CN106674745A - High heat-resistant BOPP (biaxially-oriented polypropylene) thin film - Google Patents
High heat-resistant BOPP (biaxially-oriented polypropylene) thin film Download PDFInfo
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- CN106674745A CN106674745A CN201611220672.9A CN201611220672A CN106674745A CN 106674745 A CN106674745 A CN 106674745A CN 201611220672 A CN201611220672 A CN 201611220672A CN 106674745 A CN106674745 A CN 106674745A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/10—Homopolymers or copolymers of propene
- C08L23/12—Polypropene
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D7/00—Producing flat articles, e.g. films or sheets
- B29D7/01—Films or sheets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/20—Carboxylic acid amides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
- C08K5/523—Esters of phosphoric acids, e.g. of H3PO4 with hydroxyaryl compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/524—Esters of phosphorous acids, e.g. of H3PO3
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2323/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
- C08J2323/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
- C08J2323/10—Homopolymers or copolymers of propene
- C08J2323/12—Polypropene
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2483/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/16—Applications used for films
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/24—Crystallisation aids
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/24—Crystallisation aids
- C08L2205/242—Beta spherulite nucleating agents
Abstract
The invention discloses a high heat-resistant BOPP (biaxially-oriented polypropylene) thin film, and belongs to the technical field of macromolecular materials. The high heat-resistant BOPP thin film consists of an upper surface layer, a core layer and a lower surface layer, wherein the upper surface of the core layer is compounded with the upper surface layer, and the lower surface of the core layer is compounded with the lower surface layer. The high heat-resistant BOPP thin film is characterized by being prepared from the following raw materials in parts by weight: 954 to 979 parts of homo-polypropylene, 20 to 45 parts of nucleating agent, and 1 to 2 parts of anti-blocking agent. The high heat-resistant BOPP thin film has the advantages that by utilizing the synergistic action of an alpha-crystalline nucleating agent and a beta-crystalline nucleating agent, the heat-resistant property of the thin film is good; by utilizing the silicone organic anti-blocking agent, the irregular bulge is formed at the film surface, the air enters a gap between the thin film and a circuit board, the problem of difficulty in stripping due to blocking between the thin film and the printed circuit board is solved, and the high heat-resistant BOPP thin film is suitable for the hot pressing technology of printed circuit boards.
Description
Technical field
The invention belongs to technical field of polymer materials, and in particular to a kind of for the high resistance to of printed circuit board (PCB) heat pressing process
Hot BOPP film.
Background technology
In recent years, people more and more use electronic product, and printed circuit board (PCB) (PCB) is indispensable in electronic product
Accessory, use demand both domestic and external constantly increases.The general course of processing of printed circuit board (PCB) is multilayer circuit board with release thin
Film isolation after hot pressing, in hot-forming rear stripper circuit plate, it requires the mould release membrance at high temperature adhesion shrink and press after
It is easily peeled off.At present conventional mould release membrance is the thin film such as PET, PMP, due to its heat resistance preferably, using than wide, but by
It is of a relatively high in price, limit it and use threshold.
At present, BOPP film, i.e. bidirectional stretching polypropylene film are with its cheap price, excellent mechanical strength, optics
Performance and printing adaptability, are widely used in packaging industry and other field tool;Its production is polypropylene masterbatch by extrusion
Machine melting extrusion, through die head sheet is made, and longitudinal stretching, cross directional stretch, and Jing coolings and sided corona treatment are then passed through respectively
Thin film made by winding.Sheet is respectively in the horizontal and vertical stretching for carrying out stretching ratio 5-10 in BOPP film production process,
Thin film is made along draw direction change in orientation, cooling and shaping is carried out after stretching and is processed so that state of orientation solidifies in the film;So
And pressurization can be typically heated in rear plus man-hour, generating unit decomposes orientation, and thin film occurs the phenomenon of dimensional contraction in vertical and horizontal,
The percent thermal shrinkage of general BOPP film is 2-6%, during 120 DEG C of baking oven, is dried 2 minutes.
In the contour machining procedure of printed circuit board (PCB), need to carry out under the high temperature conditions and need to put down perpendicular to circuit board
Face applies certain pressure, prevents circuit board to be adhered per needing to carry out isolation between two-tier circuit plate, and forming process terminates
Afterwards spacer peeled off again.BOPP film with low cost and with certain intensity, but the forming temperature of circuit board compares BOPP
The fusing point of thin film is high, and thin film occurs obvious dimensional contraction and softening, and its thermostability cannot meet requirement, viscous with circuit board after hot pressing
Company is difficult to peel off, it is impossible to be directly used in the processing of circuit board.
The content of the invention
In order to solve the above problems, the invention provides a kind of high heat-resisting BOPP film, disclosure satisfy that printed circuit board (PCB) heat
Thermostability to BOPP film and the requirement of stripping performance under pressure technique, and it is cheap.
The present invention is for the solution technical scheme that adopted of its technical problem:A kind of high heat-resisting BOPP film, by upper epidermis,
Sandwich layer and layer are constituted, and the compound upper epidermis of upper surface of the sandwich layer, the compound layer of lower surface of sandwich layer, its feature exists
In the BOPP film is prepared from the following raw materials in parts by weight:HOPP 954-979 parts, nucleator 20-45 parts resist
Adhesion agent 1-2 parts;
Wherein, the upper epidermis is made up of the raw material of following weight portion:HOPP 17-19 parts, nucleator 0.5-2.5 parts,
Antiblocking agent 0.5-1 parts;
The sandwich layer(2)It is made up of the raw material of following weight portion:HOPP 920-941 parts, nucleator 19-40 parts;
The layer(3)It is made up of the raw material of following weight portion:It is HOPP 17-19 parts, nucleator 0.5-2.5 parts, anti-
Adhesion agent 0.5-1 parts.
Preferably, the nucleator is the mixture of alpha-crystal form nucleator, beta crystal-type nucleater and antioxidant, and wherein α is brilliant
Type nucleator:Beta crystal-type nucleater:The weight ratio of antioxidant is 1:1:0.1, the antiblocking agent is the organic tissue adhesion of silicone
Agent, the organic antiblocking agent of the silicone for effective content 50% dimethyl siloxane master batch.
Preferably, the alpha-crystal form nucleator be phosphoric acid ester slaine methylene bis 2,4- di-tert-butyl phenoxy group sodium phosphates,
The beta crystal-type nucleater is aryl carboxylic acid diamides, and the antioxidant is phosphite antioxidant.
Above-mentioned technical proposal is prepared as follows:
1. raw material is weighed according to above-mentioned weight portion;
2. will add in respective extruder after the dry materials used by sandwich layer, upper epidermis, each layer of layer, mixing, material exists
Fusion plastification in extruder, extruder temperature is 230-250 DEG C;
3. three kinds of materials after fusion plastification are extruded at die head and converged, and make 2-3mm sheets, 250 DEG C of die head temperature;
4. sheet carries out cooling slab through laminating chilling roller and tank, and chilling roller temperature is 30-40 DEG C;
5. slab carries out longitudinal stretching, temperature 130-140 DEG C, 5 times of stretchings times in Zong La areas through preheating, stretching, sizing region
Rate;
6. cross directional stretch, temperature 150-180 DEG C, 8 times of stretchings times are carried out through preheating, stretching, sizing, cooled region in Heng Laqu
Rate, prepared thickness about 50um thin film;
7. the thin film Jing through progressively biaxial tension is cooled down, traction is flattened, winder winding, obtains final product high heat-resisting BOPP film.
Compared with prior art, the invention has the beneficial effects as follows:
1. by adding α-crystal-type nucleater, cause and greater number of crystal is formed in crystallization process, improve crystal density and rule
Whole property, so as to improve the mechanical strength and toughness of thin film;
2. by add beta-crystal nucleator, change thin film crystallization course, by part α-crystal conversion be heat distortion temperature more
High beta-crystal, solves the problems, such as that film melting points are low, poor heat resistance;
3., because α-crystal-type nucleater and beta-crystal nucleator are added with synergy jointly, increasing in amount of crystals simultaneously can
There are more crystalline transformation to be beta-crystal, comparing an only addition beta-crystal nucleator can obtain more excellent thermostability.
4. make face form irregular projection using the organic antiblocking agent of silicone, air is entered between thin film and circuit board
Space, solves the problems, such as that adhesion is difficult to peel off between thin film and printed circuit board, at the same the antiblocking agent scraping and wiping resistance performance it is good,
Fusing point is high, is suitable for hot environment and uses, and instead of thin film the step of need to being coated with mould release in rear plus man-hour, and Simplified flowsheet drops
Low cost.
Description of the drawings
Fig. 1 is the structural representation of the present invention.
In figure:1. upper epidermis, 2. sandwich layer, 3. layer.
Specific embodiment
With reference to the accompanying drawings and examples the invention will be further described.
Embodiment 1:
As shown in figure 1, the invention provides a kind of high heat-resisting BOPP film, from top to bottom successively by upper epidermis 1, sandwich layer 2 and under
Top layer 3 is composited, and BOPP film is prepared from the following raw materials in parts by weight:954 parts of HOPP, 45 parts of nucleator resists
1 part of adhesion agent;
Wherein, the upper epidermis 1 is made up of the raw material of following weight portion:17 parts of HOPP, 2.5 parts of nucleator, tissue adhesion
0.5 part of agent;
The sandwich layer 2 is made up of the raw material of following weight portion:920 parts of HOPP, 40 parts of nucleator;
The layer 3 is made up of the raw material of following weight portion:17 parts of HOPP, 2.5 parts of nucleator, antiblocking agent 0.5
Part.
Preparation method is as follows:
1. raw material is weighed according to above-mentioned weight portion;
2. will add in respective extruder after the dry materials used by sandwich layer, upper epidermis, each layer of layer, mixing, material exists
Fusion plastification in extruder, extruder temperature is 250 DEG C;
3. three kinds of materials after fusion plastification are extruded at die head and converged, and make 2-3mm sheets, 250 DEG C of die head temperature;
4. sheet carries out cooling slab through laminating chilling roller and tank, and chilling roller temperature is 30 DEG C;
5. slab carries out longitudinal stretching, 130 DEG C of temperature, 5 times of stretching ratios in Zong La areas through preheating, stretching, sizing region;
6. cross directional stretch carried out through preheating, stretching, sizing, cooled region in Heng Laqu, 150 DEG C of temperature, 8 times of stretching ratios,
Prepared thickness about 50um thin film;
7. the thin film Jing through progressively biaxial tension is cooled down, traction is flattened, winder winding, obtains final product high heat-resisting BOPP film.
Embodiment 2:
A kind of high heat-resisting BOPP film, is from top to bottom composited by upper epidermis 1, sandwich layer 2 and layer 3 successively, BOPP film
It is prepared from the following raw materials in parts by weight:968 parts of HOPP, 30 parts of nucleator, 2 parts of antiblocking agent;
Wherein, the upper epidermis 1 is made up of the raw material of following weight portion:18 parts of HOPP, 1 part of nucleator, antiblocking agent 1
Part;
The sandwich layer 2 is made up of the raw material of following weight portion:932 parts of HOPP, 28 parts of nucleator;
The layer 3 is made up of the raw material of following weight portion:18 parts of HOPP, 1 part of nucleator, 1 part of antiblocking agent.
Preparation method such as embodiment 1.
Embodiment 3:
A kind of high heat-resisting BOPP film, is from top to bottom composited by upper epidermis 1, sandwich layer 2 and layer 3 successively, BOPP film
It is prepared from the following raw materials in parts by weight:979 parts of HOPP, 20 parts of nucleator, 1 part of antiblocking agent;
Wherein, the upper epidermis 1 is made up of the raw material of following weight portion:19 parts of HOPP, 0.5 part of nucleator, tissue adhesion
0.5 part of agent;
The sandwich layer 2 is made up of the raw material of following weight portion:941 parts of HOPP, 19 parts of nucleator;
The layer 3 is made up of the raw material of following weight portion:19 parts of HOPP, 0.5 part of nucleator, antiblocking agent 0.5
Part.
Preparation method such as embodiment 1.
In above-described embodiment, the nucleator is the mixture of alpha-crystal form nucleator, beta crystal-type nucleater and antioxidant, its
Middle alpha-crystal form nucleator:Beta crystal-type nucleater:The weight ratio of antioxidant is 1:1:0.1, the antiblocking agent is that silicone is organic anti-
Adhesion agent, the organic antiblocking agent of the silicone for effective content 50% dimethyl siloxane master batch.
The alpha-crystal form nucleator is phosphoric acid ester slaine methylene bis 2, and 4- di-tert-butyl phenoxy group sodium phosphates, the β is brilliant
Type nucleator is aryl carboxylic acid diamides, and the antioxidant is phosphite antioxidant.
With the common BOPP film of prior art as comparative example, carry out respectively with BOPP film obtained in above-described embodiment heat-resisting
Performance test, is represented with the percent thermal shrinkage of thin film;The baking oven that test instrunment is produced for ruler and BINDER companies, testing standard
With reference to GB/T 13519-1992, test result is shown in Table 1;
With the common BOPP film of prior art as comparative example, stripping performance is carried out respectively with BOPP film obtained in above-described embodiment
Test, is represented with the coefficient of friction of thin film;Test instrunment be 32-07-00-0001 type friction coefficient instruments, TMI Group of
Companies companies produce, and testing standard is shown in Table 2 with reference to GB10006-88, test result.
The percent thermal shrinkage of the BOPP film of table 1
Percent thermal shrinkage(%) | Longitudinal MD | Horizontal TD |
Comparative example | 3.66 | 1.1 |
Embodiment 1 | 2.0 | 0.1 |
Embodiment 2 | 2.1 | 0.1 |
Embodiment 3 | 2.2 | 0.2 |
The coefficient of friction of the BOPP film of table 2
Coefficient of friction | Confficient of static friction/the coefficient of kinetic friction |
Comparative example | 0.526/0.427 |
Embodiment 1 | 0.305/0.219 |
Embodiment 2 | 0.314/0.248 |
Embodiment 3 | 0.343/0.274 |
The BOPP film by obtained in data in above-mentioned table can be seen that the technical program, its longitudinal contraction rate and lateral shrinkage
Respectively 41%-45% and 82%-91% are reduced than prior art, its confficient of static friction and the coefficient of kinetic friction subtract respectively than prior art
Little 35%-42% and 36%-49%, i.e. heat resistance and removability are respectively provided with and significantly improve, with significant creative special
Levy.
The BOPP film that the present invention is produced, not only with good heat resistance and removability, Er Qiegong
Skill is simple, and cost is relatively low, it is adaptable to printed circuit board (PCB) heat pressing process, effectively solving circuit board heat pressing process thin film poor heat resistance
With the technical barrier being not easily stripped.
The present embodiment purpose is professional and technical personnel in the field is understood technical scheme according to it and is added
To implement, this can not be each fallen within the protection domain of its restriction this patent, all deformations made according to present disclosure technology
The protection domain of invention.
Claims (4)
1. a kind of high heat-resisting BOPP film, by upper epidermis(1), sandwich layer(2)And layer(3)Composition, the sandwich layer(2)Upper table
Face is combined upper epidermis(1), sandwich layer(2)The compound layer of lower surface(3), it is characterised in that the BOPP film is by following heavy
The raw material of amount number is made:HOPP 954-979 parts, nucleator 20-45 parts, antiblocking agent 1-2 parts;
Wherein, the upper epidermis(1)It is made up of the raw material of following weight portion:HOPP 17-19 parts, nucleator 0.5-2.5
Part, antiblocking agent 0.5-1 parts;
The sandwich layer(2)It is made up of the raw material of following weight portion:HOPP 920-941 parts, nucleator 19-40 parts;
The layer(3)It is made up of the raw material of following weight portion:It is HOPP 17-19 parts, nucleator 0.5-2.5 parts, anti-
Adhesion agent 0.5-1 parts.
2. BOPP film according to claim 1, it is characterised in that the nucleator be alpha-crystal form nucleator, beta crystal into
Core agent and the mixture of antioxidant, wherein alpha-crystal form nucleator:Beta crystal-type nucleater:The weight ratio of antioxidant is 1:1:0.1.
3. BOPP film according to claim 1, it is characterised in that the antiblocking agent is the organic antiblocking agent of silicone,
The organic antiblocking agent of the silicone for effective content 50% dimethyl siloxane master batch.
4. BOPP film according to claim 2, it is characterised in that the alpha-crystal form nucleator is phosphoric acid ester slaine
Methylene bis 2,4- di-tert-butyl phenoxy group sodium phosphates, the beta crystal-type nucleater is aryl carboxylic acid diamides, and the antioxidant is
Phosphite antioxidant.
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CN113500835A (en) * | 2021-05-25 | 2021-10-15 | 安徽国风塑业股份有限公司 | High-temperature-resistant BOPP functional film for printed circuit board and preparation method thereof |
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CN109532170A (en) * | 2018-10-27 | 2019-03-29 | 烟台世昊塑业有限公司 | A kind of intensity height and easily peelable polypropylene release film |
CN109532066A (en) * | 2018-10-27 | 2019-03-29 | 烟台世昊塑业有限公司 | A kind of release film production process of Biaxially oriented polypropylene |
CN113500835A (en) * | 2021-05-25 | 2021-10-15 | 安徽国风塑业股份有限公司 | High-temperature-resistant BOPP functional film for printed circuit board and preparation method thereof |
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Application publication date: 20170517 |