CN106658998A - Method for processing dielectric layer of multilayer impedance flexible circuit board - Google Patents
Method for processing dielectric layer of multilayer impedance flexible circuit board Download PDFInfo
- Publication number
- CN106658998A CN106658998A CN201610996059.XA CN201610996059A CN106658998A CN 106658998 A CN106658998 A CN 106658998A CN 201610996059 A CN201610996059 A CN 201610996059A CN 106658998 A CN106658998 A CN 106658998A
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- Prior art keywords
- dielectric layer
- impedance
- fpc
- layer
- processing method
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
Abstract
The invention provides a method for processing the dielectric layer of a multilayer impedance flexible circuit board. The method can reduce the dielectric constant of the impedance flexible circuit board, improves the impedance control of the impedance flexible circuit board, and can improve the uniformity of the dielectric constant of the dielectric layer.
Description
Technical field
The invention belongs to PCB processing technique fields, and in particular to a kind of processing of multilayer impedance FPC dielectric layer
Method.
Background technology
With electronic product diversified development, the circuit board for being related to linear impedance control gradually increases, and linear impedance is
The resistance value at simple wire two ends, related to conductor length, copper thickness, live width, wherein conductor thickness is crucial effect factor.
At present printed circuit board material therefor is mainly increased using glass fabric (abbreviation glass-fiber-fabric) conduct in industry
Strong material, this kind of glass-fiber-fabric has longitude and latitude yarn network structure, in warp and weft interweaving point and space centre position glass fiber content difference
Greatly so that resin content is relatively low and uneven during coated with resins, and the structural issue from glass fabric itself causes sheet material
The dielectric constant of dielectric layer is higher, and printed circuit board is then needed if desired for lower dielectric constant is accomplished under same media thickness
Thinner glass-fiber-fabric bonding sheet is used, but it has the drawback that high cost, is unfavorable for lamination process.With current electricity
The transmission frequency more and more higher of signal, the requirement to the dielectric constant of sheet material is lower, but due to glass-fiber-fabric this body structure not
There is basic change, cannot still meet the signal transmission rate of current high frequency bottom line and the requirement of signal integrity.
Make multilayer circuit board when, there are the feelings using two identical prepregs (including size and model)
Shape.Because in laminated stacked plate, the way of prior art is to be completely superposed two prepregs, then carry out with central layer pre-
It is folded, pre- lamination is obtained, pre- lamination surface is placed on press chassis coated with Copper Foil, then Jing hot-pressing processings form multi-layer sheet, and Jing is bored
Impedance-controlled circuit is formed after hole, plating, etching, so so that the warp thread and weft yarn of two prepregs is substantially overlapping, enters one
Step causes the dielectric constant of dielectric layer to form larger difference.
The content of the invention
In view of this, the present invention provides a kind of processing method of multilayer impedance FPC dielectric layer, can effectively reduce
The dielectric constant of impedance FPC, improves impedance FPC impedance control, can be effectively improved dielectric layer dielectric constant
Homogeneity.
The technical scheme is that：A kind of processing method of multilayer impedance FPC dielectric layer, including basic unit, cover
Dielectric layer, the composition metal layers of foil of the laminating dielectric layer outer surface in described in both sides together in described basic unit both sides, including
Following processing method：
S1. when the dielectric layer of multi-layer flexible circuit board is made, from two identical prepregs；S2. described half is measured solid
Change warp-wise glass spacing a and broadwise glass spacing b of piece；S3. it is two identical prepregs are completely overlapped, at this moment, two
The warp-wise glass Shu Jun for opening prepreg extends along X-direction, and the broadwise glass Shu Jun of two prepregs prolongs along Y direction
Stretch；S4. the distance by a underlying prepreg respectively along X-direction and Y direction movement X1 and Y1 enters line misregistration,
Wherein X1 is non-integral multiple for a's, and Y1 is non-integral multiple for b's；S5. by by the way of magnetron sputtering, dielectric layer is arranged on into base
Layer surface, becomes central layer；S6. the prepreg of dislocation and central layer are carried out pre- folded, obtains pre- lamination；S7. by pre- lamination surface
Coated with composition metal layers of foil, it is placed on press chassis, then Jing hot-pressing processings form multi-layer sheet, and Jing after drilling, plating, etching
Form impedance-controlled circuit；
The dielectric layer is made up of following parts by weight meter raw material：Fe2O3 3.4、MnO 5.2、ZnO 2.7、CuO 2.1、Ta2O3
1.5、CaCO30.6th, 12.7 parts of CoO 0.3, SiO, 9.2 parts of Zr, 2.5 parts of Hf, 0.6 part of Fe, 0.2 part of Cr, 0.5 part of C,
0.25 part of N.
Further, X1=(2n-1) the * a/2 and Y1=(2n-1) * b/2, wherein, n is flexible circuitry flaggy
Number, n is integer.
Further, described basic unit is made up of following weight meter raw material：PVP 37.4, poly- diformazan
Base silane 16.8, polyimides 13.4, PEO 11.5, polyvinyl alcohol 6.8, polyacrylonitrile 4.6, BeO 2.9, ZnO
4.2nd, 1,2 dicarboxyl diisononyl esters 2.8, diisooctyl phthalate 3.5, lauroylamidopropyl betaine 12.5, bar
Ba Su oleamide propyl group amine oxide 3.2, m- tetrahydroxy phenyl chlorin 4.7.
Further, the composition metal layers of foil is that mass ratio is 2：1：3 Cu, Mn, Sn composite bed.
The advantages of the present invention are：Can effectively reduce using its impedance soft using the basic unit of the present invention
Property wiring board dielectric constant, improve impedance FPC impedance control, with reference to the present invention provide dielectric layer material, lead to
The compound synergic effect of each component is crossed, can be compared to the impedance flexible circuitry using traditional glass-fiber-fabric of same thickness structure
Plate, with lower dielectric constant；The homogeneity of the dielectric constant of dielectric layer is effectively improved, such that it is able to reduce a plurality of impedance
Resistance difference between transmission line, it is possible to improve the impedance fluctuations of same impedance line diverse location, contribute to promotion signal
Line impedence control accuracy, reduces signal reflex, promotion signal transmission quality.
Specific embodiment
Technical scheme is clearly and completely described below in conjunction with the embodiment of the present invention, it is clear that retouched
The embodiment stated is only a part of embodiment of the invention, rather than the embodiment of whole.
A kind of processing method of multilayer impedance FPC dielectric layer, including it is basic unit, laminating in described basic unit both sides
Dielectric layer, the composition metal layers of foil of the laminating dielectric layer outer surface in described in both sides, including following processing method：
S1. when the dielectric layer of multi-layer flexible circuit board is made, from two identical prepregs；S2. described half is measured solid
Change warp-wise glass spacing a and broadwise glass spacing b of piece；S3. it is two identical prepregs are completely overlapped, at this moment, two
The warp-wise glass Shu Jun for opening prepreg extends along X-direction, and the broadwise glass Shu Jun of two prepregs prolongs along Y direction
Stretch；S4. the distance by a underlying prepreg respectively along X-direction and Y direction movement X1 and Y1 enters line misregistration,
Wherein X1 is non-integral multiple for a's, and Y1 is non-integral multiple for b's；S5. by by the way of magnetron sputtering, dielectric layer is arranged on into base
Layer surface, becomes central layer；S6. the prepreg of dislocation and central layer are carried out pre- folded, obtains pre- lamination；S7. by pre- lamination surface
Coated with composition metal layers of foil, it is placed on press chassis, then Jing hot-pressing processings form multi-layer sheet, and Jing after drilling, plating, etching
Form impedance-controlled circuit；
The dielectric layer is made up of following parts by weight meter raw material：Fe2O3 3.4、MnO 5.2、ZnO 2.7、CuO 2.1、Ta2O3
1.5、CaCO30.6th, 12.7 parts of CoO 0.3, SiO, 9.2 parts of Zr, 2.5 parts of Hf, 0.6 part of Fe, 0.2 part of Cr, 0.5 part of C,
0.25 part of N.
Further, X1=(2n-1) the * a/2 and Y1=(2n-1) * b/2, wherein, n is flexible circuitry flaggy
Number, n is integer.
Further, described basic unit is made up of following weight meter raw material：PVP 37.4, poly- diformazan
Base silane 16.8, polyimides 13.4, PEO 11.5, polyvinyl alcohol 6.8, polyacrylonitrile 4.6, BeO 2.9, ZnO
4.2nd, 1,2 dicarboxyl diisononyl esters 2.8, diisooctyl phthalate 3.5, lauroylamidopropyl betaine 12.5, bar
Ba Su oleamide propyl group amine oxide 3.2, m- tetrahydroxy phenyl chlorin 4.7.
Further, the composition metal layers of foil is that mass ratio is 2：1：3 Cu, Mn, Sn composite bed.
Can effectively reduce using the dielectric constant of its impedance FPC using the basic unit of the present invention, improve impedance
FPC impedance control, with reference to the dielectric layer material that the present invention is provided, is acted on, Neng Gouxiang by the compound synergic of each component
Compared with the impedance FPC using traditional glass-fiber-fabric of same thickness structure, with lower dielectric constant；It is effectively improved
The homogeneity of the dielectric constant of dielectric layer, such that it is able to reduce the resistance difference between a plurality of impedance transmission lines, it is possible to improve
The impedance fluctuations of same impedance line diverse location, contribute to promotion signal line impedence control accuracy, reduce signal reflex, carry
Rise signal transmission quality.
It is obvious to a person skilled in the art that the invention is not restricted to the details of above-mentioned one exemplary embodiment, Er Qie
In the case of spirit or essential attributes without departing substantially from the present invention, the present invention can be in other specific forms realized.Therefore, no matter
From the point of view of which point, embodiment all should be regarded as exemplary, and be nonrestrictive, the scope of the present invention is by appended power
Profit is required rather than described above is limited, it is intended that all in the implication and scope of the equivalency of claim by falling
Change is included in the present invention.
Moreover, it will be appreciated that although this specification is been described by according to embodiment, not each embodiment is only wrapped
Containing an independent technical scheme, this narrating mode of specification is only that for clarity those skilled in the art should
Using specification as an entirety, the technical scheme in each embodiment can also Jing it is appropriately combined, form those skilled in the art
Understandable other embodiment.The ins and outs not described in detail in the present invention, can pass through arbitrary in this area
Prior art is realized.Particularly, all technical characterstics not described in detail can be realized by any prior art in the present invention.
Claims (4)
1. a kind of processing method of multilayer impedance FPC dielectric layer, it is characterised in that including basic unit, laminating in described
The composition metal layers of foil of the dielectric layer of basic unit both sides, the laminating dielectric layer outer surface in described in both sides, including following processing side
Method：
S1. when the dielectric layer of multi-layer flexible circuit board is made, from two identical prepregs；S2. described half is measured solid
Change warp-wise glass spacing a and broadwise glass spacing b of piece；S3. it is two identical prepregs are completely overlapped, at this moment, two
The warp-wise glass Shu Jun for opening prepreg extends along X-direction, and the broadwise glass Shu Jun of two prepregs prolongs along Y direction
Stretch；S4. the distance by a underlying prepreg respectively along X-direction and Y direction movement X1 and Y1 enters line misregistration,
Wherein X1 is non-integral multiple for a's, and Y1 is non-integral multiple for b's；S5. by by the way of magnetron sputtering, dielectric layer is arranged on into base
Layer surface, becomes central layer；S6. the prepreg of dislocation and central layer are carried out pre- folded, obtains pre- lamination；S7. by pre- lamination surface
Coated with composition metal layers of foil, it is placed on press chassis, then Jing hot-pressing processings form multi-layer sheet, and Jing after drilling, plating, etching
Form impedance-controlled circuit；
The dielectric layer is made up of following parts by weight meter raw material：Fe2O3 3.4、MnO 5.2、ZnO 2.7、CuO 2.1、Ta2O3
1.5、CaCO30.6th, 12.7 parts of CoO 0.3, SiO, 9.2 parts of Zr, 2.5 parts of Hf, 0.6 part of Fe, 0.2 part of Cr, 0.5 part of C,
0.25 part of N.
2. the processing method of multilayer impedance FPC dielectric layer according to claim 1, it is characterised in that the X1
=(2n-1) * a/2 and Y1=(2n-1) * b/2, wherein, n is the FPC number of plies, and n is integer.
3. the processing method of multilayer impedance FPC dielectric layer according to claim 1, it is characterised in that described
Basic unit is made up of following weight meter raw material：PVP 37.4, polydimethylsiloxane 16.8, polyimides 13.4,
PEO 11.5, polyvinyl alcohol 6.8, polyacrylonitrile 4.6, BeO 2.9, the dicarboxyl diisononyls of ZnO 4.2,1,2
Ester 2.8, diisooctyl phthalate 3.5, lauroylamidopropyl betaine 12.5, babassu oil amido propyl amine oxide
3.2nd, m- tetrahydroxy phenyl chlorin 4.7.
4. the processing method of multilayer impedance FPC dielectric layer according to claim 1, it is characterised in that described compound
It is 2 that metal foil layer is mass ratio：1：The composite bed of 3 Cu, Mn, Sn.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610996059.XA CN106658998A (en) | 2016-11-12 | 2016-11-12 | Method for processing dielectric layer of multilayer impedance flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610996059.XA CN106658998A (en) | 2016-11-12 | 2016-11-12 | Method for processing dielectric layer of multilayer impedance flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106658998A true CN106658998A (en) | 2017-05-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610996059.XA Pending CN106658998A (en) | 2016-11-12 | 2016-11-12 | Method for processing dielectric layer of multilayer impedance flexible circuit board |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110247207A1 (en) * | 2007-04-13 | 2011-10-13 | Foxconn Advanced Technology Inc. | Method for manufacturing multilayer flexible printed circuit board |
| CN105733361A (en) * | 2016-04-29 | 2016-07-06 | 珠海保税区天然宝杰数码科技材料有限公司 | Etching-resistant jet ink and application thereof |
| CN105744733A (en) * | 2014-12-08 | 2016-07-06 | 王忠义 | PCB for improving impedance |
| CN105792525A (en) * | 2016-04-01 | 2016-07-20 | 广州兴森快捷电路科技有限公司 | Method of making PCB dielectric layer |
-
2016
- 2016-11-12 CN CN201610996059.XA patent/CN106658998A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110247207A1 (en) * | 2007-04-13 | 2011-10-13 | Foxconn Advanced Technology Inc. | Method for manufacturing multilayer flexible printed circuit board |
| CN105744733A (en) * | 2014-12-08 | 2016-07-06 | 王忠义 | PCB for improving impedance |
| CN105792525A (en) * | 2016-04-01 | 2016-07-20 | 广州兴森快捷电路科技有限公司 | Method of making PCB dielectric layer |
| CN105733361A (en) * | 2016-04-29 | 2016-07-06 | 珠海保税区天然宝杰数码科技材料有限公司 | Etching-resistant jet ink and application thereof |
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| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 516000 No. 9, Longshan Eighth Road, Daya Bay West District, Huizhou City, Guangdong Province Applicant after: Guangdong Kexiang Electronic Technology Co., Ltd. Address before: 516000 No. 9, Longshan Eighth Road, Daya Bay West District, Huizhou City, Guangdong Province Applicant before: Guangdong Kexiang Electronic Technology Co., Ltd. |
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| CB02 | Change of applicant information | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170510 |
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| RJ01 | Rejection of invention patent application after publication |