CN106783462A

CN106783462A - The front and rear aniso- silver of arc gates the active display that the spot ring that interlocks interconnects side cathode construction

Info

Publication number: CN106783462A
Application number: CN201710000912.2A
Authority: CN
Inventors: 李玉魁
Original assignee: Jinling Institute of Technology
Current assignee: Fuyang zhanqianli Intellectual Property Operation Co., Ltd
Priority date: 2017-01-03
Filing date: 2017-01-03
Publication date: 2017-05-31
Anticipated expiration: 2037-01-03
Also published as: CN106783462B

Abstract

Interconnect the active display of side cathode construction the present invention relates to a kind of aniso- silver gate of the front and rear arc spot ring that interlocks, including closed from above glass cover-plate, under close the vacuum chamber that glass cover-plate and clear glass frame are constituted；In the upper phosphor powder layer for closing the anode expansion silver film and preparation that there is anodic oxide bottom membrane to be connected with anodic oxide bottom membrane on glass cover-plate on anodic oxide bottom membrane；Being closed under has the aniso- silver gate of front and rear arc staggeredly spot ring interconnection side cathode construction on glass cover-plate；Getter and rectangular wall subsidiary component in vacuum chamber.Have the advantages that luminous gray scale performance-adjustable is good, luminosity is high, the response time is short, anode working current is big.

Description

Staggeredly spot ring interconnects the luminous aobvious of side cathode construction to the front and rear aniso- silver gate of arc Show device

Technical field

The invention belongs to display technology field, photoelectron science and technology field, nanometer science and technology field, integrated electricity The field that intersects of road science and technology field, microelectronics science and technology field and vacuum science and technical field, relates to And to the making of plane Flied emission active display, and in particular to the plane Flied emission active display of carbon nanotube cathod Make, be related specifically to a kind of showing for the aniso- silver-colored active display for gating the spot ring interconnection side cathode construction that interlocks of front and rear arc Show that device makes and its manufacture craft.

Background technology

CNT is a kind of semi-conducting material with particular feature, can be made into field emission light-emitting display Cold cathode.For principle, a large amount of electronics that CNT is launched are the sources to form field emission light-emitting display currents；Just For manufacture craft, the introducing of screen printing technique, the carbon nanotube cathod for making large area has become to be easy to；Just launch For environment, the inside airtight vacuum of field emission light-emitting display so that what CNT can not be affected enters Row field-electron emission.In the field emission light-emitting display of three-stage structure, anode, negative electrode and addition have been primarily present at the two Between gate pole.Because the distance between gate pole and negative electrode are close, so gate work voltage is very low.However, in three-stage structure Active display in, also some problems have to be solved.For example, first, the launching electronics problem of CNT.Carbon nanotube layer Area very little, causes to carry out electron emission simultaneously without sufficient amount of CNT；More seriously, many CNTs Sustained damage due to the influence of subsequent manufacturing processes, or electron emission, or the electronics that can launch cannot be carried out at all Quantity is little.Meanwhile, the operation such as making, treatment of carbon nanotube layer is all interactional.Actually using which kind of manufacture craft, Using which kind of making apparatus, these problems are required for conscientiously exploring.Second, gate structure and make problem.When being applied with voltage After, gate pole is very small in the electric-field intensity that CNT layer surface is formed, and not reaching carbon nanotube layer carries out an electronics hair The lowest electric field strength requirement penetrated, such active display can not be used normally.This and actually use which kind of gate pole knot Structure is closely related.Certainly, gate structure can not be excessively complicated, the manufacture difficulty of active display can be significantly greatly increased like that, more Active display can be reduced is fabricated to power.Although can make very thin exhausted on the basis of silk-screen printing technique is combined Insulation sex chromosome mosaicism between edge layer, but gate pole-carbon nanotube cathod annoyings research staff always, because gate pole-carbon nanometer Electrical break down situation often occurs between tube cathode；Once occurring, the permanent damage of active display is necessarily caused.This and absolutely Performance, gate pole manufacture craft of edge material etc. have relation.In addition, in the manufacturing process of active display, it is impossible to used Many, expensive making apparatus, can increase considerably the manufacturing cost of active display like that, do not reach and practical substantially Ask.For the above-mentioned problem for referring to, it is necessary to grope and research and develop.

The content of the invention

Goal of the invention：In order to overcome defect present in prior art and deficiency, the present invention provides a kind of luminous gray scale can Regulation performance is good, luminosity is high, the response time is short, anode working current is big with the aniso- silver gate of front and rear arc Staggeredly the display of the active display of spot ring interconnection side cathode construction makes and its manufacture craft.

Technical scheme：The spot ring in order to solve the above technical problems, the aniso- silver gate of front and rear arc that the present invention is provided interlocks Interconnect side cathode construction active display, including closed from above glass cover-plate, under close glass cover-plate and clear glass frame institute The vacuum chamber of composition；In the upper sun for closing and thering is anodic oxide bottom membrane to be connected with anodic oxide bottom membrane on glass cover-plate Launch the phosphor powder layer of silver film and preparation on anodic oxide bottom membrane in pole；Closed under before and after having on glass cover-plate Staggeredly spot ring interconnects side cathode construction to the aniso- silver gate of arc；Getter and rectangular wall subsidiary component in vacuum chamber.

The interlock backing material of spot ring interconnection side cathode construction of the aniso- silver gate of described front and rear arc is glass, can be with Be soda-lime glass, Pyrex, that is, under close glass cover-plate；Under close the insulation paste layer shape of printing on glass cover-plate Into the thin layer that hides；The silver slurry layer of the thin printing hidden on layer forms negative electrode and launches silver film；Negative electrode launches the printing on silver film Insulation paste layer formed negative electrode spot ring underlying layers；Negative electrode spot ring underlying layers are positive eight prismatic table shape, under negative electrode spot ring underlying layers Surface is eight prismatic planes, launches on silver film positioned at negative electrode, the upper surface of negative electrode spot ring underlying layers for eight prismatic planes and and The lower surface of negative electrode spot ring underlying layers is parallel to each other, and negative electrode spot ring underlying layers central vertical axis close glass cover under Plate, the lower surface of negative electrode spot ring underlying layers is centrally located in negative electrode spot ring underlying layers central vertical axis, negative electrode spot ring underlying layers Upper surface be centrally located in negative electrode spot ring underlying layers central vertical axis, the lateral surface of negative electrode spot ring underlying layers is upright rib Cylinder face, the circular diameter of the height less than negative electrode spot ring underlying layers lower surface circumcircle of negative electrode spot ring underlying layers；Under negative electrode spot ring The silver slurry layer that there is printing in delthyrium, delthyrium in layer forms negative electrode lower floor continuity layer；Negative electrode lower floor continues layer and negative electrode exhibition Silver film is opened to be interconnected；The insulation paste layer of the printing of negative electrode spot ring underlying layers upper surface forms negative electrode spot ring bottom middle level；It is cloudy The lower surface in polar spot ring bottom middle level be circular flat, on the middle level upper surface of negative electrode spot ring bottom, under the middle level of negative electrode spot ring bottom Surface radius of circle is equal to the radius of circle of the prismatic upper surface inscribed circle of negative electrode spot ring underlying layers eight, the lower surface in negative electrode spot ring bottom middle level The round edge of outward flange and the prismatic upper surface inscribed circle of negative electrode spot ring underlying layers eight coincides, negative electrode spot ring bottom middle level central vertical shaft Line closes glass cover-plate, negative electrode spot ring bottom middle level central vertical axis and negative electrode spot ring underlying layers central vertical axis under Coincide, the lower surface in negative electrode spot ring bottom middle level is centrally located in the central vertical axis of negative electrode spot ring bottom middle level, negative electrode spot ring bottom The upper surface in middle level is the concave surface to negative electrode spot ring bottom inner recess, and the upper surface area in negative electrode spot ring bottom middle level is less than negative electrode spot The lower surface area in ring bottom middle level, the upper surface in negative electrode spot ring bottom middle level is centrally located at negative electrode spot ring bottom middle level central vertical axis On, the lateral surface in negative electrode spot ring bottom middle level is to the concave surface of negative electrode spot ring bottom middle level central vertical axis depression, near upper surface Position and negative electrode spot ring bottom middle level central vertical axis distance is small and position and negative electrode spot ring bottom middle level away from upper surface The distance of central vertical axis is big；The silver slurry layer that there is printing in delthyrium, delthyrium in the middle level of negative electrode spot ring bottom forms negative electrode Middle level uprightly continues layer；Negative electrode middle level uprightly continues layer and negative electrode lower floor continues layer and is interconnected；Negative electrode spot ring bottom middle level upper table The silver slurry layer of the printing in face forms negative electrode middle level concave surface and continues layer；Negative electrode middle level concave surface continues layer and is covered with negative electrode spot ring bottom middle level Upper surface, negative electrode middle level concave surface continues the outward flange of layer and the upper surface outward flange flush in negative electrode spot ring bottom middle level；In negative electrode Layer concave surface continues layer and negative electrode middle level uprightly continues layer and is interconnected；Negative electrode middle level concave surface continues the insulation paste of the printing on layer Layer forms negative electrode spot ring bottom upper strata；Negative electrode spot ring bottom upper strata is located at negative electrode middle level concave surface and continues on layer, in the upper strata of negative electrode spot ring bottom Heart vertical axis closes glass cover-plate, negative electrode spot ring bottom upper strata central vertical axis and negative electrode spot ring underlying layers center under Vertical axis is coincided, and the lower surface on negative electrode spot ring bottom upper strata is centrally located in the central vertical axis of negative electrode spot ring bottom upper strata, cloudy The upper surface on polar spot ring bottom upper strata is plane, the following table of the upper surface area less than negative electrode spot ring bottom upper strata on negative electrode spot ring bottom upper strata Face area, the upper surface on negative electrode spot ring bottom upper strata is centrally located in the central vertical axis of negative electrode spot ring bottom upper strata, negative electrode spot ring bottom The lateral surface on upper strata is small for the distance in tilted cylinder face, the position near upper surface and negative electrode spot ring bottom upper strata central vertical axis And the distance at the position and negative electrode spot ring bottom upper strata central vertical axis away from upper surface is big；On the lateral surface of negative electrode spot ring bottom middle level Etching metal level formed negative electrode under transition transfer layer；Transition transfer layer is concave shape and is looped around negative electrode spot ring under negative electrode On the lateral surface in bottom middle level, the concave surface top edge of transition transfer layer is located on negative electrode spot ring bottom middle level and negative electrode spot ring bottom under negative electrode Transition transfer layer continues layer and is connected with negative electrode middle level concave surface under the intersection and negative electrode of layer, and transition transfer layer is recessed under negative electrode Face lower edge is located on the lateral surface of negative electrode spot ring bottom middle level and towards negative electrode spot ring bottom middle level lower surface direction, transition under negative electrode The concave surface lower edge of transfer layer is that multiple class rings are the ellipse of outwardly convex in the shape being mutually connected to each other, each class ring The lower part of circular spot；Transition transfer layer and negative electrode middle level concave surface continue layer and are interconnected under negative electrode；Negative electrode spot ring bottom upper strata The metal level of the etching on lateral surface forms transition transfer layer on negative electrode；Transition transfer layer is faced shape directly and is surround for oblique on negative electrode On the lateral surface on negative electrode spot ring bottom upper strata, on negative electrode transition transfer layer tiltedly face lower edge directly positioned at negative electrode spot ring bottom upper strata and Transition transfer layer continues layer and is connected with negative electrode middle level concave surface on the intersection and negative electrode in negative electrode spot ring bottom middle level, mistake on negative electrode That crosses transfer layer tiltedly faces top edge directly on the lateral surface of negative electrode spot ring bottom upper strata and towards negative electrode spot ring bottom upper strata upper surface side To, on negative electrode transition transfer layer tiltedly to face top edge directly be multiple class rings in the shape being mutually connected to each other, each class ring All it is the upper part of the elliptical spot for caving inward, transition transfer layer tiltedly faces transition biography under lower edge, negative electrode directly on negative electrode The concave surface top edge and negative electrode middle level concave surface for passing layer continue layer and interconnect；Transition transfer layer and negative electrode on negative electrode Middle level concave surface continues layer and is interconnected；The insulation paste layer of the thin printing hidden on layer forms one layer of gate pole spot ring bottom；Gate pole spot The lower surface that one layer of ring bottom is plane, is hidden on layer positioned at thin；There is circular port in one layer of gate pole spot ring bottom, exposed in circular port Go out negative electrode spot ring underlying layers, negative electrode spot ring bottom middle level, negative electrode spot ring bottom upper strata, transition is passed under transition transfer layer and negative electrode on negative electrode Pass layer；Gate pole spot ring one layer of bottom circular port is hollow disc in the section that the upper and lower surface in one layer of gate pole spot ring bottom is formed；Gate pole spot The silver slurry layer of one layer of the ring bottom printing of upper surface forms convex surface layer under the aniso- electrode of gate pole；Convex surface layer under the aniso- electrode of gate pole For raise up arc surfaced, on the upper surface of one layer of bottom of gate pole spot ring, under the aniso- electrode of gate pole convex surface layer front end court To gate pole spot ring one layer of bottom circular port direction, rear end is directed away from circular port direction, convex surface layer under the aniso- electrode of gate pole Front end and one layer of gate pole spot ring bottom circular port madial wall flush, not prominent to circular port, convex surface layer under the aniso- electrode of gate pole Front height it is low and rear height is high；It is aniso- that the silver slurry layer for printing again of one layer of bottom of gate pole spot ring upper surface forms gate pole The recessed surface layer of electrode；The recessed surface layer of the aniso- electrode of gate pole is to the arc surfaced of lower recess, positioned at one layer of bottom of gate pole spot ring upper table On face, the front end of the recessed surface layer of the aniso- electrode of gate pole towards near gate pole spot ring one layer of bottom circular port direction but not with circle Hole madial wall is in contact, the rear end of convex surface layer under the front end and the aniso- electrode of gate pole of the recessed surface layer of the aniso- electrode of gate pole It is connected, the rear end of the recessed surface layer of the aniso- electrode of gate pole is directed away from circular port direction, the recessed surface layer of the aniso- electrode of gate pole Front height it is low and rear height is high；The recessed surface layer of the aniso- electrode of gate pole is mutually interconnected with convex surface layer under the aniso- electrode of gate pole It is logical；The insulation paste layer of the printing under the recessed surface layer of the aniso- electrode of gate pole and the aniso- electrode of gate pole on the layer of convex surface forms gate pole Two layers of spot ring bottom；The silver slurry layer of gate pole spot ring two layers of the bottom printing of upper surface forms the aniso- electrode ramp layer of gate pole；Gate pole Aniso- electrode ramp layer for it is inclined face shape directly, on the upper surface of two layers of bottom of gate pole spot ring, on the aniso- electrode of gate pole Towards circular port direction, rear end is directed away from circular port direction for the front end of inclined-plane layer, the aniso- electrode ramp layer of gate pole It is front end and circular port madial wall flush, not prominent to circular port, the front height of the aniso- electrode ramp layer of gate pole it is low and Rear height is high；The silver slurry layer for printing again on two layers of gate pole spot ring bottom forms hollow surface layer on the aniso- electrode of gate pole；Gate pole Hollow surface layer is the aniso- electricity of gate pole to the arc surfaced of lower recess, on the upper surface of two layers of bottom of gate pole spot ring on aniso- electrode The front end for extremely going up hollow surface layer is in contact towards near circular port direction but not with circular port madial wall, on the aniso- electrode of gate pole The front end of hollow surface layer is connected with the rear end of the aniso- electrode ramp layer of gate pole, hollow surface layer on the aniso- electrode of gate pole Rear end is directed away from the rear end of hollow surface layer and the aniso- electrode concave surface of gate pole on circular port direction and the aniso- electrode of gate pole The rear end of layer is connected, and the front height of hollow surface layer is high on the aniso- electrode of gate pole and rear height is low；The aniso- electricity of gate pole Extremely go up hollow surface layer and the aniso- electrode ramp layer of gate pole is interconnected；Hollow surface layer and gate pole are aniso- on the aniso- electrode of gate pole The recessed surface layer of electrode is interconnected；The insulation paste layer of the thin printing hidden on layer forms three layers of gate pole spot ring bottom；Gate pole spot ring The lower surface that three layers of bottom is plane, is hidden on layer positioned at thin；The silver slurry layer of the printing on the upper surface of three layers of bottom of gate pole spot ring is formed Gate pole launches silver film；Gate pole launches hollow surface layer, the recessed surface layer of the aniso- electrode of gate pole on silver film and the aniso- electrode of gate pole It is interconnected；The insulation paste layer shape of the printing on the aniso- electrode ramp layer of gate pole and the aniso- electrode of gate pole on hollow surface layer Into four layers of gate pole spot ring bottom；CNT is prepared on the negative electrode under transition transfer layer and negative electrode on transition transfer layer.

Glass is closed under being in the aniso- silver gate fixed position that staggeredly spot ring interconnects side cathode construction of described front and rear arc Glass cover plate；Transition transfer layer can be argent, molybdenum, nickel, copper, aluminium, chromium, tin under negative electrode；Transition transfer layer can be on negative electrode Argent, molybdenum, nickel, copper, aluminium, chromium, tin.

Present invention simultaneously provides the above-mentioned front and rear aniso- silver gate of arc, staggeredly spot ring interconnects the luminous aobvious of side cathode construction The preparation method for showing device, comprises the following steps：

1) making of glass cover-plate is closed under：Flat soda-lime glass is carried out to close glass cover-plate under scribing, formation；

2) making of the thin layer that hides：Closed under and insulation paste is printed on glass cover-plate, form thin latent after toasted, sintering process Hidden layer；

3) negative electrode launches the making of silver film：Silver paste is printed on the thin layer that hides, negative electrode is formed after toasted, sintering process and is launched Silver film；

4) making of negative electrode spot ring underlying layers：Launch to print insulation paste, shape after toasted, sintering process on silver film in negative electrode Into negative electrode spot ring underlying layers；

5) negative electrode lower floor continues the making of layer：Silver paste is printed in negative electrode spot ring underlying layers delthyrium, after toasted, sintering process Form negative electrode lower floor and continue layer；

6) making in negative electrode spot ring bottom middle level：Insulation paste, toasted, sintering process are printed in negative electrode spot ring underlying layers upper surface Negative electrode spot ring bottom middle level is formed afterwards；

7) negative electrode middle level uprightly continues the making of layer：Silver paste, toasted, agglomerant are printed in the delthyrium of negative electrode spot ring bottom middle level Negative electrode middle level is formed after skill and uprightly continues layer；

8) negative electrode middle level concave surface continues the making of layer：Silver paste, toasted, agglomerant are printed on the middle level upper surface of negative electrode spot ring bottom Negative electrode middle level concave surface is formed after skill and continues layer；

9) making on negative electrode spot ring bottom upper strata：Layer concave surface to continue and print insulation paste, toasted, sintering process on layer in the cathode Negative electrode spot ring bottom upper strata is formed afterwards；

10) under negative electrode transition transfer layer making：A metal nickel dam is prepared on the lateral surface of negative electrode spot ring bottom middle level, is etched Transition transfer layer under negative electrode is formed afterwards；

11) on negative electrode transition transfer layer making：A metal nickel dam is prepared on the lateral surface of negative electrode spot ring bottom upper strata, is etched Transition transfer layer on negative electrode is formed afterwards；

12) making at one layer of gate pole spot ring bottom：Insulation paste is printed on the thin layer that hides, door is formed after toasted, sintering process One layer of polar spot ring bottom；

13) under the aniso- electrode of gate pole convex surface layer making：In one layer of gate pole spot ring bottom upper surface printing silver paste, toasted, burning Convex surface layer under the aniso- electrode of gate pole is formed after knot technique；

14) making of the recessed surface layer of the aniso- electrode of gate pole：Silver paste is printed again in one layer of bottom of gate pole spot ring upper surface, through drying The gate pole recessed surface layer of aniso- electrode is formed after roasting, sintering process；

15) making at two layers of gate pole spot ring bottom：The convex surface layer under the recessed surface layer of the aniso- electrode of gate pole and the aniso- electrode of gate pole Upper printing insulation paste, forms two layers of gate pole spot ring bottom after toasted, sintering process；

16) making of the aniso- electrode ramp layer of gate pole：Print silver paste on the upper surface of two layers of bottom of gate pole spot ring, toasted, The aniso- electrode ramp layer of gate pole is formed after sintering process；

17) on the aniso- electrode of gate pole hollow surface layer making：Print silver paste again on two layers of gate pole spot ring bottom, it is toasted, burn Hollow surface layer on the aniso- electrode of gate pole is formed after knot technique；

18) making at three layers of gate pole spot ring bottom：Insulation paste is printed on the thin layer that hides, door is formed after toasted, sintering process Three layers of polar spot ring bottom；

19) gate pole launches the making of silver film：In three layers of gate pole spot ring bottom upper surface printing silver paste, after toasted, sintering process Form gate pole and launch silver film；

20) making at four layers of gate pole spot ring bottom：The hollow surface layer on the aniso- electrode ramp layer of gate pole and the aniso- electrode of gate pole Upper printing insulation paste, forms four layers of gate pole spot ring bottom after toasted, sintering process；

21) the aniso- silver of arc gates the cleaning that the spot ring that interlocks interconnects side cathode construction before and after：Silver gate aniso- to front and rear arc Staggeredly the surface of spot ring interconnection side cathode construction carries out cleaning treatment, removes impurity and dust；

22) making of carbon nanotube layer：CNT is printed on transition transfer layer under the cathode and negative electrode on transition transfer layer, Form carbon nanotube layer；

23) treatment of carbon nanotube layer：Carbon nanotube layer is post-processed, improves its field emission characteristic；

24) making of glass cover-plate is closed on：Scribing is carried out to flat soda-lime glass, glass cover-plate is closed in formation；

25) making of anodic oxide bottom membrane：Tin indium oxide film layer to above closing glass cover plate surfaces covering is carved Erosion, forms anodic oxide bottom membrane；

26) anode launches the making of silver film：Silver paste is printed on glass cover-plate in upper closing, is formed after toasted, sintering process Anode launches silver film；

27) making of phosphor powder layer：Fluorescent material is printed on anodic oxide bottom membrane, fluorescent material is formed after toasted technique Layer；

28) display devices assembling：Getter is fixed on the non-display area for closing glass cover-plate；Then, will be upper Close glass cover-plate, under close glass cover-plate, clear glass frame and rectangular wall and be assembled together, fixed with clip；

29) display devices encapsulation：Display devices to having assembled are packaged technique and form finished parts.

Specifically, the step 26 is to print silver paste in the upper non-display area for closing glass cover-plate, through overbaking (highest Baking temperature：150oC, highest baking temperature retention time：5 minutes) after, it is placed in sintering furnace and is sintered (most high fever Junction temperature：532 oC, maximum sintering temperature retention time：10 minutes).

Specifically, it is to print fluorescent material on the upper anodic oxide bottom membrane for closing glass cover-plate to state step 27, then (highest baking temperature is toasted in placement in an oven：135oC, highest baking temperature retention time：8 minutes).

Specifically, the step 29 is that display devices to having assembled carry out following packaging technology：By display device Part is toasted in being put into baking oven；It is put into sintering furnace and is sintered；Device exhaust, sealed-off are carried out on exhaust station；Disappear roasting Getter bake on machine and is disappeared, finally installed pin additional and form finished parts.

Beneficial effect：The present invention possesses following significant progress：

First, the aniso- silver gate of arc interlocks in spot ring interconnection side cathode construction before and after described, has made front and rear arc non- Equivalent silver gate pole.Convex surface layer and the aniso- electrode ramp layer of gate pole are main responsible to CNT electricity under the aniso- electrode of gate pole Son transmitting is regulated and controled, and hollow surface layer etc. primarily serves auxiliary on the recessed surface layer of the aniso- electrode of gate pole, the aniso- electrode of gate pole Transmission potential function.After appropriate voltage is applied on gate pole, strong electric field intensity will be formed in CNT layer surface, from And force carbon nanotube emission to go out a large amount of electronics, and the number of CNT institute launching electronics quantity can be with gate voltage Change and change, this just embodies the robust adaptive control performance of the aniso- silver-colored gate pole of front and rear arc.

Secondly, the aniso- silver gate of arc interlocks in spot ring interconnection side cathode construction before and after described, has made staggeredly Spot ring interconnects side negative electrode.Transition transfer layer is concave shape under negative electrode, and concave surface lower edge is that multiple class ring sides are interconnected in Shape together, each class ring side are the lower parts of the elliptical spot of outwardly convex, with electrode edge very long；Negative electrode Upper transition transfer layer is scarf, and it is shape, each class ring that multiple class ring sides are mutually connected to each other tiltedly to face top edge directly Side is all the upper part of the elliptical spot for caving inward, it may have electrode edge very long.So, field emission light-emitting display In distinctive " fringe field enhancing " phenomenon will be fully utilized.The CNT for being produced on electrode edge position can be by Launch more electronics in enhanced electric-field intensity, so as to form bigger active display anode current, this is right Luminosity, shortening response time in raising active display, the luminous gray scale performance-adjustable of improvement are all helpful to.

3rd, the aniso- silver gate of arc interlocks in spot ring interconnection side cathode construction before and after described, CNT system Under the standby transition transfer layer on negative electrode and negative electrode on transition transfer layer.Transition transfer layer is concave shape, is looped around negative electrode under negative electrode On the lateral surface of spot ring bottom middle level；Transition transfer layer is tiltedly to face shape directly, be looped around on the lateral surface of negative electrode spot ring bottom upper strata on negative electrode, this Allow under negative electrode that transition transfer layer is respectively provided with very big surface area on transition transfer layer and negative electrode；So, make under the cathode The surface area of the carbon nanotube layer on transition transfer layer and negative electrode above transition transfer layer is also just very big, so as to participate in an electronics hair The quantity of the CNT penetrated can largely increase, and this is for increasing the anode current of active display, lifting active display Luminosity is highly profitable.

Additionally, the aniso- silver gate of arc interlocks in spot ring interconnection side cathode construction before and after described, without using special Different making material, is less related to special manufacture craft such that it is able to greatly reduces the manufacturing cost of active display, has Beneficial to carrying out extensive actual production.

Except invention described above solve technical problem, constitute technical scheme technical characteristic and by these skills Outside the advantage that the technical characteristic of art scheme is brought, staggeredly spot ring interconnects side negative electrode to the front and rear aniso- silver gate of arc of the invention The other technical characteristics and these skills included in other technologies problem, technical scheme that the active display of structure can be solved The advantage that art characteristic strip comes, will be described in more detail with reference to accompanying drawing.

Brief description of the drawings

Fig. 1 be it is single in the embodiment of the present invention before and after the aniso- silver gate of arc interlock the vertical of spot ring interconnection side cathode construction To structural representation；

Fig. 2 is that the interlock transversary of spot ring interconnection side cathode construction of the front and rear aniso- silver gate of arc shows in the embodiment of the present invention It is intended to；

Fig. 3 is the aniso- silver-colored active display for gating the spot ring interconnection side cathode construction that interlocks of front and rear arc in the embodiment of the present invention Structural representation；

In figure：Under close glass cover-plate 1, the thin layer 2, negative electrode that hides and launch silver film 3, negative electrode spot ring underlying layers 4, negative electrode lower floor and prolong Subsequent layers 5, negative electrode spot ring bottom middle level 6, negative electrode middle level uprightly continue layer 7, negative electrode middle level concave surface and continue layer 8, negative electrode spot ring bottom upper strata 9th, convex surface under transition transfer layer 11, one layer 12 of gate pole spot ring bottom, the aniso- electrode of gate pole on transition transfer layer 10, negative electrode under negative electrode Layer 13, the recessed surface layer 14 of the aniso- electrode of gate pole, two layer 15 of gate pole spot ring bottom, the aniso- electrode ramp layer 16, gate pole of gate pole Hollow surface layer 17, three layer 18 of gate pole spot ring bottom, gate pole expansion silver film 19, four layer 20 of gate pole spot ring bottom, carbon are received on aniso- electrode Mitron layer 21, on close glass cover-plate 22, anodic oxide bottom membrane 23, anode launch silver film 24, phosphor powder layer 25, cool down Agent 26, clear glass frame 27, rectangular wall 28.

Specific embodiment

The present invention is further described with reference to the accompanying drawings and examples, but the invention is not limited in this implementation Example.

Staggeredly spot ring interconnects the active display of side cathode construction as schemed to the aniso- silver gate of front and rear arc of the present embodiment 1st, shown in Fig. 2 and Fig. 3, including closed from above glass cover-plate 22, under close glass cover-plate 1 and that clear glass frame 27 is constituted is true Empty room；In the upper anode for closing and thering is anodic oxide bottom membrane 23 to be connected with anodic oxide bottom membrane 23 on glass cover-plate 22 Launch the phosphor powder layer 25 of silver film 24 and preparation on anodic oxide bottom membrane 23；Closed under on glass cover-plate 1 There is the aniso- silver gate of front and rear arc staggeredly spot ring interconnection side cathode construction；Getter 26 and rectangular wall 28 in vacuum chamber Subsidiary component.

The front and rear aniso- silver gate of the arc backing material that staggeredly spot ring interconnects side cathode construction is glass, can be sodium calcium Glass, Pyrex, that is, under close glass cover-plate 1；Under close the insulation paste layer of printing on glass cover-plate 1 and form thin Hide layer 2；The silver slurry layer of the thin printing on layer 2 of hiding forms negative electrode and launches silver film 3；Negative electrode launches the printing on silver film 3 Insulation paste layer form negative electrode spot ring underlying layers 4；Negative electrode spot ring underlying layers 4 are positive eight prismatic table shape, negative electrode spot ring underlying layers 4 Lower surface is eight prismatic planes, launches on silver film 3 positioned at negative electrode, the upper surface of negative electrode spot ring underlying layers 4 is eight prismatic planes, And be parallel to each other with the lower surface of negative electrode spot ring underlying layers 4, the central vertical axis of negative electrode spot ring underlying layers 4 close glass under Glass cover plate 1, the lower surface of negative electrode spot ring underlying layers 4 is centrally located in the central vertical axis of negative electrode spot ring underlying layers 4, negative electrode spot ring The upper surface of underlying layers 4 is centrally located in the central vertical axis of negative electrode spot ring underlying layers 4, the lateral surface of negative electrode spot ring underlying layers 4 It is upright rib cylinder face, the circular diameter of the height less than the lower surface circumcircle of negative electrode spot ring underlying layers 4 of negative electrode spot ring underlying layers 4； The silver slurry layer that there is printing in delthyrium, delthyrium in negative electrode spot ring underlying layers 4 forms negative electrode lower floor continuity layer 5；Negative electrode lower floor Continue layer 5 and negative electrode launches silver film 3 and is interconnected；The insulation paste layer of the printing of the upper surface of negative electrode spot ring underlying layers 4 is formed Negative electrode spot ring bottom middle level 6；The lower surface in negative electrode spot ring bottom middle level 6 be circular flat, positioned at the upper surface of negative electrode spot ring bottom middle level 6 On, the lower surface radius of circle in negative electrode spot ring bottom middle level 6 is equal to the circle half of the prismatic upper surface inscribed circle of negative electrode spot ring underlying layers 4 eight Footpath, the lower surface outward flange in negative electrode spot ring bottom middle level 6 mutually overlaps with the round edge of the prismatic upper surface inscribed circle of negative electrode spot ring underlying layers 4 eight Close, the central vertical axis of negative electrode spot ring bottom middle level 6 close glass cover-plate 1, the central vertical shaft of negative electrode spot ring bottom middle level 6 under Line and the central vertical axis of negative electrode spot ring underlying layers 4 coincide, and the lower surface in negative electrode spot ring bottom middle level 6 is centrally located at negative electrode spot ring In the central vertical axis of bottom middle level 6, the upper surface in negative electrode spot ring bottom middle level 6 is the concave surface to negative electrode spot ring bottom inner recess, cloudy The upper surface area in polar spot ring bottom middle level 6 less than negative electrode spot ring bottom middle level 6 lower surface area, negative electrode spot ring bottom middle level 6 it is upper Centre of surface is located in the central vertical axis of negative electrode spot ring bottom middle level 6, and the lateral surface in negative electrode spot ring bottom middle level 6 is to negative electrode spot ring Concave surface, the position near upper surface and the central vertical axis of negative electrode spot ring bottom middle level 6 that the central vertical axis of bottom middle level 6 are recessed Apart from small and the distance at position and the central vertical axis of negative electrode spot ring bottom middle level 6 away from upper surface is big；Negative electrode spot ring bottom middle level 6 In there is delthyrium, the silver slurry layer of printing forms negative electrode middle level and uprightly continues layer 7 in delthyrium；Negative electrode middle level uprightly continues layer 7 Continue layer 5 with negative electrode lower floor to be interconnected；The silver slurry layer of the printing of the upper surface of negative electrode spot ring bottom middle level 6 forms negative electrode middle level concave surface Continue layer 8；Negative electrode middle level concave surface continues the upper surface that layer 8 is covered with negative electrode spot ring bottom middle level 6, and negative electrode middle level concave surface continues layer 8 Outward flange and the upper surface outward flange flush in negative electrode spot ring bottom middle level 6；Negative electrode middle level concave surface continues layer 8 and negative electrode middle level is upright Continue layer 7 to be interconnected；The insulation paste layer that negative electrode middle level concave surface continues the printing on layer 8 forms negative electrode spot ring bottom upper strata 9；It is cloudy Polar spot ring bottom upper strata 9 is located at negative electrode middle level concave surface and continues on layer 8, and the central vertical axis of negative electrode spot ring bottom upper strata 9 are perpendicular to lower tight Glass cover-plate 1 is closed, the central vertical axis of negative electrode spot ring bottom upper strata 9 and the central vertical axis of negative electrode spot ring underlying layers 4 coincide, it is cloudy The lower surface on polar spot ring bottom upper strata 9 is centrally located in the central vertical axis of negative electrode spot ring bottom upper strata 9, negative electrode spot ring bottom upper strata 9 Upper surface is plane, the lower surface area of the upper surface area less than negative electrode spot ring bottom upper strata 9 on negative electrode spot ring bottom upper strata 9, negative electrode The upper surface on spot ring bottom upper strata 9 is centrally located in the central vertical axis of negative electrode spot ring bottom upper strata 9, outside negative electrode spot ring bottom upper strata 9 Side is tilted cylinder face, the distance of the position near upper surface and the central vertical axis of negative electrode spot ring bottom upper strata 9 is small and away from The position of upper surface and the distance of the central vertical axis of negative electrode spot ring bottom upper strata 9 are big；Quarter on the lateral surface of negative electrode spot ring bottom middle level 6 The metal level of erosion forms transition transfer layer 10 under negative electrode；Transition transfer layer 10 is concave shape and is looped around negative electrode spot ring under negative electrode On the lateral surface in bottom middle level 6, the concave surface top edge of transition transfer layer 10 is located at negative electrode spot ring bottom middle level 6 and negative electrode spot ring under negative electrode Transition transfer layer 10 continues layer 8 and is connected with negative electrode middle level concave surface under the intersection and negative electrode on bottom upper strata 9, and transition is passed under negative electrode The concave surface lower edge for passing layer 10 is located on the lateral surface of negative electrode spot ring bottom middle level 6 and towards the lower surface side of negative electrode spot ring bottom middle level 6 To the concave surface lower edge of transition transfer layer 10 is multiple class rings in the shape being mutually connected to each other, each class ring under negative electrode All it is the lower part of the elliptical spot of outwardly convex；Transition transfer layer 10 and negative electrode middle level concave surface continuity layer 8 are mutual under negative electrode Connection；The metal level of the etching on the lateral surface of negative electrode spot ring bottom upper strata 9 forms transition transfer layer 11 on negative electrode；Transition is passed on negative electrode Layer 11 is passed tiltedly to face shape directly and being looped around on the lateral surface on negative electrode spot ring bottom upper strata 9, transition transfer layer 11 tiltedly faces directly on negative electrode Lower edge is located at transition transfer layer 11 and negative electrode on the intersection and negative electrode in negative electrode spot ring bottom upper strata 9 and negative electrode spot ring bottom middle level 6 Middle level concave surface continues layer 8 and is connected, and transition transfer layer 11 tiltedly faces top edge directly positioned at the outside of negative electrode spot ring bottom upper strata 9 on negative electrode On face and towards the upper surface direction of negative electrode spot ring bottom upper strata 9, the top edge of tiltedly facing directly of transition transfer layer 11 is multiple classes on negative electrode Ring is the upper part of the elliptical spot for caving inward, mistake on negative electrode in the shape being mutually connected to each other, each class ring Tiltedly face directly the concave surface top edge of transition transfer layer 10 and the negative electrode middle level concave surface under lower edge, negative electrode for crossing transfer layer 11 continue layer 8 Interconnect；Transition transfer layer 11 and negative electrode middle level concave surface continue layer 8 and are interconnected on negative electrode；The thin layer 2 that hides On the insulation paste layer of printing form gate pole spot ring bottom one layer 12；The lower surface that one layer 12 of gate pole spot ring bottom is plane, is located at It is thin to hide on layer 2；There is circular port in one layer 12 of gate pole spot ring bottom, negative electrode spot ring underlying layers 4, negative electrode spot are exposed in circular port Transition transfer layer 10 under transition transfer layer 11 and negative electrode on ring bottom middle level 6, negative electrode spot ring bottom upper strata 9, negative electrode；Gate pole spot ring bottom one 12 circular port of layer are hollow disc in the section that the upper and lower surface in one layer 12 of gate pole spot ring bottom is formed；On one layer 12 of gate pole spot ring bottom The silver slurry layer of the printing on surface forms convex surface layer 13 under the aniso- electrode of gate pole；Convex surface layer 13 is upward under the aniso- electrode of gate pole Raised arc surfaced, on the upper surface of one layer 12 of bottom of gate pole spot ring, the front end direction of convex surface layer 13 under the aniso- electrode of gate pole Gate pole spot ring one layer 12 of bottom circular port direction and rear end is directed away from circular port direction, under the aniso- electrode of gate pole convex surface layer 13 Front end and one layer 12 of gate pole spot ring bottom circular port madial wall flush, not prominent to circular port, it is convex under the aniso- electrode of gate pole The front height of surface layer 13 is low and rear height is high；The silver slurry layer for printing again of one layer 12 of bottom of gate pole spot ring upper surface forms door The extremely aniso- recessed surface layer 14 of electrode；The recessed surface layer 14 of the aniso- electrode of gate pole is to the arc surfaced of lower recess, positioned at gate pole spot On the upper surface of one layer 12 of ring bottom, the front end of the recessed surface layer 14 of the aniso- electrode of gate pole is towards near one layer 12 of gate pole spot ring bottom circle Hole direction but it is not in contact with circular port madial wall, the front end and gate pole of the recessed surface layer 14 of the aniso- electrode of gate pole are aniso- The rear end of convex surface layer 13 is connected under electrode, and the rear end of the recessed surface layer 14 of the aniso- electrode of gate pole is directed away from circular port side To the front height of the recessed surface layer 14 of the aniso- electrode of gate pole is low and rear height is high；The recessed surface layer 14 of the aniso- electrode of gate pole It is interconnected with convex surface layer 13 under the aniso- electrode of gate pole；Under the recessed surface layer 14 of the aniso- electrode of gate pole and the aniso- electrode of gate pole The insulation paste layer of the printing on convex surface layer 13 forms gate pole spot ring bottom two layer 15；Two layer 15 of the bottom printing of upper surface of gate pole spot ring Silver slurry layer form gate pole aniso- electrode ramp layer 16；Gate pole aniso- electrode ramp layer 16 for it is inclined face directly shape, On the upper surface of two layer 15 of bottom of gate pole spot ring, the front end of the aniso- electrode ramp layer 16 of gate pole is towards circular port direction Rear end is directed away from circular port direction, the front end of the aniso- electrode ramp layer 16 of gate pole and circular port madial wall flush, no Prominent to circular port, the front height of the aniso- electrode ramp layer 16 of gate pole is low and rear height is high；Two layers of gate pole spot ring bottom The silver slurry layer for printing again on 15 forms hollow surface layer 17 on the aniso- electrode of gate pole；Hollow surface layer 17 is on the aniso- electrode of gate pole To the arc surfaced of lower recess, on the upper surface of two layer 15 of bottom of gate pole spot ring, the front end of hollow surface layer 17 on the aniso- electrode of gate pole It is in contact towards near circular port direction but not with circular port madial wall, the front end of hollow surface layer 17 on the aniso- electrode of gate pole Rear end with the aniso- electrode ramp layer 16 of gate pole is connected, and the rear end of hollow surface layer 17 is towards far on the aniso- electrode of gate pole On circular port direction and the aniso- electrode of gate pole after the rear end of hollow surface layer 17 and the recessed surface layer 14 of the aniso- electrode of gate pole End is connected, and the front height of hollow surface layer 17 is high on the aniso- electrode of gate pole and rear height is low；On the aniso- electrode of gate pole Hollow surface layer 17 and the aniso- electrode ramp layer 16 of gate pole are interconnected；Hollow surface layer 17 and gate pole are non-etc. on the aniso- electrode of gate pole It is interconnected with the recessed surface layer 14 of electrode；The insulation paste layer of the thin printing on layer 2 of hiding forms gate pole spot ring bottom three layer 18；Door The lower surface that three layer 18 of polar spot ring bottom is plane, is hidden on layer 2 positioned at thin；Printing on the upper surface of three layer 18 of bottom of gate pole spot ring Silver slurry layer forms gate pole and launches silver film 19；It is non-that gate pole launches hollow surface layer 17, gate pole on silver film 19 and the aniso- electrode of gate pole The recessed surface layer 14 of equal electrode is interconnected；Hollow surface layer 17 on the aniso- electrode ramp layer 16 of gate pole and the aniso- electrode of gate pole On the insulation paste layer of printing form gate pole spot ring bottom four layer 20；CNT prepares transition transfer layer 11 and the moon on negative electrode Extremely descend on transition transfer layer 10.

Glass cover-plate is closed under being in the front and rear aniso- silver gate fixed position that staggeredly spot ring interconnects side cathode construction of arc 1；Transition transfer layer 10 can be argent, molybdenum, nickel, copper, aluminium, chromium, tin under negative electrode；Transition transfer layer 11 can be gold on negative electrode Category silver, molybdenum, nickel, copper, aluminium, chromium, tin.

The preparation method of the active display of the present embodiment is as follows：

26) anode launches the making of silver film：Silver paste is printed on glass cover-plate in upper closing, is formed after toasted, sintering process Anode launches silver film, silver paste is printed in the upper non-display area for closing glass cover-plate, through overbaking (highest baking temperature：150 OC, highest baking temperature retention time：5 minutes) after, it is placed in sintering furnace and is sintered (maximum sintering temperature：532 º C, maximum sintering temperature retention time：10 minutes).

27) making of phosphor powder layer：Fluorescent material is printed on anodic oxide bottom membrane, fluorescence is formed after toasted technique Bisque, fluorescent material is printed on the upper anodic oxide bottom membrane for closing glass cover-plate, is then placed within being toasted in baking oven (highest baking temperature：135oC, highest baking temperature retention time：8 minutes)；

29) display devices encapsulation：Display devices to having assembled carry out following packaging technology：Display devices are put To enter toasted in baking oven；It is put into sintering furnace and is sintered；Device exhaust, sealed-off are carried out on exhaust station；On roasting machine Getter bake and is disappeared, finally installed pin additional and form finished parts.

Claims

1. the aniso- silver gate of the arc spot ring that interlocks interconnects the active display of side cathode construction before and after a kind of, including vacuum chamber and Getter and rectangular wall in vacuum chamber, the vacuum chamber by closed from above glass cover-plate, under close glass cover-plate and thoroughly Bright instrument bezel composition, it is characterised in that：There are anodic oxide bottom membrane and anodic oxide counterdie in upper closing on glass cover-plate The connected anode of layer launches the phosphor powder layer of silver film and preparation on anodic oxide bottom membrane；Glass cover is closed under There is the aniso- silver gate of front and rear arc staggeredly spot ring interconnection side cathode construction on plate.

2. the aniso- silver of front and rear arc according to claim 1 gates the luminescence display that the spot ring that interlocks interconnects side cathode construction Device, it is characterised in that：Glass cover-plate is closed under described, and as the aniso- silver gate of front and rear arc, staggeredly spot ring interconnects side negative electrode knot The substrate of structure, the material of the substrate is soda-lime glass or Pyrex；Under close the insulation paste of printing on glass cover-plate Layer forms the thin layer that hides；The silver slurry layer of the thin printing hidden on layer forms negative electrode and launches silver film；Negative electrode launches on silver film The insulation paste layer of printing forms negative electrode spot ring underlying layers；Negative electrode spot ring underlying layers are positive eight prismatic table shape, negative electrode spot ring underlying layers Lower surface be eight prismatic planes, launch on silver film positioned at negative electrode, the upper surface of negative electrode spot ring underlying layers is eight prismatic planes, And be parallel to each other with the lower surface of negative electrode spot ring underlying layers, negative electrode spot ring underlying layers central vertical axis close glass under Cover plate, the lower surface of negative electrode spot ring underlying layers is centrally located in negative electrode spot ring underlying layers central vertical axis, under negative electrode spot ring The upper surface of layer is centrally located in negative electrode spot ring underlying layers central vertical axis, and the lateral surface of negative electrode spot ring underlying layers is upright Rib cylinder face, the circular diameter of the height less than negative electrode spot ring underlying layers lower surface circumcircle of negative electrode spot ring underlying layers；Negative electrode spot ring bottom The silver slurry layer that there is printing in delthyrium, delthyrium in lower floor forms negative electrode lower floor continuity layer；Negative electrode lower floor continues layer and negative electrode Launch silver film to be interconnected；The insulation paste layer of the printing of negative electrode spot ring underlying layers upper surface forms negative electrode spot ring bottom middle level； The lower surface in negative electrode spot ring bottom middle level be circular flat, on the middle level upper surface of negative electrode spot ring bottom, negative electrode spot ring bottom middle level Lower surface radius of circle is equal to the radius of circle of the prismatic upper surface inscribed circle of negative electrode spot ring underlying layers eight, the following table in negative electrode spot ring bottom middle level The round edge of face outward flange and the prismatic upper surface inscribed circle of negative electrode spot ring underlying layers eight coincides, and negative electrode spot ring bottom middle level center is vertical Axis closes glass cover-plate, negative electrode spot ring bottom middle level central vertical axis and negative electrode spot ring underlying layers central vertical shaft under Line is coincided, and the lower surface in negative electrode spot ring bottom middle level is centrally located in the central vertical axis of negative electrode spot ring bottom middle level, negative electrode spot ring The upper surface in bottom middle level is the concave surface to negative electrode spot ring bottom inner recess, and the upper surface area in negative electrode spot ring bottom middle level is less than negative electrode The lower surface area in spot ring bottom middle level, the upper surface in negative electrode spot ring bottom middle level is centrally located at negative electrode spot ring bottom middle level central vertical shaft On line, the lateral surface in negative electrode spot ring bottom middle level is to the concave surface of negative electrode spot ring bottom middle level central vertical axis depression, near upper table The position in face and the distance of negative electrode spot ring bottom middle level central vertical axis it is small and in position and negative electrode spot ring bottom away from upper surface The distance of layer central vertical axis is big；The silver slurry layer that there is printing in delthyrium, delthyrium in the middle level of negative electrode spot ring bottom forms the moon Pole middle level uprightly continues layer；Negative electrode middle level uprightly continues layer and negative electrode lower floor continues layer and is interconnected；On the middle level of negative electrode spot ring bottom The silver slurry layer of the printing on surface forms negative electrode middle level concave surface and continues layer；Negative electrode middle level concave surface continues layer and is covered with negative electrode spot ring bottom middle level Upper surface, negative electrode middle level concave surface continue layer outward flange and negative electrode spot ring bottom middle level upper surface outward flange flush；Negative electrode Middle level concave surface continues layer and negative electrode middle level uprightly continues layer and is interconnected；Negative electrode middle level concave surface continues the insulation slurry of the printing on layer The bed of material forms negative electrode spot ring bottom upper strata；Negative electrode spot ring bottom upper strata is located at negative electrode middle level concave surface and continues on layer, negative electrode spot ring bottom upper strata Central vertical axis close glass cover-plate under, in negative electrode spot ring bottom upper strata central vertical axis and negative electrode spot ring underlying layers Heart vertical axis is coincided, and the lower surface on negative electrode spot ring bottom upper strata is centrally located in the central vertical axis of negative electrode spot ring bottom upper strata, The upper surface on negative electrode spot ring bottom upper strata is plane, and the upper surface area on negative electrode spot ring bottom upper strata is less than under the upper strata of negative electrode spot ring bottom Surface area, the upper surface on negative electrode spot ring bottom upper strata is centrally located in the central vertical axis of negative electrode spot ring bottom upper strata, negative electrode spot ring The lateral surface on bottom upper strata is the distance in tilted cylinder face, the position near upper surface and negative electrode spot ring bottom upper strata central vertical axis It is small and the distance at position and negative electrode spot ring bottom upper strata central vertical axis away from upper surface is big；Negative electrode spot ring bottom middle level lateral surface On etching metal level formed negative electrode under transition transfer layer；Transition transfer layer is concave shape and is looped around negative electrode spot under negative electrode On the lateral surface in ring bottom middle level, the concave surface top edge of transition transfer layer is located at negative electrode spot ring bottom middle level and negative electrode spot ring bottom under negative electrode Transition transfer layer continues layer and is connected with negative electrode middle level concave surface under the intersection and negative electrode on upper strata, transition transfer layer under negative electrode Concave surface lower edge is located on the lateral surface of negative electrode spot ring bottom middle level and towards negative electrode spot ring bottom middle level lower surface direction, and negative electrode was descended The concave surface lower edge for crossing transfer layer is that multiple class rings are outwardly convexs in the shape being mutually connected to each other, each class ring The lower part of elliptical spot；Transition transfer layer and negative electrode middle level concave surface continue layer and are interconnected under negative electrode；On negative electrode spot ring bottom The metal level of the etching on layer lateral surface forms transition transfer layer on negative electrode；Transition transfer layer is tiltedly to face shape and ring directly on negative electrode It is wound on the lateral surface on negative electrode spot ring bottom upper strata, transition transfer layer tiltedly faces lower edge directly positioned at negative electrode spot ring bottom upper strata on negative electrode Continue layer with transition transfer layer on the intersection and negative electrode in negative electrode spot ring bottom middle level and negative electrode middle level concave surface to be connected, on negative electrode Transition transfer layer tiltedly faces top edge directly on the lateral surface of negative electrode spot ring bottom upper strata and towards negative electrode spot ring bottom upper strata upper surface Direction, on negative electrode transition transfer layer tiltedly to face top edge directly be shape, each class ring that multiple class ring sides are mutually connected to each other Side is all the upper part of the elliptical spot for caving inward, and transition transfer layer tiltedly faces transition under lower edge, negative electrode directly on negative electrode The concave surface top edge of transfer layer and negative electrode middle level concave surface continue layer and interconnect；Transition transfer layer and the moon on negative electrode Pole middle level concave surface continues layer and is interconnected；The insulation paste layer of the thin printing hidden on layer forms one layer of gate pole spot ring bottom；Gate pole The lower surface at one layer of spot ring bottom is plane, is hidden on layer positioned at thin；There is circular port in one layer of gate pole spot ring bottom, it is sudden and violent in circular port Expose negative electrode spot ring underlying layers, negative electrode spot ring bottom middle level, negative electrode spot ring bottom upper strata, transition under transition transfer layer and negative electrode on negative electrode Transfer layer；Gate pole spot ring one layer of bottom circular port is hollow disc in the section that the upper and lower surface in one layer of gate pole spot ring bottom is formed；Gate pole The silver slurry layer of one layer of the spot ring bottom printing of upper surface forms convex surface layer under the aniso- electrode of gate pole；Convex surface under the aniso- electrode of gate pole Layer for raise up arc surfaced, on the upper surface of one layer of bottom of gate pole spot ring, under the aniso- electrode of gate pole convex surface layer front end Towards gate pole spot ring one layer of bottom circular port direction, rear end is directed away from circular port direction, convex surface layer under the aniso- electrode of gate pole Front end and one layer of gate pole spot ring bottom circular port madial wall flush, under the aniso- electrode of gate pole convex surface layer front height it is low and Rear height is high；The silver slurry layer for printing again of one layer of bottom of gate pole spot ring upper surface forms the gate pole recessed surface layer of aniso- electrode； The recessed surface layer of the aniso- electrode of gate pole is gate pole is non-etc. to the arc surfaced of lower recess, on the upper surface of one layer of bottom of gate pole spot ring Front end with the recessed surface layer of electrode connects towards near gate pole spot ring one layer of bottom circular port direction but not with circular port madial wall Touch, the front end of the recessed surface layer of the aniso- electrode of gate pole is connected with the rear end of convex surface layer under the aniso- electrode of gate pole, gate pole The rear end of the aniso- recessed surface layer of electrode is directed away from circular port direction, and the front height of the recessed surface layer of the aniso- electrode of gate pole is low And rear height is high；Convex surface layer is interconnected under the recessed surface layer of the aniso- electrode of gate pole and the aniso- electrode of gate pole；Gate pole is non-etc. Two layers of gate pole spot ring bottom is formed with the insulation paste layer of the printing on convex surface layer under the recessed surface layer of electrode and the aniso- electrode of gate pole； The silver slurry layer of gate pole spot ring two layers of the bottom printing of upper surface forms the aniso- electrode ramp layer of gate pole；On the aniso- electrode of gate pole Inclined-plane layer for it is inclined face shape directly, on the upper surface of two layers of bottom of gate pole spot ring, the front end of gate pole aniso- electrode ramp layer Towards circular port direction, rear end is directed away from circular port direction, the front end of the aniso- electrode ramp layer of gate pole and circular port Madial wall flush, the front height of the aniso- electrode ramp layer of gate pole is low and rear height is high；On two layers of gate pole spot ring bottom The silver slurry layer that prints again form hollow surface layer on the aniso- electrode of gate pole；Hollow surface layer is to lower recess on the aniso- electrode of gate pole Arc surfaced, on the upper surface of two layers of bottom of gate pole spot ring, the front end of hollow surface layer is towards near circle on the aniso- electrode of gate pole Hole direction but it is not in contact with circular port madial wall, the front end and the aniso- electricity of gate pole of hollow surface layer on the aniso- electrode of gate pole The rear end of pole ramp layer is connected, and the rear end of hollow surface layer is directed away from circular port direction and door on the aniso- electrode of gate pole The rear end of hollow surface layer is connected with the rear end of the gate pole recessed surface layer of aniso- electrode on extremely aniso- electrode, and gate pole is aniso- The front height of hollow surface layer is high on electrode and rear height is low；On the aniso- electrode of gate pole on hollow surface layer and the aniso- electrode of gate pole Inclined-plane layer is interconnected；Hollow surface layer and the recessed surface layer of the aniso- electrode of gate pole are interconnected on the aniso- electrode of gate pole；It is thin to hide The insulation paste layer of the printing on layer forms three layers of gate pole spot ring bottom；The lower surface at three layers of gate pole spot ring bottom be plane, positioned at thin Hide on layer；The silver slurry layer of the printing on the upper surface of three layers of bottom of gate pole spot ring forms gate pole and launches silver film；Gate pole launches silverskin Hollow surface layer, the recessed surface layer of the aniso- electrode of gate pole are interconnected on layer and the aniso- electrode of gate pole；On the aniso- electrode of gate pole tiltedly The insulation paste layer of the printing on surface layer and the aniso- electrode of gate pole on hollow surface layer forms four layers of gate pole spot ring bottom；CNT system Under the standby transition transfer layer on negative electrode and negative electrode on transition transfer layer.

3. the aniso- silver of front and rear arc according to claim 2 gates the luminescence display that the spot ring that interlocks interconnects side cathode construction Device, it is characterised in that：Under the aniso- silver gate fixed position that staggeredly spot ring interconnects side cathode construction of described front and rear arc is Close glass cover-plate；Transition transfer layer is argent, molybdenum, nickel, copper, aluminium, chromium or tin under negative electrode；Transition transfer layer is gold on negative electrode Category silver, molybdenum, nickel, copper, aluminium, chromium or tin.

4. the aniso- silver of front and rear arc according to claim 2 gates the luminescence display that the spot ring that interlocks interconnects side cathode construction The preparation method of device, it is characterised in that comprise the following steps：

5. the aniso- silver of front and rear arc according to claim 4 gates the luminescence display that the spot ring that interlocks interconnects side cathode construction The preparation method of device, it is characterised in that：The step 26 is to print silver paste in the upper non-display area for closing glass cover-plate, is passed through After baking, it is placed in sintering furnace and is sintered, highest baking temperature 150oC, 5 minutes highest baking temperature retention times, The oC of maximum sintering temperature 532,10 minutes maximum sintering temperature retention times.

6. the aniso- silver of front and rear arc according to claim 4 gates the luminescence display that the spot ring that interlocks interconnects side cathode construction The preparation method of device, it is characterised in that：The step 27 is printed on the upper anodic oxide bottom membrane for closing glass cover-plate Fluorescent material, is then placed within being toasted in baking oven, highest baking temperature 135oC, 8 minutes highest baking temperature retention times.

7. the aniso- silver of front and rear arc according to claim 4 gates the luminescence display that the spot ring that interlocks interconnects side cathode construction The preparation method of device, it is characterised in that：The packaging technology of the step 29 is that display devices are put into baking oven to be toasted； It is put into sintering furnace and is sintered；Device exhaust, sealed-off are carried out on exhaust station；Getter bake on roasting machine and is disappeared, Finally install pin additional and form finished parts.