made metal level, be conducive to further improving radiating effect.
3rd, resistant to elevated temperatures microcavity OLED screen body of the present invention, is existed by setting reflectivity between anode and substrate
More than 85% metal level, thus can form micro-cavity structure between anode and cathode, and the microcavity effect possessed using micro-cavity structure is (i.e.
Luminous intensity increase, emission peak spectrum narrow) can effectively lift screen body efficiency so that and OLED screen body of the present invention has
Light efficiency advantage high.
4th, resistant to elevated temperatures microcavity OLED screen body of the present invention, is 1nm-100nm by the thickness for limiting metal level,
Also its radiating effect can be lifted while ensuring metal level high reflectance.
5th, resistant to elevated temperatures microcavity OLED screen body of the present invention, by by be located at cap outside metal level be set to it is non-
Planar structure to increase its area of dissipation, so as to play more preferable thermolysis.
6th, the production technology of resistant to elevated temperatures microcavity OLED screen body of the present invention, by the forming metal successively on substrate
Layer and the anode smaller than metal level area, luminescent layer and negative electrode, then under vacuum press cap and substrate, and really
Guarantor's anode, luminescent layer and negative electrode are fully located in cap and metal level is not located in cap entirely, and envelope is finally pointed to again
Metal level outside capping apply stratification treatment to form nonplanar structure.Production technology of the invention is using coating after first encapsulating
Change the mode for the treatment of, can at one stroke realize the metal level non-flattening outside metal level planarization and the cap in cap.Therefore,
Production technology of the invention is easy, workable, is suitable to large-scale production.
Brief description of the drawings
In order to illustrate more clearly of the technical scheme in the specific embodiment of the invention, specific embodiment will be retouched below
The accompanying drawing to be used needed for stating is briefly described, it should be apparent that, drawings in the following description are some realities of the invention
Mode is applied, for those of ordinary skill in the art, on the premise of not paying creative work, can also be attached according to these
Figure obtains other accompanying drawings.
Fig. 1 is the sectional view of the resistant to elevated temperatures microcavity OLED screen body that the embodiment of the present invention 1 is provided；
Fig. 2 is the top view of Fig. 1；
Fig. 3 is the sectional view of the resistant to elevated temperatures microcavity OLED screen body that the embodiment of the present invention 3 is provided；
Wherein reference is as follows：
1- substrates；2- caps；3- anodes；4- luminescent layers；5- negative electrodes；6- metal levels；7- electron injecting layers；8- electronics is passed
Defeated layer；9- hole transmission layers；10- hole injection layers.
Specific embodiment
Technical scheme is clearly and completely described below in conjunction with accompanying drawing, it is clear that described implementation
Example is a part of embodiment of the invention, rather than whole embodiments.Based on the embodiment in the present invention, ordinary skill
The every other embodiment that personnel are obtained under the premise of creative work is not made, belongs to the scope of protection of the invention.
As long as additionally, technical characteristic involved in invention described below different embodiments does not constitute conflict just each other
Can be combined with each other.
Embodiment 1
As shown in figure 1, the resistant to elevated temperatures microcavity OLED screen body that the present embodiment is provided includes：
Substrate 1 and anode 3, luminescent layer 4, negative electrode 5 and the cap 2 of setting are sequentially connected thereon；
Thickness is located between the anode 3 and the substrate 1 for the metal level 6 of 1nm, and metal level 6 has and extends
The part of cap 2；Fig. 2 is referred to, metal level 6 extends the part of cap 2 and is only located at cap 2 in the present embodiment
Side, metal level 6 is made up of metallic aluminium.
Embodiment 2
As shown in figure 3, the resistant to elevated temperatures microcavity OLED screen body that the present embodiment is provided includes：
Substrate 1 and anode 3, hole injection layer 10, hole transmission layer 9, the luminescent layer 4, electronics of setting are sequentially connected thereon
Transport layer 8, electron injecting layer 7, negative electrode 5 and cap 2；
Thickness is located between the anode 3 and the substrate 1 for the metal level 6 of 10nm, and the metal level 6 has extension
Go out the part of cap 2, this partial metal layers is surrounded on the surrounding of the cap and with nonplanar structure.
In the present embodiment, metal level 6 is that 98.8%, thermal conductivity factor is 429W/ (m into, its reflectivity by metallic silver
K), the part that metal level 6 extends cap 2 is waveform curved surface.
Thus OLED screen body described in the present embodiment may be used by the metal level of the setting high reflectance between anode and substrate
Micro-cavity structure is formed between anode and cathode, so that the microcavity effect (luminous intensity increase, the emission peak light that possess using micro-cavity structure
Spectrum narrows) can effectively lift screen body efficiency；And the metal level in the OLED screen body of the present embodiment extends the part of cap
It is surrounded on the surrounding of cap and with waveform curved surface, so this partial metal layers is just exposed to open loop after packaging is accomplished
To be conducive to radiating in time in border, so as to enhance the radiating effect of screen body.
The present embodiment additionally provides a kind of technique for producing above-mentioned resistant to elevated temperatures microcavity OLED screen body, comprises the following steps：
S1, a substrate 1 is provided, forming metal layer 6, anode 3, luminescent layer 4 and negative electrode 5 successively on the substrate 1 are described
The area of anode 3, luminescent layer 4 and negative electrode 5 is respectively less than the area of the metal level 6；
S2, vacuum be 1 × 10-3Cap 2 is pressed with the substrate 1 under conditions of Pa so that the anode 3,
Luminescent layer 4 and negative electrode 5 are fully located at the inside of the cap 2 and the metal level 6 is not located in the cap 2 entirely；
S3, the metal level 6 being pointed to outside the cap 2 by the way of dry etching are surface-treated, from
And form the nonplanar structure with waveform curved surface.
Above-mentioned production technology can at one stroke realize the metal in cap by way of use is first encapsulated and applies stratification treatment afterwards
Metal level non-flattening outside layer planarization and cap.
Obviously, above-described embodiment is only intended to clearly illustrate example, and not to the restriction of implementation method.It is right
For those of ordinary skill in the art, can also make on the basis of the above description other multi-forms change or
Change.There is no need and unable to be exhaustive to all of implementation method.And the obvious change thus extended out or
Among changing still in the protection domain of the invention.
Claims (10)
1. a kind of resistant to elevated temperatures microcavity OLED screen body, including substrate (1) and anode (3), the luminescent layer of setting are sequentially connected thereon
(4), negative electrode (5) and cap (2), it is characterised in that：
Also include metal level (6), the metal level (6) is located between the anode (3) and the substrate (1), the metal
Layer (6) is with the part for extending the cap (2).
2. resistant to elevated temperatures microcavity OLED screen body according to claim 1, it is characterised in that the heat conduction of the metal level (6)
Coefficient is not less than 100W/ (mK).
3. resistant to elevated temperatures microcavity OLED screen body according to claim 1 and 2, it is characterised in that the metal level (6) it is anti-
Rate is penetrated more than 85%.
4. the resistant to elevated temperatures microcavity OLED screen body according to claim any one of 1-3, it is characterised in that the metal level
(6) the partially surrounding in the surrounding of the cap (2) of the cap (2) is extended.
5. the resistant to elevated temperatures microcavity OLED screen body according to claim any one of 1-4, it is characterised in that the metal level
(6) thickness is 1nm-100nm.
6. the resistant to elevated temperatures microcavity OLED screen body according to claim any one of 1-5, it is characterised in that the metal level
(6) material is gold, silver, copper or aluminium.
7. the resistant to elevated temperatures microcavity OLED screen body according to claim any one of 1-6, it is characterised in that the metal level
(6) part for extending the cap (2) has nonplanar structure.
8. resistant to elevated temperatures microcavity OLED screen body according to claim 7, it is characterised in that if the nonplanar structure includes
Dry lug boss and/or depressed part.
9. the resistant to elevated temperatures microcavity OLED screen body according to claim 7 or 8, it is characterised in that the nonplanar structure is
Waveform curved surface.
10. a kind of production technology of the resistant to elevated temperatures microcavity OLED screen body described in any one of claim 7-9, including following step
Suddenly：
S1, a substrate (1) is provided, forming metal layer (6), anode (3), luminescent layer (4) and negative electrode successively on the substrate (1)
(5), the area of the anode (3), luminescent layer (4) and negative electrode (5) is respectively less than the area of the metal level (6)；
Cap (2) is pressed with the substrate (1) under S2, vacuum condition so that the anode (3), luminescent layer (4) and negative electrode
(5) be fully located at the cap (2) inside and the metal level (6) entirely be located at the cap (2) in；
S3, it is pointed to the cap (2) metal level (6) outward and is surface-treated to form nonplanar structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611225310.9A CN106784374A (en) | 2016-12-27 | 2016-12-27 | A kind of resistant to elevated temperatures microcavity OLED screen body and its production technology |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611225310.9A CN106784374A (en) | 2016-12-27 | 2016-12-27 | A kind of resistant to elevated temperatures microcavity OLED screen body and its production technology |
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| CN106784374A true CN106784374A (en) | 2017-05-31 |
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| CN201611225310.9A Pending CN106784374A (en) | 2016-12-27 | 2016-12-27 | A kind of resistant to elevated temperatures microcavity OLED screen body and its production technology |
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| JP2002063985A (en) * | 2000-08-22 | 2002-02-28 | Nec Corp | Organic electroluminescence element |
| US20080211402A1 (en) * | 2007-03-02 | 2008-09-04 | Decook Bradley C | Flat panel oled device having deformable substrate |
| CN101763777A (en) * | 2008-12-22 | 2010-06-30 | 乐金显示有限公司 | Organic electroluminescent display device including heat-radiating means |
| CN101982012A (en) * | 2008-03-31 | 2011-02-23 | 住友化学株式会社 | Organic electroluminescent device |
| CN102714281A (en) * | 2009-11-05 | 2012-10-03 | 韩国科学技术院 | Black organic light emitting diode device |
| CN104659038A (en) * | 2015-03-13 | 2015-05-27 | 京东方科技集团股份有限公司 | Display backboard, method for manufacturing the display backboard, and display device |
| CN103367623B (en) * | 2013-07-18 | 2015-10-28 | 深圳市华星光电技术有限公司 | Luminescent device and preparation method thereof |
-
2016
- 2016-12-27 CN CN201611225310.9A patent/CN106784374A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002063985A (en) * | 2000-08-22 | 2002-02-28 | Nec Corp | Organic electroluminescence element |
| US20080211402A1 (en) * | 2007-03-02 | 2008-09-04 | Decook Bradley C | Flat panel oled device having deformable substrate |
| CN101982012A (en) * | 2008-03-31 | 2011-02-23 | 住友化学株式会社 | Organic electroluminescent device |
| CN101763777A (en) * | 2008-12-22 | 2010-06-30 | 乐金显示有限公司 | Organic electroluminescent display device including heat-radiating means |
| CN102714281A (en) * | 2009-11-05 | 2012-10-03 | 韩国科学技术院 | Black organic light emitting diode device |
| CN103367623B (en) * | 2013-07-18 | 2015-10-28 | 深圳市华星光电技术有限公司 | Luminescent device and preparation method thereof |
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