CN106752729A - A kind of heat radiation coating, preparation method and flexible pcb board - Google Patents
A kind of heat radiation coating, preparation method and flexible pcb board Download PDFInfo
- Publication number
- CN106752729A CN106752729A CN201710036537.7A CN201710036537A CN106752729A CN 106752729 A CN106752729 A CN 106752729A CN 201710036537 A CN201710036537 A CN 201710036537A CN 106752729 A CN106752729 A CN 106752729A
- Authority
- CN
- China
- Prior art keywords
- heat radiation
- radiation coating
- weight portions
- substrate
- silicon dioxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
- C09D7/62—Additives non-macromolecular inorganic modified by treatment with other compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Paints Or Removers (AREA)
Abstract
The present invention provides a kind of heat radiation coating, including following components：The silicon dioxide powder of 15 20 weight portions, the epoxy resin of 70 80 weight portions, the solvent of 10 15 weight portions, the curing agent of 0.5 2 weight portions, the auxiliary agent of 21 27 weight portions.The preparation method of heat radiation coating of the invention is simple, and radiating and pressure-resistant effect are good.The flexible pcb board being made using heat radiation coating, by the use of the substrate of metal lightweight, flexibility and thermolysis in itself as carrier, by heat radiation coating even application on the surface of bearing substrate by the way of electrostatic spraying, to be formed with good pressure-resistant and heat radiation function the heat-radiating substrate of insulation, its manufacture craft is simple, can meet thermal conductivity it is good while can also meet its excellent insulating properties, and flexible pcb board is few using material, reduces Material Cost.
Description
Technical field
The invention belongs to pcb board technical field of heat dissipation, and in particular to a kind of heat radiation coating, preparation method and collection insulate and dissipate
The flexible pcb board that heat is integrated.
Background technology
At present, in the market major part flexible PCB is that one kind obtained in pi or mylar as base material can
Flexible print wiring board, but the heat conductivility of this kind of substrate is poor.As high power device is more and more, electronic component is increasingly more
Sample, the need for this kind of technology can not fully meet development.
The insulating barrier of traditional LED is typically all that using radiating paster or thermal grease, its heat-conducting effect is poor, and thickness compared with
Thickness, so that the heat energy for producing can not timely and effectively reach aluminium base outwards to radiate.The general thermal conductivity of good insulation preformance
Can be again poor, at the same meet heat conduction and insulating properties be difficult accomplish.
The content of the invention
In order to overcome the defect of prior art, it is an object of the invention to provide a kind of heat radiation coating and preparation method, system
Preparation Method is simple, and radiating and pressure-resistant effect are good.The flexible pcb board that is made using heat radiation coating, using metal in itself
The substrate of lightweight, flexibility and thermolysis is uniformly sprayed heat radiation coating by the way of electrostatic spraying as carrier
It is applied on the surface of bearing substrate, to form the substrate being integrated with the good pressure-resistant and heat sinking function of insulation, it makes work
Skill is simple, at the same can meet thermal conductivity it is good while can also meet its excellent insulating properties, and flexible is compound
Ceramic pcb board is few using material, reduces Material Cost.
What the present invention was realized in：
A kind of heat radiation coating, including following components：
The silicon dioxide powder of 15-20 weight portions,
The epoxy resin of 70-80 weight portions,
The solvent of 10-15 weight portions,
The curing agent of 0.5-2 weight portions,
The auxiliary agent of 21-27 weight portions.
Preferably, the particle diameter of the silicon dioxide powder is 3-5um,
The solvent be ethylene glycol, dimethylbenzene, n-butanol, dibasic acid ester mixture,
The curing agent is triethylene tetramine,
The auxiliary agent is coupling agent and defoamer.
Preferably, the coupling agent is one or more in KH550, KH560 and KH570, the consumption of the coupling agent
It is 0.5-2 weight portions,
The defoamer is silicon polyethers defoamer, and the consumption of the defoamer is 0.5-3 weight portions.
According to another aspect of the present invention, a kind of method for preparing above-mentioned heat radiation coating, comprises the steps：
S1:The treatment of silicon dioxide powder：Coupling agent is dissolved in ethanol, silicon dioxide powder is then added into coupling agent/second
In alcoholic solution, and pH value to 8-9 is adjusted, 70-80 DEG C of reaction 6h, centrifugation, ultrasonic ethanol is cleaned three times, then dried, obtains
It is the silicon dioxide powder of 3-5um to the modified particle diameter in surface, and silicon dioxide powder is dissolved in solvent, it is standby after ultrasonic dissolution,
S2：The preparation of mixture A：Epoxy resin and solvent are added in dispersion machine and are stirred to being completely dissolved, mixed
Compound A,
S3：The preparation of heat radiation coating：Modified silicon dioxide powder is added in mixture A and stirred, then successively
Add curing agent, coupling agent and defoamer and stir, obtain heat radiation coating.
Preferably, the speed being centrifuged in S1 is 12000r/min, and it is 10-15 minutes to be cleaned by ultrasonic the time each.
Preferably, the speed for being stirred in S2 is 200-400r/min, and mixing time is 10-20 minutes.
Preferably, silicon dioxide powder at least divides in 2 addition mixture A in S3, adds the stirring speed after silicon dioxide powder
It is 200-400r/min to spend, and mixing time is 10-20 minutes,
It is 600-800r/min that the mixing speed after curing agent, coupling agent and defoamer is added in S3, and mixing time is 10-
20 minutes.
In accordance with a further aspect of the present invention, a kind of flexible pcb board, including heat dissipating layer, conductive layer and cover layer,
The heat dissipating layer includes substrate and the thermal dispersant coatings being covered on substrate, and the thermal dispersant coatings are by above-mentioned heat-radiation coating
Material is made,
The conductive layer is formed on the heat dissipating layer by printed substrate line manufacturing process or screen printing process；
The cover layer is thermosetting ink, and the cover layer is covered on the conductive layer, cover layer thickness
≤12um。
Preferably, the substrate be the aluminium base of deflection, in aluminium copper substrate, titanium alloy substrate and copper base one
Kind.
Preferably, the preparation method of the heat dissipating layer is as follows：
(1) substrate pre-treatment：Substrate is carried out into alkali cleaning oil removing scale removal, then carries out phosphatization, after carry out twice washing, dry standby
With,
(2) prepared by thermal dispersant coatings：Using electrostatic spraying by heat radiation coating even application in substrate surface, and at 60-80 DEG C
Lower solidification 10-20 minutes, then solidifies 10-20 minutes at 100-120 DEG C, obtains thermal dispersant coatings, the thermal dispersant coatings thickness
60-80um。
Compared with prior art, the preparation method of heat radiation coating of the invention is simple, and radiating and pressure-resistant effect are good.Using scattered
The flexible pcb board that hot coating is made, the substrate using metal lightweight, flexibility and thermolysis in itself is made
It is carrier, there is well heat radiation coating even application on the surface of bearing substrate to be formed by the way of electrostatic spraying
Pressure-resistant and heat radiation function the heat-radiating substrate of insulation, its manufacture craft is simple, can meet thermal conductivity it is good while can also meet
Its excellent insulating properties, and flexible composite ceramics pcb board is few using material, reduces Material Cost.
Brief description of the drawings
Fig. 1 is flexible pcb board schematic diagram.
Mark in accompanying drawing is as follows：
1- heat dissipating layers, 11- substrates, 12- thermal dispersant coatings, 2- conductive layers, 3- cover layers.
Specific embodiment
Exemplary embodiment of the invention, feature and aspect are described in detail below with reference to accompanying drawing.Identical is attached in accompanying drawing
Icon note represents the same or analogous part of function.Although the various aspects of embodiment are shown in the drawings, unless special
Do not point out, it is not necessary to accompanying drawing drawn to scale.
For a person skilled in the art, it should be apparent that " forward and backward, upper and lower, left and right " for being referred in the application etc.
Direction word is merely to the present invention can be explained more intuitively, therefore above-mentioned direction word in the text is not constituted to this
The limitation of the protection domain of invention.
As shown in figure 1, a kind of flexible pcb board, including heat dissipating layer 1, conductive layer 2 and cover layer 3.Heat dissipating layer 1
Including substrate 11 and covering thermal dispersant coatings 12 on the substrate 11, conductive layer 2 is the line layer of design, and cover layer 3 is thermosetting
Property ink layer.Conductive layer 2 is formed on heat dissipating layer 1 by printed substrate line manufacturing process or screen printing process.Covering
Film layer 3 is thermosetting ink.Cover layer 3 is covered on conductive layer 2, cover layer thickness≤12um.Substrate 11 is deflection
Aluminium base, aluminium copper substrate, titanium alloy substrate and copper base in one kind.Thermal dispersant coatings 11 are made up of heat radiation coating.Dissipate
Hot coating, preparation method and integrate insulation with radiate flexible pcb board embodiment it is as follows：
Embodiment 1
A kind of radiating coating of flexible PCB, each component parts by weight are as follows：
15 weight portion particle diameters are the silicon dioxide powder of 5um,
The ethylene glycol of 15 weight portions,
The epoxy resin of 70 weight portions,
The triethylene tetramine of 1 weight portion,
The silicon polyethers defoamer of 1 weight portion,
The coupling agent KH-550 of 24 weight portions.
The preparation method of heat radiation coating：
S1:The treatment of silicon dioxide powder：The coupling agent KH-550 of 22 weight portions is dissolved in the ethanol of 87 weight portions and is formed
Coupling agent KH-550/ ethanol solutions, then 15 parts by weight of silica powder are added to the coupling agent KH-550/ of 109 weight portions
In ethanol solution, and pH value 8-9,70-80 DEG C of reaction 6h are adjusted with ammoniacal liquor, 10 points are separated with the centrifugation of 12000r/min
Clock, is cleaned by ultrasonic three times with 20ml ethanol as solvent, 10 minutes every time, is then dried, and it is 5um's to obtain the modified particle diameter in surface
Silicon dioxide powder, adds the ethylene glycol ultrasound of 2 weight portions fully dispersed standby.
S2：The preparation of mixture A：The ethylene glycol solvent of the epoxy resin of 70 weight portions and 13 weight portions is added into dispersion machine
To perfect solution, mixing speed is 400r/min to middle stirring at low speed, and mixing time is 20 minutes, obtains mixture A.
S3：Modified silicon-dioxide powdery mixed solution is divided 3 times and is added in mixture A, the stirring speed after addition
It is 400r/min to spend, and mixing time is 20 minutes, then the curing agent triethylene tetramine of 1 weight portion, the coupling of 2 weight portions are added dropwise successively
The silicon polyethers defoamer and high-speed stirred of agent KH-550 and 1 weight portion, mixing speed are 800r/min, and mixing time is 20 points
Clock, obtains heat radiation coating.
The heat dissipating layer preparation method of flexible pcb board is as follows：
(1) substrate pre-treatment：Deflection aluminium base carries out alkali cleaning degreasing and phosphorating treatment before spraying, to increase substrate table
The roughness in face, improves and the bond strength between coating, then is cleaned 30 minutes with ultrasonic wave ethanol, after cleaned with distilled water again
Twice, clean after 130 DEG C of dry for standby,
(2) heat radiation coating treatment：Heat radiation coating is sprayed on the substrate through pre-treatment, and is put into baking oven in 60 DEG C of lower half
Curing process 15 minutes, is allowed to levelling, then solidifies 20 minutes at 120 DEG C, obtains thermal dispersant coatings.
Embodiment 2
A kind of radiating coating of flexible PCB, each component parts by weight are as follows：
15 weight portion particle diameters are the silicon dioxide powder of 5um,
The dimethylbenzene of 5 weight portions
The n-butanol of 5 weight portions
The epoxy resin of 70 weight portions,
The triethylene tetramine of 0.5 weight portion,
The silicon polyethers defoamer of 1 weight portion,
The coupling agent KH-560 of 22 weight portions.
The preparation method of heat radiation coating：
S1:The treatment of silicon dioxide powder：The coupling agent KH-560 of 20 weight portions is dissolved in the ethanol of 80 weight portions and is formed
Coupling agent KH-560/ ethanol solutions, then 15 parts by weight of silica powder are added to the coupling agent KH-560/ of 100 weight portions
In ethanol solution, and pH value 8-9,70-80 DEG C of reaction 6h are adjusted with ammoniacal liquor, separated with the centrifugation of 12000r/min, used
20ml ethanol as solvent is cleaned by ultrasonic three times, 10 minutes every time, then dries, and obtains the dioxy that the modified particle diameter in surface is 5um
SiClx powder, adds 1：Ultrasound, fully dispersed standby in the dimethylbenzene and n-butanol mixed liquor of 12 weight portions.
S2：The preparation of mixture A：By the n-butanol of the weight portion of dimethylbenzene 4 of the epoxy resin of 70 weight portions and 4 weight portions
With stirring at low speed in addition dispersion machine to being completely dissolved, mixing speed is 400r/min, and mixing time is 20 minutes, is mixed
Thing A.
S3：Modified silicon-dioxide powdery mixed solution is divided 3 times and is added in mixture A, the stirring speed after addition
It is 400r/min to spend, and mixing time is 20 minutes, then the curing agent triethylene tetramine of 0.5 weight portion, 2 weight portion idols are added dropwise successively
The silicon polyethers defoamer and high-speed stirred of connection agent KH-560 and 1 weight portion, mixing speed is 800r/min, and mixing time is 20
Minute, heat radiation coating is obtained,
The heat dissipating layer preparation method of flexible pcb board is as follows：
(1) substrate pre-treatment：Deflection titanium alloy substrate carries out alkali cleaning degreasing and phosphorating treatment before spraying, to increase base
The roughness of plate surface, improves and the bond strength between coating, then is cleaned 30 minutes with ultrasonic wave ethanol, after use distilled water again
Cleaning twice, is cleaned after 130 DEG C of dry for standby,
(2) heat radiation coating treatment：Heat radiation coating is sprayed on the substrate through pre-treatment, and is put into baking oven in 60 DEG C of lower half
Curing process 15 minutes, is allowed to levelling, then solidifies 20 minutes at 120 DEG C, obtains thermal dispersant coatings.
Embodiment 3
A kind of radiating coating of flexible PCB, each component parts by weight are as follows：
15 weight portion particle diameters are the silicon dioxide powder of 5um,
The dibasic acid ester mixture (DBE) of 10 weight portions
The epoxy resin of 70 weight portions,
The triethylene tetramine of 0.5 weight portion,
The silicon polyethers defoamer of 2 weight portions,
The coupling agent kh-570 of 22 weight portions.
The preparation method of heat radiation coating：
S1:The treatment of silicon dioxide powder：The coupling agent kh-570 of 20 weight portions is dissolved in the ethanol of 78 weight portions and is formed
Coupling agent kh-570/ethanol solution, then 15 parts by weight of silica powder are added to the coupling agent kh-570/second of 98 weight portions
In alcoholic solution, and pH value 8-9,70-80 DEG C of reaction 6h are adjusted with ammoniacal liquor, separated with the centrifugation of 12000r/min, use 20ml
Ethanol as solvent is cleaned by ultrasonic three times, 10 minutes every time, then dries, and obtains the silica that the modified particle diameter in surface is 5um
Powder, adds the DBE ultrasounds of 2 weight portions fully dispersed standby.
S2：The preparation of mixture A：Will be low in the DBE solvents addition dispersion machine of the epoxy resin of 70 weight portions and 8 weight portions
Speed stirring, mixing speed is 400r/min, and mixing time is 20 minutes, obtains mixture A.
S3：Modified silicon-dioxide powdery mixed solution is divided 3 times and is added in mixture A, the stirring speed after addition
It is 400r/min to spend, and mixing time is 20 minutes, then the curing agent triethylene tetramine of 0.5 weight portion, 2 weight portion idols are added dropwise successively
The silicon polyethers defoamer and high-speed stirred of connection agent KH-570 and 2 weight portions, mixing speed is 800r/min, and mixing time is 20
Minute, heat radiation coating is obtained,
The heat dissipating layer preparation method of the pcb board of flexible is as follows：
(1) substrate pre-treatment：Deflection aluminium copper substrate carries out alkali cleaning degreasing and phosphorating treatment before spraying, to increase
The roughness of substrate surface, improves and the bond strength between coating, then clean 30 minutes with ultrasonic wave ethanol, after again use distill
Water is cleaned twice, is cleaned after 130 DEG C of dry for standby,
(2) heat radiation coating treatment：Heat radiation coating is sprayed on the substrate through pre-treatment, and is put into baking oven in 60 DEG C of lower half
Curing process 15 minutes, is allowed to levelling, then solidifies 20 minutes at 120 DEG C, obtains thermal dispersant coatings.
Table one：Embodiment 1-3 contrasts coating property test result
Remarks：Method of testing
Adhesive force：Hundred lattice are tested
Salt fog resistance：GB/T 1771-2007
Water resistance：GB/T 1731-2007
Compared with prior art, the preparation method of heat radiation coating of the invention is simple, and radiating and pressure-resistant effect are good.Using scattered
The flexible pcb board that hot coating is made, the substrate using metal lightweight, flexibility and thermolysis in itself is made
It is carrier, there is well heat radiation coating even application on the surface of bearing substrate to be formed by the way of electrostatic spraying
Pressure-resistant and heat radiation function the heat-radiating substrate of insulation, its manufacture craft is simple, can meet thermal conductivity it is good while can also meet
Its excellent insulating properties, and flexible composite ceramics pcb board is few using material, reduces Material Cost.
Finally it should be noted that：Above-described each embodiment is merely to illustrate technical scheme, rather than to it
Limitation；Although being described in detail to the present invention with reference to the foregoing embodiments, it will be understood by those within the art that：
It can still modify to the technical scheme described in previous embodiment, or which part or all technical characteristic are entered
Row equivalent；And these modifications or replacement, the essence of appropriate technical solution is departed from various embodiments of the present invention technical side
The scope of case.
Claims (10)
1. a kind of heat radiation coating, it is characterised in that：Including following components：
The silicon dioxide powder of 15-20 weight portions,
The epoxy resin of 70-80 weight portions,
The solvent of 10-15 weight portions,
The curing agent of 0.5-2 weight portions,
The auxiliary agent of 21-27 weight portions.
2. heat radiation coating according to claim 1, it is characterised in that：
The particle diameter of the silicon dioxide powder is 3-5um,
The solvent is one or more in dibasic acid ester mixture, dimethylbenzene, n-butanol and ethylene glycol,
The curing agent is triethylene tetramine,
The auxiliary agent is coupling agent and defoamer.
3. heat radiation coating according to claim 2, it is characterised in that：
The coupling agent is one or more in KH550, KH560 and KH570, and the consumption of the coupling agent is 0.5-2 weight
Part,
The defoamer is silicon polyethers defoamer, and the consumption of the defoamer is 0.5-3 weight portions.
4. a kind of method for preparing the heat radiation coating described in claim any one of 1-3, it is characterised in that：Comprise the steps：
S1:The treatment of silicon dioxide powder：Coupling agent is dissolved in ethanol, silicon dioxide powder is then added to coupling agent/ethanol
In solution, and pH value to 8-9 is adjusted, 70-80 DEG C of reaction 6h, centrifugation, ultrasonic ethanol is cleaned three times, then dried, obtains
The modified particle diameter in surface is the silicon dioxide powder of 3-5um, and then silicon dioxide powder is dissolved in solvent, standby after ultrasonic dissolution,
S2：The preparation of mixture A：Epoxy resin and solvent are added in dispersion machine and are stirred to being completely dissolved, obtain mixture
A,
S3：The preparation of heat radiation coating：Modified silicon dioxide powder is added in mixture A and stirred, is then sequentially added
Curing agent, coupling agent and defoamer are simultaneously stirred, and obtain heat radiation coating.
5. the method for preparing heat radiation coating according to claim 4, it is characterised in that：The speed of centrifugation is in S1
12000r/min, it is 10-15 minutes to be cleaned by ultrasonic the time each.
6. the method for preparing heat radiation coating according to claim 4, it is characterised in that：The speed stirred in S2 is 200-
400r/min, mixing time is 10-20 minutes.
7. the method for preparing heat radiation coating according to claim 4, it is characterised in that：
Silicon dioxide powder at least divides in 2 addition mixture A in S3, and it is 200- to add the mixing speed after silicon dioxide powder
400r/min, mixing time is 10-20 minutes,
It is 600-800r/min that the mixing speed after curing agent, coupling agent and defoamer is added in S3, and mixing time is 10-20 points
Clock.
8. a kind of flexible pcb board, it is characterised in that：Including heat dissipating layer, conductive layer and cover layer,
The heat dissipating layer includes substrate and the thermal dispersant coatings being covered on substrate, and the thermal dispersant coatings are any by claim 1-7
Heat radiation coating described in is made,
The conductive layer is formed on the heat dissipating layer by printed substrate line manufacturing process or screen printing process；
The cover layer is thermosetting ink, and the cover layer is covered on the conductive layer, cover layer thickness≤
12um。
9. flexible pcb board according to claim 8, it is characterised in that：The substrate for deflection aluminium base,
One kind in aluminium copper substrate, titanium alloy substrate and copper base.
10. flexible PCB according to claim 8, it is characterised in that：The preparation method of the heat dissipating layer is as follows：
(1) substrate pre-treatment：Substrate is carried out into alkali cleaning oil removing scale removal, then carries out phosphatization, after carry out twice washing, dry for standby,
(2) prepared by thermal dispersant coatings：It is using electrostatic spraying by heat radiation coating even application in substrate surface and solid at 60-80 DEG C
Change 10-20 minutes, then solidify 10-20 minutes at 100-120 DEG C, obtain thermal dispersant coatings, the thermal dispersant coatings thickness is 60-
80um。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710036537.7A CN106752729A (en) | 2017-01-18 | 2017-01-18 | A kind of heat radiation coating, preparation method and flexible pcb board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710036537.7A CN106752729A (en) | 2017-01-18 | 2017-01-18 | A kind of heat radiation coating, preparation method and flexible pcb board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106752729A true CN106752729A (en) | 2017-05-31 |
Family
ID=58944478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710036537.7A Pending CN106752729A (en) | 2017-01-18 | 2017-01-18 | A kind of heat radiation coating, preparation method and flexible pcb board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106752729A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111774262A (en) * | 2020-05-22 | 2020-10-16 | 广东日禾电器有限公司 | Composite heating slurry spin coating method for flexible substrate |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102516852A (en) * | 2011-12-16 | 2012-06-27 | 新高电子材料（中山）有限公司 | Weather-resistant and high thermal conductive coating, radiating solar rear panel and efficient solar cell panel |
| CN103596380A (en) * | 2013-11-07 | 2014-02-19 | 溧阳市江大技术转移中心有限公司 | Method for plating insulating thermal conductive plate with copper |
-
2017
- 2017-01-18 CN CN201710036537.7A patent/CN106752729A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102516852A (en) * | 2011-12-16 | 2012-06-27 | 新高电子材料（中山）有限公司 | Weather-resistant and high thermal conductive coating, radiating solar rear panel and efficient solar cell panel |
| CN103596380A (en) * | 2013-11-07 | 2014-02-19 | 溧阳市江大技术转移中心有限公司 | Method for plating insulating thermal conductive plate with copper |
Non-Patent Citations (1)
| Title |
|---|
| 蒋硕忠: "《绿色化学灌浆技术》", 31 August 2006, 长江出版社 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111774262A (en) * | 2020-05-22 | 2020-10-16 | 广东日禾电器有限公司 | Composite heating slurry spin coating method for flexible substrate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102660210B (en) | Halogen-free high heat-resistant and heat-conducting resin film and manufacturing method thereof | |
| CN105906832A (en) | Preparation method of graphene-containing water-based electrothermal film | |
| CN106626583B (en) | Ultrathin heat dissipation film and manufacturing method thereof | |
| JP2012530359A (en) | Method for shielding a substrate from electromagnetic interference | |
| JP2008106231A (en) | Adhesive sheet for electronic equipment | |
| CN104087186A (en) | Heat conducting adhesive tape and preparation method thereof | |
| CN114133791B (en) | Conductive ink and super-hydrophobic graphene composite deicing flexible electrothermal film | |
| CN106671501A (en) | Highly heat-resistant graphite film metal composite and preparation method thereof | |
| US10293956B2 (en) | Method for placing electrical conductors interior to a composite structure prior to curing | |
| KR102440882B1 (en) | Heat dissipation material adhering composition, heat dissipation material having adhesive, inlay substrate, and method for manufacturing same | |
| CN109021786A (en) | High thermal conductivity compound resin and preparation method thereof | |
| CN105131897B (en) | High heat conductive insulating Adhesive composition, high thermal conductivity aluminum matrix plate and its preparation technology | |
| CN106752729A (en) | A kind of heat radiation coating, preparation method and flexible pcb board | |
| EP3296365B1 (en) | Method for promoting electrical conduction between metallic components and composite materials | |
| CN112898929A (en) | Instant-curing liquid metal composite thermal interface material and preparation method thereof | |
| CN108300004B (en) | Graphene heat-conducting slurry and preparation method thereof | |
| CN106888548B (en) | A kind of aluminium-based copper-clad laminate and its painting method with graphene/carbon nano-tube composite radiating coating | |
| CN109996423B (en) | Composite multilayer graphite sheet structure, manufacturing method, heat dissipation structure and electronic device | |
| CN209964365U (en) | Waterproof functional precoating structure of electronic component | |
| TWI637012B (en) | Method for preparing heat-dissipating coating and metal heat-dissipating composite film made | |
| TWM589118U (en) | Thermal conductive film structure | |
| KR20220145933A (en) | Coating composition for heat radiation, printed circuit board coated the composition and methods for manufacturing the circuit board | |
| CN213029050U (en) | Composite heat dissipation film | |
| CN210432331U (en) | Electromagnetic shielding film with insulating structure layer | |
| CN103228101A (en) | FR4 circuit board enhanced by high-thermal-conductive nano DLC (diamond-like carbon) coating |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170531 |
|
| RJ01 | Rejection of invention patent application after publication |