CN106680310B - Shape memory alloy thermal cycle stability and functional fatigue performance test system - Google Patents
Shape memory alloy thermal cycle stability and functional fatigue performance test system Download PDFInfo
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Abstract
The invention discloses a shape memory alloy thermal cycle stability and functional fatigue performance test system; comprises a temperature control box, a sample support, a thermal cycle temperature control system and a data acquisition system; the temperature control box is of a hexahedral hollow structure; the flexible polyimide heating film of the thermal cycle control system is stuck to the bottom of the strip-shaped shape memory alloy sample, the positive and negative leads of the flexible polyimide heating film are connected with the heating end of the time relay, and the time relay is connected with the direct-current stabilized power supply; the thermocouple signal conditioning module and the laser tube displacement sensor of the data acquisition system are connected with a data acquisition card, the data acquisition card is connected with a computer, one end of the K-type thermocouple is connected with the thermocouple signal conditioning module, and the other end of the K-type thermocouple is connected with the flexible polyimide heating film. The invention displays and stores the shape and temperature change of the shape memory alloy in the thermal cycle process in real time through data acquisition and processing, and better evaluates the functional fatigue performance of the shape memory alloy in the thermal cycle process through analysis.
Description
Technical Field
The invention relates to a shape memory alloy test, in particular to a test for functional characteristics and microstructure evolution of a metal intelligent material under a long-term thermal cycle load, which is a test system for quantitatively evaluating the working stability, functional fatigue behavior and microstructure evolution of the shape memory alloy in a long-term thermal cycle service process.
Background
The shape memory alloy has unique shape memory effect, superelastic deformation and other functional characteristics and excellent mechanical performance, and is thus applied widely in intelligent structure, miniature drive, damping, biomedicine and other fields. Generally, the shape memory alloy is subjected to certain 'training' treatment, so that the shape memory alloy can obtain different deformation capacities such as elongation, shortening, bending and the like under the heat driving, so as to meet different application occasions. In the actual service process of the shape memory alloy, a long-time heat-induced martensitic transformation cycle or a stress-induced martensitic transformation cycle is often required, and the long-time transformation cycle can lead to the degradation or change of functional characteristics; for example, as the number of phase transition cycles increases, the alloy may undergo phase transition temperature changes, recoverable strain decreases, phase transition hysteresis increases, phase transition critical stress decreases, and the like. The change in functional properties will result in the alloy failing to meet the original design requirements, resulting in the alloy failing functionally, i.e., functional fatigue. Functional fatigue not only affects the service life of the alloy in terms of functional realization, but also can further cause microstructure change and structural damage or fracture of the alloy, thereby greatly reducing the service life of the alloy. Under the thermal cycle loading, the functional fatigue performance of the shape memory alloy is scientifically evaluated, and important and effective reference and guidance can be provided for the design and the application of the shape memory alloy; therefore, an experimental test system capable of safely and reliably testing the functional fatigue performance of the shape memory alloy under the cyclic loading condition is needed.
The Chinese patent application of the invention is a shape memory alloy thermo-mechanical fatigue experimental device (publication number is CN 105181734A) and a multifunctional tester for shape memory alloy wires (publication number is CN 101122559A), which mainly uses Joule heat to heat samples through current loading, and adopts larger voltage for the samples with larger size to meet the faster heating rate, so that larger potential safety hazard exists; in addition, the current loading mode easily causes the phenomenon that the resistance of the clamping part of the sample is too high, so that the local temperature is too high and the heating is uneven, and the current is introduced in the experimental process, so that the influence of the current on the sample in the long-term fatigue experiment cannot be eliminated. The prior art can only monitor the deformation of the shape memory alloy in the uniaxial direction, but can not monitor the bending deformation; moreover, as the extensometer is used for measuring the deformation of the sample in the thermal cycle process, and a certain space is needed for installing the extensometer, the sample with smaller size cannot be measured; in addition, the above-mentioned patents all adopt air natural cooling, and can not realize faster heating-cooling circulation actions. At present, there is an urgent need to design and build an experimental test system capable of stably realizing rapid heating-cooling cycle of the shape memory alloy, monitoring deformation of the shape memory alloy in the thermal cycle process, and accurately evaluating the functional fatigue behavior of the shape memory alloy later, and finally providing reliable reference and basis for component design and process preparation of the shape memory alloy.
Disclosure of Invention
The invention aims to overcome the defects of the prior art, and provides a system for testing the thermal cycle stability and the functional fatigue performance of a shape memory alloy, which can carry out stable thermal cycle loading on the shape memory alloy, synchronously collect and store displacement and temperature data of the shape memory alloy in a long-term thermal cycle process, and quantitatively evaluate the functional fatigue performance of the shape memory alloy through analysis of experimental data.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
the shape memory alloy thermal cycle stability and functional fatigue performance testing system comprises a temperature control box, a sample support, a thermal cycle temperature control system and a data acquisition system;
the control Wen Xiangbao comprises an upper cover plate of the temperature control box, side plates of the temperature control box and a bottom plate of the temperature control box; the temperature control box is of a hexahedral hollow structure and is formed by connecting an upper cover plate of the temperature control box, a bottom plate of the temperature control box and four side plates of the temperature control box; the upper cover plate of the temperature control box is a transparent acrylic plate; the bottom plate of the temperature control box is provided with a groove;
the sample support comprises a sample support side plate and a sample support clamp; the sample support clamp comprises a sample support clamp bolt hinge and a sample support hinge round bar; the sample support side plate is arranged in the hollow of the temperature control box, the sample support side plate is inserted into a groove of the bottom plate of the temperature control box, and the sample support clamp is fixed on the sample support side plate; the two ends of the strip-shaped shape memory alloy sample are fixed on bolt hinges of two sample support clamps, and the bolt hinges of the sample support clamps are fixed on the side plates of the sample support through round bars of the sample support hinges;
the thermal cycle control system comprises a time relay, a direct-current stabilized power supply, a first cooling fan, a second cooling fan and a flexible polyimide heating film; the flexible polyimide heating film is stuck to the bottom of the strip-shaped shape memory alloy sample, the positive and negative leads of the flexible polyimide heating film are connected with the heating end of the time relay, and the time relay is connected with the direct-current stabilized power supply; the first cooling fan and the second cooling fan are respectively arranged on two opposite side plates of the temperature control box in the same mode of blowing direction, and are connected to the cooling end of the time relay;
the data acquisition system comprises a K-type thermocouple, a laser displacement sensor, a screw rod sliding table, a thermocouple signal conditioning module, a data acquisition card and a computer; the thermocouple signal conditioning module and the laser tube displacement sensor are connected with a data acquisition card, the data acquisition card is connected with a computer, one end of the K-type thermocouple is connected with the thermocouple signal conditioning module, and the other end of the K-type thermocouple is connected with the flexible polyimide heating film; the laser displacement sensor is arranged on the screw rod sliding table and is positioned at the upper end of the upper cover plate of the temperature control box.
In order to further achieve the purpose of the invention, preferably, the four side plates of the temperature control box are transparent acrylic plates.
Preferably, the temperature control box bottom plate is a high-strength nylon plate.
Preferably, the side plate of the temperature control box is provided with a wiring hole and an air suction port.
Preferably, the sample support side plates are selected from high-strength insulating nylon plates.
Preferably, the screw rod sliding table is positioned at the outer side of the temperature control box.
Preferably, the wire diameter of the K-type thermocouple is less than 0.5mm.
Preferably, the data acquisition card adopts a USB-6001 data acquisition card; the thermocouple signal conditioning module adopts an S1101D type thermocouple model conditioning module; the laser displacement sensor adopts HG-C1050 laser displacement sensor.
Compared with the prior art, the invention has the characteristics and advantages that:
1) The invention can heat the shape memory alloy through the flexible polyimide heating film, can adopt a low-voltage direct-current power supply to supply power, and realize rapid temperature rise, thereby ensuring the safety of the whole system and ensuring that the flexible polyimide heating film can not influence the deformation of the alloy.
2) The invention can cool the heated alloy sample by two cooling fans which are installed in the same direction, realizes cold and hot air exchange in the temperature control box, and can realize rapid cooling.
3) The invention can monitor the non-uniaxial deformation of the shape memory alloy, such as bending deformation to obtain deformation amount and temperature data, and can evaluate the functional fatigue performance of the alloy in the bending deformation process by analyzing the data.
4) The invention can realize synchronous acquisition and storage of temperature data and displacement data and realize one-to-one correspondence of temperature data points and displacement data points.
Drawings
FIG. 1 is a schematic diagram showing the composition of a system for testing the thermal cycle stability and the functional fatigue performance of a shape memory alloy according to the present invention.
Fig. 2A is an external view of the incubator in fig. 1.
Fig. 2B is a schematic view of the interior of the incubator of fig. 1.
Fig. 2C is a front view of the sample holder of fig. 1 mated with an incubator.
FIG. 3A is a schematic diagram of the shape memory alloy sample clamping of FIG. 1, showing a low temperature flat state.
FIG. 3B is a schematic diagram of the shape memory alloy sample clamping of FIG. 1, illustrating a high temperature bending state.
The figure shows: the temperature control box 1, a direct-current stabilized power supply 2, a time relay 3, a thermocouple signal conditioning module 4, a data acquisition card 5, a computer 6, a screw rod sliding table 7, a laser displacement sensor 8, a K-type thermocouple 9, a first cooling fan 101, a second cooling fan 102, an upper cover plate 103 of the temperature control box, a side plate 104 of the temperature control box, a bottom plate 105 of the temperature control box, a shape memory alloy sample 106, a side plate 107 of the sample support, a clamp 108 of the sample support, a bolt hinge 1081 of the clamp of the sample support, a round bar 1082 of the hinge of the sample support and a flexible polyimide heating film 109.
Detailed Description
For a better understanding of the present invention, the present invention will be further described with reference to the accompanying drawings, but the embodiments of the present invention are not limited thereto.
As shown in FIG. 1, the system for testing the thermal cycle stability and the functional fatigue performance of the shape memory alloy comprises a temperature control box 1, a sample support, a thermal cycle temperature control system and a data acquisition system.
As shown in fig. 2A, the temperature control box 1 includes a temperature control box upper cover plate 103, a temperature control box side plate 104, and a temperature control box bottom plate 105; the temperature control box 1 is of a hexahedral hollow structure and is formed by connecting an upper cover plate 103 of the temperature control box, a bottom plate 105 of the temperature control box and four side plates 104 of the temperature control box; the upper cover plate 103 of the temperature control box and the four side plates 104 of the temperature control box are preferably transparent acrylic plates; the temperature control box bottom plate 105 is preferably a high strength nylon plate; the temperature control box side plate 104 is designed with a wiring hole and an air suction port; the temperature control box bottom plate 105 is provided with a groove;
as shown in fig. 2B, 2C and 3A, the sample holder includes a sample holder side plate 107 and a sample holder clamp 108; sample holder clamp 108 includes sample holder clamp bolt hinge 1081 and sample holder hinge round bar 1082; the sample support side plate 107 is arranged in the hollow of the temperature control box 1, the sample support side plate 107 is inserted into a groove of the bottom plate 105 of the heat preservation temperature control box, and the sample support clamp 108 is fixed on the sample support side plate 107; the two ends of the strip-shaped shape memory alloy sample 106 are fixed on two sample holder clamp bolt hinges 1081, and the sample holder clamp bolt hinges 1081 are fixed on the sample holder side plates 107 through sample holder hinge round bars 1082. The sample support side plate 107 is preferably a high-strength insulating nylon plate; the thermal cycle test of alloy samples with different sizes and shapes can be realized by designing sample brackets with different specifications.
The thermal cycle control system comprises a time relay 3, a direct-current stabilized power supply 2, a first cooling fan 101, a second cooling fan 102 and a flexible polyimide heating film 109; as shown in fig. 3A, a flexible polyimide heating film 109 is attached to the bottom of the strip-shaped shape memory alloy sample 106, the positive and negative wires of the flexible polyimide heating film 109 are connected with the heating end of a time relay 3, the time relay 3 is connected with a direct-current regulated power supply 2, and the direct-current regulated power supply, the time relay and the flexible polyimide heating film form a heating circuit cooling circuit; as shown in fig. 2A, a first cooling fan 101 and a second cooling fan 102 are respectively mounted on two opposite side plates 104 of the temperature control box 1 in the same manner in the blowing direction, and both the first cooling fan 101 and the second cooling fan 102 are connected to the cooling end of the time relay 3; the dc regulated power supply, the time relay, the first cooling fan 101, and the second cooling fan 102 constitute a cooling circuit. The time relay is provided with two wiring ports, namely a heating end and a cooling end, wherein the heating end is connected with the flexible polyimide heating film, and the cooling end is connected with the first cooling fan 101 and the second cooling fan 102.
The data acquisition system comprises a K-type thermocouple 9, a laser displacement sensor 8, a screw rod sliding table 7, a thermocouple signal conditioning module 4, a data acquisition card 5 and a computer 6; the type K thermocouple 9 serves as a temperature sensor; the computer 6 is provided with data acquisition software which is programmed based on an NI Labview DAQ module; the thermocouple signal conditioning module 4 and the laser tube displacement sensor 8 are connected with the data acquisition card 5, one end of the data acquisition card 5, which is connected with the computer 6,K type thermocouple 9, is connected with the thermocouple signal conditioning module 4, and the other end is connected with the flexible polyimide heating film 109; the laser displacement sensor 8 is arranged on the screw rod sliding table 7, the height of the laser displacement sensor 8 is adjusted through the screw rod sliding table 7 to meet the requirement of measuring the reference distance, the laser displacement sensor 8 is positioned at the upper end of the upper cover plate 103 of the temperature control box, the deformation of the shape memory alloy sample 106 in the thermal cycle process is monitored in real time through the upper cover plate 103 of the transparent temperature control box, the monitored signal is conditioned through the built-in signal conditioning module, and the screw rod sliding table 7 is positioned at the outer side of the temperature control box 1.
During testing, the flexible polyimide heating film 109 is attached to the bottom of the strip-shaped shape memory alloy sample 106, positive and negative leads of the flexible polyimide heating film 109 are connected with the time relay 3, the time relay 3 is connected with the direct-current stabilized power supply 2, the first cooling fan 101 and the second cooling fan 102 are installed on the temperature control box side plate 104 of the temperature control box 1, and wiring holes, fan blowing and air suction openings are respectively designed on the temperature control box side plate 104. As shown in fig. 2A, the first cooling fan 101 and the second cooling fan 102 are symmetrically installed in the same way in the blowing direction, and as shown in fig. 2B, both the first cooling fan 101 and the second cooling fan 102 are connected to the cooling end of the time relay 3. When the heating end of the time relay 3 connected with the flexible polyimide heating film 109 is in a conducting state, the direct current stabilized power supply 2 can conduct electric heating to the flexible polyimide heating film 109, and in the set heating time, the flexible polyimide heating film 109 is in an electric heating state, the shape memory alloy sample 106 is heated to a set temperature through heat exchange, and the shape of the strip-shaped shape memory alloy sample 106 is gradually changed from a straight shape (shown in fig. 3A) to a curved shape (shown in fig. 3B) along with the gradual rise of the temperature of the shape memory alloy sample 106; when the heating time is over, the time relay 3 cuts off the heating circuit and enables the cooling circuit to be in a passage state, the first cooling fan 101 and the second cooling fan 102 start to work, the first cooling fan 101 sucks hot air in the temperature control box 1, the second cooling fan 102 blows cold air into the temperature control box 1 to realize cold-hot air exchange, the strip-shaped shape memory alloy sample 106 is rapidly cooled, and as the temperature of the strip-shaped shape memory alloy sample 106 gradually decreases, the shape of the strip-shaped shape memory alloy sample 106 gradually returns to be flat (as shown in fig. 3A) from a bent shape (as shown in fig. 3B).
The method comprises the steps that a K-type thermocouple 9 with the wire diameter smaller than 0.5mm is glued on the surface of a strip-shaped shape memory alloy sample 106 through high-temperature glue, is led out through a wiring hole reserved on a side plate 104 of a temperature control box, the K-type thermocouple 9 is connected to a thermocouple signal conditioning module 4, and cold end compensation, noise reduction, signal isolation and other treatments are carried out on a voltage signal output by the K-type thermocouple 9 through the thermocouple signal conditioning module 4; the laser displacement sensor 8 is arranged on the screw rod sliding table 7, the height of the laser displacement sensor 8 is adjusted through the screw rod sliding table 7 to meet the requirement of measuring the reference distance, the laser displacement sensor 8 monitors the deformation of the strip-shaped shape memory alloy sample 106 in real time in the thermal cycle process through the transparent upper cover plate 103 of the temperature control box, and the monitored signal is conditioned through the built-in signal conditioning module; the laser displacement sensor can be a relaxation look HG-C1050 laser displacement sensor, and the laser displacement sensor integrates a signal conditioning module in the laser head; the thermocouple signal conditioning module 4 and the laser tube displacement sensor 8 are connected to the data acquisition card 5, the conditioned voltage signals are converted into digital signals through the data acquisition card 5 and transmitted to the computer 6 (PC), the computer 6 displays and stores the measured temperature signals and displacement signals through DAQ programming software in NI Labview, and the data acquisition software can realize the functions of data acquisition, data real-time display, automatic naming of folders, acquisition rate setting and the like. The deformation condition of the shape memory alloy in the thermal cycle process can be obtained by analyzing the acquired data, so that the functional fatigue behavior of the shape memory alloy can be evaluated.
The data acquisition card 5 adopts a U.S. national instruments (National Instruments, NI) USB-6001 data acquisition card. The data acquisition card is responsible for transmitting signals acquired by the sensor (the K-type thermocouple serving as a temperature sensor and the laser displacement sensor) to a computer (PC) end.
The thermocouple signal conditioning module 4 adopts a Beijing Altai S1101D thermocouple model conditioning module, and has the functions of cold end compensation, broken wire detection and the like.
The flexible polyimide heating film 109 is preferably a common flexible polyimide heating film, and has the following specifications: 5V,3W.
The laser displacement sensor 8 is preferably a loose look HG-C1050 laser displacement sensor.
It should be noted that the dc regulated power supply, time relay, first cooling fan, second cooling fan, type K thermocouple, computer, etc. described above may be of any suitable type known to those of ordinary skill in the art.
According to the invention, the shape memory alloy material can be subjected to heating-cooling cyclic loading through the test system, the shape deformation and temperature data of the shape memory alloy in the thermal cycle process can be acquired in real time, and the functional fatigue performance of the shape memory material in the thermal cycle loading can be evaluated through statistical processing and quantitative analysis of the acquired data.
Numerous other modifications and embodiments can be devised by those skilled in the art which fall within the scope of the principles and the spirit of the principles of this disclosure.
Claims (6)
1. The system for testing the thermal cycle stability and the functional fatigue performance of the shape memory alloy is characterized by comprising a temperature control box, a sample support, a thermal cycle temperature control system and a data acquisition system;
the control Wen Xiangbao comprises an upper cover plate of the temperature control box, side plates of the temperature control box and a bottom plate of the temperature control box; the temperature control box is of a hexahedral hollow structure and is formed by connecting an upper cover plate of the temperature control box, a bottom plate of the temperature control box and four side plates of the temperature control box; the upper cover plate of the temperature control box is a transparent acrylic plate; the bottom plate of the temperature control box is provided with a groove;
the sample support comprises a sample support side plate and a sample support clamp; the sample support clamp comprises a sample support clamp bolt hinge and a sample support hinge round bar; the sample support side plate is arranged in the hollow of the temperature control box, the sample support side plate is inserted into a groove of the bottom plate of the temperature control box, and the sample support clamp is fixed on the sample support side plate; the two ends of the strip-shaped shape memory alloy sample are fixed on bolt hinges of two sample support clamps, and the bolt hinges of the sample support clamps are fixed on the side plates of the sample support through round bars of the sample support hinges;
the thermal cycle temperature control system comprises a time relay, a direct-current stabilized power supply, a first cooling fan, a second cooling fan and a flexible polyimide heating film; the flexible polyimide heating film is stuck to the bottom of the strip-shaped shape memory alloy sample, the positive and negative leads of the flexible polyimide heating film are connected with the heating end of the time relay, and the time relay is connected with the direct-current stabilized power supply; the first cooling fan and the second cooling fan are respectively arranged on two opposite side plates of the temperature control box in the same mode of blowing direction, and are connected to the cooling end of the time relay;
the data acquisition system comprises a K-type thermocouple, a laser displacement sensor, a screw rod sliding table, a thermocouple signal conditioning module, a data acquisition card and a computer; the thermocouple signal conditioning module and the laser tube displacement sensor are connected with a data acquisition card, the data acquisition card is connected with a computer, one end of the K-type thermocouple is connected with the thermocouple signal conditioning module, and the other end of the K-type thermocouple is connected with the flexible polyimide heating film; the laser displacement sensor is arranged on the screw rod sliding table and is positioned at the upper end of the upper cover plate of the temperature control box;
the four side plates of the temperature control box select transparent acrylic plates;
the temperature control box bottom plate is a high-strength nylon plate;
the height of the laser displacement sensor is adjusted through the screw rod sliding table to meet the requirement of measuring the reference distance, the laser displacement sensor monitors the deformation of the strip-shaped shape memory alloy sample in the thermal cycle process in real time through the transparent upper cover plate of the temperature control box, and the monitored signal is conditioned through the built-in signal conditioning module.
2. The system for testing the thermal cycling stability and the functional fatigue performance of the shape memory alloy according to claim 1, wherein the side plate of the temperature control box is provided with a wiring hole and an air suction port.
3. The system for testing the thermal cycling stability and the functional fatigue performance of the shape memory alloy according to claim 1, wherein the sample support side plate is a high-strength insulating nylon plate.
4. The system for testing the thermal cycling stability and the functional fatigue performance of the shape memory alloy according to claim 1, wherein the screw sliding table is positioned outside the temperature control box.
5. The system for testing the thermal cycling stability and the functional fatigue performance of the shape memory alloy according to claim 1, wherein the wire diameter of the K-type thermocouple is less than 0.5mm.
6. The system for testing the thermal cycling stability and the functional fatigue performance of the shape memory alloy according to claim 1, wherein the data acquisition card is a USB-6001 data acquisition card; the thermocouple signal conditioning module adopts an S1101D type thermocouple model conditioning module; the laser displacement sensor adopts HG-C1050 laser displacement sensor.
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| CN108519220B (en) * | 2018-02-28 | 2020-03-24 | 西安空间无线电技术研究所 | Antenna rib high accuracy thermal stability testing arrangement |
| CN109441006B (en) * | 2018-11-30 | 2023-09-01 | 浙江大学 | Band gap controllable metamaterial beam based on shape memory alloy |
| CN110849564B (en) * | 2019-12-17 | 2024-05-28 | 吉林大学 | Shape memory alloy spring control by temperature change drive characteristic testing arrangement |
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| JPH08269654A (en) * | 1995-03-31 | 1996-10-15 | Furukawa Techno Material:Kk | Method for working shape memory alloy member |
| CN103543073A (en) * | 2013-09-26 | 2014-01-29 | 南京航空航天大学 | Mechanical performance test and heat engine training device for shape memory alloy wires |
| CN204831897U (en) * | 2015-07-21 | 2015-12-02 | 华南理工大学 | Evaluation microbonding point closes experimental system of reliability under effect at electricity - heat - couple of force |
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