CN106681946A - Semiconductor storage adapter card and storage device with semiconductor storage adapter card - Google Patents

Semiconductor storage adapter card and storage device with semiconductor storage adapter card Download PDF

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Publication number
CN106681946A
CN106681946A CN201611101447.3A CN201611101447A CN106681946A CN 106681946 A CN106681946 A CN 106681946A CN 201611101447 A CN201611101447 A CN 201611101447A CN 106681946 A CN106681946 A CN 106681946A
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CN
China
Prior art keywords
interface
semiconductor storage
semiconductor
storage adapter
ebi
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Pending
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CN201611101447.3A
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Chinese (zh)
Inventor
崔永波
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Xi'an Morebeck Semiconductor Technology Co Ltd
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Xi'an Morebeck Semiconductor Technology Co Ltd
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Priority to CN201611101447.3A priority Critical patent/CN106681946A/en
Publication of CN106681946A publication Critical patent/CN106681946A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/14Handling requests for interconnection or transfer
    • G06F13/16Handling requests for interconnection or transfer for access to memory bus
    • G06F13/1605Handling requests for interconnection or transfer for access to memory bus based on arbitration
    • G06F13/1652Handling requests for interconnection or transfer for access to memory bus based on arbitration in a multiprocessor architecture
    • G06F13/1657Access to multiple memories

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

The invention discloses a semiconductor storage adapter card. The semiconductor storage adapter card is characterized by comprising a semiconductor storage interface (11), a temporary storage memory (12), a bus interface (13) and a microprocessor (14), the temporary storage memory (12) is a semiconductor storage, the microprocessor (14) is in signal connection with the semiconductor storage interface (11), the temporary storage memory (12) and the bus interface (13), the semiconductor storage interface (11) is used for being connected with an external device, and the semiconductor storage interface is a U.2 interface. By means of the U.2 interface, the access speed of the semiconductor storage adapter card is greatly increased. The invention further discloses a storage device.

Description

A kind of semiconductor storage adapter and the storage with the semiconductor storage adapter Device
Technical field
The invention belongs to computer hardware field, is related to a kind of semiconductor storage adapter.
Background technology
U.2 interface, was originally SFF-8639, was substantially SATAExpress, and SATA-E physical interfaces are to pass through The transformation of SATA6Gbps interfaces, it is somewhat similarly to SAS interfaces.U.2 SATA-Express specifications can not only be supported, moreover it is possible to compatible The specifications such as SAS, SATA.So can simply think that U.2 interface is the SATA-Express interfaces of four-way version, its theoretical band Width is up to 32Gbps and is as good as with M.2 interface.U.2 the mentality of designing of interface is similar with SATA-E, as far as possible using existing thing Reason interface, but bandwidth is faster, and from PCI-Ex2 PCI-E3.0x4 is become, and many new agreements is also add in addition and is supported, such as NVMe, these are all that SATAE interfaces do not possess.U.2 interface has many good qualities, and interface bandwidth has reached 32Gbps, supports NVMe agreements, or even power supply capacity also improves, this both contributes to improve SSD performances.
Semiconductor memory (semi-conductormemory) is a kind of depositing using semiconductor circuit as storage media Reservoir.Can be divided into by its function:Random access memory (abbreviation RAM) and read only memory (read-only ROM).Its advantage is:Deposit Storage speed is fast, memory density is high and logic circuit interface is easy.
RAID is the abbreviation of English Redundant Array of Independent Disks, translates into Chinese and means " RAID ", sometimes also abbreviation disk array (Disk Array).Original magnetic disk array cabinet is high due to price Your use range is not wide, and the storage device being made up of magnetic disc adaptation card magnetic disc array card etc. in prior art as an alternative by It is not fast enough in magnetic disc adaptation card access speed, and the operating rate of miscellaneous part is high, causes the overall operation of storage device Speed also has much room for improvement.
The content of the invention
In order to solve above-mentioned technical problem, the invention provides a kind of magnetic disc adaptation card, including semiconductor storage interface 11, Scratch-pad memory 12, EBI 13, microprocessor 14, the scratch-pad memory 12 be semiconductor memory, the microprocessor 14 Be connected with semiconductor storage interface 11, scratch-pad memory 12, the signal of EBI 13, the semiconductor storage interface 11 be used for it is outer Portion's equipment connection, the semiconductor storage interface is U.2 interface.
Preferably, the EBI is U.2 interface.
A kind of storage device with the semiconductor storage adapter, including mainboard are additionally provided in one embodiment 40, hard disk 50, the mainboard includes assembling semiconductor memory array card 20 thereon and semiconductor storage adapter 10, institute State hard disk 50 to be connected with semiconductor memory array card 20.
Preferably, the host side 30 being connected with the semiconductor storage adapter 10 is also included.
It is further preferred that the semiconductor storage interface 31 of the host side 30 is U.2 interface.
Further, U.2 the U.2 interface of the host side 30 passes through with the U.2 interface of semiconductor storage adapter 10 Data wire connects.
Preferably, the semiconductor memory array card 20 includes EBI 21, and the EBI 21 is U.2 interface.
Preferably, the mainboard 40 is provided with and is deposited with quasiconductor with the EBI 13 of the semiconductor storage adapter 10 The slot of the docking of 20 EBI of storage RAID card 21, the slot is U.2 interface slot.
Beneficial effects of the present invention:
The present invention by existing semiconductor storage adapter by semiconductor storage interface from minicomputer interface, The interfaces such as fibre channel interface, string type storage architecture are changed into U.2 interface, improve speed, and the agreement such as the NVMe for supporting, The scope of application is wider, while semiconductor storage adapter is both configured to the EBI of semiconductor memory array card U.2 to connect Mouth also improves access speed.Scratch-pad memory is set to into semiconductor memory.The speed of service is faster.
Description of the drawings
Accompanying drawing described herein is used for providing a further understanding of the present invention, constitutes the part of the present invention, this Bright schematic description and description does not constitute inappropriate limitation of the present invention for explaining the present invention.In the accompanying drawings:
Fig. 1 is a kind of semiconductor storage adapter;
Fig. 2 is the storage device with the semiconductor storage adapter.
Specific embodiment
In order that the technical problem to be solved, technical scheme and beneficial effect are clearer, clear, below tie Drawings and Examples are closed, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only used To explain the present invention, it is not intended to limit the present invention.
Embodiment 1
As shown in figure 1, a kind of semiconductor storage adapter, semiconductor storage adapter 10 of the present invention is mainly comprising quasiconductor Memory interface 11, scratch-pad memory 12, EBI 13, microprocessor 14.Preferably, the scratch-pad memory 12 is semiconductor storage Device, the microprocessor 14 is connected with semiconductor storage interface 11, scratch-pad memory 12, the signal of EBI 13.
The semiconductor storage interface 11 is used for being connected with external equipment.Preferably, the semiconductor storage interface is for U.2 Interface.
The scratch-pad memory 12 is used for the temporary access command from external equipment, and the external equipment is preferably host side 30。
The EBI 13, for being connected with mainboard 40.Preferably, the EBI is U.2 interface.
The microprocessor 14, for processing access command, also for processing the data transfer from mainboard 40.
Semiconductor storage adapter 10 of the present invention each other passes through signal after collocation Known semiconductor storage array card 20 After conversion, so that it may allow composition similar to circumscribed semiconductor memory array cabinet.And price is cheaper, assemble simpler.
Using U.2 interface, transmission speed faster, and supports more multi-protocols to the semiconductor storage adapter, for example NVMe agreements etc..
As shown in Fig. 2 a kind of storage device with above-mentioned semiconductor storage adapter 10.
Including mainboard 40, hard disk 50.The mainboard includes the semiconductor memory array card 20 for assembling thereon and partly leads Body stores adapter 10, and the semiconductor storage adapter 10 includes semiconductor storage interface 11, scratch-pad memory 12, EBI 13rd, microprocessor 14, the microprocessor 14 is connected with semiconductor storage interface 11, scratch-pad memory 12, the signal of EBI 13. Preferably, the scratch-pad memory 12 is semiconductor memory, the microprocessor 14 and semiconductor storage interface 11, scratch-pad memory 12nd, the signal of EBI 13 connection.
When in use also with being connected with external equipment, the external equipment is preferably host side 30 to the storage device 60, Specifically, the host side 30 is connected with semiconductor storage adapter 10, the host side 30 includes semiconductor storage interface 31.
Preferably, the semiconductor storage of the host side 30 connects the semiconductor storage of 31 mouthfuls and semiconductor storage adapter 10 Interface 11 is all U.2 interface, and the U.2 interface of host side 30 passes through U.2 to count with the U.2 interface of semiconductor storage adapter 10 Connect according to line, the U.2 data wire is used for transmission signal and powers.
In one embodiment, semiconductor storage adapter 10, Known semiconductor storage array card 20 can Collaboration, This two cards must be inserted respectively in the slot belonging to motherboard 40.The semiconductor memory array card 20 has EBI 21。
The EBI 13 of the semiconductor storage adapter 10 is U.2 interface,
The EBI 21 of the semiconductor memory array card 20 is U.2 interface,
The mainboard 40 is provided with EBI 13 and semiconductor memory array with the semiconductor storage adapter 10 Block the slot of the docking of 20 EBI 21, preferably U.2 interface slot.By semiconductor storage adapter 10 and semiconductor storage battle array Row card 20 inserts respectively the U.2 interface slot on mainboard 40, realizes signal conduction.
Although the semiconductor storage adapter 10 of the present embodiment is provided with microprocessor 14, the function without CPU, it is impossible to Directly semiconductor memory array card 20 is controlled, so being provided with scratch-pad memory 12, it is preferred that the scratch-pad memory 12 is half Conductor memory, it is further preferred that the semiconductor memory is read only memory (ROM).
The semiconductor memory array card 20 is used to read access command from semiconductor storage adapter 10, then described Semiconductor memory array card 20 is operated according to the technology of RAID, after operation terminates, is needed return to host side 26 or is needed When data transfer is to host side 30, it is both needed to be transferred to semiconductor storage adapter 10 via semiconductor memory array card 20, and It is that response access command is returned or data transfer is to host side 30 under the control of its built-in microprocessor 14.
The semiconductor memory array card is known in the art technology and repeats no more.
Known semiconductor memory array card 20 is connected to hard disk 50 using RAID technique.In semiconductor storage adapter 10 After collocation mainboard 40, Known semiconductor storage array card 20, hard disk 50, can be formed as with U.2 interface, (i.e. quasiconductor is deposited Storage interface 11) storage device 60.
In order to allow host side 30 to be capable of the data of actual access hard disk 50, this mainboard 20 can allow this by slightly modified The semiconductor storage adapter 10 of embodiment becomes between host side 30, hard disk 50 (or Known semiconductor storage array card 21) Bridge assembly.
U.2 the interface of the host side 30 in the present embodiment is with the U.2 interface of semiconductor storage adapter 10 by U.2 data Line connects, and this enables semiconductor storage adapter 10 of the present invention to receive from host side 30 through semiconductor storage cable 28 Access command (for example read hard disk 50 in data).
Described above illustrates and describes the preferred embodiments of the present invention, as previously mentioned, it should be understood that not office of the invention Be limited to form disclosed herein, be not to be taken as the exclusion to other embodiment, and can be used for various other combinations, modification and Environment, and can be changed by the technology or knowledge of above-mentioned teaching or association area in invention contemplated scope described herein It is dynamic.And change that those skilled in the art are carried out and change be without departing from the spirit and scope of the present invention, then all should be appended by the present invention In scope of the claims.

Claims (8)

1. a kind of semiconductor storage adapter, it is characterised in that:Including semiconductor storage interface (11), scratch-pad memory (12), total Line interface (13), microprocessor (14), the scratch-pad memory (12) is semiconductor memory, the microprocessor (14) with partly lead Body memory interface (11), scratch-pad memory (12), EBI (13) signal connection, the semiconductor storage interface (11) for External equipment connects, and the semiconductor storage interface (11) is U.2 interface.
2. a kind of semiconductor storage adapter as claimed in claim 1, it is characterised in that:The EBI (13) is for U.2 Interface.
3. a kind of storage device with the arbitrary described semiconductor storage adapter of the claims 1-2, it is characterised in that: Including mainboard (40), hard disk (50), semiconductor memory array card (20) and half of the mainboard (40) including assembling thereon Conductor storage adapter (10), the hard disk (50) is connected with semiconductor memory array card (20).
4. a kind of storage device as claimed in claim 3, it is characterised in that:Also include and the semiconductor storage adapter (10) host side (30) of connection.
5. a kind of storage device as claimed in claim 4, it is characterised in that:The semiconductor storage interface of the host side (30) (31) it is U.2 interface.
6. a kind of storage device as claimed in claim 5, it is characterised in that:U.2 the interface of the host side (30) with partly lead U.2 the interface of body storage adapter (10) is connected by U.2 data wire.
7. a kind of storage device as claimed in claim 3, it is characterised in that:The semiconductor memory array card (20) is including total Line interface (21), the EBI (21) is U.2 interface.
8. a kind of storage device as claimed in claim 7, it is characterised in that:The mainboard (40) is provided with and the quasiconductor The slot that the EBI (13) of storage adapter (10) is docked with semiconductor memory array card (20) EBI (21), it is described Slot is U.2 interface slot.
CN201611101447.3A 2016-12-05 2016-12-05 Semiconductor storage adapter card and storage device with semiconductor storage adapter card Pending CN106681946A (en)

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Application Number Priority Date Filing Date Title
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101135950A (en) * 2006-08-28 2008-03-05 梁国恩 Magnetic disc adaptation card
CN102147650A (en) * 2010-02-09 2011-08-10 巴比禄股份有限公司 Peripheral device and method of operating the same
CN104021107A (en) * 2014-06-27 2014-09-03 浪潮电子信息产业股份有限公司 Design method for system supporting non-volatile memory express peripheral component interface express solid state disc (NVMe PCIE SSD)
CN104375785A (en) * 2014-12-02 2015-02-25 浪潮电子信息产业股份有限公司 PCIE storage card capable of flexibly expanding capacity
US20160147676A1 (en) * 2014-11-20 2016-05-26 Samsung Electronics Co., Ltd. Peripheral component interconnect (pci) device and system including the pci

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101135950A (en) * 2006-08-28 2008-03-05 梁国恩 Magnetic disc adaptation card
CN102147650A (en) * 2010-02-09 2011-08-10 巴比禄股份有限公司 Peripheral device and method of operating the same
CN104021107A (en) * 2014-06-27 2014-09-03 浪潮电子信息产业股份有限公司 Design method for system supporting non-volatile memory express peripheral component interface express solid state disc (NVMe PCIE SSD)
US20160147676A1 (en) * 2014-11-20 2016-05-26 Samsung Electronics Co., Ltd. Peripheral component interconnect (pci) device and system including the pci
CN104375785A (en) * 2014-12-02 2015-02-25 浪潮电子信息产业股份有限公司 PCIE storage card capable of flexibly expanding capacity

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Address after: 710119 the six level of new industrial park development avenue ten, new high-tech industrial park, Xi'an, Shaanxi.

Applicant after: Xi'an Morebeck Semiconductor Technology Co., Ltd.

Address before: 710119 the three layer of No. 10 hi-tech development road, Yanta District, Xi'an, Shaanxi.

Applicant before: Xi'an Morebeck Semiconductor Technology Co., Ltd.

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Application publication date: 20170517