CN106676359A - Metal, and preparation method and application thereof - Google Patents
Metal, and preparation method and application thereof Download PDFInfo
- Publication number
- CN106676359A CN106676359A CN201611117858.1A CN201611117858A CN106676359A CN 106676359 A CN106676359 A CN 106676359A CN 201611117858 A CN201611117858 A CN 201611117858A CN 106676359 A CN106676359 A CN 106676359A
- Authority
- CN
- China
- Prior art keywords
- metal
- cooling system
- indium
- cycle cooling
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
- F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F23/00—Features relating to the use of intermediate heat-exchange materials, e.g. selection of compositions
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
- F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
- F28D20/028—Control arrangements therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/14—Thermal energy storage
Abstract
The invention relates to metal, and a preparation method and application thereof. The metal, and the preparation method and application thereof are characterized in that the metal with the melting point being 300 +/- 5 DEG C comprises 83 to 86 percent by mass of indium and 14 to 17 percent by mass of copper; and the metal can be widely applied in the fields of spacecraft thermal control, advanced energy, information electron and the like which need to reduce heat conduction, electric conduction and heat dissipation of contacting heat resistors or resistors.
Description
Technical field
The present invention relates to a kind of fusing point is 300 ± 5 DEG C of metal, the temperature of the metal is relatively low, can be widely used for spacecraft heat
Control, the advanced energy, information electronics etc. need to reduce heat conduction, the conductive and field of radiating of thermal contact resistance or resistance.
Background technology
In some electronic equipment dissipating heat systems, the method that majority is radiated using phase-change material, but due to traditional phase transformation material
Expect for nonmetallic materials, density of material is less, and the latent heat of phase change of unit volume is less.Again because its heat conductivity is low, phase transformation material
The volume of material crosses conference causes system thermal resistance excessive.Therefore, in electronic equipment dissipating heat system, the phase transformation of traditional phase-change material
Latent heat is often insufficient for radiating requirements in System production time, and the addition of phase-change material mostly is balance system different operating shape
Chip temperature during state, and it is little to the effect of optimization of power consumption of heat dissipation system and volume.Therefore, people work out a kind of heat then
Conductance is high, the metal that fusing point is relatively low, electronic equipment is radiated using the circulation of electromagnetic pump.
Low-melting alloy, refers to fusible alloy of the fusing point less than 232 DEG C (fusing point of Sn)；Generally by B i, Sn, Pb, In etc.
Metallic element is constituted.Low-melting alloy is often widely used as solder, and in the device such as electrical equipment, steam, fire-fighting, fire alarm
The temperature-sensitive component such as electric fuse, fuse, be the quite potential low-melting alloy new material of a class.With sending out for technology
Exhibition, people are more and more finer for low temperature control aspect demand, and competence exertion is more under some specified temps for such as electronic equipment
Good characteristic, it is therefore desirable to by electronic equipment temperature control below the specified temp；Or by carrying out on specified temp
Metal fuses, and ambient temperature is controlled under predetermined temperature.Therefore people are to specific melting point metals, especially low-melting-point metal
There are long-term needs.
However, for the electronic equipment of those demand exothermic temperatures not high also not low (such as 500 DEG C or so), metal is followed
Ring radiating is needed on the high costs such as the electricity for spending, and research of the people in melting range for 232-1000 DEG C of metal alloy
It is considerably less, and the simple metal in the range of this, it is known to have bismuth (271.5 DEG C of fusing point), thallium (304 DEG C of fusing point), cadmium (fusing point
321.1 DEG C), cadmium (327.5 DEG C of fusing point), zinc (419.5 DEG C of fusing point) etc., but, these simple metal, or being known with very
Big toxicity (thallium, cadmium, cadmium, bismuth), or being affected by oxidation on metal surface, the variation of melting point of metal is big and speed of fusing
Also can decrease.Therefore, people are badly in need of a kind of cheap, nontoxic and fusing point with non-oxidizability in less high gold
Category carrys out the radiating for electronic equipment etc..
The content of the invention
To solve the above problems, the present invention proposes metal that a kind of fusing point is 300 ± 5 DEG C and its preparation method and application.
When the metal alloy is used for cycle cooling system, can be when electronic equipment dissipating heat temperature be relatively low, using decalescence come to gold
Category radiating, can be radiated when electronic equipment dissipating heat temperature is higher using metal liquid circulation again.
The inventor of the present invention considers the above-mentioned technical need of state of the art, through repetition test, proposes simultaneously
It is prepared for according to a kind of fusing point of one aspect of the invention metal placed in the middle, it includes the quality point of indium and copper, the indium and copper
Number scope is respectively：Indium 83%~86%, copper 14%~17%.
According to another aspect of the present invention, there is provided a kind of cycle cooling system, it includes radiator and wherein stores up
There is the cavity of the metal according to prepared by the present invention, the cavity is embedded in radiator base plate.
Cycle cooling system of the invention, wherein the cavity is closed curve pipeline.
Cycle cooling system of the invention, it also includes electromagnetic pump, and the electromagnetic pump is arranged on radiator and heat
On loop between source, and running status is entered only after the metal all becomes liquid.
Cycle cooling system of the invention, it, should also containing the temperature sensor being arranged in apart from thermal source farthest
Temperature sensor sends enabling signal to start the fortune of the electromagnetic pump when the temperature of metal is detected higher than its fusing point
OK.
Cycle cooling system of the invention, it, should also containing the flow-sensint unit being arranged in apart from thermal source farthest
Sensor sends enabling signal to start the operation of the electromagnetic pump when the flowing of metal is detected.
Cycle cooling system of the invention, wherein the section of the cavity is the rectangle with chamfering, circular or ellipse
It is circular.
Cycle cooling system of the invention, wherein routine of the equivalent diameter scope in the section for 1mm~20mm
Size or the microchannel size for 0.1mm~1mm.
According to another aspect of the present invention, there is provided the method for preparing metal of the invention, it includes following step
Suddenly：Under isolation air conditionses, the indium metal of intended component is melted；The metallic copper of intended component is added toward the indium of fusing,
To both continuous heatings and stir into molten condition；Molten alloy is maintained in 500~550 DEG C of temperature ranges and to it and is continued
Stirring 2-3h, to guarantee that two kinds of metals are fully fused；And under conditions of isolation air, make the alloy natural cooling of melting.
Metal fabrication methods of the invention, also include：It is heated continuously and stirs in and then indium metal and copper
Into after molten condition, then add the metallic zinc of intended component, and heated and stirred, until alloy is into molten condition
Melting point metal according to prepared by the present invention is 300 ± 3 DEG C.By will be described metal enclosed in cycle cooling system
Closed cavity in can realize phase-change accumulation energy circulation cooling.By temperature controller or the sensing of the phase transformation situation of detection metal
Device, monitors the temperature or phase of metal to judge the heat dispersion of system, so as to adjust the switch and work(of electromagnetic pump power supply
Rate size is controlling the working condition of metal, and then the temperature of environment that control system is applied.
Description of the drawings
Accompanying drawing herein is merged in description and constitutes the part of this specification, shows the enforcement for meeting the disclosure
Example, and be used to explain the principle of the disclosure together with description.
Fig. 1 is shown and is illustrated using a kind of theory structure of the embodiment of cycle cooling system of metal of the invention
Figure.
Fig. 2 show the side-looking structural representation of the embodiment using a kind of cycle cooling system of metal of the invention
Figure.
Description of reference numerals：1- thermals source, 2- metallic cavity, 3- electromagnetic pumps, 4- radiators, 5- temperature controllers, 6- radiatings
Fan.
Specific embodiment
Here exemplary embodiment will be illustrated in detail, its example is illustrated in the accompanying drawings.Explained below is related to
During accompanying drawing, unless otherwise indicated, the same numbers in different accompanying drawings represent same or analogous key element.Following exemplary embodiment
Described in embodiment do not represent all embodiments consistent with the disclosure.Conversely, they be only with it is such as appended
The example of the consistent apparatus and method of some aspects described in detail in claims, the disclosure.
The term used in the disclosure is, only merely for the purpose of description specific embodiment, and to be not intended to be limiting and originally open.
" one kind ", " described " and " being somebody's turn to do " of singulative used in disclosure and the accompanying claims book is also intended to include many number forms
Formula, unless context clearly shows that other implications.It is also understood that term "and/or" used herein is referred to and included
One or more associated any or all possible combinations for listing project.
It will be appreciated that though various information, but this may be described using term first, second, third, etc. in the disclosure
A little information should not necessarily be limited by these terms.These terms are only used for that same type of information is distinguished from each other out.For example, without departing from
In the case of disclosure scope, first can be referred to as second, and similarly, second can also be referred to as first.Depending on linguistic context,
As used in this word " if " can be construed to " and ... when " or " when ... when " or " in response to determining ".
In order that those skilled in the art more fully understand the disclosure, with reference to the accompanying drawings and detailed description to this public affairs
Open and be described in further detail.
In order to obtain metal of the fusing point at 300 ± 3 DEG C, inventor is finally obtained through repetition test using following methods
One kind mainly contains indium copper point alloy.Concrete preparation process is as follows：
First, under isolation air conditionses, by scheduled volume, (for example, the indium metal of mass fraction scope 83%~86%) adds
Heat fusing.Subsequently, scheduled volume (for example, the metallic copper of mass fraction scope 14%~17%), while right is added in the indium of fusing
Both continuous heatings simultaneously stir into molten condition.Then, molten alloy is maintained in 500~550 DEG C of temperature ranges and to it
2-3h is persistently stirred, to guarantee that two kinds of metals are fully fused, finally, under conditions of isolation air, the alloy nature of melting is made
Cooling, so as to obtain alloy of the fusing point near 300 ± 3 DEG C.A small amount of zinc element, the zinc can be added in the indium copper alloy
Mass fraction scope be 0.1%~3%.If necessary to add zinc, then after indium copper is fully fused, and then metallic zinc, side
Heating side stirring, until molten alloy is maintained in 500~550 DEG C of temperature ranges and to it and is continued by alloy into molten condition
Stirring 2-3h, to guarantee that three kinds of metals are fully fused, finally, under conditions of isolation air, makes the alloy natural cooling of melting,
So as to obtain alloy of the fusing point near 300 ± 3 DEG C.
The scope of each metal component in these alloys is named above, these components can become within the specific limits
It is dynamic, so that the fusing point of alloy also changes in the range of above-mentioned 300 ± 3 DEG C.
The alloy can be used for various uses.Due to the higher phase-change accumulation energy characteristic that the alloy is embodied, therefore can be with
In being applied to the various applications for being suitable for and carrying out phase-change accumulation energy.For this purpose, the present invention proposes a kind of metal phase change energy-storage circulation dissipating
Hot systems.
Fig. 1 show the principle of the embodiment using a kind of phase-change accumulation energy cycle cooling system of metal of the invention
Structural representation.Fig. 2 show the side-looking structure of the embodiment using a kind of cycle cooling system of metal of the invention
Schematic diagram.As illustrated in fig. 1 and 2, cycle cooling system of the invention includes：Thermal source 1, metallic cavity 2, electromagnetic pump 3, radiating
Device 4, temperature controller 5, radiator fan 6.The metallic cavity 2 is embedded in the substrate of radiator 4, wherein filling fusing point is 300
± 3 DEG C of metal.The track of the metallic cavity 2 for arbitrary shape closed curve, and integral sealing forms the metal and exists
Flow pipe under liquid phase state.
The metal keeps its solid state when ambient temperature is less than its fusing point, and when ambient temperature rises, absorbs
Heat in environment so that ambient temperature is kept for no more its fusing point.In the case of ambient temperature not acute variation, Jin Jintong
Crossing the phase-change thermal storage ability of a certain amount of metal being contained in cavity 2 can prevent the rising of ambient temperature.
The electromagnetic pump 3 is arranged on the liquid metal runner pipe road 2 on the substrate of radiator 4 between thermal source 1 and radiator 4,
For driving the liquid metal in cavity 2 when operation is energized.So as to when ambient temperature is ramping up, by liquid metal
Quick heat exchange characteristics absorb the heat produced at thermal source rapidly, and the heat for being absorbed is transmitted at radiator 4 rapidly
To radiator 4, so as to the discharge of acceleration environment heat, so as to reduce ambient temperature.
For this purpose, temperature sensor 5 or flow or viscosity detector 5 are provided with the cooling system, to sense chamber
Whether metal has been completely in liquid phase in body 2.The sensor 5 or detector 5 are generally arranged in circulation duct 2 apart from thermal source
1 farthest position, and it is viscous higher than the metal at its fusing point or the position in the temperature for detecting the metal at the position
When denseness is less than its flowable viscosity, enabling signal is sent to electromagnetic pump 3 so that electromagnetic pump enters running status.The temperature
Temperature or flow or viscosity that degree sensor 5 or flow or viscosity detector 5 are arrived always according to real-time detection, adjust the electricity
The applying size of current of magnetic pumping 3, so as to control its running status.For example, the temperature that temperature sensor 5 passes through monitoring metal
To judge the heat dispersion of system, so as to the work shape for adjusting the switch and watt level of electromagnetic pump power supply to control metal
State, and then the temperature of control system.
Because metal needs to be powered in flow process, therefore in order to prevent electric leakage, need the metallic cavity or pipeline 2
Inwall coats one layer of insulant.The metallic cavity or pipeline 2 material of itself can be metal.The metallic cavity or pipe
The section in road 2 is the rectangle with chamfering, circular or ellipse.The equivalent diameter scope in the section is the routine of 1mm-20mm
Size or the microchannel size for 0.1mm-1mm.It is different according to the application scenario of cooling system, for example needing high-power heat-dissipation
Occasion, the equivalent diameter in the section of the metallic cavity or pipeline 2 can be 15mm, 20mm.In some small application scenarios,
The section of such as chip cooling field, the metallic cavity or pipeline 2 is circular or oval, and the equivalent diameter in its section is
0.1mm、0.5mm、1mm。
The radiator 4 is made up of substrate, radiating fin and radiator fan 6 successively from top to bottom.The radiating fin cloth
On full whole radiator base plate.The radiating fin is arranged in the sphere of action of the radiator fan 6, in other words, radiating fin
Piece faces the air outlet of radiator fan 6.
Use metal of the invention to be used as heat transfer medium by the cooling system of said structure, when in use, work as heat
Source caloric value is less or during relatively low ambient temperature, when fever time is shorter, the heat that metal absorbs from thermal source or in environment is not
Be enough to melt it, temperature sensor detects that temperature is not up to the fusing point of metal, send to electromagnetic pump so as to it will not be triggered
Enabling signal, therefore battery pump is in power-off off position, now, meets the radiating of low-power thermal source.When thermal source caloric value
Increase, when fever time extends, the enough heats of Metal absorption undergo phase transition, and are changed into solidliquid mixture or liquid, temperature control
Device processed detects that temperature reaches the fusing point of metal, i.e., be powered to electromagnetic pump, and electromagnetic pump is in running order, now, meets Gao Gong
The radiating of rate thermal source.
According to metal of the present invention, have the advantage that：Fusing point for 300 ± 3 DEG C of metal as phase-change thermal storage and
Heat sink material is used, and its latent heat of phase change is big, heat conductivity is high, is applied in the system of short time work, can be substantially reduced and be sent out
The temperature shock of thermal device, at the same can make cooling system volume reduce, lower power consumption.
When metal of the invention is applied in cycle cooling system, when system heat generation amount is larger, fever time is longer
When, metal heat absorption is changed into liquid, and so as to be radiated by circulating, system radiating ability is greatly improved.
Above specific description of embodiments of the present invention, and just to helping understand the inventive concept of the present invention, this is simultaneously
Do not mean that all applications of the invention can only be confined to these specific specific embodiments.Those skilled in the art should manage
Solve, above-described specific embodiment, simply some examples in various preferred implementations.It is any to embody right of the present invention
The specific embodiment of requirement, all should be within the scope of the claims in the present invention be claimed.Those skilled in the art's energy
Enough technical scheme described in each specific embodiment above is modified or which part technical characteristic is carried out etc.
With replacement.All any modification, equivalent or improvement made within spirit and principles of the present invention etc., should be included in
Within the protection domain of the claims in the present invention.
The ultimate principle of the disclosure is described above in association with specific embodiment, however, it is desirable to, it is noted that above-mentioned concrete reality
Mode is applied, the restriction to disclosure protection domain is not constituted.Those skilled in the art want it is to be understood that depending on design
Summation other factors, can occur various modifications, combination, sub-portfolio and replacement.Any spiritual and original in the disclosure
Modification, equivalent and improvement for being made within then etc., should be included within disclosure protection domain.
Claims (10)
1. a kind of metal, the mass fraction scope that it includes indium and copper, the indium and copper is respectively：Indium 83%~86%, copper
14%~17%.
2. a kind of cycle cooling system, it includes radiator, wherein accommodates the cavity of metal according to claim 1,
The cavity is embedded in radiator base plate.
3. cycle cooling system according to claim 2, wherein the cavity is closed curve pipeline.
4. cycle cooling system according to claim 3, it also includes electromagnetic pump, the electromagnetic pump be arranged on radiator and
On loop between thermal source, and running status is entered only after the metal all becomes liquid.
5. the cycle cooling system according to claim 3 or 4, it includes the temperature sensing arranged apart from thermal source farthest
Device, with temperature sensor when the temperature higher than the fusing point of metal is detected, sends enabling signal to start the electromagnetic pump
Operation.
6. the cycle cooling system according to claim 3 or 4, its flowing also containing arrangement apart from thermal source farthest is sensed
Device, the sensor sends enabling signal to start the operation of the electromagnetic pump when the flowing of metal is detected.
7. the cycle cooling system according to claim 4 or 5, wherein the section of the metallic cavity is with the rectangular of chamfering
Shape, circle or ellipse.
8. cycle cooling system according to claim 7, wherein the equivalent diameter scope in the section is 1mm-20mm's
Stock size or the microchannel size for 0.1mm-1mm.
9. a kind of preparation method of metal as claimed in claim 1, comprises the steps of：
Under isolation air conditionses, the indium metal of intended component is melted；
The metallic copper of intended component is added toward the indium of fusing, to both continuous heatings and molten condition is stirred into；
Molten alloy is maintained in 500~550 DEG C of temperature ranges and to it and persistently stirs 2-3h, it is abundant to guarantee two kinds of metals
Fusion；
Under conditions of isolation air, the alloy natural cooling of melting is made.
10. the preparation method of metal according to claim 9, also includes：
After and then indium metal and copper are heated continuously and stir into molten condition, then add the metallic zinc of intended component,
And heated and stirred, until alloy is into molten condition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611117858.1A CN106676359A (en) | 2016-12-07 | 2016-12-07 | Metal, and preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611117858.1A CN106676359A (en) | 2016-12-07 | 2016-12-07 | Metal, and preparation method and application thereof |
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| Publication Number | Publication Date |
|---|---|
| CN106676359A true CN106676359A (en) | 2017-05-17 |
Family
ID=58868675
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611117858.1A Pending CN106676359A (en) | 2016-12-07 | 2016-12-07 | Metal, and preparation method and application thereof |
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| Country | Link |
|---|---|
| CN (1) | CN106676359A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108235664A (en) * | 2018-02-05 | 2018-06-29 | 四川九洲电器集团有限责任公司 | A kind of closed cabinet of liquid metal self-loopa heat dissipation |
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| CN108235664A (en) * | 2018-02-05 | 2018-06-29 | 四川九洲电器集团有限责任公司 | A kind of closed cabinet of liquid metal self-loopa heat dissipation |
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Application publication date: 20170517 |