CN106658980A - Method for preparing graphene circuit board based on addressing adjustable high-energy rays - Google Patents
Method for preparing graphene circuit board based on addressing adjustable high-energy rays Download PDFInfo
- Publication number
- CN106658980A CN106658980A CN201710028635.6A CN201710028635A CN106658980A CN 106658980 A CN106658980 A CN 106658980A CN 201710028635 A CN201710028635 A CN 201710028635A CN 106658980 A CN106658980 A CN 106658980A
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- Prior art keywords
- circuit board
- graphene
- addressing
- energy ray
- adjustable high
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/092—Particle beam, e.g. using an electron beam or an ion beam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Carbon And Carbon Compounds (AREA)
Abstract
The invention provides a method for preparing a graphene circuit board based on addressing adjustable high-energy rays. The method comprises the following steps: coating an oxidized graphene solution on a base material; radiating by adopting the high-energy rays through x-axis plane and a y-axis plane addressing and positioning on an oxidized graphene thin film according to a required and formed circuit routing layout, so that oxidized graphene is reduced to form a graphene routing; and washing and removing redundant oxidized graphene so as to obtain the graphene circuit board. The method for preparing the graphene circuit board based on the addressing adjustable high-energy rays provided by the invention is simple in operation, high in yield and high in benefit, and the graphene circuit board prepared by the method is small in size, good in electrical conductivity and high in high-temperature stability. By adopting a high-energy ray addressing technology, the routing layout of the graphene circuit board is controlled by programming to set x-axis and y-axis routing control, so that the positioning is accurate, and the operation is simple.
Description
Technical field
The present invention relates to field of circuit boards, more particularly to a kind of Graphene circuit is prepared based on the adjustable high-energy ray of addressing
The method of plate.
Background technology
Graphene refers in the narrow sense mono-layer graphite, and thickness is 0.335nm, only one layer carbon atom, but within actually 10 layers
Graphite-structure be also referred to as Graphene.And more than 10 layers are then referred to as graphite film.Each carbon atom of Graphene is
Sp2 hydridization, and a remaining hydridization is contributed, and contribute a remaining p orbital electron to form π keys, pi-electron can be moved freely,
Give Graphene the excellent property led.Due to former intermolecular forces it is very strong, at normal temperatures, even if surrounding carbon atom collides, stone
The interference that electronics in black alkene is subject to also very little.Scattering, 140 times of electron mobility about in silicon are not susceptible in transmission.
Its electrical conductivity is up to 106S/m, is the optimal material of electric conductivity under room temperature.
Graphene oxide is typically aoxidized by graphite Jing strong acid and obtained, and can be considered a kind of flexible material of non-traditional kenel, is had
There are polymer, colloid, thin film, and amphiphilic characteristic.Mode property using high-energy ray redox graphene is steady
Fixed, the measured Graphene of matter, may be used on various electronic devices and components.
Existing circuit board is mostly the cloth copper conductor on monolayer pcb board, when monolayer wiring can not meet electronic product
It is necessary to using dual platen when needing, or even multi-layer sheet；And it is bigger by the electric current of circuit, it is desirable to wire it is wider；Institute
It is difficult to for circuit board to do little with complicated circuit.
The content of the invention
It is an object of the invention to a kind of method that Graphene circuit board is prepared based on the adjustable high-energy ray of addressing is proposed,
The method is simple to operate, yield is good, high efficiency, the method prepare Graphene circuit board small volume, conduct electricity very well, high temperature it is steady
It is qualitative strong.
The present invention proposes a kind of method for preparing Graphene circuit board based on the adjustable high-energy ray of addressing, including following step
Suddenly：
A. graphene oxide solution is coated on base material, graphene oxide film is dried to obtain；
B. according to the circuit trace layout of required formation, by x on graphene oxide film, y-axis flat addressing positioning is adopted
High-energy ray is irradiated, and makes graphene oxide reduce to form Graphene cabling；
C. cleaning removes unnecessary graphene oxide, obtains Graphene circuit board.
Preferably, the high-energy ray includes laser, X-ray, particle beam.
Preferably, it is characterised in that the wavelength of the laser is 150-850nm.
Preferably, the graphene oxide solution is that graphene oxide and polar solvent are prepared the solution for obtaining, described
Polar solvent is poly- for deionized water, ethanol, ethylene glycol, dimethylformamide, tetrahydrofuran, N-Methyl pyrrolidone or lauryl alcohol
One kind in ether sodium sulfovinate.
Preferably, the concentration of the graphene oxide solution is 1-10mg/mL.
Preferably, the coating operation of step A is spraying, prints or spin coating.
Preferably, the cleaning operation of step C is referred to be cleaned with polar solvent or organic solvent and removes unnecessary oxidation
Graphene.
Preferably, the base material is fexible film.
Preferably, the fexible film is polydimethylsiloxanefilm film, polyvinyl alcohol film, PE thin film, mylar
Or the one kind in the thin film of coating aqueouss UV resin.
Beneficial effects of the present invention are：It is proposed by the present invention that Graphene circuit board is prepared based on the adjustable high-energy ray of addressing
Method, using high-energy ray and addressable technology, the cabling of x, the control Graphene circuit board that walks of y-axis is arranged by programming
Layout, accurate positioning is simple to operate, and the use that yield is good, high efficiency avoids poisonous reducing agent, environmental protection.Prepared by the method
Graphene circuit board small volume, conduct electricity very well, high-temperature stability it is strong.
Specific embodiment
The present invention is described further with reference to specific embodiment.
Embodiment one：
A kind of method for preparing Graphene circuit board based on the adjustable high-energy ray of addressing, comprises the following steps：
A. spraying concentration is the graphene oxide-ethanol solution of 1mg/mL in polydimethylsiloxanefilm film, is dried to obtain oxygen
Graphite alkene thin film；
B. according to the circuit trace layout of required formation, by x on graphene oxide film, y-axis flat addressing positioning is carried out
Laser is portrayed, and makes graphene oxide reduce to form Graphene cabling, and the wavelength of the laser is 780nm；
C. unnecessary graphene oxide is washed away with ethanol, obtains Graphene circuit board.
Obtained Flexible graphene circuit board may be used on the flexibility electrical equipment such as flexible liquid crystal screen, also can be with rigid substrate
Rigid circuit board is combined into, different electric elements is installed and is applied to different electrical equipment.
Embodiment two：
A kind of method for preparing Graphene circuit board based on the adjustable high-energy ray of addressing, comprises the following steps：
A. printing concentration is the graphene oxide-deionized water solution of 5mg/mL on polyvinyl alcohol film, is dried to obtain oxidation
Graphene film；
B. according to the circuit trace layout of required formation, by x on graphene oxide film, y-axis flat addressing positioning adopts X
Ray is irradiated, and makes graphene oxide reduce to form Graphene cabling,
C. deionized water washes away unnecessary graphene oxide, obtains Graphene circuit board.
Obtained Flexible graphene circuit board may be used on the flexibility electrical equipment such as flexible liquid crystal screen, also can be with rigid substrate
Rigid circuit board is combined into, different electric elements is installed and is applied to different electrical equipment.
Embodiment three：
A kind of method for preparing Graphene circuit board based on the adjustable high-energy ray of addressing, comprises the following steps：
A. spraying concentration is the graphene oxide-N-Methyl pyrrolidone solution of 10mg/mL on mylar, is dried to obtain oxygen
Graphite alkene thin film；
B. according to the circuit trace layout of required formation, by x on graphene oxide film, y-axis flat addressing positioning is adopted
Particle beam is irradiated, and makes graphene oxide reduce to form Graphene cabling；
C. unnecessary graphene oxide is washed away with N-Methyl pyrrolidone solution, obtains Graphene circuit board.
Obtained Flexible graphene circuit board may be used on the flexibility electrical equipment such as flexible liquid crystal screen, also can be with rigid substrate
Rigid circuit board is combined into, different electric elements is installed and is applied to different electrical equipment.
Above-mentioned preferred implementation should be regarded as the illustration of application scheme embodiment, all and application scheme thunder
Technology deduction that is same, approximately or based on this making, replacement, improvement etc., are regarded as the protection domain of this patent.
Claims (9)
1. it is a kind of based on addressing the method that adjustable high-energy ray prepares Graphene circuit board, it is characterised in that including following step
Suddenly：
A. graphene oxide solution is coated on base material, graphene oxide film is dried to obtain；
B. according to the circuit trace layout of required formation, by x on graphene oxide film, y-axis flat addressing positioning is adopted
High-energy ray is irradiated, and makes graphene oxide reduce to form Graphene cabling；
C. cleaning removes unnecessary graphene oxide, obtains Graphene circuit board.
2. according to claim 1 based on addressing the method that adjustable high-energy ray prepares Graphene circuit board, its feature
It is that the high-energy ray includes laser, X-ray, particle beam.
3. according to claim 1 based on addressing the method that adjustable high-energy ray prepares Graphene circuit board, its feature
It is that the wavelength of the laser is 150-850nm.
4. according to claim 1 based on addressing the method that adjustable high-energy ray prepares Graphene circuit board, its feature
It is that the graphene oxide solution is that graphene oxide and polar solvent are prepared the solution for obtaining, and the polar solvent is
Deionized water, ethanol, ethylene glycol, dimethylformamide, tetrahydrofuran, N-Methyl pyrrolidone or sodium laureth sulfate
In one kind.
5. according to claim 1 based on addressing the method that adjustable high-energy ray prepares Graphene circuit board, its feature
It is that the concentration of the graphene oxide solution is 1-10mg/mL.
6. according to claim 1 based on addressing the method that adjustable high-energy ray prepares Graphene circuit board, its feature
It is that the coating operation of step A is spraying, prints or spin coating.
7. according to claim 1 based on addressing the method that adjustable high-energy ray prepares Graphene circuit board, its feature
It is that the cleaning operation of step C is referred to be cleaned with polar solvent or organic solvent and removes unnecessary graphene oxide.
8. according to claim 1 based on addressing the method that adjustable high-energy ray prepares Graphene circuit board, its feature
It is that the base material is fexible film.
9. according to claim 8 based on addressing the method that adjustable high-energy ray prepares Graphene circuit board, its feature
It is that the fexible film is polydimethylsiloxanefilm film, polyvinyl alcohol film, PE thin film, mylar or coating aqueouss
One kind in the thin film of UV resins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710028635.6A CN106658980A (en) | 2017-01-16 | 2017-01-16 | Method for preparing graphene circuit board based on addressing adjustable high-energy rays |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710028635.6A CN106658980A (en) | 2017-01-16 | 2017-01-16 | Method for preparing graphene circuit board based on addressing adjustable high-energy rays |
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| CN106658980A true CN106658980A (en) | 2017-05-10 |
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| CN201710028635.6A Pending CN106658980A (en) | 2017-01-16 | 2017-01-16 | Method for preparing graphene circuit board based on addressing adjustable high-energy rays |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101204872A (en) * | 2006-12-22 | 2008-06-25 | 帕洛阿尔托研究中心公司 | Method of printing with high spot placement accuracy |
| WO2014069818A1 (en) * | 2012-10-30 | 2014-05-08 | 삼성테크윈 주식회사 | X-ray detector and x-ray detection system |
| CN104176729A (en) * | 2014-08-12 | 2014-12-03 | 四川大学 | Reduction method of oxidized graphene |
| JP2016018711A (en) * | 2014-07-09 | 2016-02-01 | 株式会社クラレ | Film, and film formation method |
| CN106206050A (en) * | 2016-06-29 | 2016-12-07 | 南京邮电大学 | A kind of laser reduction prepares the method for porous graphene |
-
2017
- 2017-01-16 CN CN201710028635.6A patent/CN106658980A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101204872A (en) * | 2006-12-22 | 2008-06-25 | 帕洛阿尔托研究中心公司 | Method of printing with high spot placement accuracy |
| WO2014069818A1 (en) * | 2012-10-30 | 2014-05-08 | 삼성테크윈 주식회사 | X-ray detector and x-ray detection system |
| JP2016018711A (en) * | 2014-07-09 | 2016-02-01 | 株式会社クラレ | Film, and film formation method |
| CN104176729A (en) * | 2014-08-12 | 2014-12-03 | 四川大学 | Reduction method of oxidized graphene |
| CN106206050A (en) * | 2016-06-29 | 2016-12-07 | 南京邮电大学 | A kind of laser reduction prepares the method for porous graphene |
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Application publication date: 20170510 |