CN106686882A - 多层印刷电路板的边缘手指 - Google Patents
多层印刷电路板的边缘手指 Download PDFInfo
- Publication number
- CN106686882A CN106686882A CN201610622841.5A CN201610622841A CN106686882A CN 106686882 A CN106686882 A CN 106686882A CN 201610622841 A CN201610622841 A CN 201610622841A CN 106686882 A CN106686882 A CN 106686882A
- Authority
- CN
- China
- Prior art keywords
- edge
- additional
- ground connection
- fingers
- plane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000005540 biological transmission Effects 0.000 claims abstract description 63
- 238000003780 insertion Methods 0.000 claims abstract description 17
- 230000037431 insertion Effects 0.000 claims abstract description 17
- 239000002184 metal Substances 0.000 claims description 23
- 229910052751 metal Inorganic materials 0.000 claims description 23
- 238000007514 turning Methods 0.000 claims description 5
- 210000004247 hand Anatomy 0.000 claims description 3
- 241000208340 Araliaceae Species 0.000 claims description 2
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 claims description 2
- 235000003140 Panax quinquefolius Nutrition 0.000 claims description 2
- 235000008434 ginseng Nutrition 0.000 claims description 2
- 238000010276 construction Methods 0.000 description 24
- MTCPZNVSDFCBBE-UHFFFAOYSA-N 1,3,5-trichloro-2-(2,6-dichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC(Cl)=C1C1=C(Cl)C=CC=C1Cl MTCPZNVSDFCBBE-UHFFFAOYSA-N 0.000 description 9
- 238000005520 cutting process Methods 0.000 description 6
- 230000007423 decrease Effects 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000003321 amplification Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 238000009738 saturating Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 238000002372 labelling Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000011514 reflex Effects 0.000 description 1
- 230000011664 signaling Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
- H05K1/0225—Single or multiple openings in a shielding, ground or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09409—Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
Claims (20)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/933,006 US9788419B2 (en) | 2015-11-05 | 2015-11-05 | Edge fingers of multi-layer printed circuit board |
US14/933,006 | 2015-11-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106686882A true CN106686882A (zh) | 2017-05-17 |
CN106686882B CN106686882B (zh) | 2020-07-10 |
Family
ID=58664145
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610622841.5A Active CN106686882B (zh) | 2015-11-05 | 2016-07-29 | 多层印刷电路板的边缘手指 |
Country Status (2)
Country | Link |
---|---|
US (1) | US9788419B2 (zh) |
CN (1) | CN106686882B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108811315A (zh) * | 2017-04-27 | 2018-11-13 | 南宁富桂精密工业有限公司 | 金手指结构 |
CN113163599A (zh) * | 2020-01-23 | 2021-07-23 | 美超微电脑股份有限公司 | 使用参考迹线设置电路板的信号迹线的阻抗 |
CN113904143A (zh) * | 2020-07-06 | 2022-01-07 | 美光科技公司 | 具有对内耦合的卡边缘连接器 |
US11626693B2 (en) | 2021-01-25 | 2023-04-11 | Lotes Co., Ltd | Electrical connector and connector assembly |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020078431A1 (zh) * | 2018-10-17 | 2020-04-23 | 青岛海信宽带多媒体技术有限公司 | 电路板和光模块 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3818117A (en) * | 1973-04-23 | 1974-06-18 | E Reyner | Low attenuation flat flexible cable |
CN1318882A (zh) * | 2000-04-19 | 2001-10-24 | 日本压着端子制造株式会社 | 印刷电路板连接件 |
US6710266B2 (en) * | 2002-07-26 | 2004-03-23 | Intel Corporation | Add-in card edge-finger design/stackup to optimize connector performance |
CN1996677A (zh) * | 2005-12-09 | 2007-07-11 | 蒂科电子公司 | 包括具有控制阻抗的电路板的电连接器 |
CN101861051A (zh) * | 2009-04-13 | 2010-10-13 | 鸿富锦精密工业(深圳)有限公司 | 软性电路板 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6425766B1 (en) * | 2000-06-09 | 2002-07-30 | Molex Incorporated | Impedance control in edge card connector systems |
US7204648B2 (en) | 2002-03-19 | 2007-04-17 | Finisar Corporation | Apparatus for enhancing impedance-matching in a high-speed data communications system |
-
2015
- 2015-11-05 US US14/933,006 patent/US9788419B2/en active Active
-
2016
- 2016-07-29 CN CN201610622841.5A patent/CN106686882B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3818117A (en) * | 1973-04-23 | 1974-06-18 | E Reyner | Low attenuation flat flexible cable |
CN1318882A (zh) * | 2000-04-19 | 2001-10-24 | 日本压着端子制造株式会社 | 印刷电路板连接件 |
US6710266B2 (en) * | 2002-07-26 | 2004-03-23 | Intel Corporation | Add-in card edge-finger design/stackup to optimize connector performance |
CN1996677A (zh) * | 2005-12-09 | 2007-07-11 | 蒂科电子公司 | 包括具有控制阻抗的电路板的电连接器 |
CN101861051A (zh) * | 2009-04-13 | 2010-10-13 | 鸿富锦精密工业(深圳)有限公司 | 软性电路板 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108811315A (zh) * | 2017-04-27 | 2018-11-13 | 南宁富桂精密工业有限公司 | 金手指结构 |
US10390425B2 (en) | 2017-04-27 | 2019-08-20 | Nanning Fugui Precision Industrial Co., Ltd. | Golden finger structure |
CN108811315B (zh) * | 2017-04-27 | 2020-03-17 | 南宁富桂精密工业有限公司 | 金手指结构 |
CN113163599A (zh) * | 2020-01-23 | 2021-07-23 | 美超微电脑股份有限公司 | 使用参考迹线设置电路板的信号迹线的阻抗 |
CN113163599B (zh) * | 2020-01-23 | 2024-05-14 | 美超微电脑股份有限公司 | 使用参考迹线设置电路板的信号迹线的阻抗 |
CN113904143A (zh) * | 2020-07-06 | 2022-01-07 | 美光科技公司 | 具有对内耦合的卡边缘连接器 |
CN113904143B (zh) * | 2020-07-06 | 2024-07-09 | 美光科技公司 | 具有对内耦合的卡边缘连接器 |
US11626693B2 (en) | 2021-01-25 | 2023-04-11 | Lotes Co., Ltd | Electrical connector and connector assembly |
Also Published As
Publication number | Publication date |
---|---|
CN106686882B (zh) | 2020-07-10 |
US20170135202A1 (en) | 2017-05-11 |
US9788419B2 (en) | 2017-10-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20180904 Address after: 3 / F, new science centre, 6 science and technology Avenue East, Hongkong Science Park, Sha Tin, New Territories, Hongkong, China Applicant after: Yun Hui Technology Co., Ltd. Address before: Xinke center, 6 science and Technology Road East, Hongkong Science Park, Sha Tin, New Territories, Hongkong, China Applicant before: Xinke Industry Co., Ltd. |
|
TA01 | Transfer of patent application right | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information |
Address after: Room 1515-1519, 15 / F, 19W building, 19 science and technology Avenue, Hong Kong Science Park, Pak Shek Kok, New Territories, Hong Kong, China Applicant after: SAE Magnetics (H.K.) Ltd. Address before: 3 / F, new science centre, 6 science and technology Avenue East, Hongkong Science Park, Sha Tin, New Territories, Hongkong, China Applicant before: SAE Magnetics (H.K.) Ltd. |
|
CB02 | Change of applicant information | ||
GR01 | Patent grant | ||
GR01 | Patent grant |