CN106675454A - Solvent material formula applied to high-CTI-value and CAF-resistant copper-clad plates - Google Patents
Solvent material formula applied to high-CTI-value and CAF-resistant copper-clad plates Download PDFInfo
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- CN106675454A CN106675454A CN201611269026.1A CN201611269026A CN106675454A CN 106675454 A CN106675454 A CN 106675454A CN 201611269026 A CN201611269026 A CN 201611269026A CN 106675454 A CN106675454 A CN 106675454A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J129/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Adhesives based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Adhesives based on derivatives of such polymers
- C09J129/02—Homopolymers or copolymers of unsaturated alcohols
- C09J129/04—Polyvinyl alcohol; Partially hydrolysed homopolymers or copolymers of esters of unsaturated alcohols with saturated carboxylic acids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/24—Homopolymers or copolymers of amides or imides
- C09J133/26—Homopolymers or copolymers of acrylamide or methacrylamide
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/02—Coating on the layer surface on fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/12—Coating on the layer surface on paper layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/26—Polymeric coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
The invention discloses a solvent material formula applied to high-CTI-value and CAF-resistant copper-clad plates. According to the solvent material formula, a solvent in an adhesive layer is prepared by stirring and mixing polydimethylsiloxane, alkyl phenol polyoxyethylene ether, glycerol monoester stearate, polyvinyl alcohol, arabia gum, dimethyl imidazole, diethylenetriamine, dimethyl glutarate, di-ethylene glycol di-butyl ether and polyacrylamide under normal temperature and normal pressure. When the prepared solvent is used in a production process of copper-clad plates, dielectric properties and mechanical properties of the copper-clad plates can be improved; the service life of the adhesive layer is prolonged; the service performance of the adhesive layer is improved; the curing time of the adhesive is easy to master; the adhesion of the adhesive is improved.
Description
Technical field
The present invention relates to copper-clad plate production technical field, more particularly to a kind of solvent material of the high CTI value type of resistance to CAF copper-clad plate
Material formula.
Background technology
Also known as base material, it is to make reinforcing material by wood pulp paper or glass-fiber-fabric etc., is soaked with resin, and single or double covers for copper-clad plate
With Copper Foil, through a kind of board-like material of hot pressing, referred to as copper-clad laminate.It is the stock for being PCB, is often base
Material, when it is produced for multi-layer sheet, is also core plate.Copper-clad plate is divided into according to mechanical rigid：Rigid plate, flex plate；According to not
It is divided into insulating material structure：The copper-clad plate of organic resin class, metal-based copper-clad plate, ceramic base copper-clad plate；It is divided into according to thickness：Often
What straightedge and thin plate, wherein thickness were less than 0.5mm is thin plate；It is divided into according to reinforcing material：The copper-clad plate of glass cloth base, paper substrate cover copper
Plate, composite-based copper clad plate；It is divided into according to some properties：TG plates high, high dielectric property are done, uv blocking plate.Copper-clad plate is mainly used
In printed circuit board is made, for the manufacture such as various Military Electronic Equipments, communication equipment, computer, automotive electronics, household electrical appliance
Industry.With the development of global electronic information industry, to the demand rapid growth of copper-clad plate, the high-speed developing period is entered.With this
Meanwhile, domestic electronics and information industry simultaneous growth, copper-clad plate market growth rate exceedes the average speedup in the world, presents for many years prosperous
The growth of Sheng., it is necessary to apply to solvent in the production process of copper-clad plate, but solvent composition of the prior art is more
It is single, in the manufacturing process of copper-clad plate, the service life and performance of adhesive layer can be influenceed so that when adhesive solidifies
Between be difficult grasp, while reducing the adhesive force of adhesive.
The content of the invention
The present invention is in order to overcome deficiency of the prior art, there is provided a kind of solvent material of the high CTI value type of resistance to CAF copper-clad plate
Material formula.
The present invention is to be achieved through the following technical solutions：
A kind of solvent material formula of the high CTI value type of resistance to CAF copper-clad plate, described copper-clad plate includes adhesive layer, substrate layer, copper
Layers of foil, the adhesive layer is coated on substrate layer, and the adhesive layer includes solvent, fire retardant, antiradiation agent, described molten
Agent is made up of the component of following weight portion：Dimethyl silicone polymer 3-10 parts, APES 5-12 parts, stearic acid it is sweet
Oily monoesters 6-9 parts, polyvinyl alcohol 10-25 parts, arabia gum 4-9 parts, methylimidazole 3-8 parts, diethylenetriamine 10-15
Part, dimethyl glutarate 4-8 parts, dibutyl ethylene glycol ether 9-20 parts and polyacrylamide 10-24 parts.
Further, the solvent is made up of the component of following weight portion：3 parts of dimethyl silicone polymer, alkyl phenol polyoxy
5 parts of vinethene, 6 parts of glycerol stearate monoesters, 10 parts of polyvinyl alcohol, 4 parts of arabia gum, 3 parts of methylimidazole, divinyl three
10 parts of 10 parts of amine, 4 parts of dimethyl glutarate, 9 parts of dibutyl ethylene glycol ether and polyacrylamide.
Further, the solvent is made up of the component of following weight portion：10 parts of dimethyl silicone polymer, alkyl phenol polyoxy
12 parts of vinethene, 9 parts of glycerol stearate monoesters, 25 parts of polyvinyl alcohol, 9 parts of arabia gum, 8 parts of methylimidazole, divinyl
24 parts of 15 parts of triamine, 8 parts of dimethyl glutarate, 20 parts of dibutyl ethylene glycol ether and polyacrylamide.
Further, the solvent is made up of the component of following weight portion：7 parts of dimethyl silicone polymer, alkyl phenol polyoxy
9 parts of vinethene, 8 parts of glycerol stearate monoesters, 15 parts of polyvinyl alcohol, 7 parts of arabia gum, 5 parts of methylimidazole, divinyl three
18 parts of 13 parts of amine, 6 parts of dimethyl glutarate, 15 parts of dibutyl ethylene glycol ether and polyacrylamide.
Compared with prior art, the beneficial effects of the invention are as follows：The present invention by by the solvent in adhesive layer by gathering
Dimethyl siloxane, APES, glycerol stearate monoesters, polyvinyl alcohol, arabia gum, methylimidazole,
Diethylenetriamine, dimethyl glutarate, dibutyl ethylene glycol ether and polyacrylamide stir mix at normal temperatures and pressures,
The solvent that will be obtained is applied in the middle of the production technology of copper-clad plate, it is possible to increase the dielectric properties of copper-clad plate, mechanical property, while
Improve the service life and performance of adhesive layer so that adhesive hardening time is easily mastered, while improve adhesive
Adhesive force.
Specific embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, the present invention is carried out further below
Describe in detail.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, it is not used to limit this hair
It is bright.
Embodiment one：
A kind of solvent material formula of the high CTI value type of resistance to CAF copper-clad plate, described copper-clad plate includes adhesive layer, substrate layer, copper
Layers of foil, the adhesive layer is coated on substrate layer, and the adhesive layer includes solvent, fire retardant, antiradiation agent, described molten
Agent is made up of the component of following weight portion：3 parts of dimethyl silicone polymer, 5 parts of APES, glycerol stearate monoesters
6 parts, 10 parts of polyvinyl alcohol, 4 parts of arabia gum, 3 parts of methylimidazole, 10 parts of diethylenetriamine, 4 parts of dimethyl glutarate,
10 parts of 9 parts of dibutyl ethylene glycol ether and polyacrylamide.
Embodiment two：
A kind of solvent material formula of the high CTI value type of resistance to CAF copper-clad plate, described copper-clad plate includes adhesive layer, substrate layer, copper
Layers of foil, the adhesive layer is coated on substrate layer, and the adhesive layer includes solvent, fire retardant, antiradiation agent, described molten
Agent is made up of the component of following weight portion：10 parts of dimethyl silicone polymer, 12 parts of APES, glycerol stearate list
9 parts of ester, 25 parts of polyvinyl alcohol, 9 parts of arabia gum, 8 parts of methylimidazole, 15 parts of diethylenetriamine, dimethyl glutarate 8
24 parts of part, 20 parts of dibutyl ethylene glycol ether and polyacrylamide.
Embodiment three：
A kind of solvent material formula of the high CTI value type of resistance to CAF copper-clad plate, described copper-clad plate includes adhesive layer, substrate layer, copper
Layers of foil, the adhesive layer is coated on substrate layer, and the adhesive layer includes solvent, fire retardant, antiradiation agent, described molten
Agent is made up of the component of following weight portion：7 parts of dimethyl silicone polymer, 9 parts of APES, glycerol stearate monoesters
8 parts, 15 parts of polyvinyl alcohol, 7 parts of arabia gum, 5 parts of methylimidazole, 13 parts of diethylenetriamine, 6 parts of dimethyl glutarate,
18 parts of 15 parts of dibutyl ethylene glycol ether and polyacrylamide.
The present invention by by the solvent in adhesive layer by dimethyl silicone polymer, APES, stearic acid
Monoglyceride, polyvinyl alcohol, arabia gum, methylimidazole, diethylenetriamine, dimethyl glutarate, the fourth of diethylene glycol two
Ether and polyacrylamide stir mix at normal temperatures and pressures, and the production technology that the solvent that will be obtained applies to copper-clad plate is worked as
In, it is possible to increase the dielectric properties of copper-clad plate, mechanical property, while improving the service life and performance of adhesive layer, make
Must be easily mastered adhesive hardening time, while improve the adhesive force of adhesive.
Wherein, dimethyl silicone polymer is also referred to as dimethicone, is a kind of organic silicon materials of hydrophobic class.Medicine,
There is application in each field such as daily chemical product, food, building, and its derivative has reached hundreds of, conventional polysiloxanes mainly to be had：
Dimethyl silicone polymer, cyclomethicone, amino silicone, PSI, polysiloxane polyether copolymer.Its
Middle cyclomethicone is just for conventional polysiloxanes is a kind of.
APES（APEO）It is a kind of important Determination of Polyoxyethylene Non-ionic Surfactants, its having property
Matter stabilization, acid and alkali-resistance and the low feature of cost, are mainly used to produce high-performance detergent, are the most frequently used main in printing and dyeing assistant
One of raw material, it is various in preparation detergent, scouring agent, spinning oil, softening agent, crude oil and metal cleaner etc. for a long time
It is required for adding APES in printing and dyeing assistant.
Tristerin is the emulsifying agent and additive of food；It is used as emulsifying agent in cosmetics and medical paste.White
Wax-like thin slice or bead solid, it is water insoluble, mix through intense oscillations with hot water and be dispersed among in water.
Polyvinyl alcohol, organic compound, white plates, cotton-shaped or pulverulent solids are tasteless.It is dissolved in water（More than 95 DEG C）,
Dimethyl sulfoxide (DMSO) is slightly soluble in, insoluble in gasoline, kerosene, vegetable oil, benzene, toluene, dichloroethanes, carbon tetrachloride, acetone, acetic acid second
Ester, methyl alcohol, ethylene glycol etc..Polyvinyl alcohol is important industrial chemicals, for manufacturing Pioloform, polyvinyl acetal, resistance to gasoline pipeline and dimension
Nylon synthetic fibers, fabric-treating agent, emulsifying agent, paper coating, adhesive, glue etc..
Arabia gum is transparent fine particle or to micro-yellow powder.Almost it is completely dissolved in 2 times of water of weight.100G satisfies
With solubility in solution：It is 37G at 25 DEG C, is 38G at 50 DEG C, be 40G at 90 DEG C, the aqueous solution, in acidity, is dissolved in sweet to reindeer moss
Oil and propane diols, but be completely dissolved（About 5%）A couple of days must be reheated, insoluble in ethanol.Relative density 1.35-1.49（100℃
When dry product it is heavier）.
Methylimidazole white has moisture absorption to off-white color crystalline powder, is dissolved in water, alcohol, is dissolved in acetone, DMF.Indissoluble
In benzene；It is poisonous, and corrosivity irritant to skin, mucous membrane.This product is used for metronidazole, and the synthesis of dimetridazole is also asphalt mixtures modified by epoxy resin
Fat curing agent.
Diethylenetriamine is that yellow has hygroscopic clear viscous liquids, and irritant ammonia is smelly, flammable, in strong basicity.
Water, acetone, benzene, ethanol, methyl alcohol etc. are dissolved in, normal heptane is insoluble in, copper and its alloy are corrosive.- 35 DEG C of fusing point, boiling point
207 DEG C, relative density 0.9586（20、20℃）, refractive index 1.4810.94 DEG C of flash-point.This product has the reactivity of secondary amine, easily with
Multiple compounds react, and its derivative has been widely used.Moisture and carbon dioxide in easy absorption air.
The chemical formula of dimethyl glutarate is：C7H12O4It is a kind of liquid with micro-perfume gas, its boiling point is 214 DEG C
(0.9MPa), is highly soluble in ether and alcohol.
Dibutyl ethylene glycol ether is colorless clear liquid, there is faint ether taste, the general character with ether.
Polyacrylamide classification polyacrylamide Products：Polyacrylamide（PAM）It is high molecular weight water soluble polymer,
Insoluble in most of organic solvents, with good flocculability, the frictional resistance between liquid can be reduced, by ion characteristic point
Nonionic, anion, cation and the type of amphoteric four can be divided into.
General principle of the invention, principal character and advantages of the present invention has been shown and described above.The technology of the industry
It should be appreciated that the present invention is not limited to the above embodiments, described in above-described embodiment and specification is only the present invention to personnel
Preference, be not intended to limit the present invention, without departing from the spirit and scope of the present invention, the present invention also have it is various
Changes and improvements, these changes and improvements all fall within the protetion scope of the claimed invention.The claimed scope of the invention is by institute
Attached claims and its equivalent thereof.
Claims (4)
1. a kind of solvent material formula of the high CTI value type of resistance to CAF copper-clad plate, described copper-clad plate include adhesive layer, substrate layer,
Copper foil layer, the adhesive layer is coated on substrate layer, and the adhesive layer includes solvent, fire retardant, antiradiation agent, and it is special
Levy and be, the solvent is made up of the component of following weight portion：Dimethyl silicone polymer 3-10 parts, APES 5-
12 parts, 6-9 parts of glycerol stearate monoesters, polyvinyl alcohol 10-25 parts, arabia gum 4-9 parts, methylimidazole 3-8 parts, diethyl
10-15 parts, dimethyl glutarate 4-8 parts, dibutyl ethylene glycol ether 9-20 parts and polyacrylamide 10-24 parts of alkene triamine.
2. the solvent material formula of the high CTI value type of resistance to CAF copper-clad plate according to claim 1, it is characterised in that described molten
Agent is made up of the component of following weight portion：3 parts of dimethyl silicone polymer, 5 parts of APES, glycerol stearate monoesters
6 parts, 10 parts of polyvinyl alcohol, 4 parts of arabia gum, 3 parts of methylimidazole, 10 parts of diethylenetriamine, 4 parts of dimethyl glutarate,
10 parts of 9 parts of dibutyl ethylene glycol ether and polyacrylamide.
3. the solvent material formula of the high CTI value type of resistance to CAF copper-clad plate according to claim 1, it is characterised in that described molten
Agent is made up of the component of following weight portion：10 parts of dimethyl silicone polymer, 12 parts of APES, glycerol stearate list
9 parts of ester, 25 parts of polyvinyl alcohol, 9 parts of arabia gum, 8 parts of methylimidazole, 15 parts of diethylenetriamine, dimethyl glutarate 8
24 parts of part, 20 parts of dibutyl ethylene glycol ether and polyacrylamide.
4. the solvent material formula of the high CTI value type of resistance to CAF copper-clad plate according to claim 1, it is characterised in that described molten
Agent is made up of the component of following weight portion：7 parts of dimethyl silicone polymer, 9 parts of APES, glycerol stearate monoesters
8 parts, 15 parts of polyvinyl alcohol, 7 parts of arabia gum, 5 parts of methylimidazole, 13 parts of diethylenetriamine, 6 parts of dimethyl glutarate,
18 parts of 15 parts of dibutyl ethylene glycol ether and polyacrylamide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611269026.1A CN106675454A (en) | 2016-12-31 | 2016-12-31 | Solvent material formula applied to high-CTI-value and CAF-resistant copper-clad plates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611269026.1A CN106675454A (en) | 2016-12-31 | 2016-12-31 | Solvent material formula applied to high-CTI-value and CAF-resistant copper-clad plates |
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| Publication Number | Publication Date |
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| CN106675454A true CN106675454A (en) | 2017-05-17 |
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| CN201611269026.1A Pending CN106675454A (en) | 2016-12-31 | 2016-12-31 | Solvent material formula applied to high-CTI-value and CAF-resistant copper-clad plates |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102689463A (en) * | 2012-05-28 | 2012-09-26 | 珠海亚泰电子科技有限公司 | Flexible copper-clad plate |
| CN102702989A (en) * | 2012-05-28 | 2012-10-03 | 珠海亚泰电子科技有限公司 | Cover film for flexible copper clad plate and preparation method thereof |
| CN104559864A (en) * | 2015-02-10 | 2015-04-29 | 安徽希玛欧美佳装饰材料工业有限公司 | Heat-resistance phenolic resin adhesive for chemical resistant laminate |
-
2016
- 2016-12-31 CN CN201611269026.1A patent/CN106675454A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102689463A (en) * | 2012-05-28 | 2012-09-26 | 珠海亚泰电子科技有限公司 | Flexible copper-clad plate |
| CN102702989A (en) * | 2012-05-28 | 2012-10-03 | 珠海亚泰电子科技有限公司 | Cover film for flexible copper clad plate and preparation method thereof |
| CN104559864A (en) * | 2015-02-10 | 2015-04-29 | 安徽希玛欧美佳装饰材料工业有限公司 | Heat-resistance phenolic resin adhesive for chemical resistant laminate |
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Application publication date: 20170517 |