CN106753108A - It is a kind of can high temperature rapid curing epoxyn - Google Patents
It is a kind of can high temperature rapid curing epoxyn Download PDFInfo
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- CN106753108A CN106753108A CN201611043399.7A CN201611043399A CN106753108A CN 106753108 A CN106753108 A CN 106753108A CN 201611043399 A CN201611043399 A CN 201611043399A CN 106753108 A CN106753108 A CN 106753108A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J163/04—Epoxynovolacs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Field of adhesive technology the invention belongs to be used for inductance element, more particularly to it is a kind of can high temperature rapid curing epoxyn.The technical problems to be solved by the invention be to provide it is a kind of can be with rapid curing, the adhesive that energy consumption is low, adhesion strength is high.In order to solve the above problems, technical scheme provided by the present invention is：It is a kind of can high temperature rapid curing epoxyn, the component and percentage by weight of the adhesive are：Liquid bisphenol A types epoxy resin 10% 22%, solid-state bisphenol A type epoxy resin 10% 15%, liquid bisphenol F types epoxy resin 20% 30%, novolac epoxy resin 15% 25%, the modified electron level dicy-curing agent of micro powder type 2% 5%, substituted urea 0.5% 1%, epoxy imidazole adducts 3% 5%, amine modifier 12% 17%, nano core-shell modifier 4% 9%, fumed silica 0.5% 2%, surface modified silicon dioxide 10% 20%.The beneficial effects of the present invention are can reducing energy consumption, improve and throughput rate and can improve the existing product subsequent use life-span.
Description
Technical field
Field of adhesive technology the invention belongs to be used for inductance element, more particularly to it is a kind of can high temperature rapid curing ring
Oxygen resin adhesive.
Background technology
At present, because I-shaped inductance and colour loop inductance are largely used on electronic apparatus, there is the huge market demand, together
When, supply is also very big.Regardless of whether being I-shaped inductance or colour loop inductance, adhesive, but I-shaped inductance and color will be used
Adhesive on ring inductance belongs to minority's product again in adhesive industry.Again because such inductance need with 430 DEG C to higher by 550
DEG C, it is very high for product condition of cure, it is necessary to which that hot setting can just obtain TG high, and TG high could meet 430 DEG C and 550 DEG C
The performance requirement crossed after tin.So many adhesive producing persons do not do specific aim exploitation.Conventional product curing rate is all needed
Want 280 DEG C x240 seconds, or 220 DEG C x360 seconds.Therefore user will consume excessive energy consumption, and high temperature is crossed after tin
There is no good adhesive strength.
The content of the invention
The technical problems to be solved by the invention be to provide it is a kind of can be with rapid curing, the glue that energy consumption is low, adhesion strength is high
Stick.
In order to solve the above problems, technical scheme provided by the present invention is：
It is a kind of can high temperature rapid curing epoxyn, the component and percentage by weight of the adhesive are：Liquid
State bisphenol A type epoxy resin 10%-22%, solid-state bisphenol A type epoxy resin 10%-15%, liquid bisphenol F type epoxy resin
20%-30%, novolac epoxy resin 15%-25%, the modified electron level dicy-curing agent 2%-5% of micro powder type, substituted urea
0.5%-1%, epoxy imidazole adducts 3%-5%, amine modifier 12%-17%, nano core-shell modifier 4%-9%, gas phase
Method silica 0.5%-2%, surface modified silicon dioxide 10%-20%.
Preferably, the component and percentage by weight of the adhesive are：Liquid bisphenol A type epoxy resin 10%-13%, Gu
State bisphenol A type epoxy resin 10%-12%, liquid bisphenol F types epoxy resin 20%-22%, novolac epoxy resin 15%-
17%, the modified electron level dicy-curing agent 2%-5%, substituted urea 0.5%-1%, epoxy imidazole adducts 3%- of micro powder type
5%, amine modifier 12%-17%, nano core-shell modifier 4%-9%, fumed silica 0.5%-2%, surface is modified
Silica 1 0%-13%.
Preferably, the component and percentage by weight of the adhesive are：Liquid bisphenol A type epoxy resin 13%-17%, Gu
State bisphenol A type epoxy resin 12%-13%, liquid bisphenol F types epoxy resin 22%-26%, novolac epoxy resin 17%-
23%, the modified electron level dicy-curing agent 2%-5%, substituted urea 0.5%-1%, epoxy imidazole adducts 3%- of micro powder type
5%, amine modifier 12%-17%, nano core-shell modifier 4%-7%, fumed silica 0.5%-2%, surface is modified
Silica 1 3%-15%.
Preferably, the component and percentage by weight of the adhesive are：Liquid bisphenol A type epoxy resin 17%-22%, Gu
State bisphenol A type epoxy resin 13%-15%, liquid bisphenol F types epoxy resin 26%-30%, novolac epoxy resin 23%-
25%, the modified electron level dicy-curing agent 2%-5%, substituted urea 0.5%-1%, epoxy imidazole adducts 3%- of micro powder type
5%, amine modifier 12%-17%, nano core-shell modifier 7%-9%, fumed silica 0.5%-7%, surface is modified
Silica 1 5%-20%.
The beneficial effects of the present invention are：Product of the present invention is high temperature rapid curing product, is to improve I-shaped inductance
With colour loop inductance throughput rate, and reduction energy consumption.And while energy consumption is reduced, passable raising production
Speed and can improve the existing product subsequent use life-span；In addition, when I-shaped inductance and colour loop inductance are bonded PIN
Time can provide effective bonding simultaneously.
Specific embodiment
In order to become apparent from, completely illustrate present disclosure, optimal implementation method is provided below to illustrate present inventive concept.
Certainly, provide embodiment to be intended to illustrate design of the invention, be not the whole of design of the present invention, less should
It is considered as the limitation of design content of the present invention.Under the enlightenment of the implementation method for being provided, done any scheme belongs to this
The protection domain of invention.
Embodiment 1
It is a kind of can high temperature rapid curing epoxyn, the component and percentage by weight of the adhesive are：Liquid
State bisphenol A type epoxy resin 10%, solid-state bisphenol A type epoxy resin 10%, liquid bisphenol F types epoxy resin 30%, phenolic aldehyde ring
Oxygen tree fat 15%, the modified electron level dicy-curing agent 4% of micro powder type, substituted urea 0.5%, epoxy imidazole adducts 4%, amine changes
Property thing 12%, nano core-shell modifier 4%, fumed silica 0.5%, surface modified silicon dioxide 10%.
Embodiment 2
It is a kind of can high temperature rapid curing epoxyn, the component and percentage by weight of the adhesive are：Liquid
State bisphenol A type epoxy resin 12%, solid-state bisphenol A type epoxy resin 13%, liquid bisphenol F types epoxy resin 20%, phenolic aldehyde ring
Oxygen tree fat 15%, the modified electron level dicy-curing agent 2% of micro powder type, substituted urea 1%, epoxy imidazole adducts 3%, amine is modified
Thing 16%, nano core-shell modifier 5%, fumed silica 1%, surface modified silicon dioxide 12%.
Embodiment 3
It is a kind of can high temperature rapid curing epoxyn, the component and percentage by weight of the adhesive are：Liquid
State bisphenol A type epoxy resin 14%, solid-state bisphenol A type epoxy resin 15%, liquid bisphenol F types epoxy resin 22%, phenolic aldehyde ring
Oxygen tree fat 17%, the modified electron level dicy-curing agent 2% of micro powder type, substituted urea 0.5%, epoxy imidazole adducts 3%, amine changes
Property thing 12%, nano core-shell modifier 4%, fumed silica 0.5%, surface modified silicon dioxide 10%.
Embodiment 3
It is a kind of can high temperature rapid curing epoxyn, the component and percentage by weight of the adhesive are：Liquid
State bisphenol A type epoxy resin 14%, solid-state bisphenol A type epoxy resin 15%, liquid bisphenol F types epoxy resin 22%, phenolic aldehyde ring
Oxygen tree fat 17%, the modified electron level dicy-curing agent 2% of micro powder type, substituted urea 0.5%, epoxy imidazole adducts 3%, amine changes
Property thing 12%, nano core-shell modifier 4%, fumed silica 0.5%, surface modified silicon dioxide 10%.
Embodiment 4
It is a kind of can high temperature rapid curing epoxyn, the component and percentage by weight of the adhesive are：Liquid
State bisphenol A type epoxy resin 13%, solid-state bisphenol A type epoxy resin 10%, liquid bisphenol F types epoxy resin 22%, phenolic aldehyde ring
Oxygen tree fat 16%, the modified electron level dicy-curing agent 3% of micro powder type, substituted urea 0.6%, epoxy imidazole adducts 4%, amine changes
Property thing 13%, nano core-shell modifier 6%, fumed silica 1.4%, surface modified silicon dioxide 11%.
Embodiment 5
It is a kind of can high temperature rapid curing epoxyn, the component and percentage by weight of the adhesive are：Liquid
State bisphenol A type epoxy resin 11%, solid-state bisphenol A type epoxy resin 12%, liquid bisphenol F types epoxy resin 24%, phenolic aldehyde ring
Oxygen tree fat 15%, the modified electron level dicy-curing agent 2% of micro powder type, substituted urea 0.8%, epoxy imidazole adducts 4.2%, amine
Modifier 12%, nano core-shell modifier 5%, fumed silica 1%, surface modified silicon dioxide 13%.
Embodiment 6
It is a kind of can high temperature rapid curing epoxyn, the component and percentage by weight of the adhesive are：Liquid
State bisphenol A type epoxy resin 10%, solid-state bisphenol A type epoxy resin 10%, liquid bisphenol F types epoxy resin 20%, phenolic aldehyde ring
Oxygen tree fat 15%, the modified electron level dicy-curing agent 5% of micro powder type, substituted urea 0.7%, epoxy imidazole adducts 5%, amine changes
Property thing 12%, nano core-shell modifier 4%, fumed silica 2%, surface modified silicon dioxide 16.3%.
Embodiment 7
It is a kind of can high temperature rapid curing epoxyn, the component and percentage by weight of the adhesive are：Liquid
State bisphenol A type epoxy resin 10%, solid-state bisphenol A type epoxy resin 10%, liquid bisphenol F types epoxy resin 20%, phenolic aldehyde ring
Oxygen tree fat 15%, the modified electron level dicy-curing agent 2% of micro powder type, substituted urea 0.5%, epoxy imidazole adducts 3%, amine changes
Property thing 12%, nano core-shell modifier 7%, fumed silica 0.5%, surface modified silicon dioxide 20%.
Embodiment 8
It is a kind of can high temperature rapid curing epoxyn, the component and percentage by weight of the adhesive are：Liquid
State bisphenol A type epoxy resin 10%, solid-state bisphenol A type epoxy resin 10%, liquid bisphenol F types epoxy resin 21%, phenolic aldehyde ring
Oxygen tree fat 16%, the modified electron level dicy-curing agent 2% of micro powder type, substituted urea 0.9%, epoxy imidazole adducts 3.1%, amine
Modifier 17%, nano core-shell modifier 9%, fumed silica 1%, surface modified silicon dioxide 10%.
Embodiment 9
It is a kind of can high temperature rapid curing epoxyn, the component and percentage by weight of the adhesive are：Liquid
State bisphenol A type epoxy resin 13%, solid-state bisphenol A type epoxy resin 10%, liquid bisphenol F types epoxy resin 20%, phenolic aldehyde ring
Oxygen tree fat 25%, the modified electron level dicy-curing agent 2% of micro powder type, substituted urea 0.5%, epoxy imidazole adducts 3%, amine changes
Property thing 12%, nano core-shell modifier 4%, fumed silica 0.5%, surface modified silicon dioxide 10%.
Embodiment 10
It is a kind of can high temperature rapid curing epoxyn, the component and percentage by weight of the adhesive are：Liquid
State bisphenol A type epoxy resin 22%, solid-state bisphenol A type epoxy resin 10%, liquid bisphenol F types epoxy resin 20%, phenolic aldehyde ring
Oxygen tree fat 16%, the modified electron level dicy-curing agent 2% of micro powder type, substituted urea 0.5%, epoxy imidazole adducts 3%, amine changes
Property thing 12%, nano core-shell modifier 4%, fumed silica 0.5%, surface modified silicon dioxide 10%.
Embodiment 11
It is a kind of can high temperature rapid curing epoxyn, the component and percentage by weight of the adhesive are：Liquid
State bisphenol A type epoxy resin 17%, solid-state bisphenol A type epoxy resin 11%, liquid bisphenol F types epoxy resin 25%, phenolic aldehyde ring
Oxygen tree fat 15%, the modified electron level dicy-curing agent 2% of micro powder type, substituted urea 0.5%, epoxy imidazole adducts 3%, amine changes
Property thing 12%, nano core-shell modifier 4%, fumed silica 0.5%, surface modified silicon dioxide 10%.
Embodiment 12
It is a kind of can high temperature rapid curing epoxyn, the component and percentage by weight of the adhesive are：Liquid
State bisphenol A type epoxy resin 10%, solid-state bisphenol A type epoxy resin 15%, liquid bisphenol F types epoxy resin 20%, phenolic aldehyde ring
Oxygen tree fat 23%, the modified electron level dicy-curing agent 2% of micro powder type, substituted urea 0.5%, epoxy imidazole adducts 3%, amine changes
Property thing 12%, nano core-shell modifier 4%, fumed silica 0.5%, surface modified silicon dioxide 10%.
Embodiment 13
It is a kind of can high temperature rapid curing epoxyn, the component and percentage by weight of the adhesive are：Liquid
State bisphenol A type epoxy resin 20%, solid-state bisphenol A type epoxy resin 10%, liquid bisphenol F types epoxy resin 22%, phenolic aldehyde ring
Oxygen tree fat 16%, the modified electron level dicy-curing agent 2% of micro powder type, substituted urea 0.5%, epoxy imidazole adducts 3%, amine changes
Property thing 12%, nano core-shell modifier 4%, fumed silica 0.5%, surface modified silicon dioxide 10%.
Embodiment 14
It is a kind of can high temperature rapid curing epoxyn, the component and percentage by weight of the adhesive are：Liquid
State bisphenol A type epoxy resin 21%, solid-state bisphenol A type epoxy resin 11%, liquid bisphenol F types epoxy resin 21%, phenolic aldehyde ring
Oxygen tree fat 15%, the modified electron level dicy-curing agent 2% of micro powder type, substituted urea 0.5%, epoxy imidazole adducts 3%, amine changes
Property thing 12%, nano core-shell modifier 4%, fumed silica 0.5%, surface modified silicon dioxide 10%.
Embodiment 15
It is a kind of can high temperature rapid curing epoxyn, the component and percentage by weight of the adhesive are：Liquid
State bisphenol A type epoxy resin 15%, solid-state bisphenol A type epoxy resin 10%, liquid bisphenol F types epoxy resin 28%, phenolic aldehyde ring
Oxygen tree fat 15%, the modified electron level dicy-curing agent 2% of micro powder type, substituted urea 0.5%, epoxy imidazole adducts 3%, amine changes
Property thing 12%, nano core-shell modifier 4%, fumed silica 0.5%, surface modified silicon dioxide 10%.
Embodiment 16
It is a kind of can high temperature rapid curing epoxyn, the component and percentage by weight of the adhesive are：Liquid
State bisphenol A type epoxy resin 15%, solid-state bisphenol A type epoxy resin 12%, liquid bisphenol F types epoxy resin 26%, phenolic aldehyde ring
Oxygen tree fat 15%, the modified electron level dicy-curing agent 2% of micro powder type, substituted urea 0.5%, epoxy imidazole adducts 3%, amine changes
Property thing 12%, nano core-shell modifier 4%, fumed silica 0.5%, surface modified silicon dioxide 10%.
Embodiment 17
It is a kind of can high temperature rapid curing epoxyn, the component and percentage by weight of the adhesive are：Liquid
State bisphenol A type epoxy resin 11%, solid-state bisphenol A type epoxy resin 10%, liquid bisphenol F types epoxy resin 20%, phenolic aldehyde ring
Oxygen tree fat 22%, the modified electron level dicy-curing agent 2% of micro powder type, substituted urea 0.5%, epoxy imidazole adducts 3%, amine changes
Property thing 12%, nano core-shell modifier 4%, fumed silica 0.5%, surface modified silicon dioxide 15%.
Embodiment 18
It is a kind of can high temperature rapid curing epoxyn, the component and percentage by weight of the adhesive are：Liquid
State bisphenol A type epoxy resin 10%, solid-state bisphenol A type epoxy resin 10%, liquid bisphenol F types epoxy resin 20%, phenolic aldehyde ring
Oxygen tree fat 20%, the modified electron level dicy-curing agent 2% of micro powder type, substituted urea 0.5%, epoxy imidazole adducts 3%, amine changes
Property thing 12%, nano core-shell modifier 4%, fumed silica 0.5%, surface modified silicon dioxide 18%.
On inventive principle of the invention：The present invention selects high-purity, and low viscous bisphenol A type epoxy resin, liquid are double
The novolac epoxy resin certain proportion mixing of phenol F types epoxy resin and different molecular weight, then adds a certain proportion of nanometer
Nucleocapsid modifier, makes product of the present invention have good operation, high temperature resistant, high intensity, the main carriers of high tenacity.It is modified using micro powder type
The good dispersive property of electron level dicy-curing agent, with the highly compatible reached and between main carrier resin.Substituted urea is added, can
To be effectively promoted the solidification of the modified electron level dicy-curing agent of micro powder type, at the same make product high temperature rapid curing when
Wait, be unlikely to because early stage curing rate is too fast, and causes the product cannot to ensure adhesive strength.To the matrix resin of this product,
Curing system has been fully completed.Add a certain proportion of aerosil and using helping to adjust glue user
When optimal construction effect, and a certain degree of reinforcement.High speed promotion system is initially added into again, adds epoxy imidazoles addition
Thing, and amine modifier, are effectively mixed.Effective mixing can allow whole product during heating cure, stablize
And uniformly promote whole product form, early stage PhastGel and solidification can be mainly provided.The promotion system of this system, makes
Can entirely be formulated can rapid shaping in tens seconds at high temperature, to reach required performance.According to the glue that above composition makes
Stick, being capable of shipping storage at normal temperatures, low cost, low energy consumption, high efficiency, practical value high and environment-friendly epoxy tree
Fat bonding agent.
Claims (4)
1. it is a kind of can high temperature rapid curing epoxyn, it is characterised in that：The component and weight hundred of the adhesive
Point ratio is：Liquid bisphenol A type epoxy resin 10%-22%, solid-state bisphenol A type epoxy resin 10%-15%, liquid bisphenol F types
Epoxy resin 20%-30%, novolac epoxy resin 15%-25%, the modified electron level dicy-curing agent 2%-5% of micro powder type,
Substituted urea 0.5%-1%, epoxy imidazole adducts 3%-5%, amine modifier 12%-17%, nano core-shell modifier 4%-
9%, fumed silica 0.5%-2%, surface modified silicon dioxide 10%-20%.
2. adhesive according to claim 1, it is characterised in that the component and percentage by weight of the adhesive be：Liquid
State bisphenol A type epoxy resin 10%-13%, solid-state bisphenol A type epoxy resin 10%-12%, liquid bisphenol F type epoxy resin
20%-22%, novolac epoxy resin 15%-17%, the modified electron level dicy-curing agent 2%-5% of micro powder type, substituted urea
0.5%-1%, epoxy imidazole adducts 3%-5%, amine modifier 12%-17%, nano core-shell modifier 4%-9%, gas phase
Method silica 0.5%-2%, surface modified silicon dioxide 10%-13%.
3. adhesive according to claim 1, it is characterised in that the component and percentage by weight of the adhesive be：Liquid
State bisphenol A type epoxy resin 13%-17%, solid-state bisphenol A type epoxy resin 12%-13%, liquid bisphenol F type epoxy resin
22%-26%, novolac epoxy resin 17%-23%, the modified electron level dicy-curing agent 2%-5% of micro powder type, substituted urea
0.5%-1%, epoxy imidazole adducts 3%-5%, amine modifier 12%-17%, nano core-shell modifier 4%-7%, gas phase
Method silica 0.5%-2%, surface modified silicon dioxide 13%-15%.
4. adhesive according to claim 1, it is characterised in that the component and percentage by weight of the adhesive be：Liquid
State bisphenol A type epoxy resin 17%-22%, solid-state bisphenol A type epoxy resin 13%-15%, liquid bisphenol F type epoxy resin
26%-30%, novolac epoxy resin 23%-25%, the modified electron level dicy-curing agent 2%-5% of micro powder type, substituted urea
0.5%-1%, epoxy imidazole adducts 3%-5%, amine modifier 12%-17%, nano core-shell modifier 7%-9%, gas phase
Method silica 0.5%-7%, surface modified silicon dioxide 15%-20%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611043399.7A CN106753108A (en) | 2016-11-21 | 2016-11-21 | It is a kind of can high temperature rapid curing epoxyn |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611043399.7A CN106753108A (en) | 2016-11-21 | 2016-11-21 | It is a kind of can high temperature rapid curing epoxyn |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106753108A true CN106753108A (en) | 2017-05-31 |
Family
ID=58973881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611043399.7A Withdrawn CN106753108A (en) | 2016-11-21 | 2016-11-21 | It is a kind of can high temperature rapid curing epoxyn |
Country Status (1)
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| CN (1) | CN106753108A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112980370A (en) * | 2021-03-25 | 2021-06-18 | 重庆索梦得新材料科技有限公司 | High-strength wafer structure adhesive |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1297975A (en) * | 1999-11-26 | 2001-06-06 | 三友（天津）高分子技术有限公司 | Quick-setting single-component surface adhesive |
| CN101463239A (en) * | 2008-11-05 | 2009-06-24 | 深圳市道尔科技有限公司 | Single-component surface pasting adhesive capable of being rapidly cured |
| CN103087664A (en) * | 2013-01-29 | 2013-05-08 | 深圳市宝力科技有限公司 | Relay liquid state epoxy resin pouring sealant and preparation method thereof |
-
2016
- 2016-11-21 CN CN201611043399.7A patent/CN106753108A/en not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1297975A (en) * | 1999-11-26 | 2001-06-06 | 三友（天津）高分子技术有限公司 | Quick-setting single-component surface adhesive |
| CN101463239A (en) * | 2008-11-05 | 2009-06-24 | 深圳市道尔科技有限公司 | Single-component surface pasting adhesive capable of being rapidly cured |
| CN103087664A (en) * | 2013-01-29 | 2013-05-08 | 深圳市宝力科技有限公司 | Relay liquid state epoxy resin pouring sealant and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112980370A (en) * | 2021-03-25 | 2021-06-18 | 重庆索梦得新材料科技有限公司 | High-strength wafer structure adhesive |
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