CN106658995A - High rupture flex-rigid printed board production protection cap - Google Patents
High rupture flex-rigid printed board production protection cap Download PDFInfo
- Publication number
- CN106658995A CN106658995A CN201610946947.0A CN201610946947A CN106658995A CN 106658995 A CN106658995 A CN 106658995A CN 201610946947 A CN201610946947 A CN 201610946947A CN 106658995 A CN106658995 A CN 106658995A
- Authority
- CN
- China
- Prior art keywords
- pad
- protection cap
- printed board
- destroyed
- width
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 238000000034 method Methods 0.000 claims abstract description 7
- 235000019994 cava Nutrition 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 238000003475 lamination Methods 0.000 abstract description 5
- 238000005452 bending Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention relates to a high rupture flex-rigid printed board production protection cap. The high rupture flex-rigid printed board production protection cap comprises an inner-layer bearing film and an outer-layer back cap, wherein the back cap comprises a back cap body, two sides of the back cap body are respectively provided with a first gasket set and a second gasket set, a first gasket and a second gasket of the first gasket set and a third gasket and a fourth gasket of the second gasket set are alternately arranged, the bearing film and the back cap are identical in shape and size, an emptying area is filled and protected in a lamination positioning process to realize layering at the flex-rigid portion, and flexural endurance of the flex-rigid board is improved.
Description
Technical field
The present invention relates to a kind of protection cap, and in particular to a kind of high printed board combining rigidness and flexibleness production protection cap destroyed or force to yield.
Background technology
As mobile fingerprint identification flourishes, fingerprint module loading plate requires that product size is little, and heat resistance is high, while tool
There is the rigidity and flexibility combined printed circuit board application of superior bending performance and multifunction more and more.But existing four layers of rigid-flexible combination
The structure of hardened conjunction 1-2-1, rigid-flexible junction is glued together and is also easy to produce stress appearance broken string, and number of times resistant to bending can not be complete
Meet the demand of mobile phone market, but mobile phone some fingerprint recognition components and parts are draw keys, and with common folded structure layer high flexible is made
Its requirement cannot be met.
According to this requirement, a kind of high rigidity and flexibility combined printed circuit board destroyed or force to yield is have developed, carried in rigid-flexible junction
Film is more than prepreg 0.2mm, is positioned by tool lamination, makes rigid-flexible junction to be pasted together to realize demixing zone,
Need special rear protection cap that etched-off area is filled and led up and is protected by lamination position fixing process.
The content of the invention
The present invention proposes a kind of high printed board combining rigidness and flexibleness production protection cap destroyed or force to yield for the problems referred to above, in lamination
In position fixing process etched-off area is filled and led up and is protected by, realize that wiring board is layered, strengthen the bending resistance of rigid-flex combined board.
Specific technical scheme is as follows：
The printed board combining rigidness and flexibleness production protection cap that height is destroyed or force to yield, including the carrier film and the bonnet of outer layer of internal layer, it is described
Bonnet includes bonnet main body, and bonnet main body is respectively provided on two sides with one group of first shim pack and one group of second shim pack, described first
Shim pack includes first pad and four the second pads, and the first pad is located at the top of the second pad, the first pad and the
A carrying projection is equipped with below two pads, the first pad and the second pad are rectangle structure, the width of the first pad
Degree L1 exists more than the width L2 of the second pad between the first pad and the second pad, between the second pad and the second pad
Width L5 is the empty avoiding chamber of 8.49mm, and the inwall in empty avoiding chamber caves inward to form the avoiding hollow groove of arc-shaped structure；
Second shim pack includes the oneth the 3rd pad and four the 4th pads, and the 3rd pad is located under the 4th pad
Side, is equipped with a carrying projection above the 3rd pad and the 4th pad, the 3rd pad and the 4th pad are rectangle knot
Structure, the width L3 of the 3rd pad is equal to the width L1 of the first pad, and the width L4 of the 4th pad is equal to the width L2 of the second pad,
There is empty avoiding chamber between 3rd pad and the 4th pad, between the 4th pad and the 4th pad, the inwall in empty avoiding chamber concaves
Fall into the avoiding hollow groove for forming arc-shaped structure；
First pad of first shim pack, the 3rd pad of the second pad and the second shim pack, the 4th pad replace
Arrange；
The shape of the carrier film, size are identical with the shape of bonnet, size.
The printed board combining rigidness and flexibleness production protection cap that above-mentioned height is destroyed or force to yield, wherein, the carrier film is relative to carrying projection
The bonnet at place stretches out 0.2mm.
The printed board combining rigidness and flexibleness production protection cap that above-mentioned height is destroyed or force to yield, wherein, set on the axis of the bonnet main body
There is one to take off cover slot, take off cover slot and be molded by etch process.
The printed board combining rigidness and flexibleness production protection cap that above-mentioned height is destroyed or force to yield, wherein, the thickness h 1 of the protection cap is 12.5 μ
m。
The printed board combining rigidness and flexibleness production protection cap that above-mentioned height is destroyed or force to yield, wherein, the carrier film single-sided back-adhesive.
The printed board combining rigidness and flexibleness production protection cap that above-mentioned height is destroyed or force to yield, wherein, the bonnet is with polyimides as material.
The printed board combining rigidness and flexibleness production protection cap that above-mentioned height is destroyed or force to yield, wherein, first pad, the second pad,
Length L7 of three pads and the 4th pad is 14.90mm.
The printed board combining rigidness and flexibleness production protection cap that above-mentioned height is destroyed or force to yield, wherein, first shim pack or the second pad
The width L6 of group is 120.58mm.
Beneficial effects of the present invention are：
Semi-solid preparation half and center flexing plate are separated realization layering with holding film by the present invention in lamination position fixing process, strengthen firm
Joint number of times resistant to bending.
Description of the drawings
Fig. 1 is present configuration figure (1).
Fig. 2 is present configuration figure (2).
Fig. 3 is A-A directions of the present invention sectional view.
Specific embodiment
To make technical scheme become apparent from clearly, below in conjunction with the accompanying drawings the present invention is described further,
Any technical characteristic to technical solution of the present invention carries out the scheme that equivalencing and conventional reasoning draw and each falls within guarantor of the present invention
Shield scope.
Reference
Carrier film 1, bonnet 2, bonnet main body 3, the first shim pack 4, the second shim pack 5 of group, the first pad 6, the second pad
7th, projection 8, empty avoiding chamber 9 are carried, avoiding hollow groove 10, the 3rd pad 11, the 4th pad 12, cover slot 13 is taken off.
The high printed board combining rigidness and flexibleness production protection cap destroyed or force to yield as shown in the figure, the thickness h 1 of the protection cap is 12.5 μ
M, including the carrier film 1 and the bonnet 2 of outer layer of internal layer, the carrier film single-sided back-adhesive, bonnet is described with polyimides as material
Bonnet includes bonnet main body 3, and bonnet main body is respectively provided on two sides with one group of first shim pack 4 and one group of second shim pack 5, described the
One shim pack includes first pad 6 and four the second pads 7, and the first pad is located at the top of the second pad, the first pad
Projection 8 is carried with being equipped with one below the second pad, the first pad and the second pad are rectangle structure, the first pad
Width L1 more than the second pad width L2, between the first pad and the second pad, between the second pad and the second pad
There is the empty avoiding chamber 9 that width L5 is 8.49mm, the inwall in empty avoiding chamber caves inward to form the avoiding hollow groove 10 of arc-shaped structure；
Second shim pack includes the oneth the 3rd pad 11 and four the 4th pads 12, and the 3rd pad is located at the 4th pad
Lower section, a carrying projection is equipped with above the 3rd pad and the 4th pad, the 3rd pad and the 4th pad are rectangular
Shape structure, the width L3 of the 3rd pad is equal to the width L1 of the first pad, and the width L4 of the 4th pad is equal to the width of the second pad
, there is empty avoiding chamber between the 3rd pad and the 4th pad, between the 4th pad and the 4th pad in degree L2, the inwall in empty avoiding chamber to
Sunken inside forms the avoiding hollow groove of arc-shaped structure；
First pad of first shim pack, the 3rd pad of the second pad and the second shim pack, the 4th pad replace
Arrange；
The shape of the carrier film, size are identical with the shape of bonnet, size；
The carrier film stretches out 0.2mm relative to the bonnet carried at projection.
The axis of the bonnet main body is provided with one and takes off cover slot 13, takes off cover slot and is molded by etch process.
Length L7 of first pad, the second pad, the 3rd pad and the 4th pad is 14.90mm.
The width L6 of first shim pack or the second shim pack is 120.58mm.
Claims (8)
1. the printed board combining rigidness and flexibleness production protection cap that height is destroyed or force to yield, it is characterized by, including after the carrier film and outer layer of internal layer
Lid, the bonnet includes bonnet main body, and bonnet main body is respectively provided on two sides with one group of first shim pack and one group of second shim pack, institute
The first shim pack is stated including first pad and four the second pads, the first pad is located at the top of the second pad, the first pad
A carrying projection is equipped with below piece and the second pad, the first pad and the second pad are rectangle structure, the first pad
The width L1 of piece is more than the width L2 of the second pad, between the first pad and the second pad, between the second pad and the second pad
There is the empty avoiding chamber that width L5 is 8.49mm, the inwall in empty avoiding chamber caves inward to form the avoiding hollow groove of arc-shaped structure；
Second shim pack includes the oneth the 3rd pad and four the 4th pads, and the 3rd pad is located at the lower section of the 4th pad,
A carrying projection is equipped with above 3rd pad and the 4th pad, the 3rd pad and the 4th pad are rectangle structure,
The width L3 of the 3rd pad is equal to the width L1 of the first pad, and the width L4 of the 4th pad is equal to the width L2 of the second pad, the
There is empty avoiding chamber between three pads and the 4th pad, between the 4th pad and the 4th pad, the inwall in empty avoiding chamber caves inward
Form the avoiding hollow groove of arc-shaped structure；
First pad of first shim pack, the 3rd pad of the second pad and the second shim pack, the 4th pad are arranged alternately；
The shape of the carrier film, size are identical with the shape of bonnet, size.
2. the printed board combining rigidness and flexibleness production protection cap that height as claimed in claim 1 is destroyed or force to yield, it is characterized by, the bonnet master
The axis of body is provided with one and takes off cover slot, takes off cover slot and is molded by etch process.
3. the printed board combining rigidness and flexibleness production protection cap that height as claimed in claim 1 is destroyed or force to yield, it is characterized by, the protection cap
Thickness h 1 be 12.5 μm.
4. the printed board combining rigidness and flexibleness production protection cap that height as claimed in claim 1 is destroyed or force to yield, it is characterized by, the carrier film
Single-sided back-adhesive.
5. the printed board combining rigidness and flexibleness production protection cap that height as claimed in claim 1 is destroyed or force to yield, it is characterized by, the bonnet with
Polyimides is material.
6. the printed board combining rigidness and flexibleness production protection cap that height as claimed in claim 1 is destroyed or force to yield, it is characterized by, first pad
Length L7 of piece, the second pad, the 3rd pad and the 4th pad is 14.90mm.
7. the printed board combining rigidness and flexibleness production protection cap that height as claimed in claim 1 is destroyed or force to yield, it is characterized by, first pad
The width L6 of piece group or the second shim pack is 120.58mm.
8. the printed board combining rigidness and flexibleness production protection cap that height as claimed in claim 1 is destroyed or force to yield, it is characterized by, the carrier film
Stretch out 0.2mm relative to the bonnet carried at projection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610946947.0A CN106658995A (en) | 2016-11-02 | 2016-11-02 | High rupture flex-rigid printed board production protection cap |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610946947.0A CN106658995A (en) | 2016-11-02 | 2016-11-02 | High rupture flex-rigid printed board production protection cap |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106658995A true CN106658995A (en) | 2017-05-10 |
Family
ID=58821299
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610946947.0A Pending CN106658995A (en) | 2016-11-02 | 2016-11-02 | High rupture flex-rigid printed board production protection cap |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106658995A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102209442A (en) * | 2010-11-16 | 2011-10-05 | 博罗县精汇电子科技有限公司 | Technology of producing soft-hard combination multilayer circuit board with copper foil covering method |
| JP2012089620A (en) * | 2010-10-18 | 2012-05-10 | Sharp Corp | Rigid flexible board, and electronic apparatus equipped with it |
| CN204069498U (en) * | 2014-07-18 | 2014-12-31 | 深圳市爱升精密电路科技有限公司 | A kind of flexible and hard combined circuit board of New-energy electric vehicle battery |
| CN105578728A (en) * | 2016-01-29 | 2016-05-11 | 上海温良昌平电器科技股份有限公司 | One-piece aluminum flexible circuit board with support layer switching function and preparation technology |
| CN206559741U (en) * | 2016-11-02 | 2017-10-13 | 江苏弘信华印电路科技有限公司 | The printed board combining rigidness and flexibleness production protection cap that height is destroyed or force to yield |
-
2016
- 2016-11-02 CN CN201610946947.0A patent/CN106658995A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012089620A (en) * | 2010-10-18 | 2012-05-10 | Sharp Corp | Rigid flexible board, and electronic apparatus equipped with it |
| CN102209442A (en) * | 2010-11-16 | 2011-10-05 | 博罗县精汇电子科技有限公司 | Technology of producing soft-hard combination multilayer circuit board with copper foil covering method |
| CN204069498U (en) * | 2014-07-18 | 2014-12-31 | 深圳市爱升精密电路科技有限公司 | A kind of flexible and hard combined circuit board of New-energy electric vehicle battery |
| CN105578728A (en) * | 2016-01-29 | 2016-05-11 | 上海温良昌平电器科技股份有限公司 | One-piece aluminum flexible circuit board with support layer switching function and preparation technology |
| CN206559741U (en) * | 2016-11-02 | 2017-10-13 | 江苏弘信华印电路科技有限公司 | The printed board combining rigidness and flexibleness production protection cap that height is destroyed or force to yield |
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Legal Events
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170510 |
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| WD01 | Invention patent application deemed withdrawn after publication |