CN106783929A - Display panel and display device - Google Patents
Display panel and display device Download PDFInfo
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- CN106783929A CN106783929A CN201611243193.9A CN201611243193A CN106783929A CN 106783929 A CN106783929 A CN 106783929A CN 201611243193 A CN201611243193 A CN 201611243193A CN 106783929 A CN106783929 A CN 106783929A
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- display panel
- display
- test lead
- inorganic layer
- test
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- 230000003068 static effect Effects 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 9
- 230000001681 protective effect Effects 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- 230000011218 segmentation Effects 0.000 claims description 6
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 5
- 229920005591 polysilicon Polymers 0.000 claims description 5
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- 238000007641 inkjet printing Methods 0.000 claims description 3
- UMVBXBACMIOFDO-UHFFFAOYSA-N [N].[Si] Chemical compound [N].[Si] UMVBXBACMIOFDO-UHFFFAOYSA-N 0.000 claims 1
- 238000003698 laser cutting Methods 0.000 abstract description 11
- 239000000758 substrate Substances 0.000 abstract description 6
- 239000000126 substance Substances 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 9
- 239000004020 conductor Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000012528 membrane Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 238000013467 fragmentation Methods 0.000 description 3
- 238000006062 fragmentation reaction Methods 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000002271 resection Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention provides a display panel and display equipment. The display panel includes: a flexible substrate including a display region and a non-display region; in the non-display area, a plurality of test points and a plurality of test leads electrically connected with the test points are also included; the inorganic layer is positioned on one side of the test lead, which is far away from the flexible substrate, and covers the display area and the non-display area; in the non-display region, the inorganic layer includes a plurality of first grooves; the first retaining wall part is arranged between two adjacent first grooves; wherein, have at least one said first retaining wall portion between two adjacent test leads. According to the display panel and the display device provided by the invention, the plurality of the retaining wall parts are formed between the adjacent test leads in a groove digging mode on the inorganic film, and the retaining wall parts effectively block conductive substances sputtered between the test leads during laser cutting, so that the problem of short circuit of the test leads in the display panel is avoided.
Description
Technical field
The present invention relates to display field, more particularly to a kind of display panel, display device.
Background technology
Accumulation of static electricity and release are to cause one of principal element of device destruction in semiconductor applications.In existing display surface
In board manufacturing process, in order to effectively intercept or conduct static, it is to avoid device typically can all add ESD by electrostatic breakdown
The antistatic capacity that (Electro-Static discharge, Electro-static Driven Comb) protection circuit comes in reinforcing glass processing procedure.It is quiet
Electric protection circuit includes the static protective unit for conduct static, will be included with methods such as laser cuttings again after manufacture terminates
The Partial Resection of static protective unit.Therefore, the reasonability of electrostatic discharge protection circuit design has decided on whether preferably to intercept
Or conduct static.
During laser cutting, inorganic film easily produces fragmentation and is spread to viewing area and cause display bad,
Therefore typically grooving treatment can be carried out in the cutting corresponding region of organic film.Figure 1A illustrates a kind of display of the prior art
The basic structure of panel, wherein, display panel 10 has viewing area 101 and non-display area 102, electrostatic discharge protection circuit 103
In the non-display area 102.Figure 1B illustrates a kind of concrete structure of electrostatic discharge protection circuit of the prior art.Display
Panel includes multiple test points 1001 and a plurality of test lead M1, M2 ..., Mn, each test point respectively with a test lead electricity
Connection.Inoranic membrane 1002 is formed at side of the test lead away from the flexible base board.Inoranic membrane 1002 by grooving at
Manage and form groove 1003, the shape of groove 1003 can be rectangle.Display panel also includes cut zone 1004, cut-off rule
1005 are located in cut zone 1004.Groove 1003 be used for separate covering viewing area inorganic layer and cut zone it is inorganic
Layer.After the static protective unit is using terminating, the cut zone is separated with the flexible base board along the cut-off rule.
However, in laser cutting, substrate can discharge a large amount of gases due to high temperature so that the conductive material in substrate is splashed to
On neighbouring flexible base board, the test lead short circuit on display panel is caused, influence display effect.
The content of the invention
In view of this, the present invention provides a kind of display panel, display device, exists in the prior art for eliminating or mitigating
Above mentioned problem.
To achieve the above object, the invention provides a kind of display panel, it is characterised in that including：Flexible base board, it is described
Flexible base board includes viewing area and non-display area；In the non-display area, also including multiple test points and with the survey
The a plurality of test lead of pilot electrical connection；Inorganic layer, the inorganic layer is located at the test lead away from the flexible base board
Side, the inorganic layer covers the viewing area and the non-display area；In the non-display area, the inorganic layer bag
Include multiple first grooves；And it is arranged at the first barricade portion between two adjacent first grooves；Wherein, two it is adjacent described
There is the first barricade portion described at least one between test lead.
Further, the display panel also includes cut zone in the non-display area, and the cut zone also sets
There is cut-off rule, the cut-off rule intersects with test lead every described, after cut zone is using terminating, will along the cut-off rule
The cut zone is separated with the flexible base board.Optionally, the cut-off rule is line segmentation line or curve segmentation line.
Further, the cut zone also includes static protective unit, and a plurality of test lead is electrically connected to described
Static protective unit.
Further, the display panel also includes low-temperature polysilicon film transistor, and the test lead is low with described
The semiconductor layer of warm polycrystalline SiTFT is set with layer.
Further, the inorganic layer also includes at least one second grooves, and second groove is used to separate described showing
Show the inorganic layer in region and the inorganic layer of the non-display area.
Further, on the direction of the flexible base board, the thickness in the first barricade portion for 0.5 micron-
20 microns, including endpoint value.
Further, the non-display area also includes multiple second barricade portions, and the second barricade portion has " u "-shaped figure
Case, the " u "-shaped pattern includes two components parallel to the test lead, wherein, the same " u "-shaped pattern
Two components be located at its corresponding test lead both sides.
Further, vertical range of the component away from its corresponding test lead is 0.5 micron -5 microns,
Including endpoint value.
Further, the described first and/or second barricade portion is made up of silicon nitride material or silica material.
Further, portion of the second barricade portion is formed by InkJet printing processes.
Present invention also offers a kind of display device, including any of the above-described kind of display panel.
Display panel, display device that the present invention is provided, by way of the grooving on inoranic membrane, draw in adjacent test
Multiple barricade portions are formd between line, the barricade portion effectively blocks leading between being splashed to test lead in laser cutting
Isoelectric substance, it is to avoid the problem of test lead short circuit in display panel.
Brief description of the drawings
In order to allow present disclosure to become apparent, the detailed description of Examples below and accompanying drawing is refer to：
Figure 1A is a kind of basic structure of display panel of the prior art；
Figure 1B is a kind of concrete structure of electrostatic discharge protection circuit of the prior art；
Fig. 2 is a kind of concrete structure schematic diagram of the one embodiment for the display panel provided according to the application；
Fig. 3 is sectional view of Fig. 2 embodiments at cut-off rule A-A ' places；
Fig. 4 is a kind of concrete structure schematic diagram of another embodiment of the display panel provided according to the application；
Fig. 5 is sectional view of Fig. 4 embodiments at cut-off rule A-A ' places；
Fig. 6 is a kind of concrete structure schematic diagram of the further embodiment of the display panel provided according to the application；
Sectional view of Fig. 7 Fig. 6 embodiments at cut-off rule A-A ' places；
Fig. 8 is that a kind of concrete structure of another embodiment of the display panel provided according to the application the application is illustrated
Figure；
Fig. 9 is sectional view of Fig. 8 embodiments at cut-off rule A-A ' places；
Figure 10 is a kind of schematic diagram of the display device provided according to the application.
Specific embodiment
It is understandable to enable the above objects, features and advantages of the present invention to become apparent, below in conjunction with accompanying drawing and implementation
The present invention will be further described for example.
, it is necessary to set a plurality of test lead and electrostatic protection apparatus on a display panel in the manufacturing process of display panel
To strengthen the antistatic capacity in manufacturing process, electrostatic test circuit is cut with the method for laser cutting again after manufacture terminates
Remove.But, during laser cutting, inoranic membrane produces fragmentation and is spread to viewing area and cause display bad.Therefore, one
As can carry out grooving treatment in the cutting corresponding region of inorganic film.However, in laser cutting, substrate can be released due to high temperature
Release a large amount of gases so that the conductive material in substrate is splashed on neighbouring flexible base board, causes the survey on display panel
Examination lead short circuit, influences display effect.Display panel and its manufacture method, display device that the present invention is provided, by inorganic
Grooving treatment is carried out on layer, barricade portion is formd between two adjacent test leads, it is to avoid tested in display panel and drawn
The problem of line short circuit.
To achieve the above object, a kind of display panel that the present invention is provided includes flexible base board, multiple test points, a plurality of survey
Examination lead and inorganic layer.Wherein, flexible base board includes viewing area and non-display area, multiple test points and a plurality of test lead
Positioned at non-display area.Inorganic layer is formed at side of the test lead away from flexible base board, and cover the viewing area and
The non-display area.Inorganic layer includes multiple first grooves and the first barricade being arranged between two adjacent first grooves
Portion.There are at least one first barricade portions between two adjacent test leads.It should be noted that illustrating in the following description
Detail is in order to fully understanding the present invention.But the present invention can be come with various different from other manner described here
Implement, those skilled in the art can do similar popularization in the case of without prejudice to intension of the present invention.Therefore the present invention is not received down
The limitation of specific embodiment disclosed in face.
Fig. 2 is refer to, it illustrates a kind of concrete structure of the one embodiment for the display panel provided according to the application
Schematic diagram.The display panel that the present embodiment is provided includes flexible base board (not shown), multiple test points 1031, a plurality of test
Lead M1, M2 ..., Mn and inorganic layer 1032.Wherein, flexible base board include viewing area and non-display area, multiple test points with
A plurality of test lead is located at non-display area, and each test point is electrically connected with a test lead respectively.Inorganic layer is located at
The test lead and covers viewing area and non-display area away from the side of the flexible base board.Inorganic layer includes many
Individual first groove and the first barricade portion being arranged between two adjacent grooves.Have extremely between two adjacent test leads
A few first barricade portion.Specifically, the groove on inoranic membrane includes first barricade portion N1, N2 ..., Nn, each first barricade portion
Between two adjacent test leads.For example, having a first barricade N2, test lead between test lead M1 and M2
There is a first barricade N3, by that analogy between M2 and M3.It should be noted that in first test lead M1 near display
The side of face plate edge, can have the first groove N1；Display panel edge is close in a test lead Mn of most end
Side, can have the first groove N (n+1).
Further, display panel also includes cut zone 1034 in the non-display area, and cut zone 1034 also sets
There is cut-off rule 1035, cut-off rule 1035 intersects with every test lead, after cut zone is using terminating, will along cut-off rule 1035
Cut zone 1034 is separated with flexible base board.Optionally, the cut-off rule is line segmentation line or curve segmentation line.
Further, cut zone also includes static protective unit 1037, and a plurality of test lead passes through the phase of short bar 1036
Static protective unit 1037 is connected to after mutual short circuit.
Further, display panel can be organic electroluminescence display panel, including low-temperature polysilicon film transistor, test
Lead is set with the semiconductor layer of low-temperature polysilicon film transistor with layer.
Please continue to refer to Fig. 2, inorganic layer also includes second groove 1033, and second groove is used for viewing area
The inorganic layer of inorganic layer and non-display area is separated, it is to avoid in cutting, the fragmentation of inorganic layer diffuses to viewing area.Each
Second groove is connected with the first groove and forms the inorganic layer groove of comb teeth-shaped.Fig. 3 shows Fig. 2 embodiments in cut-off rule A-A '
The sectional view at place.Inorganic layer includes multiple first barricade portion L0, L1, L2 ..., Ln, and each first barricade portion is completely covered a survey
Examination lead, for example, the first barricade portion L1 coverage test leads M1, the first barricade portion L2 coverage test lead M2, by that analogy.Need
It is noted that can have the first barricade portion L0 near the side at display panel edge in first test lead M1；Most
The side at the close display panel edge of one test lead Mn at end, can have the first barricade portion L (n+1), first gear
Wall portion L0 and L (n+1) do not cover any test lead.
Further, on the direction of display panel, the thickness of inoranic membrane is the thickness in the first barricade portion,
In the present embodiment, it is preferred that the thickness in the first barricade portion is 0.5 micron -20 microns, including endpoint value.
In the present embodiment, by setting the first barricade portion on test lead, effectively block in laser cutting
It is splashed to the conductive materials between test lead, it is to avoid the problem of test lead short circuit in display panel.First barricade portion
Thickness is thicker, and the scope of coverage test lead is bigger, stops that the effect of conductive materials is better.
In other alternative embodiments, the first groove on inorganic layer can have different shapes and position.Please join
Fig. 4 is examined, it illustrates a kind of concrete structure schematic diagram of another embodiment of the display panel provided according to the application.With figure
The something in common of 2 embodiments will not be repeated here, and difference is that inoranic membrane includes first groove N1, N2 ..., N2n, first
Groove is located at every both sides of test lead.For example, the both sides of test lead M1 have the first groove N1 and N2, test lead M
Both sides have the first groove N3 and N4, by that analogy.Each first groove is not connected with the second groove, and each is first recessed
Groove is not connected mutually.Fig. 5 is refer to, it shows the sectional view at cut-off rule A-A ' places according to Fig. 4 embodiments.Inorganic layer includes many
Individual first barricade portion L0, L1, L2 ..., Ln, have a first barricade portion between two adjacent test leads, for example, test
There is the first barricade portion L1 between lead M1 and M2, there is the first barricade portion L2, by that analogy between test lead M2 and M3.Need
It is noted that in the present embodiment, because inorganic layer is formed at side of the test lead away from flexible base board, therefore inorganic layer
At least partly cover its corresponding test lead.
Further, the first barricade portion can be made up of silicon nitride material or silica material.In the present embodiment, it is inorganic
Layer includes being covered in the part of test lead M1, M2 ..., Mn, the inorganic layer being made of silicon nitride material or silica material every
While exhausted conductive materials, corrosion or infringement of the external environment condition (such as aqueous vapor) to test lead are effectively prevented.
It will be understood by those skilled in the art that the first groove on inorganic layer can have different shapes and position.Only
Want the first groove that the first barricade portion is formed between adjacent test lead, it is possible to eliminate or mitigate in laser cutting process
In, conductive materials cause the short-circuit problem of display panel between being splashed to adjacent test lead.Therefore, the present embodiment does not limit
The shape of one groove and position.Those skilled in the art were it is also to be understood that the second groove and the first groove can both connect or can
Not connect, it is also possible to which two kinds of mode of communicating are while and deposit.
In other alternative embodiments, non-display area is additionally may included in the second barricade portion formed on inorganic layer.
Fig. 6 is refer to, it illustrates a kind of concrete structure of the further embodiment of the display panel provided according to the application the application
Schematic diagram.Something in common with Fig. 2 embodiments will not be repeated here, and difference is that inorganic layer is also inorganic including being formed at
The second barricade portion on film, the second barricade portion has " U " pattern P 1, P2...., Pn, and every test lead corresponds to one respectively
The second barricade of " u "-shaped portion.In the present embodiment, the opening of " U " pattern is towards the edge of display panel, and each pattern P 1,
P2...., Pn is not connected mutually.Refer to Fig. 7, it illustrates according to Fig. 6 embodiments cut-off rule A-A ' places sectional view.Phase
There is a second barricade portion, each second barricade portion has a barricade pattern respectively between two adjacent test leads.
Further, the distance of the second barricade portion distance test lead can change.Specifically, please continue to refer to Fig. 7,
In display panel plane, " u "-shaped pattern includes two components parallel to test lead.Wherein, same " u "-shaped pattern
Two components be located at its corresponding test lead both sides.
Further, vertical range of the component away from its corresponding test lead can change for d according to demand.At this
In embodiment, it is preferred that the numerical value of d is 0.5 micron -5 microns, including endpoint value.Further, the second barricade portion can be by spraying
Black printing technology is formed.InkJet printing processes advantageously reduce the manufacturing cost of display panel.
In the present embodiment, the second barricade portion being formed on inorganic layer separates adjacent test lead, effectively
The conductive materials being splashed in laser cutting process between adjacent test lead are avoided or alleviated, display is effectively prevented
The problem of test lead short circuit on panel.
It will be understood by those skilled in the art that the shape in the second barricade portion can be the pattern of other public domains.Second
The design in barricade portion directly affects the effect for stopping conductive materials, the thickness phase in the shape in the second barricade portion and the second barricade portion
Mutual matching design, reaches best blocking effect.Therefore, the present embodiment does not limit the shape in the second barricade portion, specifically, not limiting
Make the vertical range size of the edge far from test lead center in the second barricade portion.
In other alternative embodiments, test lead also includes the part of bending.Fig. 8 is refer to, it illustrates basis
A kind of concrete structure schematic diagram of another embodiment of display panel that the application the application is provided.With the phase of Fig. 2 embodiments
Be will not be repeated here with part, difference is that the test lead positioned at the first groove includes the part of bending.Refer to figure
9, it shows the sectional view at cut-off rule A-A ' places according to Fig. 8 embodiments.Something in common with Fig. 3 embodiments is no longer gone to live in the household of one's in-laws on getting married herein
State, difference is, when grooving treatment is carried out to inorganic layer, the inorganic layer of the covering on test lead also to be dug in the lump
Fall.
It will be understood by those skilled in the art that the bending part that test lead includes may be located at test lead extending direction
On any one position.The width of the first groove can be with different on inorganic layer, it is also possible to which part is identical.Therefore, at this
The width of the first groove on inorganic layer is not limited in embodiment, position and the concrete form of test lead bending are not limited yet.This
Art personnel are it is also to be understood that the inorganic layer covered on test lead is more, it is to avoid short circuit between adjacent test lead
Effect is better.Therefore, the inorganic layer form covered on test lead is not limited in the present embodiment.
Present invention also offers a kind of display device, including the display panel described by any of the above-described embodiment.Refer to
Figure 10, it illustrates a kind of schematic diagram of the display device provided according to the application.Display device signified in the present embodiment
Including but not limited to intelligent watch, mobile phone, panel computer, TV etc..Display device includes display panel 10, and display panel 10 can
Think the display panel described by any of the above-described embodiment.
Above content is to combine specific preferred embodiment further description made for the present invention, it is impossible to assert
Specific implementation of the invention is confined to these explanations.For general technical staff of the technical field of the invention,
On the premise of not departing from present inventive concept, some simple deduction or replace can also be made, should be all considered as belonging to of the invention
Protection domain.
Claims (12)
1. a kind of display panel, it is characterised in that including：
Flexible base board, the flexible base board includes viewing area and non-display area；
In the non-display area, a plurality of test lead for also being electrically connected including multiple test points and with the test point；
Inorganic layer, the inorganic layer is located at side of the test lead away from the flexible base board, and the inorganic layer covers institute
State viewing area and the non-display area；
In the non-display area, the inorganic layer includes multiple first grooves；And be arranged at two adjacent first grooves it
Between the first barricade portion；
Wherein, there is the first barricade portion described at least one between two adjacent test leads.
2. display panel as claimed in claim 1, it is characterised in that the display panel also includes in the non-display area
Cut zone, the cut zone is additionally provided with cut-off rule, and the cut-off rule intersects with test lead every described, in cut zone
After terminating, the cut zone is separated with the flexible base board along the cut-off rule.
3. display panel as claimed in claim 2, it is characterised in that the cut-off rule is line segmentation line or curve segmentation
Line.
4. display panel as claimed in claim 2, it is characterised in that the cut zone also includes static protective unit, many
Test lead described in bar is electrically connected to the static protective unit.
5. display panel as claimed in claim 1, it is characterised in that the display panel also includes that low-temperature polysilicon film is brilliant
Body pipe, the test lead is set with the semiconductor layer of the low-temperature polysilicon film transistor with layer.
6. display panel as claimed in claim 1, it is characterised in that the inorganic layer also includes at least one second grooves,
Second groove is used to separate the inorganic layer of the viewing area and the inorganic layer of the non-display area.
7. display panel as claimed in claim 1, it is characterised in that on the direction of the flexible base board, it is described
The thickness in the first barricade portion is 0.5 micron -20 microns, including endpoint value.
8. display panel as claimed in claim 1, it is characterised in that the non-display area also includes multiple second barricades
Portion, the second barricade portion has " u "-shaped pattern, and the " u "-shaped pattern includes two branches parallel to the test lead
Part, wherein, two components of the same " u "-shaped pattern are located at the two of its corresponding test lead
Side.
9. display panel as claimed in claim 8, it is characterised in that the component is away from its corresponding test lead
Vertical range be 0.5 micron -5 microns, including endpoint value.
10. display panel as claimed in claim 1, it is characterised in that the first barricade portion and/or the second barricade portion are by nitrogen
Silicon nitride material or silica material are made.
11. display panels as claimed in claim 1, it is characterised in that the second barricade portion is formed by InkJet printing processes.
12. a kind of display devices, it is characterised in that including the display panel as described in claim 1-11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611243193.9A CN106783929B (en) | 2016-12-29 | 2016-12-29 | Display panel and display device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611243193.9A CN106783929B (en) | 2016-12-29 | 2016-12-29 | Display panel and display device |
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| CN106783929A true CN106783929A (en) | 2017-05-31 |
| CN106783929B CN106783929B (en) | 2020-08-11 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109671746A (en) * | 2018-12-11 | 2019-04-23 | 武汉华星光电半导体显示技术有限公司 | Organic LED display panel and display device |
| CN110085552A (en) * | 2019-04-15 | 2019-08-02 | 厦门天马微电子有限公司 | A kind of production method of display panel, display device and display panel |
| WO2020103292A1 (en) * | 2018-11-22 | 2020-05-28 | 武汉华星光电技术有限公司 | Liquid crystal display apparatus |
| WO2020124743A1 (en) * | 2018-12-18 | 2020-06-25 | 武汉华星光电半导体显示技术有限公司 | Display panel and manufacturing method therefor |
| CN112634759A (en) * | 2020-12-22 | 2021-04-09 | 昆山国显光电有限公司 | Display panel, display panel preparation method and display device |
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| CN101681997A (en) * | 2008-02-28 | 2010-03-24 | 松下电器产业株式会社 | Organic el display panel |
| US20160172623A1 (en) * | 2014-12-15 | 2016-06-16 | Lg Display Co., Ltd. | Flexible display device having support layer with rounded edge |
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