CN106715613B - 可热成形的聚合物厚膜透明导体及其在电容式开关电路中的用途 - Google Patents

可热成形的聚合物厚膜透明导体及其在电容式开关电路中的用途 Download PDF

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Publication number
CN106715613B
CN106715613B CN201580049697.4A CN201580049697A CN106715613B CN 106715613 B CN106715613 B CN 106715613B CN 201580049697 A CN201580049697 A CN 201580049697A CN 106715613 B CN106715613 B CN 106715613B
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China
Prior art keywords
weight
transparent conductor
thick film
switching circuit
polymer thick
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Expired - Fee Related
Application number
CN201580049697.4A
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English (en)
Chinese (zh)
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CN106715613A (zh
Inventor
J·R·多尔夫曼
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DuPont Electronics Inc
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EI Du Pont de Nemours and Co
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Publication of CN106715613A publication Critical patent/CN106715613A/zh
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Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/042—Coating with two or more layers, where at least one layer of a composition contains a polymer binder
    • C08J7/0423—Coating with two or more layers, where at least one layer of a composition contains a polymer binder with at least one layer of inorganic material and at least one layer of a composition containing a polymer binder
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/044—Forming conductive coatings; Forming coatings having anti-static properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02—Polyalkylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D171/00—Coating compositions based on polyethers obtained by reactions forming an ether link in the main chain; Coating compositions based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
    • C08G2650/56—Polyhydroxyethers, e.g. phenoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2369/00—Characterised by the use of polycarbonates; Derivatives of polycarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2375/00—Characterised by the use of polyureas or polyurethanes; Derivatives of such polymers
    • C08J2375/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2475/00—Characterised by the use of polyureas or polyurethanes; Derivatives of such polymers
    • C08J2475/04—Polyurethanes

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Laminated Bodies (AREA)
  • Contacts (AREA)
CN201580049697.4A 2014-09-18 2015-09-01 可热成形的聚合物厚膜透明导体及其在电容式开关电路中的用途 Expired - Fee Related CN106715613B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/489,878 US9431147B2 (en) 2014-09-18 2014-09-18 Thermoformable polymer thick film transparent conductor and its use in capacitive switch circuits
US14/489,878 2014-09-18
PCT/US2015/047846 WO2016043963A1 (en) 2014-09-18 2015-09-01 Thermoformable polymer thick film transparent conductor and its use in capacitive switch circuits

Publications (2)

Publication Number Publication Date
CN106715613A CN106715613A (zh) 2017-05-24
CN106715613B true CN106715613B (zh) 2020-02-18

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CN201580049697.4A Expired - Fee Related CN106715613B (zh) 2014-09-18 2015-09-01 可热成形的聚合物厚膜透明导体及其在电容式开关电路中的用途

Country Status (5)

Country Link
US (1) US9431147B2 (enExample)
EP (1) EP3195328B1 (enExample)
JP (1) JP6592080B2 (enExample)
CN (1) CN106715613B (enExample)
WO (1) WO2016043963A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10072177B2 (en) 2014-11-06 2018-09-11 E I Du Pont De Nemours And Company Stretchable polymer thick film compositions for thermoplastic substrates and wearables electronics
US20160183328A1 (en) * 2014-12-17 2016-06-23 E I Du Pont De Nemours And Company Method and devices for high temperature thick film pastes
FR3052594B1 (fr) 2016-06-10 2018-11-23 Commissariat A L'energie Atomique Et Aux Energies Alternatives Dispositif a piste electriquement conductrice et procede de fabrication du dispositif
FR3061800B1 (fr) * 2017-01-12 2019-05-31 Commissariat A L'energie Atomique Et Aux Energies Alternatives Dispositif comprenant un substrat apte a etre thermoforme sur lequel est agence un organe electriquement conducteur

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101280100A (zh) * 2007-04-05 2008-10-08 帝人化成株式会社 导电性树脂组合物
WO2014119463A1 (ja) * 2013-01-30 2014-08-07 Dic株式会社 導電性ペースト、導電性パターンの形成方法及び導電性パターン印刷物

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5112687A (en) 1990-05-02 1992-05-12 Advanced Products Inc. Highly conductive polymer thick film compositions
US5631311A (en) 1994-08-18 1997-05-20 E. I. Du Pont De Nemours And Company Transparent static dissipative formulations for coatings
DE102004014645A1 (de) * 2004-03-25 2005-10-13 Mitsubishi Polyester Film Gmbh Transparente, elektrisch leitfähige, beschichtete Polyesterfolie, Verfahren zu ihrer Herstellung sowie ihre Verwendung
JP4784550B2 (ja) * 2007-05-08 2011-10-05 住友金属鉱山株式会社 透明導電塗料及び透明導電膜
US20090169724A1 (en) * 2007-12-27 2009-07-02 Toshiaki Ogiwara Conductive paste for use in membrane touch switch applications
US20130068512A1 (en) * 2011-09-20 2013-03-21 Ei Du Pont De Nemours And Company Thermoformable polymer thick film silver conductor and its use in capacitive switch circuits
US20130069016A1 (en) * 2011-09-20 2013-03-21 E. I. Du Pont De Nemours And Company Thermoformable polymer thick film silver conductor for capacitive switches
US9245666B2 (en) 2011-09-20 2016-01-26 E I Du Pont De Nemours And Company Thermoformable polymer thick film silver conductor and its use in capacitive switch circuits
US9573438B2 (en) * 2013-04-10 2017-02-21 E I Du Pont De Nemours And Company Polymer thick film positive temperature coefficient carbon composition

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101280100A (zh) * 2007-04-05 2008-10-08 帝人化成株式会社 导电性树脂组合物
WO2014119463A1 (ja) * 2013-01-30 2014-08-07 Dic株式会社 導電性ペースト、導電性パターンの形成方法及び導電性パターン印刷物

Also Published As

Publication number Publication date
JP2017531073A (ja) 2017-10-19
CN106715613A (zh) 2017-05-24
US20160086686A1 (en) 2016-03-24
EP3195328B1 (en) 2018-11-28
US9431147B2 (en) 2016-08-30
JP6592080B2 (ja) 2019-10-16
WO2016043963A1 (en) 2016-03-24
EP3195328A1 (en) 2017-07-26

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Effective date of registration: 20221115

Address after: Delaware

Patentee after: DuPont Electronics

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Patentee before: E.I. Nemours DuPont

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20200218