CN106768454A - Telemetering type temperature sensor - Google Patents
Telemetering type temperature sensor Download PDFInfo
- Publication number
- CN106768454A CN106768454A CN201611032238.8A CN201611032238A CN106768454A CN 106768454 A CN106768454 A CN 106768454A CN 201611032238 A CN201611032238 A CN 201611032238A CN 106768454 A CN106768454 A CN 106768454A
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- Prior art keywords
- film
- temperature
- insulating properties
- jointing
- sensitive element
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Radiation Pyrometers (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Abstract
The present invention proposes a kind of telemetering type temperature sensor, including sensor diaphragm and connector modules；Sensor diaphragm includes：Temperature-sensitive element and temperature compensating element；Conductive wires film one end is connected with temperature-sensitive element or temperature compensating element, other end connection jointing；Temperature-sensitive element, temperature compensating element, conductive wires film and jointing are folded between insulating properties film and lower insulating properties film；Upper insulating properties film top is fitted with infrared absorbing film, and infrared absorbing film is located at directly over temperature-sensitive element；Lower insulating properties film lower section is fitted with infrared reflection film, and infrared reflection film is located at immediately below temperature-sensitive element；Lower insulating properties film lower section sets protective layer；Connector modules have the side of jointing located at sensor diaphragm；Connector modules include main controller, and main controller is connected with wireless communication module and power supply, and main controller is electrically connected with jointing.The present invention is light and thin, and resistance to vibration is excellent, and thermometric is accurate；Can remote monitoring, it is with low cost.
Description
Technical field
The present invention relates to electrical accessorie technical field, specifically a kind of telemetering type temperature sensor.
Background technology
Temperature sensor (temperature transducer) refers to that can experience temperature and be converted into usable output signal
Sensor.
Existing temperature sensor is to clamping thermistor between gold leaf in two gold leaf one end using metal framework
After chip, heat under vacuum conditions, pressurize, the diaphragm-type thermistor that two polyimides diaphragms are made is bonded up and down
Temperature sensor.But, existing temperature sensor tool as described above has disadvantages that.Due between two polyimides diaphragms
Be provided with thermistor chip and be not provided with thermistor chip position between be formed with difference in height, it is difficult to pass through apply a level pressure
Power equably pastes all sites could be realized, it is necessary to pass through high price apparatus, and be difficult batch production.
Also, gold leaf can only be based in outside diaphragm to be connected to external circuit, when the gold leaf to projecting applies repeatedly
Gold leaf is possible to break during external force.First thermistor chip is clipped between gold leaf when thermistor chip is adhered into gold leaf
Then (soldering) is welded, because gold leaf needs to maintain a certain size, therefore, cannot not only produce less than a scale
Very little product, and variously-shaped product cannot be produced.
Further, since each sensor diaphragm is equipped with a thermistor chip, and in order to determine telework
The temperature of sensing of standing needs wired delivery module, therefore, not only manufacturing expense increases, and when multiple temperature sensors are set
It is difficult distribution.And, mounted temperature sensor has what is caused by wire due to wire is connected into thermistor
The problems such as coupling part of weight increase or wire and thermistor is because of vibration deterioration.
When thermistor chip without being accurately installed on measured element very much, it may appear that cannot measure or measure
The larger situation of value deviation.
The content of the invention
The present invention proposes a kind of telemetering type temperature sensor, solve temperature sensor in the prior art be difficult distribution, into
This height, easily deterioration, the problem that need to accurately install.
The technical proposal of the invention is realized in this way：
A kind of telemetering type temperature sensor, including sensor diaphragm and connector modules；
The sensor diaphragm includes：
The temperature compensating element of the temperature-sensitive element of some film-forms and a film-form；
Some conductive wires films, each temperature-sensitive element and temperature compensating element are connected to a pair of conductive wiring film,
The other end of some conductive wires films is connected to jointing；
Upper insulating properties film and lower insulating properties film, the upper insulation film are fitted in the upper of the lower insulating properties film
Side；The temperature-sensitive element, temperature compensating element, conductive wires film and jointing be folded in the upper insulating properties film and under
Between insulating properties film；
Some infrared absorbing films are fitted with above the upper insulating properties film, the infrared absorbing film is located at institute
State the surface of temperature-sensitive element；
Some infrared reflection films are fitted with below the lower insulating properties film, the infrared reflection film is located at institute
State the underface of temperature-sensitive element；
It is provided with protective layer below the lower insulating properties film, the protective layer is by the lower insulating properties film and infrared ray
Reflectance coating is covered；
The connector modules have the side of jointing located at the sensor diaphragm；
The connector modules include a main controller, and the main controller is connected with wireless communication module and power supply, the master
Control device is electrically connected with the jointing.
Further, the upper insulating properties film and lower insulating properties film are formed by infrared transmitting film.
Further, the temperature-sensitive element and temperature compensating element are the film heat of the film forming on the lower insulating properties film
Quick resistive element.
Further, the jointing and conductive wires film are formed by mode of printing.
Further, the connector modules include a housing, and one end of the housing has for accommodating the sensing
The holding tank of device diaphragm one end, the top of the holding tank is hinged with rotatable lid by articulated elements；
Downwardly projecting conductive bonding pin is provided with the inside of the lid, the bottom of the holding tank is provided with for accommodating
State the pin-and-hole of conductive bonding pin；
There is the sensor diaphragm side of jointing to be contained in the holding tank, and the conductive bonding pin is passed through
The lower end that the sensor diaphragm has the position of jointing, the conductive bonding pin is placed in the pin-and-hole.
Beneficial effects of the present invention are：
Telemetering type arrangement of temperature sensor of the invention is simple, reasonable in design；The present invention is lightweight and thin, installation and resistance to
Shaking property is excellent, even if there is the position deviation somewhat can also to accurately measure temperature；Temperature compensating element can determine surrounding environment
Temperature, improves accuracy of detection；Can by temperature value Wireless transceiver to remote central control terminal, can remote monitoring, take arrange in time
Apply；The present invention is simple to manufacture, with low cost.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
The accompanying drawing to be used needed for having technology description is briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is the structural representation of one embodiment of the invention；
Fig. 2 is the structural representation of sensor diaphragm one embodiment in the present invention.
Wherein：
1st, temperature-sensitive element；2nd, conductive wires film；3rd, jointing；4th, upper insulating properties film；5th, lower insulating properties film；6、
Infrared absorbing film；7th, infrared reflection film；8th, housing；9th, holding tank；10th, lid；11st, conductive bonding pin；12nd, pin-and-hole；13、
Protective layer；14th, temperature compensating element.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
As Figure 1-Figure 2, the telemetering type temperature sensor in the present embodiment, including sensor diaphragm and connector mould
Block.
The sensor diaphragm includes：The temperature compensating element 14 of the film-form of temperature-sensitive element 1 and of some film-forms；If
Dry conductive wires film 2, each temperature-sensitive element 1 and temperature compensating element 14 are connected to a pair of conductive wiring film 2, Ruo Gansuo
The other end for stating conductive wires film 2 is connected to jointing 3；Upper insulating properties film 4 and lower insulating properties film 5, it is described
Upper insulation film is fitted in the top of the lower insulating properties film 5；The temperature-sensitive element 1, temperature compensating element 14, electric conductivity are matched somebody with somebody
Line film 2 and jointing 3 are folded between the upper insulating properties film 4 and lower insulating properties film 5；The upper insulating properties film 4
Top be fitted with some infrared absorbing films 6, the infrared absorbing film 6 is located at the surface of the temperature-sensitive element 1；Institute
The lower section for stating lower insulating properties film 5 is fitted with some infrared reflection films 7, and the infrared reflection film 7 is located at the temperature-sensitive
The underface of element 1；The lower section of the lower insulating properties film 5 is provided with protective layer 13, and the protective layer 13 is by the lower insulating properties
Film 5 and infrared reflection film 7 are covered.In the present embodiment, the quantity of temperature-sensitive element 1 is 3.
In the present embodiment, the upper insulating properties film 4 and lower insulating properties film 5 are formed by infrared transmitting film.Institute
State temperature-sensitive element 1 and thin-film thermistor element that temperature compensating element 14 is the film forming on the lower insulating properties film 5.It is described
Jointing 3 and conductive wires film 2 are formed by mode of printing.
The connector modules have the side of jointing 3 located at the sensor diaphragm；The connector modules bag
A main controller is included, the main controller is connected with wireless communication module and power supply, and the main controller is electrically connected with the jointing 3
Connect.
In the present embodiment, the connector modules include a housing 8, and one end of the housing 8 is with described for accommodating
The holding tank 9 of sensor diaphragm one end, the top of the holding tank 9 is hinged with rotatable lid 10 by articulated elements；It is described
The inner side of lid 10 is provided with downwardly projecting conductive bonding pin 11, and the bottom of the holding tank 9 is provided with for accommodating the conduction
The pin-and-hole 12 of connecting pin 11；There is the sensor diaphragm side of jointing 3 to be contained in the holding tank 9, described to lead
Electrical connector pin 11 has the position of jointing 3 through the sensor diaphragm, and the lower end of the conductive bonding pin 11 is placed in
In the pin-and-hole 12.
In the present embodiment, upper insulating properties film 4 clamps temperature-sensitive element 1, temperature-compensating between lower insulating properties film 5
The state of element 14, conductive wires film 2 and jointing 3 is pasted on lower insulating properties film 5.That is, temperature-sensitive element 1, temperature
Compensating element, 14, conductive wires film 2 and jointing 3 are clamped by a pair of insulating properties films.In addition, lower insulating properties film 5 and
Upper insulating properties film 4 is formed by infrared transmitting film.In the present embodiment, lower insulating properties film 5 and upper insulating properties film 4 by
Polyimide resin piece is formed.
The temperature-sensitive element 1 and temperature compensating element 14 can use thin-film thermistor element.In the present embodiment, temperature-sensitive
Element 1 and temperature compensating element 14 use following thin-film thermistor element：By Mn-Co systems metal composite oxide or in Mn-
The composition metal oxidation that at least one metal composite oxide comprising Ni, Fe, Cu is constituted in Co systems metal composite oxide
Thing film and be formed on the metal composite oxide film and be connected to the resistance measurements such as the comb poles of conductive wires film 2 use
Metal electrode (diagram is omitted).
The infrared absorbing film 6 is formed by the material with the infrared absorption rate higher than upper insulating properties film 4, for example
Formed by the film comprising infrared absorbing materials such as carbon blacks or infrared ray-absorbable glass-film.That is, by the infrared ray absorbing
Film 6 absorbs the infrared ray from determinand radiation, then by the heat transfer of upper insulating properties film 4, makes the temperature-sensitive element 1 of underface
Temperature change.The infrared absorbing film 6 covers the temperature-sensitive element 1 with the size less times greater than temperature-sensitive element 1.
The infrared reflection film 7 is formed by the material with the infrared emission rate less than lower insulating properties film 5, for example
Aluminium-vapour deposition film or aluminium foil by minute surface etc. are formed.The infrared reflection film 7 is with less times greater than temperature-sensitive element 1 and infrared absorbing film
6 size covers them.
The infrared ray absorbing temperature of the measurement of infrared absorbing film 6 is based on due to temperature-sensitive element 1, even if therefore not being pasted on survey
Determine to realize that contact is fixed on object, as long as being arranged close to state, even if generation position deviation somewhat can also be surveyed exactly
Constant temperature degree, mitigates installation operation and installation workload.Even if that is, setting when with measure object apart from slight variation, it is also possible to
Fully absorbed with infrared absorbing film 6 come the infrared ray of measure object radiation, temperature measuring is carried out well therefore, it is possible to precision.
Temperature compensating element 14 as determine ambient temperature reference, according to temperature compensating element 14 and temperature-sensitive element
1 detection relative value can improve the ultrared accuracy of detection of temperature-sensitive element 1.
And, wire is not used as distribution, and be utilized on lower insulating properties film 5 with pattern form integral printing
Conductive wires film 2, therefore, it is possible to suppress the increase of weight, improve the resistance to vibration of distribution.
In addition, infrared reflection film 7 is set, it is red beyond being cut down from measure object by infrared reflection film 7
The interference that outside line causes, it is possible to carry out the temperature measuring of higher precision.
Further, since temperature-sensitive element 1, temperature compensating element 14 and conductive wires film 2 by lower insulating properties film 5 and it is upper absolutely
Edge film 4 is clamped, therefore, temperature-sensitive element 1, temperature compensating element 14 and conductive wires film 2 will not expose, and can use insulation
Property film while protect them, further improve the resistance to vibration of distribution.
In the present embodiment, the connector modules accommodate the sensor diaphragm has one end of jointing 3, by electricity
The temperature value Wireless transceiver that will be sensed after connection sensing temperature is to remote work station.The front end of the housing 8 of connector modules is to open
Formula is put, and is formed with the holding tank 9 for accommodating sensor diaphragm one end, the top of the holding tank 9 is hinged by articulated elements
There is rotatable lid 10.
The inner side of the lid 10 is provided with downwardly projecting conductive bonding pin 11, and the bottom correspondence of the holding tank 9 is conductive
Connecting pin 11 is provided with pin-and-hole 12.The lid 10 is installed on the appearance of the housing 8 at the end of jointing 3 of the sensor diaphragm
Covered when receiving in groove 9 on holding tank 9, now, the conductive bonding pin 11 runs through jointing 3, the conductive bonding pin 11
End is placed in pin-and-hole 12.The conductive bonding pin 11 is mutually in status of electrically connecting when running through jointing 3.Also, can lead to
The conductive bonding pin 11 is crossed through sensor diaphragm to prevent the sensor diaphragm to be disconnected device module.
The main controller for being electrically connected to the conductive bonding pin 11 is provided with the housing 8, the temperature value that main controller is exported
It is sent to the wireless communication module and power supply of remote work station.
When the present embodiment works, temperature-sensitive element 1 and temperature compensating element 14 experience the change of temperature, such as film temperature-sensitive electricity
Resistance element varies with temperature its resistance and changes, and main controller reads its increased resistance value, and is converted into temperature value, then
By wireless communication module by the temperature value Wireless transceiver for converting to remote central control room.
Presently preferred embodiments of the present invention is the foregoing is only, is not intended to limit the invention, it is all in essence of the invention
Within god and principle, any modification, equivalent substitution and improvements made etc. should be included within the scope of the present invention.
Claims (5)
1. a kind of telemetering type temperature sensor, it is characterised in that including sensor diaphragm and connector modules；
The sensor diaphragm includes：
The temperature compensating element of the temperature-sensitive element of some film-forms and a film-form；
Some conductive wires films, each temperature-sensitive element and temperature compensating element are connected to a pair of conductive wiring film, some
The other end of the conductive wires film is connected to jointing；
Upper insulating properties film and lower insulating properties film, the upper insulation film are fitted in the top of the lower insulating properties film；Institute
State temperature-sensitive element, temperature compensating element, conductive wires film and jointing and be folded in the upper insulating properties film and lower insulation
Between property film；
Some infrared absorbing films are fitted with above the upper insulating properties film, the infrared absorbing film is located at the heat
The surface of quick element；
Some infrared reflection films are fitted with below the lower insulating properties film, the infrared reflection film is located at the heat
The underface of quick element；
It is provided with protective layer below the lower insulating properties film, the protective layer is by the lower insulating properties film and infrared reflection
Film is covered；
The connector modules have the side of jointing located at the sensor diaphragm；
The connector modules include a main controller, and the main controller is connected with wireless communication module and power supply, the main controller
Electrically connected with the jointing.
2. telemetering type temperature sensor as claimed in claim 1, it is characterised in that the upper insulating properties film and lower insulating properties
Film is formed by infrared transmitting film.
3. telemetering type temperature sensor as claimed in claim 2, it is characterised in that the temperature-sensitive element and temperature compensating element
It is the thin-film thermistor element of the film forming on the lower insulating properties film.
4. telemetering type temperature sensor as claimed in claim 3, it is characterised in that the jointing and conductive wires film
Formed by mode of printing.
5. telemetering type temperature sensor as claimed in claim 4, it is characterised in that the connector modules include a housing,
One end of the housing has the holding tank for accommodating described sensor diaphragm one end, and the top of the holding tank is by being hinged
Part is hinged with rotatable lid；
Downwardly projecting conductive bonding pin is provided with the inside of the lid, the bottom of the holding tank is provided with for accommodating described leading
The pin-and-hole of electrical connector pin；
There is the sensor diaphragm side of jointing to be contained in the holding tank, and the conductive bonding pin is described in
The lower end that sensor diaphragm has the position of jointing, the conductive bonding pin is placed in the pin-and-hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611032238.8A CN106768454A (en) | 2016-11-22 | 2016-11-22 | Telemetering type temperature sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611032238.8A CN106768454A (en) | 2016-11-22 | 2016-11-22 | Telemetering type temperature sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106768454A true CN106768454A (en) | 2017-05-31 |
Family
ID=58971584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611032238.8A Pending CN106768454A (en) | 2016-11-22 | 2016-11-22 | Telemetering type temperature sensor |
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| Country | Link |
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| CN (1) | CN106768454A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113008378A (en) * | 2021-02-24 | 2021-06-22 | 维沃移动通信有限公司 | Terminal device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011033358A (en) * | 2009-07-29 | 2011-02-17 | Mitsubishi Materials Corp | Temperature sensor |
| CN102478432A (en) * | 2010-11-30 | 2012-05-30 | 三菱综合材料株式会社 | Infrared sensor |
| CN102478431A (en) * | 2010-11-22 | 2012-05-30 | 三菱综合材料株式会社 | Temperature sensor |
| CN102667431A (en) * | 2009-12-25 | 2012-09-12 | 三菱综合材料株式会社 | Infrared sensor |
| CN104220856A (en) * | 2012-02-29 | 2014-12-17 | 株式会社俞旻St | Film-type temperature sensor |
-
2016
- 2016-11-22 CN CN201611032238.8A patent/CN106768454A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011033358A (en) * | 2009-07-29 | 2011-02-17 | Mitsubishi Materials Corp | Temperature sensor |
| CN102667431A (en) * | 2009-12-25 | 2012-09-12 | 三菱综合材料株式会社 | Infrared sensor |
| CN102478431A (en) * | 2010-11-22 | 2012-05-30 | 三菱综合材料株式会社 | Temperature sensor |
| CN102478432A (en) * | 2010-11-30 | 2012-05-30 | 三菱综合材料株式会社 | Infrared sensor |
| CN104220856A (en) * | 2012-02-29 | 2014-12-17 | 株式会社俞旻St | Film-type temperature sensor |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113008378A (en) * | 2021-02-24 | 2021-06-22 | 维沃移动通信有限公司 | Terminal device |
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Application publication date: 20170531 |
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