CN106695138B - Solder ball distributing mechanism - Google Patents
Solder ball distributing mechanism Download PDFInfo
- Publication number
- CN106695138B CN106695138B CN201611268956.5A CN201611268956A CN106695138B CN 106695138 B CN106695138 B CN 106695138B CN 201611268956 A CN201611268956 A CN 201611268956A CN 106695138 B CN106695138 B CN 106695138B
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- Prior art keywords
- ball
- solder
- solder ball
- welding
- ball distributing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
- B23K26/211—Bonding by welding with interposition of special material to facilitate connection of the parts
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides a solder ball distributing mechanism which comprises a shell and a ball distributing disc, wherein the ball distributing disc is provided with a cylindrical main body structure, a circular ball distributing disc assembling cavity is formed in the shell, and the inner diameter of the ball distributing disc assembling cavity is the same as the diameter of the ball distributing disc; a circle of ball distributing holes for containing single solder balls are uniformly formed in the ball distributing disc, and the ball distributing disc is connected with the shell through a rotary bearing; the shell is provided with a solder ball loading groove and a solder ball receiving groove at the top and the bottom of the ball distributing disc respectively, the diameter of the bottom of the solder ball loading groove is larger than that of a solder ball, and the diameter of the top of the solder ball receiving groove is matched with that of the solder ball so as to ensure that only one solder ball can fall into the solder ball receiving groove each time; the bottom of the shell is fixedly provided with a welding nozzle seat, and the solder ball receiving groove is communicated with the welding nozzle seat through a solder ball conveying pipe so as to ensure that solder balls in the solder ball receiving groove can be conveyed into the welding nozzle seat; and the bottom of the welding nozzle seat is fixedly provided with a welding nozzle used for arranging the welding ball to the welding point, and the diameter of the opening at the bottom of the welding nozzle is matched with the diameter of the welding ball.
Description
Technical Field
The invention relates to the field of laser welding equipment, in particular to a solder ball distributing mechanism.
Background
Laser welding is an efficient precision welding method using a laser beam with high energy density as a heat source. Laser welding can be achieved by using a continuous or pulsed laser beam, and the principle of laser welding can be divided into heat conduction type welding and laser deep fusion welding. Power density less than 104~105W/cm2The welding is heat conduction welding, and the welding depth is shallow and the welding speed is slow; power density greater than 105~107W/cm2When the method is used, the metal surface is recessed into 'holes' under the action of heat to form deep fusion welding, and the method has the characteristics of high welding speed and large depth-to-width ratio.
Because the laser welding temperature is very high, in the welding process of some precise electronic components, in order to ensure the precision of the processing, a solder ball is generally adopted as a welding flux, and the solder ball is delivered to a welding point in advance during the welding and then is welded. The processing mode not only can control the consumption of the solder very precisely, but also can shorten the welding time to the greatest extent and effectively avoid heat damage to the periphery of the welding point. However, how to accurately deliver solder balls to solder joints is a difficult problem in the industry today. For the existing electronic components, the number of solder joints is large, the distribution is dense, the configuration of solder balls one by one is undoubtedly long, the efficiency is low, and the configuration of solder balls on a large scale to the solder joints requires the ball separation of the solder balls in large quantity, and then the configuration one by one is difficult. Particularly, under the condition of higher and higher technological requirements nowadays, the size of the solder ball is smaller and smaller, and the accurate and convenient ball distribution and conveying are more and more difficult to realize.
Disclosure of Invention
The invention aims to solve the technical problem of providing a solder ball distributing mechanism to solve the problem aiming at the defects that the solder balls in the prior art are difficult to distribute and accurately convey and the like.
In order to solve the technical problem, the invention provides a solder ball distributing mechanism which comprises a shell and a ball distributing disc, wherein the ball distributing disc is provided with a cylindrical main body structure, a circular ball distributing disc assembling cavity is formed in the shell, and the inner diameter of the ball distributing disc assembling cavity is the same as the diameter of the ball distributing disc; a circle of ball distributing holes for containing single solder balls are uniformly formed in the ball distributing disc, and the ball distributing disc is connected with the shell through a rotary bearing; the shell is provided with a solder ball loading groove and a solder ball receiving groove at the top and the bottom of the ball distributing disc respectively, the diameter of the bottom of the solder ball loading groove is larger than that of a solder ball, and the diameter of the top of the solder ball receiving groove is matched with that of the solder ball so as to ensure that only one solder ball can fall into the solder ball receiving groove each time; the bottom of the shell is fixedly provided with a welding nozzle seat, and the solder ball receiving groove is communicated with the welding nozzle seat through a solder ball conveying pipe so as to ensure that solder balls in the solder ball receiving groove can be conveyed into the welding nozzle seat; and the bottom of the welding nozzle seat is fixedly provided with a welding nozzle used for arranging the welding ball to the welding point, and the diameter of the opening at the bottom of the welding nozzle is matched with the diameter of the welding ball.
In the technical scheme, the spacing distance between the adjacent ball distributing holes is preferably 3-10 mm.
In the technical scheme, the most preferable spacing distance between the adjacent ball separating holes is 3-5 mm.
In the technical scheme, a circle of air passages are formed in the ball dividing disc, the number of the air passages is consistent with that of the ball dividing holes, and the air passages are communicated with the ball dividing holes one by one.
In the above technical scheme, the ball distributing mechanism further comprises an air blowing device, and an air blowing port of the air blowing device is over against an air passage communicated with a ball distributing hole corresponding to the solder ball receiving groove.
In the above technical scheme, the ball separating mechanism further comprises a front baffle for sealing the ball separating disc in the shell, and the blowing device is fixedly installed on the front baffle.
In the above technical scheme, the ball separating mechanism further comprises a welding tip pressurizing device, the welding tip pressurizing device is a blowing pressurizing device, and an air outlet of the blowing pressurizing device is communicated with the upper portion of the welding tip seat.
Compared with the prior art, the invention has the beneficial effects that: the invention utilizes the rotary ball distributing disc to distribute the solder balls, can realize high-efficiency automatic ball distribution, and is accurate and convenient; meanwhile, the structure of the invention can realize the ball separation and the conveying of the solder balls with small size, and provides guarantee for precise welding.
Drawings
FIG. 1 is a schematic view of an assembly structure of the present invention;
FIG. 2 is a schematic cross-sectional view of the present invention;
the welding device comprises a ball distributing disc 1, a ball distributing hole 1a, an air passage 1b, a shell 2, a front baffle 3, an air blowing device 3a, a welding nozzle pressurizing device 4, a welding nozzle seat 5, a connecting mechanism 6, a welding nozzle 7, a rotating bearing 8, a welding ball loading groove 9, a welding ball receiving groove 10 and a welding ball conveying pipe 11.
Detailed Description
Specific embodiments of the present invention are described in further detail below with reference to the accompanying drawings:
as shown in fig. 1 and fig. 2, the solder ball distributing mechanism designed by the present invention includes a housing 2, and further includes a ball distributing plate 1, where the ball distributing plate 1 has a cylindrical main body structure. A circular ball distributing disc assembling cavity is formed in the shell 2, the inner diameter of the ball distributing disc assembling cavity is the same as the diameter of the ball distributing disc 1, and the ball distributing disc 1 is embedded in the ball distributing disc assembling cavity. A circle of ball distributing holes 1a used for containing a single solder ball are uniformly formed in the ball distributing disc 1, and the ball distributing disc 1 is connected with the shell 2 through the rotary bearing 8 and can rotate around the rotary bearing 8. The shell 2 is provided with a solder ball loading groove 9 and a solder ball receiving groove 10 at the top and the bottom of the ball distributing disc 1 respectively, the diameter of the bottom of the solder ball loading groove 9 is larger than the diameter of a solder ball, and the diameter of the top of the solder ball receiving groove 10 is matched with the diameter of the solder ball, so that only one solder ball can fall into the solder ball receiving groove 10 at each time. The bottom of the shell 2 is fixedly provided with a welding nozzle seat 5, and the solder ball receiving groove 10 is communicated with the welding nozzle seat 5 through a solder ball conveying pipe 11 so as to ensure that the solder balls in the solder ball receiving groove 10 can be conveyed into the welding nozzle seat 5. The bottom of the welding nozzle seat 5 is fixedly provided with a welding nozzle 7 used for arranging a welding ball to a welding point, and the diameter of an opening at the bottom of the welding nozzle 7 is matched with the diameter of the welding ball.
When the ball distributing disc is used, solder balls are loaded in the solder ball loading grooves 9, then the ball distributing disc 1 rotates in an indexing manner, when the ball distributing holes 1a rotate to the solder ball loading grooves 9, the solder balls in the grooves fall into the ball distributing holes 1a under the action of gravity, and the size of the ball distributing holes 1a can only accommodate one solder ball, and the ball distributing disc 1 is tightly assembled in the shell 2 without gaps, so that the ball distributing of the solder balls can be realized by continuously rotating the ball distributing disc 1. When the ball distributing hole 1a rotates to the solder ball receiving groove 10, the solder balls contained therein also fall into the solder ball receiving groove 10 due to the action of gravity, and then are conveyed into the welding nozzle base 5 through the solder ball conveying pipe 11, and finally are conveyed to the welding point through the welding nozzle 7, so that the accurate conveying of the solder balls is realized.
In order to avoid ball clamping of the solder balls, the spacing distance between the adjacent ball distributing holes 1a is preferably 3-10 mm, and most preferably 3-5 mm. The ball distributing holes 1a are spaced at a certain distance, so that the phenomenon that the mechanism runs unsmoothly due to the fact that the solder balls are clamped in the ball distributing process can be avoided.
In order to prevent the solder balls from being stuck in the solder ball receiving grooves 10, the present invention can be additionally provided with an air blowing system for blowing the solder balls into the solder ball conveying pipe 11. The structure specifically adopts the following structure: the ball separating disc 1 is provided with a circle of air passages 1b, the number of the air passages 1b is consistent with that of the ball separating holes 1a, and the air passages 1b are communicated with the ball separating holes 1a one by one. The ball distributing mechanism further comprises an air blowing device 3a, and an air blowing port of the air blowing device 3a is over against an air channel 1b communicated with a ball distributing hole 1a corresponding to the solder ball bearing groove 10.
In order to ensure the beauty and stable operation of the whole device, the ball separating mechanism can be also provided with a front baffle plate 3 for sealing the ball separating disc 1 in the shell 2, and the air blowing device 3a can be fixedly arranged on the front baffle plate 3.
In order to prevent the welding ball from being clamped at the welding nozzle 7, the ball distributing mechanism can be further provided with a welding nozzle pressurizing device 4, the welding nozzle pressurizing device 4 is a blowing pressurizing device, and an air outlet of the blowing pressurizing device is communicated with the upper part of the welding nozzle seat 5.
The invention can select the ball distributing disc 1 with the ball distributing holes 1a with different sizes according to the sizes of the solder balls and match with the welding tips 7 with different sizes. The welding tip 7 can be connected to the bottom of the welding tip seat 5 by the connecting mechanism 6, which is convenient for replacement.
The core of the present invention is to adopt the rotary ball distributing disc 1 to realize the ball distribution of the solder balls so as to achieve the purpose of accurate ball distribution, therefore, the protection scope of the present invention is not limited to the above embodiments, and any change or modification utilizing the above mechanism based on the principle of the present invention belongs to the protection scope of the present invention.
Claims (4)
1. A solder ball distributing mechanism comprises a shell (2), and is characterized in that: the ball distributing mechanism further comprises a ball distributing disc (1), the ball distributing disc (1) is provided with a cylindrical main body structure, a circular ball distributing disc assembling cavity is formed in the shell (2), and the inner diameter of the ball distributing disc assembling cavity is the same as the diameter of the ball distributing disc (1); a circle of ball distributing holes (1 a) used for containing single solder balls are uniformly formed in the ball distributing disc (1), and the ball distributing disc (1) is connected with the shell (2) through a rotary bearing (8); the shell (2) is provided with a solder ball loading groove (9) and a solder ball receiving groove (10) at the top and the bottom of the ball distributing disc (1) respectively, the diameter of the bottom of the solder ball loading groove (9) is larger than that of a solder ball, and the diameter of the top of the solder ball receiving groove (10) is matched with that of the solder ball so as to ensure that only one solder ball can fall into the solder ball receiving groove (10) each time; the bottom of the shell (2) is fixedly provided with a welding nozzle seat (5), and the solder ball bearing groove (10) is communicated with the welding nozzle seat (5) through a solder ball conveying pipe (11) so as to ensure that solder balls in the solder ball bearing groove (10) can be conveyed into the welding nozzle seat (5); the bottom of the welding nozzle seat (5) is fixedly provided with a welding nozzle (7) used for arranging a welding ball to a welding point, and the diameter of an opening at the bottom of the welding nozzle (7) is matched with the diameter of the welding ball; a circle of air passages (1 b) are formed in the ball dividing disc (1), the number of the air passages (1 b) is consistent with that of the ball dividing holes (1 a), and the air passages (1 b) are communicated with the ball dividing holes (1 a) one by one; the ball distributing mechanism also comprises an air blowing device (3 a), and an air blowing port of the air blowing device (3 a) is over against an air passage (1 b) communicated with a ball distributing hole (1 a) corresponding to the solder ball bearing groove (10); the ball separating mechanism further comprises a front baffle (3) used for sealing the ball separating disc (1) in the shell (2), and the blowing device (3 a) is fixedly arranged on the front baffle (3).
2. The solder ball distribution mechanism of claim 1, wherein: the spacing distance between the adjacent ball distributing holes (1 a) is 3-10 mm.
3. The solder ball distribution mechanism of claim 2, wherein: the spacing distance between the adjacent ball distributing holes (1 a) is 3-5 mm.
4. The solder ball distribution mechanism according to any one of claims 1 to 3, wherein: the ball distributing mechanism further comprises a welding nozzle pressurizing device (4), the welding nozzle pressurizing device (4) is a blowing pressurizing device, and an air outlet of the blowing pressurizing device is communicated with the upper portion of the welding nozzle seat (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611268956.5A CN106695138B (en) | 2016-12-31 | 2016-12-31 | Solder ball distributing mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611268956.5A CN106695138B (en) | 2016-12-31 | 2016-12-31 | Solder ball distributing mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106695138A CN106695138A (en) | 2017-05-24 |
| CN106695138B true CN106695138B (en) | 2020-08-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611268956.5A Active CN106695138B (en) | 2016-12-31 | 2016-12-31 | Solder ball distributing mechanism |
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| CN (1) | CN106695138B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000015536A (en) * | 1998-06-26 | 2000-01-18 | Toyota Motor Corp | Feeding device of tool and the like |
| CN1632934A (en) * | 2004-12-29 | 2005-06-29 | 上海交通大学 | Multi-diameter solder ball automatic releasing device |
| CN202114398U (en) * | 2010-08-24 | 2012-01-18 | 武汉凌云光电科技有限责任公司 | A welding apparatus realizing single output of welding materials |
| CN103252552A (en) * | 2013-04-02 | 2013-08-21 | 深圳市卓茂科技有限公司 | Automatic ball mounter for BGAs (ball grid arrays) |
| CN204735813U (en) * | 2015-06-26 | 2015-11-04 | 武汉锐泽科技发展有限公司 | Single tin sweat(ing) is planted football shirt and is put |
| CN205702778U (en) * | 2016-06-27 | 2016-11-23 | 上海嘉强自动化技术有限公司 | A kind of pay-off of miniature stannum ball bonding |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9227260B2 (en) * | 2013-02-14 | 2016-01-05 | HGST Netherlands B.V. | High-speed transportation mechanism for micro solder balls |
-
2016
- 2016-12-31 CN CN201611268956.5A patent/CN106695138B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000015536A (en) * | 1998-06-26 | 2000-01-18 | Toyota Motor Corp | Feeding device of tool and the like |
| CN1632934A (en) * | 2004-12-29 | 2005-06-29 | 上海交通大学 | Multi-diameter solder ball automatic releasing device |
| CN202114398U (en) * | 2010-08-24 | 2012-01-18 | 武汉凌云光电科技有限责任公司 | A welding apparatus realizing single output of welding materials |
| CN103252552A (en) * | 2013-04-02 | 2013-08-21 | 深圳市卓茂科技有限公司 | Automatic ball mounter for BGAs (ball grid arrays) |
| CN204735813U (en) * | 2015-06-26 | 2015-11-04 | 武汉锐泽科技发展有限公司 | Single tin sweat(ing) is planted football shirt and is put |
| CN205702778U (en) * | 2016-06-27 | 2016-11-23 | 上海嘉强自动化技术有限公司 | A kind of pay-off of miniature stannum ball bonding |
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| Publication number | Publication date |
|---|---|
| CN106695138A (en) | 2017-05-24 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A ball splitting mechanism for welding ball Effective date of registration: 20220124 Granted publication date: 20200814 Pledgee: Wuhan area branch of Hubei pilot free trade zone of Bank of China Ltd. Pledgor: Wuhan Brilliant Tech Co.,Ltd. Registration number: Y2022420000026 |
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