CN106784368B - A kind of display panel package structure, display device and production method - Google Patents
A kind of display panel package structure, display device and production method Download PDFInfo
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- CN106784368B CN106784368B CN201611206395.6A CN201611206395A CN106784368B CN 106784368 B CN106784368 B CN 106784368B CN 201611206395 A CN201611206395 A CN 201611206395A CN 106784368 B CN106784368 B CN 106784368B
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- display panel
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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Abstract
It includes: to make display panel on a substrate that the present invention, which discloses a kind of display panel package structure, display device and production method, the production method, around one bank layer with chamfering shaped opening of display panel production；The first inorganic water oxygen barrier layer is deposited on the display panel and bank layer using ALD technique；Organic buffer layer is deposited on the described first inorganic water oxygen barrier layer using pecvd process；The second inorganic water oxygen barrier layer is deposited on organic buffer layer using ALD technique, the second inorganic water oxygen barrier layer is connected at chamfering shaped opening with the first inorganic water oxygen barrier layer exposed.Bank layer of the present invention by production one with chamfering shaped opening, utilize the step coverage that the good step coverage of ALD technique and PECVD are poor, under conditions of same size exposure mask, organic buffer layer in thin-film packing structure is sealed in inside two layers of inorganic water oxygen barrier layer by realization, to simplify manufacture craft, reduce costs.
Description
Technical field
The present invention relates to field of display technology more particularly to a kind of display panel package structures, display device and production side
Method.
Background technique
In the present age of information-intensive society, the importance of the display as visual information transmission medium is being further strengthened, and is
Leading position will be occupied in future, and display is just towards lighter, thinner, more low energy consumption, more inexpensive and more preferable picture quality
Trend development.
Organic electroluminescent LED (OLED) due to it with self-luminous, reaction is fast, visual angle is wide, brightness is high, frivolous etc.
Advantage, market potential prospect are had an optimistic view of by industry.Most probably development is next-generation display technology.
But OLED device water, oxygen are more sensitive, the infiltration of water oxygen is very big to the aging effects of device, it is therefore desirable into
The stringent encapsulation of row.More the encapsulation technology in forward position is thin-film package at present, mutual by inorganic encapsulated layer and organic buffer layer
Superposition forms packaging film, and water oxygen is penetrated into from the side of the organic buffer layer of stacked package film in order to prevent, the nothing on upper layer
Machine encapsulated layer needs to cover the organic buffer layer and lower layer's inorganic encapsulated layer of lower layer, therefore needs difference when production thin-film encapsulation layer
The exposure mask (mask) of size switches to realize covering of the topmost thin film to lower film, increases process time and cost of manufacture.
Therefore, the existing technology needs to be improved and developed.
Summary of the invention
In view of above-mentioned deficiencies of the prior art, the purpose of the present invention is to provide a kind of display panel package structures, display
Device and production method, it is intended to solve to need various sizes of exposure mask switching to realize when making thin-film encapsulation layer in the prior art
Covering of the topmost thin film to lower film, the problem of increasing process time and cost of manufacture.
Technical scheme is as follows:
A kind of production method of display panel package structure, comprising steps of
A, display panel is made on a substrate, around one dykes and dams with chamfering shaped opening of display panel production
Layer, wherein the chamfering shaped opening surround the display panel, and exposes the substrate of lower end at the chamfering shaped opening；
B, the first inorganic water oxygen resistance is deposited on the display panel and the bank layer using atom layer deposition process
Barrier, the first inorganic water oxygen barrier layer keep chamfering shape at the chamfering shaped opening；
C, using plasma enhancing chemical vapor deposition method deposits organic on the described first inorganic water oxygen barrier layer
Buffer layer exposes the first inorganic water oxygen barrier layer at the chamfering shaped opening；
D, the second inorganic water oxygen barrier layer is deposited on the organic buffer layer using atom layer deposition process, described second
Inorganic water oxygen barrier layer is connected at chamfering shaped opening with the described first inorganic water oxygen barrier layer of exposing.
The production method of the display panel package structure, wherein the material packet on the first inorganic water oxygen barrier layer
Include Al2O3、SiO2。
The production method of the display panel package structure, wherein the material of the organic buffer layer includes organosilicon.
The production method of the display panel package structure, wherein the material packet on the second inorganic water oxygen barrier layer
Include Al2O3、SiO2。
The production method of the display panel package structure, wherein the display panel be OLED display panel or
QLED display panel.
The production method of the display panel package structure, wherein the first inorganic water oxygen barrier layer with a thickness of
100~500nm。
The production method of the display panel package structure, wherein the organic buffer layer with a thickness of 500 ~
3000nm。
The production method of the display panel package structure, wherein the second inorganic water oxygen barrier layer with a thickness of
100~500nm。
A kind of display panel package structure, using the production method of the display panel package structure as described in any of the above item
Production obtains.
A kind of display device, including display panel package structure as described above.
The utility model has the advantages that the present invention is by utilizing around one bank layer with chamfering shaped opening of display panel production
The good step coverage of ALD technique and the poor step coverage of PECVD are realized under conditions of same size exposure mask
Organic buffer layer in thin-film packing structure is sealed in inside two layers of inorganic water oxygen barrier layer, to simplify relevant production
Technique reduces costs.
Detailed description of the invention
Fig. 1 is that the invention shows the flow charts of the production method of panel encapsulating structure.
Fig. 2 is the overall schematic of display panel package structure of the present invention.
Fig. 3 is the partial structural diagram in Fig. 2 at A.
Fig. 4 is the structural schematic diagram of the bank layer of the present invention with chamfering shaped opening.
Fig. 5 is the structural schematic diagram on the of the present invention first inorganic water oxygen barrier layer.
Fig. 6 is the structural schematic diagram of organic buffer layer of the present invention.
Specific embodiment
The present invention provides a kind of display panel package structure, display device and production method, to make the purpose of the present invention, skill
Art scheme and effect are clearer, clear, and the present invention is described in more detail below.It should be appreciated that tool described herein
Body embodiment is only used to explain the present invention, is not intended to limit the present invention.
The present invention provides a kind of production methods of display panel package structure, as shown in Figure 1, itself comprising steps of
S1, display panel is made on a substrate, around one dykes and dams with chamfering shaped opening of display panel production
Layer, wherein the chamfering shaped opening surround the display panel, and exposes the substrate of lower end at the chamfering shaped opening；
S2, to deposit first on the display panel and the bank layer using ald (ALD) technique inorganic
Water oxygen barrier layer, the first inorganic water oxygen barrier layer keep chamfering shape at the chamfering shaped opening；
S3, using plasma enhancing chemical vapor deposition (PECVD) technique are on the described first inorganic water oxygen barrier layer
Organic buffer layer is deposited, the first inorganic water oxygen barrier layer is exposed at the chamfering shaped opening；
S4, the second inorganic water oxygen barrier layer, institute are deposited on the organic buffer layer using ald (ALD) technique
The second inorganic water oxygen barrier layer is stated to be connected at chamfering shaped opening with the described first inorganic water oxygen barrier layer of exposing.
The present invention is good using ALD technique by having the bank layer of chamfering shaped opening around display panel production one
The poor step coverage of good step coverage and PECVD, under conditions of same size exposure mask (mask), realization will be thin
Organic buffer layer in film encapsulating structure is sealed in inside two layers of inorganic water oxygen barrier layer, to simplify relevant production work
Skill reduces costs.
Further, in the present embodiment, the material on the described first inorganic water oxygen barrier layer includes but is not limited to Al2O3、
SiO2.Using the described in ALD process deposits first inorganic water oxygen barrier layer, due to the good step coverage of ALD, the first inorganic water
Dykes and dams (Dam) layer that chamfering shape can be completely covered in oxygen barrier layers is open and keeps original chamfering shape.
Further, in the present embodiment, the material of the organic buffer layer includes but is not limited to organosilicon.Using
Pecvd process deposits the organic buffer layer, and due to the step coverage that PECVD is poor, organic buffer layer can not be completely covered
The chamfering shaped opening of bank layer exposes the first inorganic water oxygen barrier layer.
Further, in the present embodiment, the material on the described second inorganic water oxygen barrier layer includes but is not limited to Al2O3、
SiO2.Using the described in ALD process deposits second inorganic water oxygen barrier layer, due to the good step coverage of ALD, the second inorganic water
Oxygen barrier layers can be completely covered the chamfering shaped opening of bank layer, and with the first inorganic water for not there is the machine buffer layer to cover
Oxygen barrier layers are connected, so that organic buffer layer is entirely sealed in inorganic water oxygen barrier layer.
Further, in the present embodiment, the described first inorganic water oxygen barrier layer and the second inorganic water oxygen barrier layer
With a thickness of 100 ~ 500nm, and the organic buffer layer with a thickness of 500 ~ 3000nm.
Further, in the present embodiment, the display panel is OLED display panel or QLED(quantum dot light emitting two
Pole pipe) display panel.
Further, in the present embodiment, the material of the bank layer can be prepared using photoresist, because of photoresist material
Material is easy to graphical, and preferred bank layer is prepared using negativity photoresist.
Based on the production method of above-described display panel package structure, the embodiment of the invention also provides a kind of displays
Panel encapsulating structure, the production method for using above-described display panel package structure make to obtain.
Specifically, using the prepared display panel encapsulation knot of production method of display panel package structure described above
Structure, as shown in Figure 2 comprising substrate 1, display panel (display unit) 2 and thin-film packing structure (encapsulation unit) 3；Wherein, institute
Stating substrate includes display area and non-display area；The display panel 2 is arranged on the display area.
Further, as shown in Figures 3 to 6, film (TFE) encapsulating structure of the present invention includes trilamellar membrane layer: first
Inorganic water oxygen barrier layer 31, organic buffer layer 32 and the second inorganic water oxygen barrier layer 33.Ring is provided on the non-display area
Around the display area display panel 2() bank layer 4；The chamfering shaped opening around display panel 2 is provided on the bank layer 4
41, and at chamfering shaped opening 41 expose lower end substrate；The first inorganic covering of water oxygen barrier layer 31 is arranged described
On bank layer 4 and shown panel 2, and chamfering shape is kept at the chamfering shaped opening 41；The organic buffer layer 32 covers
Lid is arranged on the described first inorganic water oxygen barrier layer 31, and exposes the first inorganic water oxygen at chamfering shaped opening 41 and stop
Layer 31；The second inorganic covering of water oxygen barrier layer 33 is arranged on the organic buffer layer 32, and in chamfering shaped opening
It is connected at 41 with the first inorganic water oxygen barrier layer 31 exposed.
The present invention in the encapsulation region production for being located at non-display area by, around the chamfering shape bank layer of viewing area, then adopting
With the inorganic water oxygen barrier layer of ALD process deposits, pecvd process deposits organic buffer layer, due to the good step coverage of ALD,
PECVD poor step coverage, after having deposited three layers of packaging film, two layers of inorganic water oxygen barrier layer is connected with each other, will in
Between organic buffer layer be entirely sealed in inorganic water oxygen barrier layer, prevent edge water oxygen from penetrating into film from organic buffer layer
Inside encapsulated layer, organic buffer layer is sealed in inside inorganic water oxygen barrier layer to realize to make of same size exposure mask
Thin-film packing structure.
The present invention also provides a kind of display devices comprising above-described display panel package structure.
In conclusion the present invention passes through the dykes and dams in the encapsulation region production chamfering shape for being located at display panel non-display area
Layer, using the step coverage that the good step coverage of ALD technique and PECVD are poor, in the condition of same size exposure mask
Organic buffer layer in thin-film packing structure is sealed in inside two layers of inorganic water oxygen barrier layer by lower realization, to simplify correlation
Manufacture craft.
It should be understood that the application of the present invention is not limited to the above for those of ordinary skills can
With improvement or transformation based on the above description, all these modifications and variations all should belong to the guarantor of appended claims of the present invention
Protect range.
Claims (10)
1. a kind of production method of display panel package structure, which is characterized in that comprising steps of
A, display panel is made on a substrate, and there is the bank layer of chamfering shaped opening around display panel production one,
In, the chamfering shaped opening surround the display panel, and exposes the substrate of lower end at the chamfering shaped opening；
B, the first inorganic water oxygen barrier layer is deposited on the display panel and the bank layer using atom layer deposition process,
The first inorganic water oxygen barrier layer keeps chamfering shape at the chamfering shaped opening；
C, using plasma enhancing chemical vapor deposition method deposits organic buffer on the described first inorganic water oxygen barrier layer
Layer exposes the first inorganic water oxygen barrier layer at the chamfering shaped opening；
D, the second inorganic water oxygen barrier layer is deposited on the organic buffer layer using atom layer deposition process, described second is inorganic
Water oxygen barrier layer is connected at chamfering shaped opening with the described first inorganic water oxygen barrier layer of exposing.
2. the production method of display panel package structure according to claim 1, which is characterized in that the first inorganic water
The material of oxygen barrier layers includes Al2O3And/or SiO2。
3. the production method of display panel package structure according to claim 1, which is characterized in that the organic buffer layer
Material include organosilicon.
4. the production method of display panel package structure according to claim 1, which is characterized in that the second inorganic water
The material of oxygen barrier layers includes Al2O3And/or SiO2。
5. the production method of display panel package structure according to claim 1, which is characterized in that the display panel is
OLED display panel or QLED display panel.
6. the production method of display panel package structure according to claim 1, which is characterized in that the first inorganic water
Oxygen barrier layers with a thickness of 100 ~ 500nm.
7. the production method of display panel package structure according to claim 1, which is characterized in that the organic buffer layer
With a thickness of 500 ~ 3000nm.
8. the production method of display panel package structure according to claim 1, which is characterized in that the second inorganic water
Oxygen barrier layers with a thickness of 100 ~ 500nm.
9. a kind of display panel package structure, which is characterized in that using such as the described in any item display panel envelopes of claim 1 ~ 8
The production method of assembling structure makes to obtain.
10. a kind of display device, which is characterized in that including display panel package structure as claimed in claim 9.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201611206395.6A CN106784368B (en) | 2016-12-23 | 2016-12-23 | A kind of display panel package structure, display device and production method |
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| CN201611206395.6A CN106784368B (en) | 2016-12-23 | 2016-12-23 | A kind of display panel package structure, display device and production method |
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| CN106784368B true CN106784368B (en) | 2019-07-09 |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107546336A (en) * | 2017-08-16 | 2018-01-05 | 武汉华星光电半导体显示技术有限公司 | A kind of OLED thin-film packages mask plate |
| KR101976832B1 (en) | 2017-11-06 | 2019-05-10 | 엘지디스플레이 주식회사 | Display Device |
| CN110085133A (en) | 2018-01-26 | 2019-08-02 | 京东方科技集团股份有限公司 | Display base plate and preparation method thereof, display panel and display device |
| CN109065749A (en) * | 2018-07-23 | 2018-12-21 | 武汉华星光电半导体显示技术有限公司 | OLED display |
| CN109560112B (en) * | 2018-11-30 | 2022-03-01 | 云谷（固安）科技有限公司 | Display panel, display device and display panel preparation method |
| US11937446B2 (en) | 2019-10-21 | 2024-03-19 | Boe Technology Group Co., Ltd. | Display panel and manufacture method thereof, and display apparatus |
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