CN106685107A - Magnetic sheet and wireless power charging device - Google Patents

Magnetic sheet and wireless power charging device Download PDF

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Publication number
CN106685107A
CN106685107A CN201610307744.7A CN201610307744A CN106685107A CN 106685107 A CN106685107 A CN 106685107A CN 201610307744 A CN201610307744 A CN 201610307744A CN 106685107 A CN106685107 A CN 106685107A
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CN
China
Prior art keywords
magnetosphere
binding agent
magnetic piece
hole
magnetic
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201610307744.7A
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Chinese (zh)
Other versions
CN106685107B (en
Inventor
朴晟烈
朴杜镐
赵诚男
吴胜熙
李承珉
赵中英
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Wits Co Ltd
Original Assignee
Samsung Electro Mechanics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of CN106685107A publication Critical patent/CN106685107A/en
Application granted granted Critical
Publication of CN106685107B publication Critical patent/CN106685107B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00Thin magnetic films, e.g. of one-domain structure
    • H01F10/08Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers
    • H01F10/10Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition
    • H01F10/12Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys
    • H01F10/13Amorphous metallic alloys, e.g. glassy metals
    • H01F10/131Amorphous metallic alloys, e.g. glassy metals containing iron or nickel
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00Thin magnetic films, e.g. of one-domain structure
    • H01F10/08Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers
    • H01F10/10Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition
    • H01F10/12Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys
    • H01F10/13Amorphous metallic alloys, e.g. glassy metals
    • H01F10/132Amorphous metallic alloys, e.g. glassy metals containing cobalt
    • H02J5/005
    • H02J7/025

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Charge And Discharge Circuits For Batteries Or The Like (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)

Abstract

A magnetic sheet and a wireless power charging device are provided. The magnetic sheet includes a laminating structure in which a plurality of magnetic layers are laminated. At least one magnetic layer in the plurality of magnetic layers is provided with a through hole penetrating each magnetic layer at the thickness direction, and is adhered to an adjacent magnetic layer in the plurality of magnetic layers through an adhesive filling the at least one through hole.

Description

Magnetic piece and wireless charging device
This application claims submit in Korean Intellectual Property Office on November 6th, 2015 The rights and interests of the priority of 10-2015-0155563 korean patent applications, in the disclosure of the korean patent application Hold by quoting whole being incorporated herein.
Technical field
It relates to a kind of magnetic piece and wireless charging device.
Background technology
Using little and light weight electronic device, the weight of various types of electronic installations can be reduced.Therefore, Contactless charging method (the wireless charging for not using electrical contact to be charged battery using magnetic couplings Method for electrically) just receive publicity.
Battery is charged using electromagnetic induction provide wireless charging method, wherein, first coil (is sent out Send device coil) it is arranged on charger (wireless power transmitter), the second coil (receiver coil) In being arranged on the object (wireless power receptor) being electrically charged, by will be by first coil and the second coil Between the electric current for inductively producing be converted into energy to be charged battery.
In this case, in order to shield electromagnetic wave, concentrate electromagnetic wave etc., magnetic piece may be provided at reception Between device coil and battery.Such magnetic piece can be used to stop that the magnetic field produced by receiver coil reaches Battery, and make the electromagnetic wave produced by wireless power transmitter be effectively transmitted to wireless power receptor.
It is logical in several watts to tens watts of electric power in the case where wireless charging is carried out to battery using magnetic piece While crossing magnetic piece, it may appear that the loss of material and circuit, therefore, substantial amounts of heat can be produced.Therefore, Just energetically to effectively dissipate by around magnetic piece or magnetic piece produce hot method study.
The content of the invention
The one side of the disclosure can provide a kind of magnetic piece with the heat-sinking capability for improving and the thickness of reduction And wireless charging device.
According to the one side of the disclosure, a kind of magnetic piece can have can wherein be improved heat-sinking capability and can subtract The novel structure of the thickness of little magnetic piece, so as to be conducive to becoming compact, specifically, magnetic piece includes The laminar structure that multiple magnetospheres are laminated each other, each magnetosphere in the plurality of magnetosphere has the plurality of At least one through hole of each magnetosphere is penetrated on the thickness direction of magnetosphere, and is used described in filling extremely The binding agent of a few through hole is being connected to another magnetic adjacent with a magnetosphere in the plurality of magnetosphere Layer.
According to another aspect of the present disclosure, a kind of magnetic piece can have to be included multiple magnetospheres and is placed in described many The laminar structure of the bonding part between individual magnetosphere, bonding part includes bonding supporting part and filling with through hole The binding agent of through hole.
According to another aspect of the present disclosure, a kind of wireless charging device includes:Wireless power transmitter;Nothing Line power receiver, including above-described magnetic piece.
Description of the drawings
By the detailed description for carrying out below in conjunction with the accompanying drawings, it will be more clearly understood that the disclosure more than and Other side, feature and advantage, in the accompanying drawings:
Fig. 1 is the perspective view of conventional wireless charging system;
Fig. 2 is the sectional view of the main inside construction of the conventional wireless charging system illustrated in Fig. 1;
Fig. 3 is the schematic diagram of the magnetic piece used in the exemplary embodiment of the disclosure;
Fig. 4 is the detailed view of the magnetosphere that the magnetic piece of Fig. 3 includes;
Fig. 5, Fig. 6, Fig. 7, Fig. 8 and Fig. 9 are respectively the magnetic used in the exemplary embodiment of the disclosure The schematic diagram of property piece.
Specific embodiment
Hereinafter, hereinafter with reference to Description of Drawings embodiment of the disclosure.
However, the disclosure can be illustrated in many different forms, and it is not construed as It is confined to specific embodiment set forth herein.More specifically, there is provided these embodiments, so that the disclosure To be thoroughly with it is complete, and the scope of the present disclosure is fully conveyed to into those skilled in the art.
Throughout the specification, it will be appreciated that, when such as layer, region or the element of wafer (substrate) Be referred to as " " another element " on ", " being connected to " or during " being attached to " another element, institute State element can directly " " another element " on ", directly " being connected to " or directly " being attached to " Another element, or there may be other elements between them.By contrast, when element is referred to as " directly existing " another element " on ", " being directly connected to " or " being bonded directly to " another element When, there is no element between them or layer.Identical label indicates all the time identical element.Such as It is as used herein, term "and/or" include one or more associated Listed Items in it is any with And all combinations.
It will be apparent that, although can here use term " first ", " second ", " the 3rd " etc. come Various components, component, region, layer and/or part described, but these components, component, region, layer And/or part should not be limited by these terms.These terms be only used for by a component, component, region, Layer or part distinguish with another component, component, region, layer or part.Therefore, without departing from example Property embodiment teaching in the case of, first component described below, component, region, layer or part can Referred to as second component, component, region, layer or part.
For convenience of description, can here using space correlation term (for example, " and ... on ", " ... top ", " ... under " and " ... lower section " etc.), to describe as illustrated The relation of one element and another element.It will be appreciated that in addition to the orientation illustrated in figure, with The term of space correlation is intended to include device different azimuth in use or operation.For example, if figure In device upset, then be described as " " other elements or feature " on " or " top " Element will be positioned as other elements described in " " or feature " under " or " lower section ".Therefore, Term " ... on " specific direction that can be with reference to the accompanying drawings and include " ... on " and " ... it Under " two kinds of orientation.Device can by addition positioning (be rotated by 90 ° or at other orientations), and Respective explanations can be made to as used herein with space correlation descriptor.
Term as used herein only describes specific embodiment, and disclosure not limited to this.As here makes , unless the context clearly dictates otherwise, otherwise singulative also will be including plural form. It will be further understood that when term " including " and/or "comprising" is used in this manual, enumerating Feature, entirety, step, operation, component, element and/or combinations thereof described in existing, but not Exclude and there is or increase one or more further features, entirety, step, operation, component, element And/or combinations thereof.
Hereinafter, the enforcement of the disclosure will be described with reference to the schematic diagram for illustrating embodiment of the disclosure Example.In the accompanying drawings, for example, due to manufacturing technology and/or tolerance, the modification of shown shape is can Estimated.Therefore, embodiment of the disclosure is not intended to be limited to the spy in the region being shown in which Setting shape, for example, should be interpreted as including due to the change of shape caused by manufacture.Following enforcement Example also can by one or its combination and constitute.
Content of this disclosure described below can have various constructions, although and needed for here only proposes Construction, but not limited to this.
Fig. 1 is the perspective schematic view of conventional wireless charging system, and Fig. 2 is illustrate in Fig. 1 normal The sectional view of the main inside construction of wireless charging system.
See figures.1.and.2, conventional wireless charging system may include wireless power transmitter 10 and nothing Line power receiver 20, wireless power receptor 20 may include in such as mobile phone, above-knee PC Or in the electronic installation 30 of Desktop PC.
In the inside of wireless power transmitter 10, transmitter coils 11 may be formed on plate 12, with Magnetic field is produced when exchanging (AC) voltage and being applied to wireless power transmitter 10.Therefore, it is embedded in Receiver coil 21 in wireless power receptor 20 can be allowed to produce and sensed by transmitter coils 11 Electromotive force, so as to be charged to battery 22.
Battery 22 can be chargeable or the Ni-MH battery or lithium ion battery of electric discharge, but not limited to this. Battery 22 can be arranged independently of wireless power receptor 20, to be attached to wireless power receptor 20 Or dismantle from wireless power receptor 20, or also can form one with wireless power receptor 20.
Transmitter coils 11 and receiver coil 21 can be electromagnetically coupled to each other, and can respectively by twining Formed around the metal wire of such as copper cash etc..In this case, transmitter coils 11 or receptor The winding shape of coil 21 can be circular, oval, tetragon or rhombus, and its overall chi Very little or winding number of times can be as needed characteristic suitably arranging.
Magnetic piece 100 may be provided between receiver coil 21 and battery 22.Magnetic piece 100 can be situated between Between receiver coil 21 and battery 22, to concentrate the magnetic flux of receiver coil 21 so that Electric power can be efficiently received by receiver coil 21.Additionally, magnetic piece 100 can be used to stop magnetic flux At least a portion of amount reaches battery 22.Will be described in more detail below magnetic piece 100.
Fig. 3, Fig. 5, Fig. 6, Fig. 7, Fig. 8 and Fig. 9 are respectively in the exemplary embodiment of the disclosure The schematic diagram of the magnetic piece for using.Fig. 4 is the detailed view of the magnetosphere that the magnetic piece of Fig. 3 includes.
First as shown in figure 3, magnetic piece 100 may include laminar structure, in the laminar structure, Multiple magnetospheres 101 are laminated each other, and binding agent 102 can be filled respectively along the thickness side of each magnetosphere 101 To the through hole for penetrating each magnetosphere 101, so as to provide the bonding between magnetosphere 101 in laminar structure Power.For example, binding agent 102 can pass through the through hole of filling magnetosphere 101 (rather than between magnetosphere 101 Layer) connecting magnetosphere 101 adjacent to each other.
Magnetosphere 101 can perform the function of stopping or concentrate electromagnetic wave in wireless charging device etc., and Can use includes the thin film type metal band of amorphous alloy or nanocrystal alloys and is formed.In this feelings Under condition, Fe- bases or Co- base magnetic alloys can be used as amorphous alloy.Fe- bases magnetic alloy can be used Such as Fe-Si-B alloys and formed.With the content increase of the metal comprising Fe, saturation flux density Can become higher.When the content of Fe is excessive, can be difficult to form amorphous alloy.Therefore, Fe Atom percentage content can be 70% to 90%, when Si contents and total atomic percent of B content Than for 10% to 30% when, can most preferably obtain amorphous alloy.In order to prevent such basis Corrosion, can be by corrosion-resistant element that its atomic percent is such as Cr or Co in the range of 20% It is added to basis, and as needed, also other a small amount of metallic elements can be included basic In composition, to provide other characteristics as basis.
Next, in the example using amorphous alloy, for example, Fe- base nanometer crystal bodies can be used Magnetic alloy.Fe- base nanometer crystal bodies magnetic alloy can be formed using Fe-Si-B-Cu-Nb alloys.
Magnetosphere 101 may also comprise soft magnetic material, and can by such as Mn-Zn- bases, Mn-Ni- bases, Br- bases or Sr- based ferrite materials are formed.Additionally, these materials can be formed by nanocrystal powder.
In this case, as shown in figure 4, magnetosphere 101 can process (flake through thin slice Treatment), being crushed to the structure of multiple fragment P with magnetosphere 101.Magnetosphere 101 this The tile structure of sample can be caused to be formed in being electrically connected between magnetosphere 101 and partially disconnected, so as to Contribute to reducing the intensity of vortex flow.
Meanwhile, arranging can be using general in this area to the binding agent 102 in the through hole of magnetosphere 101 Jointing material (for example, it is known that resinous principle) and formed, it is possible to use magnetic adjacent to each other can be made Layer 101 physically bond and the materials that can chemically be combined with magnetosphere 101 etc. and formed.Make For the embodiment, the glued construction of magnetosphere 101 can cause binding agent 102 to be arranged in magnetosphere 101, And magnetosphere 101 adjacent to each other is in direct contact with one another, to improve the radiating work(of magnetic piece 100 Can, so as to reduce its thickness.
More particularly, in order to ensure as shown in Fig. 3, Fig. 5, Fig. 6, Fig. 7, Fig. 8 and Fig. 9 Excellent screening ability, when multiple magnetospheres 101 are laminated each other, to be formed during magnetic piece 100, puts Uneven material (for example, binding agent etc.) between multiple magnetospheres 101 can cause magnetic piece 100 Radiating efficiency reduce.May have about including the binding agent of conventional fluoropolymer resin etc. The heat conductivity value of 0.2W/mK to 1W/mK.Even if in binding agent by the material with high heat conductance In the case of formation, binding agent is likely to be difficult to the heat conductivity value with 2W/mK to 5W/mK. By contrast, the magnetosphere 101 including metal tape etc. can have the thermal conductivity of 5W/mK to 20W/mK Rate value, causes difference between the heat-sinking capability of uneven material big.
In the example of the magnetic piece 100 according to the embodiment, through hole may be formed in magnetosphere 101 simultaneously And can replace significantly decreasing the binding agent 102 between magnetosphere 101 filled with binding agent 102 Amount.Therefore, the novel glued construction of magnetic piece 100 can be obtained.Such glued construction can be Keep being significantly reduced while the firm integrated structure between magnetosphere 101 and be unfavorable for effectively dissipating The region that the binding agent 102 of heat is occupied, so that it is guaranteed that the level of the heat-sinking capability of abundance.Additionally, magnetic Property piece 100 thickness can reduce big as the region that the region that occupied by binding agent 102 reduces.
Because binding agent 102 is present in the through hole of magnetosphere 101, therefore binding agent 102 is positively retained at Between magnetosphere 101.In order to supplement bonding strength, other adhesive material can be applied to magnetosphere 101.During filling through hole, a small amount of binding agent 102 also can be flowed in magnetosphere 101.
Meanwhile, during forming through hole in magnetosphere 101, method commonly used in the art can be used, For example, using the machining of Drilling operation, pin processing or laser beam processing, it is possible to use chemistry Etching.In this case, Fig. 3 shows the magnetic with the multiple through holes filled with binding agent 102 Layer 101, but a part for through hole can also be not filled with binding agent 102.In some instances, can be in list Single through hole is only formed in individual magnetosphere 101.In the through hole that magnetosphere 101 is filled using binding agent 102 During, various types of methods can be used, for example, the magnetosphere 101 for being formed with through hole is soaked Method, silk screen print method and spraying process in binder solution etc..
Fig. 3 also show the binding agent 102 of the through hole that one magnetosphere 101 of filling includes and may be formed at The binding agent of the through hole that another magnetosphere 101 for being adjacent to one magnetosphere 101 with filling includes In the 102 corresponding position in position.In other words, it is present in viscous in magnetosphere 101 different from each other Mixture 102 can be connected to each other, magnetosphere 101 can directly contact be adjacent other magnetospheres 101 (and Do not pass through binding agent 102), so as to be conducive to improving heat-sinking capability.However, as shown in figure 5, being More firm and more firm glued construction is obtained, the viscous of the through hole that a magnetosphere 101 includes is filled Mixture 102 also may be formed to be adjacent in another magnetosphere 101 of one magnetosphere 101 with filling and wrap In the position that the position of the binding agent 102 of the through hole for including does not line up.
Fig. 6 and Fig. 7 the difference is that only bonding supporting layer 103 between magnetic with embodiment before Between layer 101, therefore bonding supporting layer 103 will only be described.Bonding supporting layer 103 can be between multiple Between magnetosphere 101, to be connected to binding agent 102, layer insulation structure may be provided at adjacent to each other Between magnetosphere 101, so as to obtain the effect of the loss for reducing vortex flow.Bonding supporting layer 103 can make Formed with the material of the matrix of such as traditional two-sided tape, so that magnetosphere 101 is bonded to each other, and And may include such as PET film etc..
In the example of the embodiment, the binding agent 102 being present in magnetosphere 101 different from each other can (with reference to Fig. 6) is formed in the position to correspond to each other of binding agent 102, or in order to improve magnetosphere 101 Between bonding force, fill the through hole that magnetosphere 101 includes binding agent 102 may be formed at Filling is adjacent to the binding agent 102 of the through hole that another magnetosphere 101 of one magnetosphere 101 includes The position that do not line up of position in (with reference to Fig. 7).
Next, Fig. 8 and Fig. 9 show that binding agent 102 is filled in the logical of bonding supporting layer 103 In hole (rather than in magnetosphere 101), so that magnetosphere 101 is bonded to each other, binding agent 102 and bonding Supporting layer 103 can be referred to as bonding part.In the example according to each magnetic piece 100 of the embodiment, The region occupied by binding agent 102 can be significantly reduced, so as to improve heat-sinking capability, and binding agent 102 can be not formed in the upper and lower surface of bonding supporting layer 103, or minimal amount of bonding Agent 102 can be applied to magnetic piece 100, so as to reduce the thickness of each magnetic piece 100.In the reality In applying the example of example, when can be provided with three or more magnetospheres 101 and can be provided with two or more During multiple bonding parts, two or more bonding parts adjacent to each other may be formed at and wherein make binding agent In 102 positions to correspond to each other (with reference to Fig. 8), or may be formed at wherein make binding agent 102 that In this position not lined up, to increase the bonding force between magnetosphere 101 (with reference to Fig. 9).
It is similar to description before, during forming through hole in bonding supporting layer 103, can use Conventional method, for example, can use the machining of Drilling operation, pin processing or laser beam processing, Also chemical etching can be used.In this case, Fig. 8 and Fig. 9 are shown with filled with binding agent The bonding supporting layer 103 of 102 multiple through holes, but a part for through hole can also be not filled with binding agent 102.In some instances, single through hole can only be formed in single bonding supporting layer 103.Make In the example of the process that the through hole of bonding supporting layer 103 is filled with binding agent 102, can use various types of The method of type, for example, the bonding supporting layer 103 for being formed with through hole is immersed in binder solution Method, silk screen print method and spraying process etc..
As described above, can be made according to the exemplary embodiment of the disclosure, magnetic piece and wireless charging device The binding agent obtained between magnetosphere adjacent to each other is significantly decreased, to increase heat dissipation characteristics, so as to Be conducive to improving the reliability of the electronic installation for using magnetic piece and wireless charging device.Additionally, so Structure can reduce the thickness of magnetic piece, and be applicable to use magnetic piece and wireless charging device Electronic device miniaturization.
Although having been described above illustrating and describing embodiment, for those skilled in the art will be obvious , in the case of without departing from the scope of the present invention being defined by the claims, modification can be made And modification.

Claims (12)

1. a kind of magnetic piece, including the laminar structure that multiple magnetospheres are laminated each other,
Wherein, at least one of the plurality of magnetosphere magnetosphere has the thickness at least one magnetosphere Side upwardly penetrates through at least one through hole of at least one magnetosphere, and using filling described at least one The binding agent of through hole is being connected to another magnetosphere adjacent with least one magnetosphere.
2. magnetic piece as claimed in claim 1, wherein, the plurality of magnetosphere adjacent to each other is straight each other Contact.
3. magnetic piece as claimed in claim 1, wherein, at least one through hole is arranged to multiple.
4. magnetic piece as claimed in claim 1, wherein, fill a magnetosphere in the plurality of magnetosphere In the binding agent of included at least one through hole be arranged on and be adjacent to the another of one magnetosphere with filling In magnetosphere in the corresponding position in position of the binding agent of at least one included through hole.
5. magnetic piece as claimed in claim 1, wherein, fill a magnetosphere in the plurality of magnetosphere In the binding agent of included at least one through hole be arranged on and be adjacent to the another of one magnetosphere with filling In the position that the position of the binding agent of at least one included through hole does not line up in magnetosphere.
6. magnetic piece as claimed in claim 1, wherein, bonding support be placed on the plurality of magnetosphere it Between, to be connected to binding agent.
7. magnetic piece as claimed in claim 1, wherein, the plurality of magnetosphere is arranged to no presence of Jie Other binding agent between the plurality of magnetosphere.
8. magnetic piece as claimed in claim 1, wherein, the plurality of magnetosphere has the plurality of magnetosphere It is broken respectively as the structure of multiple fragments.
9. a kind of magnetic piece, including with multiple magnetospheres and the bonding part being placed between the plurality of magnetosphere Laminar structure,
Wherein, bonding part includes the binding agent of the bonding supporting layer with through hole and filling through hole.
10. magnetic piece as claimed in claim 9, wherein, the plurality of magnetosphere be arranged to three or More, bonding part is arranged to two or more, described two or more bondings adjacent to each other Portion is respectively formed to be made in binding agent position to correspond to each other.
11. magnetic pieces as claimed in claim 9, wherein, the plurality of magnetosphere be arranged to three or More, bonding part is arranged to two or more, described two or more bondings adjacent to each other Portion is respectively formed in the position for making binding agent not line up each other.
A kind of 12. wireless charging devices, including:
Wireless power transmitter;
Wireless power receptor, including described in any one claim in claim 1-11 Magnetic piece.
CN201610307744.7A 2015-11-06 2016-05-11 Magnetic sheet and wireless charging device Expired - Fee Related CN106685107B (en)

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KR10-2015-0155563 2015-11-06
KR1020150155563A KR20170053277A (en) 2015-11-06 2015-11-06 Magnetic Sheet and Wireless Power Charging Device

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108076619A (en) * 2016-11-15 2018-05-25 三星电机株式会社 Wireless charging electromagnetic wave shielding sheet

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57173154A (en) * 1981-04-16 1982-10-25 Mitsubishi Electric Corp Alloy magnetic thin band laminate
CN202887926U (en) * 2012-10-24 2013-04-17 深圳顺络电子股份有限公司 Magnetic element
CN103493158A (en) * 2011-04-25 2014-01-01 株式会社东芝 Magnetic sheet, and non-contact power receiving device, electronic instrument, and non-contact charging device employing same
CN104011814A (en) * 2011-12-21 2014-08-27 阿莫先恩电子电器有限公司 Magnetic field shielding sheet for a wireless charger, method for manufacturing same, and receiving apparatus for a wireless charger using the sheet
CN105185531A (en) * 2015-09-14 2015-12-23 广东新昇电业科技股份有限公司 Novel reactor iron core structure and production process thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57173154A (en) * 1981-04-16 1982-10-25 Mitsubishi Electric Corp Alloy magnetic thin band laminate
CN103493158A (en) * 2011-04-25 2014-01-01 株式会社东芝 Magnetic sheet, and non-contact power receiving device, electronic instrument, and non-contact charging device employing same
CN104011814A (en) * 2011-12-21 2014-08-27 阿莫先恩电子电器有限公司 Magnetic field shielding sheet for a wireless charger, method for manufacturing same, and receiving apparatus for a wireless charger using the sheet
CN202887926U (en) * 2012-10-24 2013-04-17 深圳顺络电子股份有限公司 Magnetic element
CN105185531A (en) * 2015-09-14 2015-12-23 广东新昇电业科技股份有限公司 Novel reactor iron core structure and production process thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108076619A (en) * 2016-11-15 2018-05-25 三星电机株式会社 Wireless charging electromagnetic wave shielding sheet

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