CN106705911A - Thermal wave imaging film layer thickness detection system and method - Google Patents
Thermal wave imaging film layer thickness detection system and method Download PDFInfo
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- 238000003384 imaging method Methods 0.000 title claims abstract description 22
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- 230000005284 excitation Effects 0.000 claims abstract description 37
- 238000012360 testing method Methods 0.000 claims abstract description 29
- 230000000750 progressive effect Effects 0.000 claims abstract description 16
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- 230000001360 synchronised effect Effects 0.000 claims description 7
- 238000001931 thermography Methods 0.000 abstract description 18
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 238000000691 measurement method Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 42
- 239000010408 film Substances 0.000 description 33
- 239000000523 sample Substances 0.000 description 25
- 238000000576 coating method Methods 0.000 description 13
- 239000011248 coating agent Substances 0.000 description 12
- 239000000463 material Substances 0.000 description 6
- 238000005259 measurement Methods 0.000 description 5
- 239000011247 coating layer Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
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- 238000005070 sampling Methods 0.000 description 3
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Abstract
The invention relates to a thermal wave imaging film layer thickness measurement method. Pulse heating is performed on the surface of a test piece by using a high-power thermal excitation source; the thermal wave signals of the surface of the test piece are recorded by using a thermal imaging device adopting the mode of progressive scanning so as to obtain a curve of which the thermal wave signals of the surface of the test piece change along with time; and then fitting of the curve and a corresponding theoretical model is performed so as to obtain the thickness of the surface film layer of the test piece.
Description
Technical field
The present invention relates to a kind of thicknesses of layers detecting system and method based on thermal wave imagine technique, especially with the uniform thermal excitation of pulsed, and the detection to thicknesses of layers is realized using progressive scan thermal imaging, belong to Infrared Non-destructive Testing technical field.
Background technology
As the fast development of science and technology, coating are more and more extensive with the application of film, measurement of the industrial quarters to thicknesses of layers proposes requirement higher, such as require online, noncontact, real-time detection etc..The conventional method that the detection to thicknesses of layers is used at present is mainly including vortex, ultrasound, X-ray, sonde method and optical method etc., but these methods can not fully meet requirement of the modern industry to film thickness measuring, as eddy-current method is required to backing material property, it is necessary to conductive；Ultrasonic method needs couplant, and can not effectively measure film layer；X-ray requirement sample must can carry out transmission detection, and have the requirement of specific safety protection；The detection of probe contact-type owned by France, may injure sample；And optical method requirement film layer must be transparent medium, and with very best bright finish, etc..At present many coatings with thickness of thin, nontransparent, the fragile characteristic such as easily damaged, therefore meet measurement the needs more advanced technological means of use of these film layers.
Thermal wave imagine technique is the nondestructiving detecting means that RECENT DEVELOPMENTS is got up, its general principle is that surface of test piece is heated using thermal excitation source, produce thermal pulse and to test specimen internal communication, a part will be produced to reflect back into the surface of test specimen when heat wave runs into the local heat energy that defect or thermal impedance change inside test specimen, dynamic Temperature Distribution is formed in surface of test piece.Using the thermal infrared imager record information that changes over time of surface of test piece temperature, then heat wave signal is corrected by image procossing, data processing and analysis, realize the detection to thicknesses of layers.Compared to traditional nondestructiving detecting means, thermal wave imagine technique has unique advantage, such as noncontact, large area fast imaging, be adapted to nontransparent coating, to thermal property sensitivity of material etc., the demand to thicknesses of layers detection in modern industry can be met.
Need to obtain the curve that heat wave signal is changed over time when detecting film layer using thermal wave imagine technique, this is typically by obtaining to a series of infrared images of sample surfaces continuous acquisition, a data point is represented per two field picture, sample frequency is frame frequency, for example for the thermal imaging system of 50Hz frame frequencies, the sampling period is just 20 milliseconds.For the detection of relatively thin film layer, particularly high thermal conductivity materials film layer, because of its heat wave signal intensity quickly, such as within tens even several milliseconds of times, therefore common thermal imaging system cannot gather enough data points to obtain the curve that complete heat wave signal is changed over time.Be this at present only using the thermal imaging system of frame frequency high, and this thermal imaging system is sufficiently expensive, from thus limit the application of this technology.
The content of the invention
The purpose of the present invention proposes a kind of new thickness detection method based on thermal wave imagine technique aiming at the deficiency of current thicknesses of layers e measurement technology.Its specific method is：First sample surfaces are carried out with full-sized pulse thermal excitation, i.e. the thermal pulse of sample surfaces each point results from synchronization；When being acquired to sample surfaces heat wave signal, in the form of progressive scan, i.e., the acquisition time of adjacent rows has the time delay that the individual time is line period.The heat wave signal do not gone together on the width heat wave image for so obtaining has different time delays, and along the direction that thermal imaging system row is scanned, this time delay is in increase progressively.So heat wave signal is equal to signal change in time in the change along scanning direction.The heat wave signal of every row is linked to be curve by the direction scanned along thermal imaging system row, then it is fitted with theoretical model, such that it is able to derive the thickness of film layer.In this case, heat wave signal sampling frequencies are the line frequency of thermal imaging system, therefore compared to sample frequency in conventional method for the situation of frame frequency improves hundreds times, so performance requirement to thermal imaging system is greatly reduced.
According to above-mentioned principle, a kind of typical method for measuring thicknesses of layers of the invention comprises the following steps：
A, the characteristic according to test specimen film layer, determine the energy of thermal excitation source, and surface to test specimen carries out PULSE HEATING excitation heat wave；
B, the heat wave image using progressive scan mode collection test specimen surface；
C, in the heat wave image multiple pixel values are chosen along progressive scan direction, the multiple pixel value order is arranged, form the heat wave signal curve of film layer；
D, the above-mentioned heat wave signal curve theoretical model corresponding with the film layer is carried out into numerical fitting, draw the thickness and other physical parameters of the film layer.
Brief description of the drawings
Fig. 1 is one embodiment of the present invention system block diagram；
Fig. 2 is thermal wave imaging principle schematic；
Fig. 3 changes over time curve for the heat wave signal of different-thickness film layer；
Fig. 4 is the principle schematic of the inventive method；
Fig. 5 is another embodiment of the invention system block diagram；
Fig. 6 is another embodiment system block diagram of the invention.
Specific embodiment
In order that the features of the present invention can be best understood from, below with reference to specific drawings and Examples, the present invention will be further described.
First shown in Fig. 2 be thermal wave imaging Non-Destructive Testing principle, pulse heat exciting unit 22 carries out short-lived pulses heating to sample surfaces 30, pulse heat wave 33 is produced to be propagated to sample interior, when the interface 36 of coating 31 and substrate 32 is run into, part transmission heat wave 35 continues to be propagated toward sample interior, it is related to the physical characteristic of the thickness of film layer and two kinds of materials that another part reflection heat wave 34 can return to sample surfaces, time, intensity that heat wave is reflected etc..Therefore the temperature of sample surfaces changes with time the physical parameter with film layer, such as thickness, thermal conductivity correlation.Shown in Fig. 3 is curve that several typical heat wave signals are changed over time, what curve 37 was represented is the sample surfaces heat wave signal in the case of no film layer, 38,39 situations represented when having coating of curve, three curve coincides together in early days, because reflection heat wave 34 is not reflected also from interface 36.When the arrival surface of heat wave 34 is reflected, three signals are initially separated, and coating is thinner, and the time of separation is more early, and as shown in 38 in Fig. 3 and 39, the coating wherein representated by curve 38 is just thinner than curve 39, and the more thin then signal of coating is stronger.Real-time Collection is carried out to the temperature of sample surfaces using thermal imaging system, the curve that temperature is changed over time is obtained, recycling respective formula to be fitted the curve just can learn including the physical parameter including coating layer thickness.Therefore the key of film layer detection is to accurately obtain the film surface temperature to change with time relation.
In the case where short pulse plane heat source carries out thermal excitation, the distribution in sample interior temperature field can be expressed by one-dimensional model：
,
Whereinα= K/ (ρ CV ) it is thermal diffusivity, K is the coefficient of heat conduction,ρIt is density,CV It is thermal capacitance,qIt is thermal excitation energy density.
If ignoring the heat transfer of air, in the case where sample is for half infinity, solution above formula obtains sample surface temperature and changes with time：
,
WhereinC = q/(ρ CV )。
It is when there is thickness on the surface of sampledFilm layer when, surface temperature can be similar to：
WhereinrIt is the hot reflection coefficient at interface 36, is decided by two kinds of thermal parameters of material.In above-mentioned formula, and coating layer thicknessdContinuous item isr*exp(-d2/ α t), it can be seen that when film layer is very thin, i.e. d<<1, only existtDuring very little, this is just meaningful with coating layer thickness continuous item, that is to say, that the change of heat wave signal in a short period of time can reflect thicknesses of layers, and the change of heat wave signal depends mainly on the characteristic of backing material after having spent this period, and film layer is substantially unrelated.Therefore thin film layer thickness is detected, just must within a very short time gathers the curve that heat wave signal is changed over time.
For thicker coating, reflection heat wave 34 reaches time of sample surfaces than later, and the change of heat wave signal is slower, therefore thermal imaging system using common frame frequency can also collect the image of enough frame numbers.But if coating is than relatively thin, such as below hundreds of microns, quickly, useful information is occurred as soon as and disappeared in the time of millisecond magnitude for the change of heat wave signal.The frame frequency cycle of conventional thermal imaging system, at 20 milliseconds or so, does not collect a few width images, it is impossible to depict the curve that heat wave signal is changed over time exactly, thus can not be accurately obtained the information of coating layer thickness in this period.Although frame frequency thermal imaging system high can improve this problem to a certain extent, this thermal imaging system is sufficiently expensive, and the image resolution ratio of output declines to a great extent with the raising of frame frequency.
Fig. 1 show thermal wave imaging film layer measuring system schematic diagram of the present invention.System includes data acquisition processing system 27, synchronous control unit 23, thermal excitation driving source 21, thermal excitation unit 22, infreared imaging device 25 etc..Under the control of data acquisition processing system 27, thermal excitation driving source 21 drives thermal excitation unit 22 to produce high power, the thermal excitation of short pulse, surface to test specimen 24 is heated, and this pulse thermal excitation source can be high power flash, laser and other energy-rich radiation sources.The change that data acquisition processing system 27 passes through the continuous acquisition sample surface temperature of infreared imaging device 25, synchronous control unit 23 is used to coordinate the sequential relationship between thermal excitation pulse generation and IMAQ.
The working method of thermal infrared imager have gazing type and progressive scan type point, gazing type refers to that all pixels of entire image all integrate in synchronization and keep signal in the chips, then to export line by line, therefore often between row pixel does not have time delay.And the infreared imaging device 25 in present system must use progressive scan type, that is, often the integration of row pixel for not in the same time, image postpones line by line in direction of line scan, the time delay of adjacent rows is the line-scanning period.Most non-refrigeration type infrared focal plane detectors are all using progressive scan form in the market.
Fig. 4 further illustrates principle of the invention.When the thermal imaging system using progressive scan, each pixel column order of its focus planardetector 41 is integrated and read successively from top to bottom, and often the capable sampling time is different, there is a delay for line period.If each row heat wave signal sequence coupled together along the direction of line scan of focus planardetector 41, such as Fig. 4（b）Shown, it is possible to obtain heat wave signal versus time curve 42, its sample frequency is line frequency.If using a thermal imaging system for routine 50Hz frame frequencies, if 500 row pixels, its line frequency is 2500Hz, therefore can greatly improve the sample frequency of heat wave image.Data processing, such as background signal amendment and denoising are carried out to heat wave signal versus time curve 42, then by the fitting with corresponding theory model, just can obtain the thickness and other information of coating.
It is to realize the detection to time change in the change in space by heat wave signal in above-mentioned implementation method, or perhaps the signal that will be changed over time is converted into the signal of spatial variations.So if accurately to measure the thickness of coating, it is desirable to which coating is more uniform in sample surfaces certain limit internal ratio.
The embodiment above carries out the collection of heat wave image using progressive scan focal plane thermal infrared imager, but other IMAQ modes can also be used, the mode that one-dimensional infrared array detector 51 combines scanning galvanometer 53 is employed in another embodiment as shown in Figure 5.One-dimensional infrared array detector 51 is by single file（Or several rows）Infrared sensor array is constituted, and galvanometer 53 carries out one-dimensional scanning under the control of scanner driver 52 to the surface of test specimen 24, so as to obtain the heat wave image on the surface of test specimen 24.The price of this one-dimensional infrared array detector is much lower compared with two-dimensional infrared thermal imaging system, therefore can be in the case of lower cost, the one-dimensional infrared array detector using signal to noise ratio refrigeration mode higher or with higher pixel.Certain present invention can also be realized using the infrared sensor of single pixel by way of 2-D vibration mirror scanning.
Shown in Fig. 6 is another implementation method of the invention, and in order to reach the purpose of progressive scan, system equally uses one-dimensional infrared array detector 51, and further includes motor driver 61 and one-dimensional movement platform 62.Test specimen 24 is placed on mobile platform 62, and mobile platform 62 carries out one-dimensional scanning under the driving of motor driver 61, and synchronous control unit 23 is used to control the sequential relationship between the scanning of mobile platform 62 and thermal excitation pulse.
In sum, the film thickness measuring method that the present invention takes comprises the following steps：
A, the characteristic according to the film layer of test specimen 24, determine the energy of thermal excitation unit 22, and surface to test specimen 24 carries out PULSE HEATING excitation heat wave；
B, the heat wave image using progressive scan mode collection test specimen 24 surface；
C, in the heat wave image multiple pixel values are chosen along progressive scan direction, the multiple pixel value order is arranged, the heat wave signal for forming film layer changes over time curve 42；
D, above-mentioned heat wave signal is changed over time the theoretical model corresponding with the film layer of curve 42 carry out numerical fitting, draw the thickness and other physical parameters of the film layer.
In order to accurately obtain the thickness of film layer, some other parameters in theoretical model need to be demarcated by the measurement to standard specimen, and standard specimen and test specimen have a same physical characteristic, and the thickness of film layer has passed through other means and determines in advance.
Main application of the invention is measurement thicknesses of layers, and film layer can be single or multiple lift, it is also possible to be applied to the detection to other film layer physical characteristics, such as bonding quality of the thermal characteristic of film layer and substrate, mechanics parameter and film layer and substrate.
The above description of this invention is illustrative instead of limiting, it is modified within the scope of the appended claims, is changed and equivalent, will all fall within protection scope of the present invention.
Claims (7)
1. a kind of thermal wave imaging thicknesses of layers detecting system, it is characterised in that the system includes：
Thermal excitation unit（22）, the thermal excitation unit（22）For producing high energy pulse to radiate, and in test specimen（24）Surface excitation pulse heat wave；
Thermal excitation driving source（21）, the thermal excitation driving source（21）For driving the thermal excitation unit（22）；
Infreared imaging device（25）, the infreared imaging device（25）Using progressive scan mode, for gathering the test specimen（24）The heat wave signal on surface；
Data acquisition processing system（27）, the data acquisition processing system（27）For gathering heat wave image and being analyzed treatment；
Synchronous control unit（23）, the synchronous control unit（23）For adjusting the thermal excitation unit（22）And infreared imaging device（25）Sequential relationship between IMAQ.
2. thermal wave imaging thicknesses of layers detecting system according to claim 1, the thermal excitation unit（22）It is high power flash.
3. thermal wave imaging thicknesses of layers detecting system according to claim 1, the thermal excitation unit（22）It is high power laser.
4. thermal wave imaging thicknesses of layers detecting system according to claim 1, the infreared imaging device（25）Including one-dimensional infrared array detector（51）With scanning galvanometer（53）.
5. thermal wave imaging thicknesses of layers detecting system according to claim 1, the infreared imaging device（25）Including single pixel Infrared Detectors and two-dimensional scanning mirrors.
6. a kind of thermal wave imaging thicknesses of layers detecting system, it is characterised in that the system includes：
Thermal excitation unit（22）, the thermal excitation unit（22）For producing high energy pulse to radiate, and in test specimen（24）Surface excitation pulse heat wave；
Thermal excitation driving source（21）, the thermal excitation driving source（21）For driving the thermal excitation unit（22）；
Data acquisition processing system（27）, the data acquisition processing system（27）For gathering heat wave image and being analyzed treatment；
Mobile platform（62）, the mobile platform（62）For carrying the test specimen（24）Carry out one-dimensional scanning；
One-dimensional infrared array detector（51）, the one-dimensional infrared array detector（51）For gathering the test specimen（24）The heat wave signal on surface；
Synchronous control unit（23）, the synchronous control unit（23）For adjusting the thermal excitation unit（22）With the one-dimensional infrared array detector（51）With the mobile platform（62）Between sequential relationship.
7. a kind of thermal wave imaging thicknesses of layers detection method, it is characterised in that methods described comprises the following steps：
According to test specimen（24）The characteristic of film layer, determines thermal excitation unit（22）Excitation energy, and to the test specimen（24）Surface carry out pulse thermal excitation；
The test specimen is gathered by the way of progressive scan（24）The heat wave image on surface；
A series of pixel values are chosen along progressive scan direction order in the heat wave image, the heat wave signal for forming the film layer changes over time curve（42）；
The heat wave signal is changed over time into curve（42）The theoretical model corresponding with the film layer carries out numerical fitting, draws the thickness and other physical parameters of the film layer.
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| CN109959455A (en) * | 2019-03-13 | 2019-07-02 | 浙江大学 | One kind is based on lensless static infrared target scanned imagery device and method |
| CN110073171A (en) * | 2017-11-24 | 2019-07-30 | 韩国科学技术院 | The method and its equipment of visualization measurement are executed to the thickness distribution of paint film |
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| CN114719805A (en) * | 2022-02-18 | 2022-07-08 | 中国航发北京航空材料研究院 | Method and device for measuring thickness of thermal barrier coating of blade |
| CN117288103A (en) * | 2023-09-20 | 2023-12-26 | 广州泽亨实业有限公司 | Method and system for measuring film thickness of coating |
| CN117367344A (en) * | 2023-09-14 | 2024-01-09 | 深圳市汇天益电子有限公司 | Coating thickness measuring system and method based on infrared nondestructive testing technology |
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| CN117367344A (en) * | 2023-09-14 | 2024-01-09 | 深圳市汇天益电子有限公司 | Coating thickness measuring system and method based on infrared nondestructive testing technology |
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