CN106700418A - Epoxy resin modified titanium silicon resin and preparation method thereof - Google Patents
Epoxy resin modified titanium silicon resin and preparation method thereof Download PDFInfo
- Publication number
- CN106700418A CN106700418A CN201611133255.0A CN201611133255A CN106700418A CN 106700418 A CN106700418 A CN 106700418A CN 201611133255 A CN201611133255 A CN 201611133255A CN 106700418 A CN106700418 A CN 106700418A
- Authority
- CN
- China
- Prior art keywords
- parts
- epoxy resin
- resin
- bisphenol
- type epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
The invention relates to epoxy resin modified titanium silicon resin and a preparation method thereof, which belong to the technical field of resin. The titanium silicon resin is prepared from the following raw materials in parts by weight: 20 to 30 parts of bisphenol-A epoxy resin E-51, 10 to 20 parts of bisphenol-A epoxy resin E-44, 20 to 30 parts of titanium silicon resin, 10 to 20 parts of phenyl silicon resin, 3 to 5 parts of coupling agent KH-560, 3 to 5 parts of catalyst stannous octoate, 50 to 100 parts of methylbenzene, and 20 to 30 parts of epoxy resin diluents. By adopting the epoxy resin modified organic silicon resin, and introducing the epoxy group, the modified organic silicon resin can be cured by adopting a curing agent of epoxy resin, so that the curing temperature of the organic silicon resin is effectively lowered, and the resin can be cured at the normal temperature. The selected non-amine curing agent is a low-toxicity curing agent, so that not only is the curing at the room temperature realized, but also the mechanical performance of a cured material is excellent.
Description
Technical field
The present invention relates to a kind of titanium silicone resin and preparation method thereof, it is more particularly related to a kind of epoxy resin
Modifying titanium-silicon resin and preparation method thereof, belongs to resin technology field.
Background technology
Organic siliconresin has preferable heat resistance, and its varnish heatproof adds metal powder, heat-resisting fills out up to 200-250 DEG C
The coating that material and frit are prepared is resistant to 300-700 DEG C of high temperature, thus organic siliconresin frequently as high-temperature resistant coating it is main into
Membrane substance.High-temperature resistant coating is widely used, it is adaptable to automobile exhaust pipe, blast furnace, coke oven, petroleum cracking device, steel chimney etc.
The high temperature resistance protection of high temperature position.With continuing to develop for China's modern industry and deepening continuously for opening to the outside world, particularly smelting
New technology, new equipment constantly emerge in large numbers in the industries such as gold, petrochemical industry, the energy, new material, to the demand of high-temperature resistant coating increasingly
Greatly, thus develop high performance high-temperature resistant coating there are wide market prospects.But organic siliconresin is used as mainly to lack during coating
Point is to need hot setting, and hardening time is long；In high temperature, antiseptic power is poor in addition, resistance to organic to the poor adhesive force of base material
Solvent borne is poor, and the mechanical strength of paint film is bad when temperature is higher.
The content of the invention
Present invention seek to address that the problems of the prior art, there is provided a kind of epoxy resin modification titanium silicone resin, the resin is not
But can realize cold curing, and solidfied material good mechanical performance.
In order to realize foregoing invention purpose, its specific technical scheme is as follows：
A kind of epoxy resin modification titanium silicone resin, it is characterised in that：Including following raw materials by weight：
20-30 parts of bisphenol A type epoxy resin E-51
10-20 parts of bisphenol A type epoxy resin E-44
20-30 parts of titanium silicon silicones
Phenyl polysiloxane 10-20 parts
3-5 parts of coupling agent KH-560
3-5 parts of octoate catalyst stannous
Toluene 50-100 parts
Epoxy resin diluent 20-30 parts.
A kind of preparation method of epoxy resin modification titanium silicone resin, it is characterised in that：Comprise the following steps that：
A, bisphenol A type epoxy resin E-51, bisphenol A type epoxy resin E-44 and toluene are weighed according to recipe requirements and is added and one have
In the reactor of stirring, charge door and condenser pipe, stirring is until epoxy resin fully dissolves；
B, reaction is warming up to 60-65 DEG C at add epoxy resin diluent, titanium silicone resin, the stirring reaction 2- such as phenyl polysiloxane
3h；
C, in the reactor addition coupling agent KH-560 continue to stir up to each component is sufficiently mixed dissolving, cool down, and discharge, standby
With；
D, by 1:5-1:Be sufficiently mixed uniformly for above-mentioned product and octoate catalyst stannous by 8 ratio, pours into template simultaneously
It is placed in baking oven；
E, oven temperature is risen to 75-80 DEG C of 2-3h；Curing reaction 2-3h at 85-90 DEG C；110-120 DEG C of solidification 2-3h, cooling,
Take out mould, discharging.
The Advantageous Effects that the present invention brings：
The present invention uses epoxy resin modified organosilicon resin, by introducing epoxy radicals so that modified organic siliconresin can be adopted
Solidified with the curing agent of epoxy resin, so as to effectively reduce the solidification temperature of organic siliconresin, allow resin in normal temperature
It is i.e. curable down.The non-amine curing agent that the present invention is selected is a kind of curing agent of hypotoxicity, can not only realize cold curing,
And the good mechanical performance of solidfied material.
Specific embodiment
Embodiment 1
A kind of epoxy resin modification titanium silicone resin, including following raw materials by weight：
20 parts of bisphenol A type epoxy resin E-51
10 parts of bisphenol A type epoxy resin E-44
20 parts of titanium silicon silicones
10 parts of phenyl polysiloxane
3 parts of coupling agent KH-560
3 parts of octoate catalyst stannous
50 parts of toluene
20 parts of epoxy resin diluent.
Embodiment 2
A kind of epoxy resin modification titanium silicone resin, including following raw materials by weight：
30 parts of bisphenol A type epoxy resin E-51
20 parts of bisphenol A type epoxy resin E-44
30 parts of titanium silicon silicones
20 parts of phenyl polysiloxane
5 parts of coupling agent KH-560
5 parts of octoate catalyst stannous
100 parts of toluene
30 parts of epoxy resin diluent.
Embodiment 3
A kind of epoxy resin modification titanium silicone resin, including following raw materials by weight：
25 parts of bisphenol A type epoxy resin E-51
15 parts of bisphenol A type epoxy resin E-44
25 parts of titanium silicon silicones
15 parts of phenyl polysiloxane
4 parts of coupling agent KH-560
4 parts of octoate catalyst stannous
75 parts of toluene
25 parts of epoxy resin diluent.
Embodiment 4
A kind of preparation method of epoxy resin modification titanium silicone resin, comprises the following steps that：
A, bisphenol A type epoxy resin E-51, bisphenol A type epoxy resin E-44 and toluene are weighed according to recipe requirements and is added and one have
In the reactor of stirring, charge door and condenser pipe, stirring is until epoxy resin fully dissolves；
B, reaction is warming up to 60 DEG C at add epoxy resin diluent, titanium silicone resin, the stirring reaction 2h such as phenyl polysiloxane；
C, in the reactor addition coupling agent KH-560 continue to stir up to each component is sufficiently mixed dissolving, cool down, and discharge, standby
With；
D, by 1:Be sufficiently mixed uniformly for above-mentioned product and octoate catalyst stannous by 5 ratio, pours into template and is placed in
In baking oven；
E, oven temperature is risen to 75 DEG C of 2h；Curing reaction 2h at 85 DEG C；110 DEG C of solidification 2h, cooling, taking-up mould, discharging.
Embodiment 5
A kind of preparation method of epoxy resin modification titanium silicone resin, comprises the following steps that：
A, bisphenol A type epoxy resin E-51, bisphenol A type epoxy resin E-44 and toluene are weighed according to recipe requirements and is added and one have
In the reactor of stirring, charge door and condenser pipe, stirring is until epoxy resin fully dissolves；
B, reaction is warming up to 65 DEG C at add epoxy resin diluent, titanium silicone resin, the stirring reaction 3h such as phenyl polysiloxane；
C, in the reactor addition coupling agent KH-560 continue to stir up to each component is sufficiently mixed dissolving, cool down, and discharge, standby
With；
D, by 1:Be sufficiently mixed uniformly for above-mentioned product and octoate catalyst stannous by 8 ratio, pours into template and is placed in
In baking oven；
E, oven temperature is risen to 80 DEG C of 3h；Curing reaction 3h at 90 DEG C；120 DEG C of solidification 3h, cooling, taking-up mould, discharging.
Embodiment 6
A kind of preparation method of epoxy resin modification titanium silicone resin, comprises the following steps that：
A, bisphenol A type epoxy resin E-51, bisphenol A type epoxy resin E-44 and toluene are weighed according to recipe requirements and is added and one have
In the reactor of stirring, charge door and condenser pipe, stirring is until epoxy resin fully dissolves；
B, reaction is warming up to 62 DEG C at add epoxy resin diluent, titanium silicone resin, the stirring reaction 2.5h such as phenyl polysiloxane；
C, in the reactor addition coupling agent KH-560 continue to stir up to each component is sufficiently mixed dissolving, cool down, and discharge, standby
With；
D, by 1:Be sufficiently mixed uniformly for above-mentioned product and octoate catalyst stannous by 7 ratio, pours into template and is placed in
In baking oven；
E, oven temperature is risen to 77 DEG C of 2.5h；Curing reaction 2.5h at 88 DEG C；115 DEG C solidification 2.5h, cooling, take out mould,
Discharging.
Claims (2)
1. a kind of epoxy resin modification titanium silicone resin, it is characterised in that：Including following raw materials by weight：
20-30 parts of bisphenol A type epoxy resin E-51
10-20 parts of bisphenol A type epoxy resin E-44
20-30 parts of titanium silicon silicones
Phenyl polysiloxane 10-20 parts
3-5 parts of coupling agent KH-560
3-5 parts of octoate catalyst stannous
Toluene 50-100 parts
Epoxy resin diluent 20-30 parts.
2. the preparation method of a kind of epoxy resin modification titanium silicone resin according to claim 1, it is characterised in that：Including with
Lower processing step：
A, bisphenol A type epoxy resin E-51, bisphenol A type epoxy resin E-44 and toluene are weighed according to recipe requirements and is added and one have
In the reactor of stirring, charge door and condenser pipe, stirring is until epoxy resin fully dissolves；
B, reaction is warming up to 60-65 DEG C at add epoxy resin diluent, titanium silicone resin, the stirring reaction 2- such as phenyl polysiloxane
3h；
C, in the reactor addition coupling agent KH-560 continue to stir up to each component is sufficiently mixed dissolving, cool down, and discharge, standby
With；
D, by 1:5-1:Be sufficiently mixed uniformly for above-mentioned product and octoate catalyst stannous by 8 ratio, pours into template simultaneously
It is placed in baking oven；
E, oven temperature is risen to 75-80 DEG C of 2-3h；Curing reaction 2-3h at 85-90 DEG C；110-120 DEG C of solidification 2-3h, cooling,
Take out mould, discharging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611133255.0A CN106700418A (en) | 2016-12-10 | 2016-12-10 | Epoxy resin modified titanium silicon resin and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611133255.0A CN106700418A (en) | 2016-12-10 | 2016-12-10 | Epoxy resin modified titanium silicon resin and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106700418A true CN106700418A (en) | 2017-05-24 |
Family
ID=58937026
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611133255.0A Pending CN106700418A (en) | 2016-12-10 | 2016-12-10 | Epoxy resin modified titanium silicon resin and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106700418A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101544745A (en) * | 2009-04-22 | 2009-09-30 | 大连理工大学 | Method using MQ silicon resin and nanometer TiO2 for compound modification of epoxy resin |
| CN101712762A (en) * | 2009-11-13 | 2010-05-26 | 广东工业大学 | High-temperature resistant epoxy-titanium silicone resin capable of being solidified at a room temperature, preparation method thereof and application thereof |
| CN102532809A (en) * | 2011-11-17 | 2012-07-04 | 杭州师范大学 | Organosilicon-epoxy resin composition and preparation method thereof |
| CN104293267A (en) * | 2014-10-23 | 2015-01-21 | 卢儒 | Pouring sealant of organosilicon modified epoxy resin for class-C electric welding machine and preparation method of pouring sealant |
| CN104774587A (en) * | 2014-03-18 | 2015-07-15 | 岳胜武 | High-viscosity high-heat resistance modified organic silicone resin binder and preparation method thereof |
-
2016
- 2016-12-10 CN CN201611133255.0A patent/CN106700418A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101544745A (en) * | 2009-04-22 | 2009-09-30 | 大连理工大学 | Method using MQ silicon resin and nanometer TiO2 for compound modification of epoxy resin |
| CN101712762A (en) * | 2009-11-13 | 2010-05-26 | 广东工业大学 | High-temperature resistant epoxy-titanium silicone resin capable of being solidified at a room temperature, preparation method thereof and application thereof |
| CN102532809A (en) * | 2011-11-17 | 2012-07-04 | 杭州师范大学 | Organosilicon-epoxy resin composition and preparation method thereof |
| CN104774587A (en) * | 2014-03-18 | 2015-07-15 | 岳胜武 | High-viscosity high-heat resistance modified organic silicone resin binder and preparation method thereof |
| CN104293267A (en) * | 2014-10-23 | 2015-01-21 | 卢儒 | Pouring sealant of organosilicon modified epoxy resin for class-C electric welding machine and preparation method of pouring sealant |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110479564B (en) | Preparation and process of in-situ ceramic high-temperature-resistant heat-insulating coating | |
| CN101440268A (en) | Low temperature curing high temperature resistant inorganic / organic hybridization epoxy adhesive and preparation thereof | |
| CN106221559B (en) | A kind of ordinary steel high-temp. resistant antioxidation coating and its application method | |
| CN103771883B (en) | Nanometer masking paste and its preparation method and application | |
| CN101935497A (en) | Epoxy modified high-temperature-resistant anticorrosive paint | |
| CN101812233A (en) | Bicomponent addition type room curing silicon rubber and preparation method thereof | |
| CN110183962A (en) | A kind of ceramic coating and preparation method thereof with incubation and thermal insulation function | |
| CN113789120B (en) | Shock-cooling-resistant anti-cracking organic-inorganic composite high-temperature-resistant coating and preparation method thereof | |
| CN103694840B (en) | A kind of reactor high temperature-resistant wire lacquer and preparation method thereof | |
| CN105819875A (en) | Refractory castable for Ausmelt copper smelting furnace flue and preparation method thereof | |
| CN101824275A (en) | Special coating resisting 400 DEG C to 0 DEG C high and low temperature alternative transient variations | |
| CN106318299B (en) | High-temperature-resistant epoxy pouring sealant, preparation method thereof and application of pouring sealant as packaging material in IGBT module | |
| CN101837617B (en) | Gel curing processing method of epoxy resin | |
| CN104710931A (en) | One-component room temperature self-drying color organosilicon heat-resistant coating and preparation method thereof | |
| CN106700418A (en) | Epoxy resin modified titanium silicon resin and preparation method thereof | |
| CN106700917A (en) | High-temperature resistant anticorrosion paint with high irradiation rate and preparation method thereof | |
| CN104650697A (en) | High temperature resistant nano coating | |
| CN112961498A (en) | High-compatibility organic silicon phenolic epoxy resin composite material and preparation method thereof | |
| CN105860783A (en) | Heat-resistant and flame-resistant powder coating for gas-cooker body surface layer and preparing method thereof | |
| CN105924742A (en) | Fiber toughening heat-resistant optical cable material and preparation method thereof | |
| CN105131793A (en) | Preparation method for paint for ion sheet material | |
| CN102477508A (en) | Method for preventing iron increase in ZL205A alloy melting process | |
| CN103320007B (en) | The preparation method of resistant to elevated temperatures powder coating | |
| CN105670498A (en) | High-performance coating for exhaust pipe and preparation method thereof | |
| CN106590415A (en) | Preparation process of weather-resisting colored steel plate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170524 |