CN106739289A - A kind of preparation method of Halogen, High Tg CCL - Google Patents

A kind of preparation method of Halogen, High Tg CCL Download PDF

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Publication number
CN106739289A
CN106739289A CN201611057437.4A CN201611057437A CN106739289A CN 106739289 A CN106739289 A CN 106739289A CN 201611057437 A CN201611057437 A CN 201611057437A CN 106739289 A CN106739289 A CN 106739289A
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preparation
halogen
parts
sheet material
epoxy resin
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CN106739289B (en
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秦伟峰
李宝东
陈长浩
王卫兴
朱琪琪
周鸥
李洪学
朱义刚
姜晓亮
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SHANDONG JINBAO ELECTRONICS CO Ltd
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Campbell Shandong Branch Of Ltd By Share Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/16—Drying; Softening; Cleaning
    • B32B38/164—Drying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/08—Interconnection of layers by mechanical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B2037/1269—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives multi-component adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

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  • Mechanical Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention belongs to copper-clad plate production technical field, more particularly to a kind of Halogen, High Tg CCL preparation method.The present invention does matrix resin using polyfunctional group base phosphorus system epoxy resin, increase the heat resistance of sheet material using phenol type novolac epoxy resin, lifting sheet material glass transition temperature, improve the fire resistance of sheet material using aluminium hydroxide, further improve sheet material heat resistance using talcum powder, it is surface-treated and size controlling by aluminium hydroxide and talcum powder, and kettle dispersion machine and emulsification motor are cut by the stirring mixing of various raw materials using height, uniform filling is distributed in resin adhesive liquid and glass-fiber-fabric, improve sheet material toughness；Its total halogen content is less than 900ppm, meets the non-halogen requirement such as European Union；In addition to the key propertys such as electric property, insulating properties with conventional halogen-free copper-clad plate, also with glass transition temperature higher, its Tg value is more than 160 DEG C for obtained copper-clad plate.

Description

A kind of preparation method of Halogen, High Tg CCL
Technical field
The invention belongs to copper-clad plate production technical field, more particularly to a kind of Halogen, High Tg CCL preparation method.
Background technology
After European Union and China's Mainland harmful substance limitation instruction ROHS implement successively after, comprising lead, cadmium, mercury, Cr VI, The material such as PBBs and PBDEs must not be used to manufacture electronic product or its component；Green peace organization (Green Peace the greening policy for) promoting energetically at this stage, it is desirable to which the bromine system that all of manufacturer excludes in its electronic product completely is fire-retardant Agent and polyvinyl chloride, unleaded and halogen-free environment-friendly electronic is had concurrently to meet.But still having many circuit-board industries at present can make With bromine-containing compound, because brominated flame retardant flame retardant effect is excellent, and cost is relatively low；Halide can discharge in ignition Go out the hydrogen halide that a large amount of toxicity are big, corrosivity is strong, this gas not only pollutes environment, a setting loss can be also caused to health Evil, and in the case where there is bromine and chlorine in hydrocarbon, the severe toxicity such as bioxin can be produced in low temperature partial combustion process Material.
(Tg130 refers to conventional halogen-free type Tg130 series：Sheet material glass transition temperature is 130 DEG C, hereinafter referred to as Tg130 plates Material) sheet material glass transition temperature it is low (125-145Tg150 DEG C), cause its heat resistance poor, be 50S-80S (according to IPC- TM-650-2.4.8 examination criterias).And the sheet material of phenolic resinoid solidification, although its heat resistance can reach requirement, sheet material It is crisp, poor toughness, sheet edge part produces a large amount of powder when cutting, and easily pollutes sheet material outward appearance and is gone, it is necessary to expend a large amount of manpowers Cleaning, and sheet material poor toughness, are unfavorable for being made precision end product high.
Therefore, in copper-clad plate production field, the demand in the halogen-free copper-clad plate market of Tg types high is increasing, but Tg types high Copper-clad plate still cannot be good the control heat resistance of sheet material, flammability and toughness reguirements.
The content of the invention
The deficiency that the present invention exists for above-mentioned prior art, there is provided a kind of Halogen, the preparation method of High Tg CCL.
The technical scheme that the present invention solves above-mentioned technical problem is as follows：The preparation method of a kind of Halogen, High Tg CCL, step It is rapid as follows：
(1) take 700 parts of polyfunctional group base phosphorus system epoxy resin, 55-60 parts of phenol type novolac epoxy resin, 20-25 parts it is solid Agent solution, 1.0-1.1 part accelerator solution, 325 parts of inorganic fillers, 3.0-3.5 parts of silane coupling agent and 700-710 parts are molten Agent, is well mixed, and glue is obtained；
(2) glue of step (1) is coated on E-glass cloth, 5-10min is toasted in 160-190 DEG C of baking oven, Prepreg is obtained；
(3) several prepregs obtained in step (2) are taken to be superimposed, its it is two-sided be respectively covered with a Copper Foil, Pressure is 1.0-2.8MPa, temperature is hot pressing 100-130min under the conditions of 150-210 DEG C, and cooling is obtained copper-clad plate.
The beneficial effects of the invention are as follows：
1st, the present invention does matrix resin using polyfunctional group base phosphorus system epoxy resin, is increased using phenol type novolac epoxy resin The heat resistance of splice material, lifts sheet material glass transition temperature, and the fire resistance of sheet material is improved using aluminium hydroxide, uses cunning Stone flour further improves sheet material heat resistance, is surface-treated and size controlling by aluminium hydroxide and talcum powder, and Kettle dispersion machine is cut using height and various raw materials are stirred and mixed by emulsification motor, uniform filling is distributed to resin adhesive liquid and glass-fiber-fabric In, improve sheet material toughness.
2nd, the present invention obtained Halogen, High Tg CCL, its total halogen content is less than 900ppm, meets European Union etc. non-halogen It is required that；Obtained copper-clad plate also has in addition to the key propertys such as electric property, insulating properties with conventional halogen-free copper-clad plate There is glass transition temperature higher, its Tg value is more than 160 DEG C.
On the basis of above-mentioned technical proposal, the present invention can also do following improvement.
Further, the polyfunctional group base phosphorus system epoxy resin described in step (1) is epoxide equivalent 180-220g/eq's The ODOPB of DOPO or epoxide equivalent 180-220g/eq.
Further, the phenol type novolac epoxy resin described in step (1) is the orthoresol of epoxide equivalent 195-230g/eq The DCPD benzene of formaldehyde epoxy resin, the BPA novolac epoxy resins of epoxide equivalent 195-230g/eq or epoxide equivalent 235-290g/eq Phenol novolak epoxy.
Further, the curing agent solution described in step (1) is dicyandiamide and halogen-free solvent with 1:10 weight is than dissolving It is obtained.
Further, the accelerator solution described in step (1) is methylimidazole and halogen-free solvent with 1:10 weight ratio Dissolving is obtained.
Further, described halogen-free solvent be DMF, acetone, methyl alcohol, butanone or toluene in one or more mix Close.
Further, the inorganic filler described in step (1) is the mixture of talcum powder and aluminium hydroxide.
Further, talcum powder and aluminium hydroxide be surface-treated with silane coupling agent, and control particle diameter It is 1-15 μm.
Further, the silane coupling agent described in step (1) is KH550, KH560 or KH570.
Further, the solvent described in step (1) is one or more mixing in acetone, DMF or butanone.
Specific embodiment
Principle of the invention and feature are described below in conjunction with example, example is served only for explaining the present invention, and It is non-for limiting the scope of the present invention.
Embodiment 1
A kind of preparation method of Halogen, High Tg CCL, step is as follows：
(1) 700 parts of polyfunctional group base phosphorus system epoxy resin DOPO, 58 parts of o-cresol formaldehyde epoxy resins, 25 parts of dicyandiamides are taken Solution, 1.06 parts of methylimidazole solution, 180 parts of talcum powder, 145 parts of aluminium hydroxides, 3.0 parts of KH550 and 700 part of DMF, open Height cuts kettle dispersion motor and emulsification motor, is well mixed, and glue is obtained；
(2) glue of step (1) is coated on E-glass cloth, 10min is toasted in 160 DEG C of baking ovens, be obtained half Cured sheets；
(3) several prepregs obtained in step (2) are taken to be superimposed, its it is two-sided be respectively covered with a Copper Foil, Pressure is 2.0MPa, temperature is hot pressing 100-130min under the conditions of 200 DEG C, and cooling is obtained copper-clad plate.
Embodiment 2
A kind of preparation method of Halogen, High Tg CCL, step is as follows：
(1) 700 parts of polyfunctional group base phosphorus system epoxy resin ODOPB, 55 parts of BPA novolac epoxy resins, 20 parts of dicyandiamides are taken Solution, 1.1 parts of methylimidazole solution, 180 parts of talcum powder, 145 parts of aluminium hydroxides, 3.5 parts of KH570 and 710 part of solvents (350 Part acetone mixes with 360 parts of butanone), open height and cut kettle dispersion motor and emulsification motor, it is well mixed, glue is obtained；
(2) glue of step (1) is coated on E-glass cloth, 5min is toasted in 190 DEG C of baking ovens, be obtained half solid Change piece；
(3) several prepregs obtained in step (2) are taken to be superimposed, its it is two-sided be respectively covered with a Copper Foil, Pressure is 1.5MPa, temperature is hot pressing 100min under the conditions of 210 DEG C, and cooling is obtained copper-clad plate.
The foregoing is only presently preferred embodiments of the present invention, be not intended to limit the invention, it is all it is of the invention spirit and Within principle, any modification, equivalent substitution and improvements made etc. should be included within the scope of the present invention.

Claims (9)

1. the preparation method of a kind of Halogen, High Tg CCL, it is characterised in that step is as follows：
(1) 700 parts of polyfunctional group base phosphorus system epoxy resin, 55-60 parts of phenol type novolac epoxy resin, 20-25 parts of curing agent are taken Solution, 1.0-1.1 part accelerator solution, 325 parts of inorganic fillers, 3.0-3.5 parts of silane coupling agent and 700-710 parts of solvents, It is well mixed, glue is obtained；
(2) glue of step (1) is coated on E-glass cloth, 5-10min is toasted in 160-190 DEG C of baking oven, be obtained Prepreg；
(3) several prepregs obtained in step (2) are taken to be superimposed, its it is two-sided be respectively covered with a Copper Foil, in pressure For 1.0-2.8MPa, temperature are hot pressing 100-130min under the conditions of 150-210 DEG C, cooling is obtained copper-clad plate.
2. preparation method according to claim 1, it is characterised in that the polyfunctional group base phosphorus system ring described in step (1) Oxygen tree fat is the ODOPB of the DOPO or epoxide equivalent 180-220g/eq of epoxide equivalent 180-220g/eq.
3. preparation method according to claim 1, it is characterised in that the phenol type epoxy novolac tree described in step (1) Fat is o-cresol formaldehyde epoxy resin, the BPA epoxy novolac trees of epoxide equivalent 195-230g/eq of epoxide equivalent 195-230g/eq The DCPD phenol novolac epoxy resins of fat or epoxide equivalent 235-290g/eq.
4. preparation method according to claim 1, it is characterised in that the curing agent solution described in step (1) is double cyanogen Amine is with halogen-free solvent with 1:10 weight is obtained than dissolving.
5. preparation method according to claim 1, it is characterised in that the accelerator solution described in step (1) is diformazan Base imidazoles is with halogen-free solvent with 1:10 weight is obtained than dissolving.
6. the preparation method according to claim 4 or 5, it is characterised in that described halogen-free solvent is DMF, acetone, first One or more mixing in alcohol, butanone or toluene.
7. preparation method according to claim 1, it is characterised in that the inorganic filler described in step (1) is talcum powder With the mixture of aluminium hydroxide.
8. preparation method according to claim 1, it is characterised in that the silane coupling agent described in step (1) is KH550, KH560 or KH570.
9. preparation method according to claim 1, it is characterised in that the solvent described in step (1) is acetone, DMF or One or more mixing in butanone.
CN201611057437.4A 2016-11-26 2016-11-26 A kind of preparation method of Halogen, High Tg CCL Active CN106739289B (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110254025A (en) * 2019-07-17 2019-09-20 江西省航宇新材料股份有限公司 A kind of copper-clad plate production treatment process
CN110283428A (en) * 2019-07-15 2019-09-27 山东金宝电子股份有限公司 A kind of copper-clad plate halogen-free resin composition and preparation method thereof
CN113667276A (en) * 2021-09-23 2021-11-19 江苏耀鸿电子有限公司 Halogen-free high-Tg copper-clad substrate and preparation method thereof
CN113912981A (en) * 2021-11-04 2022-01-11 江苏耀鸿电子有限公司 High-heat-resistance medium-Tg copper-clad plate and preparation method thereof
CN114133703A (en) * 2021-12-16 2022-03-04 山东金宝电子股份有限公司 Preparation method of halogen-free low-dielectric compatible high-frequency FR4 copper-clad plate

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CN101684191A (en) * 2009-08-27 2010-03-31 广东生益科技股份有限公司 Halogen-less high frequency resin composition, and prepreg and laminate manufacturing by using same
CN102134375A (en) * 2010-12-23 2011-07-27 广东生益科技股份有限公司 Halogen-free Tg resin composite and presoaked material and laminated board made by adopting same
CN102408859A (en) * 2011-11-14 2012-04-11 上海南亚覆铜箔板有限公司 Halogen-free environment-friendly bonding agent and preparation method thereof
CN103182831A (en) * 2013-04-02 2013-07-03 陕西生益科技有限公司 Preparation technology of copper-clad laminate based on halogen-free flame-retardant resin compositions

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Publication number Priority date Publication date Assignee Title
CN101684191A (en) * 2009-08-27 2010-03-31 广东生益科技股份有限公司 Halogen-less high frequency resin composition, and prepreg and laminate manufacturing by using same
CN102134375A (en) * 2010-12-23 2011-07-27 广东生益科技股份有限公司 Halogen-free Tg resin composite and presoaked material and laminated board made by adopting same
CN102408859A (en) * 2011-11-14 2012-04-11 上海南亚覆铜箔板有限公司 Halogen-free environment-friendly bonding agent and preparation method thereof
CN103182831A (en) * 2013-04-02 2013-07-03 陕西生益科技有限公司 Preparation technology of copper-clad laminate based on halogen-free flame-retardant resin compositions

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110283428A (en) * 2019-07-15 2019-09-27 山东金宝电子股份有限公司 A kind of copper-clad plate halogen-free resin composition and preparation method thereof
CN110254025A (en) * 2019-07-17 2019-09-20 江西省航宇新材料股份有限公司 A kind of copper-clad plate production treatment process
CN113667276A (en) * 2021-09-23 2021-11-19 江苏耀鸿电子有限公司 Halogen-free high-Tg copper-clad substrate and preparation method thereof
CN113912981A (en) * 2021-11-04 2022-01-11 江苏耀鸿电子有限公司 High-heat-resistance medium-Tg copper-clad plate and preparation method thereof
CN114133703A (en) * 2021-12-16 2022-03-04 山东金宝电子股份有限公司 Preparation method of halogen-free low-dielectric compatible high-frequency FR4 copper-clad plate
CN114133703B (en) * 2021-12-16 2024-01-26 山东金宝电子有限公司 Preparation method of halogen-free low-dielectric compatible high-frequency FR4 copper-clad plate

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