CN106658997B - A kind of printing mechanism for the metallization of ceramic chips through hole wall - Google Patents
A kind of printing mechanism for the metallization of ceramic chips through hole wall Download PDFInfo
- Publication number
- CN106658997B CN106658997B CN201611244256.2A CN201611244256A CN106658997B CN 106658997 B CN106658997 B CN 106658997B CN 201611244256 A CN201611244256 A CN 201611244256A CN 106658997 B CN106658997 B CN 106658997B
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- China
- Prior art keywords
- negative pressure
- hole
- support plate
- exposure mask
- printing
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0736—Methods for applying liquids, e.g. spraying
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
- Screen Printers (AREA)
Abstract
The present invention proposes a kind of printing mechanism for the metallization of ceramic chips through hole wall, it include: printing platform with big cavity, the external negative pressure source, exposure mask piece and the support plate that are connected to big cavity, the vertically movable top that support plate is arranged in of exposure mask piece, exposure mask on piece are provided with and the consistent through-hole of ceramic chips；The support plate setting should brush flat on platform, and be provided with venthole corresponding with the through-hole of exposure mask on piece on the supporting plate, and be provided with adsorption hole at remaining position of support plate；The negative pressure all the way of the negative pressure source is connected to the venthole, and another way negative pressure is connected to the adsorption hole.The uniformity of hanging when the metallization of ceramic chips through hole wall improves in printing mechanism of the invention slows down slurry blocking through-hole phenomenon.
Description
Technical field
The present invention relates to multilayer ceramic substrate manufacturing printer fields, in particular to a kind of to be used for ceramic chips through-hole hole
The printing mechanism of wall metallization.
Background technique
When the ceramic chips the via hole of multilayer ceramic substrate, realize that the printing mechanism of the via hole is necessary parts.
Currently, the mode that the through hole wall of ceramic chips metallizes are as follows: on big cavity workbench, ceramic chips are arranged in porous backing plate
On, the through-hole of ceramic chips is coaxially corresponding one by one with the aperture of porous backing plate, and the big cavity of workbench is connected to external negative pressure source, benefit
Ceramic chips are adsorbed on porous backing plate with the negative pressure all the way of negative pressure source, are adsorbed onto slurry using the another way negative pressure of negative pressure source
In the through-hole of ceramic chips, slurry is paved with through-hole wall.In aforesaid way, the small hole number of porous backing plate is more and aperture is small, difficult
To ensure the precision of the aperture of porous gasket, when the deviation of the through-hole on the aperture and ceramic chips on porous backing plate is big, can make
Phenomena such as at through hole wall hanging unevenness and plug-hole；If increasing the aperture of the aperture on porous backing plate, ceramic chips back will cause
Phenomena such as face residual slurry.In addition, the difficulty of processing of the aperture of porous backing plate is big, processing cost is high.
Summary of the invention
In order to which hanging is uneven when slowing down ceramic chips through hole wall metallization in the prior art, plug-hole and porous backing plate add
Big, the at high cost problem of work difficulty, the present invention propose a kind of printing mechanism for the metallization of ceramic chips through hole wall.
The technical scheme of the present invention is realized as follows:
It is a kind of for ceramic chips through hole wall metallization printing mechanism, comprising: with big cavity printing platform and with
The external negative pressure source of big cavity connection, which is characterized in that further include exposure mask piece and support plate, the exposure mask piece is vertically
The movable top that support plate is arranged in, exposure mask on piece are provided with and the consistent through-hole of ceramic chips；The support plate setting is printing
It brushes flat on platform, and is provided with venthole corresponding with the through-hole of exposure mask on piece on the supporting plate, and in remaining position of support plate
Place is provided with adsorption hole；The negative pressure all the way of the negative pressure source is connected to the venthole, and another way negative pressure and the adsorption hole connect
It is logical.
Preferably, in the printing mechanism, the structure of the printing platform with big cavity includes: printing platen, sky
Chamber lid plate, cylinder manifold and gas path plate, it is described printing platen top in the middle part of be provided with an elongated chamber, be located at elongated chamber around
Printing platen on be provided with a circle stomata；The cavity cover board be fixed on it is described printing platen lower section, and with printing platen
Form a cavity body being connected to elongated chamber；The cylinder manifold is fixed on the lower section of cavity cover board and communicates therewith；
The structure of the gas path plate is that the upper surface of a plate body is provided with several boss, is provided on each boss small
Hole has groove between any two boss, and the aperture is corresponding with the venthole of support plate, the suction of the groove and support plate
Attached hole is corresponding；
Wherein, the negative pressure all the way of the negative pressure source accesses the cylinder manifold, and the road negative pressure is by the aperture on boss, support
Venthole on plate is connected to the through-hole on the ceramic chips；The another way negative pressure of the negative pressure source accesses the cavity cover board,
Another way negative pressure is connected to by the groove with the adsorption hole in support plate；The last negative pressure all the way of the negative pressure source accesses cavity
Cover board, finally negative pressure is connected to the stomata all the way.
Preferably, in the printing mechanism, there are four mouth is divided, every punishment pressure mouth is remote for setting on the cavity cover board
Side from cylinder manifold is provided with a cowling panel by pillar, and four partial pressure mouths are used for one by cylinder manifold and negative pressure source formation
Road negative pressure is divided into four tunnels.
Preferably, in the printing mechanism, the upper surface of the support plate and the upper surface of the printing platen are neat
It is flat.
Preferably, in the printing mechanism, the exposure mask on piece is provided with location hole, is provided in the support plate
Location hole, the location hole that pin passes sequentially through exposure mask on piece connect exposure mask piece with support plate with the location hole in support plate.
The invention has the benefit that the printing mechanism proposed by the present invention for the metallization of ceramic chips through hole wall, covers
Diaphragm is thin slice, improves the position precision and aperture precision of through-hole in exposure mask on piece processing through-hole, further increases exposure mask on piece
The correspondence precision of through-hole on through-hole and ceramic chips；And the venthole in support plate only plays the role of negative pressure conducting, required precision
It is low, difficulty of processing is reduced, processing cost is reduced；It is provided with adsorption hole on the supporting plate simultaneously, so that ceramic chips are close, smooth
It is fitted in exposure mask on piece；The combination of exposure mask piece and support plate is arranged, and hanging is uniform when improving the metallization of ceramic chips through hole wall
Property, slow down the phenomenon that slurry blocks through-hole.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention without any creative labor, may be used also for those of ordinary skill in the art
To obtain other drawings based on these drawings.
Fig. 1 is a kind of explosion signal of an embodiment of the printing mechanism for the metallization of ceramic chips through hole wall of the present invention
Figure；
Fig. 2 is the schematic perspective view of gas path plate shown in Fig. 1.
In figure:
1, platen is printed；2, cavity cover board；3, cylinder manifold；4, gas path plate；5, exposure mask piece；6, support plate；11, elongated chamber；
12, stomata；21, pillar；22, cowling panel；41, plate body；42, boss；43, aperture；44, groove.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Printing mechanism for the metallization of ceramic chips through hole wall as shown in Figure 1, comprising: printing platen 1, cavity cover board
2, cylinder manifold 3, gas path plate 4, exposure mask piece 5, support plate 6 and external negative pressure source.It prints and is provided with one in the middle part of the top of platen 1
A elongated chamber 11 is provided with a circle stomata 12 around the elongated chamber；Cavity cover board 2 be fixed on printing platen 1 lower section, and with
It prints platen 1 and forms a cavity body being connected to elongated chamber 11；Cylinder manifold 3 is fixed on the lower section of cavity cover board 2 and connects with it
It is logical；Gas path plate 4 is inlaid in elongated chamber 11；Support plate 6 is stacked in the top of gas path plate 4, the upper surface of support plate and print station
The upper surface of plate flushes；The vertically movable top that support plate 6 is set of exposure mask piece 5, be provided on exposure mask piece 5 with it is raw
The consistent through-hole of tile, is provided with venthole corresponding with the through-hole on exposure mask piece 5 in support plate 6, and support plate remaining
Adsorption hole is provided at position.
Gas path plate as shown in Figure 2 is provided with several boss 42 in the upper surface of a plate body 41, sets on each boss 42
Be equipped with aperture 43, between any two boss 42 have groove 44, aperture 43 is corresponding with the venthole of support plate 6, groove 44 and
The adsorption hole of support plate 6 is corresponding.
The access way of negative pressure source are as follows: the negative pressure all the way of negative pressure source accesses cylinder manifold, and the road negative pressure is by small on boss
Venthole on hole, support plate is connected to the through-hole on ceramic chips, for realizing the hanging of the hole wall of the through-hole on ceramic chips；It is negative
The another way negative pressure of potential source accesses cavity cover board, and another way negative pressure is connected to by groove with the adsorption hole in support plate, and being used for will
Ceramic chips are close, smooth are fitted in exposure mask on piece；The last negative pressure all the way of negative pressure source accesses cavity cover board, finally negative pressure all the way
It is connected to stomata, for exposure mask piece to be adsorbed on to the table top of printing platen.It can be seen from the above, gas path plate is used for negative pressure source
Another way negative pressure and last negative pressure all the way separate, and two-way negative pressure is avoided to generate interference in application process.
As shown in Figure 1, setting passes through there are four mouth, every punishment pressure mouth is divided far from the side of cylinder manifold on cavity cover board 2
Pillar 21 is provided with a cowling panel 22, and four partial pressure mouths are used to the negative pressure all the way that cylinder manifold and negative pressure source are formed being divided into four
Road, for keeping the intracorporal negative pressure field pressure of cavity identical.
It is provided with location hole on exposure mask piece 5, location hole is provided in support plate, pin connects exposure mask piece and support plate activity
It connects.Exposure mask piece uses the stainless steel thin slice of 0.1mm left and right thickness, completes adding for exposure mask on piece through-hole using laser cutting device
Work further increases the aperture precision and position precision of through-hole.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Within mind and principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (4)
1. it is a kind of for ceramic chips through hole wall metallization printing mechanism, comprising: with big cavity printing platform and with it is big
The external negative pressure source of cavity connection, which is characterized in that further include exposure mask piece and support plate, the exposure mask piece is vertically lived
The dynamic top that support plate is arranged in, exposure mask on piece are provided with and the consistent through-hole of ceramic chips；The support plate setting is being printed
On platform, and it is provided with venthole corresponding with the through-hole of exposure mask piece on the supporting plate, and is set at remaining position of support plate
It is equipped with adsorption hole；The negative pressure all the way of the negative pressure source is connected to the venthole, and another way negative pressure is connected to the adsorption hole；
The structure of printing platform with big cavity includes: printing platen, cavity cover board, cylinder manifold and gas path plate, the printing
It is provided with an elongated chamber in the middle part of the top of platen, a circle stomata is provided on the printing platen around elongated chamber；Institute
The lower section that cavity cover board is fixed on the printing platen is stated, and forms a cavity body being connected to elongated chamber with printing platen；
The cylinder manifold is fixed on the lower section of cavity cover board and communicates therewith；
The structure of the gas path plate is that the upper surface of a plate body is provided with several boss, is provided on each boss one small
Hole has groove between any two boss, and the aperture is corresponding with the venthole of support plate, the suction of the groove and support plate
Attached hole is corresponding；
Wherein, the negative pressure all the way of the negative pressure source accesses the cylinder manifold, which passes through the aperture on boss, in support plate
Venthole be connected to the through-hole on the ceramic chips；The another way negative pressure of the negative pressure source accesses cavity cover board, and another way is negative
Pressure is connected to by the groove with the adsorption hole in support plate；The last negative pressure all the way of the negative pressure source accesses cavity cover board, most
Negative pressure is connected to the stomata all the way afterwards.
2. printing mechanism according to claim 1, which is characterized in that mouth is divided on the cavity cover board there are four settings,
Every punishment pressure side of the mouth far from cylinder manifold is provided with a cowling panel by pillar, and four partial pressure mouths are used for cylinder manifold and bear
The negative pressure all the way that potential source is formed is divided into four tunnels.
3. printing mechanism according to claim 1, which is characterized in that the upper surface of the support plate and the printing platen
Upper surface flush.
4. printing mechanism according to claim 1, which is characterized in that the exposure mask on piece is provided with location hole, the branch
Location hole is provided on fagging, pin passes sequentially through the location hole on the location hole and support plate of exposure mask on piece for exposure mask piece and branch
Fagging connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611244256.2A CN106658997B (en) | 2016-12-29 | 2016-12-29 | A kind of printing mechanism for the metallization of ceramic chips through hole wall |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611244256.2A CN106658997B (en) | 2016-12-29 | 2016-12-29 | A kind of printing mechanism for the metallization of ceramic chips through hole wall |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106658997A CN106658997A (en) | 2017-05-10 |
| CN106658997B true CN106658997B (en) | 2019-06-04 |
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ID=58835599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611244256.2A Active CN106658997B (en) | 2016-12-29 | 2016-12-29 | A kind of printing mechanism for the metallization of ceramic chips through hole wall |
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| Country | Link |
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| CN (1) | CN106658997B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111806066B (en) * | 2020-07-31 | 2024-05-14 | 东莞市微格能自动化设备有限公司 | Ceramic substrate through hole coating mechanism |
| CN115379664B (en) * | 2022-07-29 | 2023-08-11 | 浙江东瓷科技有限公司 | Production device for finishing membrane hole wall metallization |
| CN115635765B (en) * | 2022-12-26 | 2023-03-07 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Ceramic packaging tube shell pore wall metallization die and screen printing equipment |
| CN115817000B (en) * | 2023-01-10 | 2023-05-26 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Inner and outer bench mechanism for raw ceramic sheet framed hole wall metallization |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101811872A (en) * | 2010-03-24 | 2010-08-25 | 中国电子科技集团公司第二研究所 | Aligning platform used for processing green ceramic plates |
| CN102244986A (en) * | 2010-05-13 | 2011-11-16 | 富葵精密组件(深圳)有限公司 | Hole plugging device and hole plugging method of circuit board |
| CN103442527A (en) * | 2013-09-03 | 2013-12-11 | 中国电子科技集团公司第五十四研究所 | Method for controlling height of slurry in hole in raw LTCC chip |
| CN205272821U (en) * | 2016-01-06 | 2016-06-01 | 江苏省宜兴电子器件总厂 | Metallization thick liquids printing device of green through -hole |
-
2016
- 2016-12-29 CN CN201611244256.2A patent/CN106658997B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101811872A (en) * | 2010-03-24 | 2010-08-25 | 中国电子科技集团公司第二研究所 | Aligning platform used for processing green ceramic plates |
| CN102244986A (en) * | 2010-05-13 | 2011-11-16 | 富葵精密组件(深圳)有限公司 | Hole plugging device and hole plugging method of circuit board |
| CN103442527A (en) * | 2013-09-03 | 2013-12-11 | 中国电子科技集团公司第五十四研究所 | Method for controlling height of slurry in hole in raw LTCC chip |
| CN205272821U (en) * | 2016-01-06 | 2016-06-01 | 江苏省宜兴电子器件总厂 | Metallization thick liquids printing device of green through -hole |
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| Publication number | Publication date |
|---|---|
| CN106658997A (en) | 2017-05-10 |
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Address after: No. 115, Heping South Road, Wanbailin District, Taiyuan City, Shanxi Province Patentee after: Northwest electronic equipment Technology Research Institute (the second Research Institute of China Electronic Technology Corp.) Address before: No. 115, Heping South Road, Taiyuan City, Taiyuan City, Shanxi Province 030024 Patentee before: THE SECOND RESEARCH INSTITUTE OF CHINA ELECTRONIC TECHNOLOGY Group Corp. |