CN106675425A - Production method of adhesive tape made of heat conduction adhesive - Google Patents
Production method of adhesive tape made of heat conduction adhesive Download PDFInfo
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- CN106675425A CN106675425A CN201510744564.0A CN201510744564A CN106675425A CN 106675425 A CN106675425 A CN 106675425A CN 201510744564 A CN201510744564 A CN 201510744564A CN 106675425 A CN106675425 A CN 106675425A
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- adhesive
- heat conduction
- adhesive tape
- mixed solution
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- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention relates to a production method of an adhesive tape made of a heat conduction adhesive. The method comprises the following steps: mixing an acrylate adhesive, an isocyanate curing agent, a soluble organic-metal complex and an inorganic eat conduction agent according to a ratio of 20:1:2:1, adding the obtained mixture to a reactor, adding water, and stirring above substances until the substances are uniformly mixed; adding an antioxidant and an anti-ageing agent to the above obtained mixed solution, uniformly stirring the solution, the antioxidant and the anti-ageing agent, and allowing the obtained solution to stand for 30-40 min in order to prepare an adhesive mixed solution; and coating release paper having release force with the prepared adhesive mixed solution, drying the coated release paper in a 85 DEG C oven for 1-2 min, compounding the dried release paper with soft aluminum foil, placing the obtained material in a 35 DEG C oven, ripening the material for 3-5 d, and cutting the ripened material to form the supporting adhesive tape. The heat conductivity of the prepared adhesive is improved, the application range of the adhesive is wide, and the heat conductivity obtained by adding a small amount of the inorganic heat conduction filler is same to the heat conductivity obtained by individually adding a large amount of the inorganic heat conduction filler, so the adhesion, the retentivity and other basic performances of the adhesive tape are improved.
Description
Technical field
The present invention relates to a kind of preparation method of adhesive tape, the adhesive tape preparation method of more particularly to a kind of heat conduction adhesive.
Background technology
In recent years, digital product is developed rapidly as light, thin, short and smallization, and these changes are inseparable with high-performance short and smallization of digital product and high density actual load technology, and heat-conducting glue has outstanding processing characteristics, and it is easy to operate, its deficiency for existing is the heat conduction of adhesive itself
Rate is relatively low, obtain higher thermal conductivity, generally need to fill substantial amounts of inorganic filler, it is easily caused other hydraulic performance declines such as adhesion strength of heat-conducting glue and affects normally to use, therefore it is badly in need of developing a kind of adhesive tape preparation method of the strong heat conduction adhesive of adhesion strength, Jing is retrieved, and is not found and same or analogous technical scheme of the invention.
The content of the invention
The technical problem to be solved in the present invention is to provide a kind of adhesive tape preparation method of the strong heat conduction adhesive of adhesion strength.
To solve above-mentioned technical problem, the technical scheme is that：A kind of adhesive tape preparation method of heat conduction adhesive, its innovative point is：The preparation method is specific as follows：
（1）It is in proportion 20 by acrylate adhesive, isocyanate curing agent, soluble metal-organic complex and inorganic thermal conductivity agent:1:2:1 mixing is added in reactor, and the stirring that adds water is to being well mixed；
（2）Antioxidant and age resistor are added in mixed solution, 30～40min is stood after stirring, adhesive mixed liquor is obtained；
（3）The mixing of obtained adhesive is coated in the big release liners of off-type force, 85 DEG C of 1～2min of oven drying of Jing, and it is compound with soft aluminium foil, it is placed on maturation 3～5 days in 35 DEG C of baking oven, cleaved support tape.
Further, the step（3）The coating thickness of middle adhesive is 35～55 μm.
It is an advantage of the current invention that：
（1）The thermal conductivity of adhesive prepared by the present invention is lifted, and range of application becomes wide, at the same the less inorganic heat filling of addition and obtain and individually add a large amount of inorganic heat filling identical thermal conductivitys, so as to improve the key property such as adhesion strength, confining force of adhesive tape.
（2）The coating thickness of adhesive is 35～55 μm, it is ensured that the normal use demand of adhesive tape.
Specific embodiment
Embodiment 1
The invention discloses a kind of adhesive tape preparation method of heat conduction adhesive, the preparation method is specific as follows：
（1）It is in proportion 10 by acrylate adhesive, isocyanate curing agent, soluble metal-organic complex and inorganic thermal conductivity agent:1:1:1 mixing is added in reactor, and the stirring that adds water is to being well mixed；
（2）Antioxidant and age resistor are added in mixed solution, 30～40min is stood after stirring, adhesive mixed liquor is obtained；
（3）The mixing of obtained adhesive is coated in the big release liners of off-type force, coating thickness is 35～55 μm, 85 DEG C of 1～2min of oven drying of Jing, and it is compound with soft aluminium foil, it is placed on maturation 3～5 days in 35 DEG C of baking oven, cleaved support tape.
Embodiment 2
The present embodiment is with the unique difference of embodiment 1：The proportioning of acrylate adhesive, isocyanate curing agent, soluble metal-organic complex and inorganic thermal conductivity agent is 20:1:2:1.
Embodiment 3
The present embodiment is with the unique difference of embodiment 1：The proportioning of acrylate adhesive, isocyanate curing agent, soluble metal-organic complex and inorganic thermal conductivity agent is 15:1:2:1.
According to above-described embodiment, the adherence of obtained adhesive tape is most strong in embodiment 2, therefore is 20 from the proportioning of acrylate adhesive, isocyanate curing agent, soluble metal-organic complex and inorganic thermal conductivity agent:1:2:1.
The general principle and principal character of the present invention has been shown and described above.It should be understood by those skilled in the art that; the present invention is not restricted to the described embodiments; merely illustrating the principles of the invention described in above-described embodiment and specification; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements are both fallen within scope of the claimed invention.The claimed scope of the invention is by appending claims and its equivalent thereof.
Claims (2)
1. the adhesive tape preparation method of a kind of heat conduction adhesive, it is characterised in that：The preparation method is specific as follows：
(1) it is in proportion 20 by acrylate adhesive, isocyanate curing agent, soluble metal-organic complex and inorganic thermal conductivity agent:1:2:1 mixing is added in reactor, and the stirring that adds water is to being well mixed；
(2) antioxidant and age resistor are added in mixed solution, 30～40min is stood after stirring, adhesive mixed liquor is obtained；
(3) mixing of obtained adhesive is coated in the big release liners of off-type force, 85 DEG C of 1～2min of oven drying of Jing, and it is compound with soft aluminium foil, it is placed on maturation 3～5 days in 35 DEG C of baking oven, cleaved support tape.
2. the adhesive tape preparation method of a kind of heat conduction adhesive according to claim 1, it is characterised in that：The step（3）The coating thickness of middle adhesive is 35～55 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510744564.0A CN106675425A (en) | 2015-11-06 | 2015-11-06 | Production method of adhesive tape made of heat conduction adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510744564.0A CN106675425A (en) | 2015-11-06 | 2015-11-06 | Production method of adhesive tape made of heat conduction adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106675425A true CN106675425A (en) | 2017-05-17 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510744564.0A Pending CN106675425A (en) | 2015-11-06 | 2015-11-06 | Production method of adhesive tape made of heat conduction adhesive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106675425A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109705771A (en) * | 2017-10-26 | 2019-05-03 | 江苏凤凰木业有限公司 | A kind of swollen adhesive of timber heat resistanceheat resistant |
| CN113444484A (en) * | 2021-06-03 | 2021-09-28 | 苏州赛伍应用技术股份有限公司 | Polyurethane adhesive composition, protective film and application thereof |
-
2015
- 2015-11-06 CN CN201510744564.0A patent/CN106675425A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109705771A (en) * | 2017-10-26 | 2019-05-03 | 江苏凤凰木业有限公司 | A kind of swollen adhesive of timber heat resistanceheat resistant |
| CN113444484A (en) * | 2021-06-03 | 2021-09-28 | 苏州赛伍应用技术股份有限公司 | Polyurethane adhesive composition, protective film and application thereof |
| CN113444484B (en) * | 2021-06-03 | 2022-11-18 | 苏州赛伍应用技术股份有限公司 | Polyurethane adhesive composition, protective film and application thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170517 |