CN106658937A - Printed circuit board and method for manufacturing the same - Google Patents
Printed circuit board and method for manufacturing the same Download PDFInfo
- Publication number
- CN106658937A CN106658937A CN201610320464.XA CN201610320464A CN106658937A CN 106658937 A CN106658937 A CN 106658937A CN 201610320464 A CN201610320464 A CN 201610320464A CN 106658937 A CN106658937 A CN 106658937A
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- CN
- China
- Prior art keywords
- circuit
- insulating barrier
- layer
- pcb
- circuit board
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0379—Stacked conductors
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention provides a printed circuit board and a method of manufacturing the same. According to one embodiment,the printed circuit board comprises an insulating layer formed on a core, a first circuit formed on an upper surface of the insulating layer; a second circuit on which at least a part of the second circuit is embedded in an upper surface of the insulating layer, wherein the first circuit is formed on the upper surface of the insulating layer, and the thickness of the second circuit is greater than the thickness of the first circuit.
Description
This application claims being submitted to the of Korean Intellectual Property Office on October 29th, 2015
The rights and interests of 10-2015-0151411 korean patent applications, the complete disclosure of this application is for all mesh
Be incorporated herein by this.
Technical field
Below description is related to a kind of Printed circuit board and manufacturing methods.
Background technology
In response to the electricity to the performance with lighter weight, faster speed, bigger capacity and Geng Gao
The demand of sub-device (such as, smart phone), has required that printed circuit board (PCB) reduces its size.Especially,
The reduction of printed circuit board sizes is relevant with the reduction of battery size.
The content of the invention
The content of the invention is provided for introducing in simplified form in detailed description below further
The selection of the design of description.The content of the invention is not intended to the key feature of the theme for identifying claimed or must
Feature is wanted, the scope for being used to help determine the theme for claiming also is not intended to.
In a general aspect, a kind of printed circuit board (PCB) may include：Insulating barrier, is formed on core；First
Circuit, is formed on the upper surface of insulating barrier；Second circuit, at least a portion of second circuit is embedded exhausted
The upper surface of edge layer, wherein, the thickness of second circuit can be more than the thickness of the first circuit.
Insulating barrier may include the ground floor and formation second layer on the first layer, wherein, the first circuit shape
Into on the upper surface of the second layer and the embedded second layer of second circuit.
Ground floor can by from formed for the different resin of resin that forms the second layer.
Ground floor can be photosensitive with right and wrong, and the second layer can be photosensitive.
The printed circuit board (PCB) may also include：Tertiary circuit, is embedded in the bottom of ground floor, wherein, the 3rd
The thickness of circuit is smaller than the thickness of second circuit.
The printed circuit board (PCB) may also include：First via, through ground floor with second circuit and the 3rd
It is attached between circuit.
The printed circuit board (PCB) may also include：Second via, through insulating barrier with the first circuit and the 3rd
It is attached between circuit, wherein, the second via may include：First conductor, forms on the first layer；
Second conductor, forms on the second layer to be attached with the first conductor.
A part for second circuit can be embedded in insulating barrier, and the remainder of second circuit can be to insulating barrier
Upper surface project.
First circuit could be for the circuit of signal transmission, and second circuit could be for electric power biography
Defeated circuit.
In another general aspect, a kind of method for manufacturing printed circuit board (PCB) includes：Formed on core exhausted
Edge layer；Form second circuit, the upper surface of the embedded insulating barrier of at least a portion of second circuit；In insulation
The first circuit is formed on the upper surface of layer, wherein, the thickness of second circuit can be more than the thickness of the first circuit.
The operation that insulating barrier is formed on core may include ground floor to be formed on core and in ground floor
The second layer is formed on upper surface, forming the operation of second circuit may include to form second circuit in the second layer.
Methods described may also include：Before forming insulating barrier on core, tertiary circuit is formed on core, its
In, tertiary circuit can be embedded in the bottom of ground floor, and the thickness of tertiary circuit is smaller than second circuit
Thickness.
Methods described may also include：Before second circuit is formed, the first via is formed, wherein, first
Via is through ground floor being attached second circuit and tertiary circuit.
Methods described may also include：Before the first circuit is formed, the second via is formed, wherein, second
Via is through insulating barrier being attached the first circuit and tertiary circuit.
Ground floor can be photosensitive with right and wrong, and the second layer can be photosensitive.
When second circuit is formed, the part of second circuit can be embedded in insulating barrier, and second circuit
Remainder can be prominent to the upper surface of insulating barrier.
By detailed description below, accompanying drawing and claim, other features and aspect will be clear
Chu.
Description of the drawings
Fig. 1 is the view of the first example for illustrating printed circuit board (PCB).
Fig. 2 is the view of the second example for illustrating printed circuit board (PCB).
Fig. 3 is the view of the 3rd example for illustrating printed circuit board (PCB).
Fig. 4 to Figure 10 is to illustrate the view for manufacturing the first example of the method for printed circuit board (PCB).
Figure 11 to Figure 17 is to illustrate the view for manufacturing the second example of the method for printed circuit board (PCB).
Figure 18 to Figure 24 is to illustrate the view for manufacturing the 3rd example of the method for printed circuit board (PCB).
In whole the drawings and specific embodiments, unless otherwise described or provide, otherwise identical accompanying drawing
Reference number refers to identical element, feature and structure.Accompanying drawing can not to scale draw, and in order to
Clear, explanation and it is convenient for the sake of, the relative size of the element in accompanying drawing, ratio and description can be exaggerated.
Specific embodiment
There is provided detailed description below come help reader obtain to method described here, equipment and/
Or the comprehensive understanding of system.However, for the person of ordinary skill of the art, side described here
The various change of method, equipment and/or system, modification and equivalent will be apparent.It is general for this area
Logical technical staff will be apparent that the order of operation described here is only example, and is not limited to
This order for illustrating, but in addition to the operation that must occur by particular order, it is also possible to here is retouched
The order of the operation stated is changed.Additionally, in order to more clear and succinct, the general of this area can be omitted
The description of function and construction well known to logical technical staff.
Feature described here can be carried out in different forms, and should not be construed as limited to here
Described example.More specifically, there is provided embodiment described here will be so that the disclosure will be thorough
And it is complete, and the four corner of the disclosure is conveyed to into one of ordinary skill in the art.
Although it will be appreciated that here can use term " first ", " second ", " the 3rd ", " the 4th "
Etc. describing various elements, but these elements should not be limited by these terms.These terms be only used for by
One element is distinguished with another element.For example, without departing from the scope of the disclosure, first
Element is referred to alternatively as the second element, also, similarly, the second element is referred to alternatively as the first element.It is similar
Ground, when a kind of method is described including series of steps, the order of step is not necessarily the step should
The order that should be performed according to an order, can omit any technical step and/or can will be not disclosed herein
Other arbitrary steps be added in method.
Under appropriate environment, term as used herein be it is tradable, with it is shown and described herein
The different direction in direction is operated.It will be appreciated that when element is referred to as " connection " or " with reference to "
During to another element, it can be directly connected to or be attached to another element or there may be intermediary element.Phase
Instead, when element is referred to as " being directly connected to " or " directly in conjunction with " to another element, there is no centre
Element.
Fig. 1 is the view of the first example for illustrating printed circuit board (PCB).
With reference to Fig. 1, insulating barrier 110, the first circuit 120 may include according to the printed circuit board (PCB) of the first example
With second circuit 130.The thickness of second circuit 130 is bigger than the thickness of the first circuit 120.
The two-layer that insulating barrier 110 can be made up of ground floor 111 and the second layer 112 is formed.The second layer 112
It is placed on ground floor 111.The thickness of insulating barrier 110 can be 10 μm to 500 μm.Ground floor 111
With the half that each in the second layer 112 can be insulating barrier 110.
Ground floor 111 and the second layer 112 can be formed by resin.Resin can be thermosetting resin, thermoplastic
Property resin etc., for example, such as epoxy resin, BT (bismaleimide-triazine) resin, polyimides
Deng.
The example of epoxy resin may include Naphthol-based Epoxy Resin, bisphenol A type epoxy resin, bisphenol-f type ring
Oxygen tree fat, novolac epoxy resin, CF epoxy resin, rubber modified epoxy resin, ring-type alicyclic ring
Race's epoxy resin, organosilicon epoxy resin, nitrogen base epoxy, phosphorus base epoxy etc..However, ring
Oxygen tree fat can not limited to this.
Resin for forming ground floor 111 can be different from the resin for being used to be formed the second layer 112.
Ground floor 111 and the second layer 112 can be formed by the resin comprising reinforcing agent.The example of reinforcing agent can
Including fiber enhancer, inorganic filler, organic polymer etc..Reinforcing agent can be provided by force for insulating barrier 110
Degree.
Fiber enhancer can be glass fibre, and the thickness of its cross section can be from 1 micron to number
In the range of hundred microns.Glass fibre can be improved absolutely in addition to it can improve the intensity of insulating barrier 110, also
The chemical resistance of edge layer 110.Glass fibre can also reduce the absorption rate of insulating barrier 110.Glass fibre
Glass fiber, glass fibre, glass fabric can be divided into according to its thickness.
The example of inorganic filler may include SiO2、Al2O3、SiC、BaSO4, talcum, clay, mica
Powder, aluminium hydroxide (Al (OH)3), magnesium hydroxide (Mg (OH)2), calcium carbonate (CaCO3)、
Magnesium carbonate (MgCO3), magnesia (MgO), boron nitride (BN), aluminium borate (AlBO3), metatitanic acid
Barium (BaTiO3) and calcium zirconate (CaZrO3)。
The example of organic polymer may include natural polymer (for example, such as cellulose), synthetic polymer
(for example, such as acrylic acid and aromatic polyamides) and needle-like or whisker type reinforcing material.
The reinforcing agent being included in ground floor 111 can be different from the reinforcing agent being included in the second layer 112.
For example, ground floor 111 can be glass fiber impregnated prepreg, and the second layer 112 can be with
It is the film containing inorganic filler.
Ground floor 111 can have non-photo-sensing characteristic, and the second layer 112 can have photobehavior.Second
Layer 112 can be PID (light can imaging dielectric).In this case, due to can be only for the second layer
112 perform photoetching process, so opening portion can be partly formed in insulating barrier 110.
The photosensitive second layer 112 can be eurymeric or minus.
When photosensitive insulating layer 110 is eurymeric, the combination of the photopolymer of the part of receiving light may expose
Destroyed in light technique.The destroyed part of those of photopolymer can be removed in developing process.
It is single due to the photopolymerization during exposure technology using light when photosensitive insulating layer 110 is minus
One structure can be changed into chain structure, and the chain structure is three-dimensional net structure.The part of non-receiving light can be
It is removed during developing process.
Core 100 can be formed by insulating materials or non-insulating material.Core 100 can be formed by nonmetallic or metal.
Core 100 can include reinforcing agent.Core 100 can be the resin comprising conduction-enhancing agent.Reinforcing agent can be
Carbon reinforcing agent.
Carbon reinforcing agent can be carbon dust or carbon fiber.Carbon reinforcing agent can have relatively high intensity.Due to carbon
With thermal conductivity and electric conductivity, so it may relate to the heat dispersion of core 100.
Through hole (through via) 101 may be formed in core 100.Through hole 101 can connect and be formed in core
Circuit in 100 upper and lower surface.
First circuit 120 may be formed on the upper surface of insulating barrier 110.First circuit 120 may be formed at
On the upper surface of the second layer 112 of insulating barrier 110.First circuit 120 can not be embedded into insulating barrier 110
In.
First circuit 120 can by with good electrical property metal (for example, such as Cu, Ag, Pd,
Al, Ni, Ti, Au, Pt etc.) formed.
First circuit 120 can pass through additive process, subtract into technique, half additive process, cap bore (tenting)
Technique, half additive process etc. of improvement are forming.However, the technique for forming the first circuit 120 can
Not limited to this.
At least a portion of second circuit 130 can be embedded in the top of insulating barrier 110.Second circuit 130
At least a portion can be embedded in the second layer 112 of insulating barrier 110.
Second circuit 130 can by with good electrical property metal (for example, such as Cu, Ag, Pd,
Al, Ni, Ti, Au, Pt etc.) formed.
Second circuit 130 may include opening portion.Second circuit 130 can be by being opened with conductive material filling
Oral area divides and is formed.
The thickness of second circuit 130 is bigger than the thickness of the first circuit 120.For example, first circuit 120
Thickness can be 10 μm to 15 μm, and the thickness of second circuit 130 can be 50 μm.
First circuit 120 could be for the circuit of signal transmission, and second circuit 130 can be used
In the circuit of power transmission.Because the circuit for power transmission is to the electronics installed on a printed circuit
Device provides electric power, so, different from for the circuit of signal transmission, the circuit for power transmission can
With the constant volume at predetermined value.
Although the volume of the circuit for power transmission should be kept, with to little and thin printing
The demand growth of circuit board, needs the width for reducing circuit.Therefore, the thickness of second circuit board 130 can
More than the thickness of second circuit board 120, wherein, second circuit board 130 is the circuit for power transmission,
First circuit 120 is the circuit for signal transmission.
The width of the first circuit 120 (for the circuit of signal transmission) can reduce regardless of whether volume how.
The width of second circuit board 130 (for the circuit of power transmission) can increase second circuit board 130
Thickness and reduce while keep volume.
Correspondingly, the width of all circuits can be reduced such that the overall width of printed circuit board (PCB) reduces.To
Electronic installation provides the size of the battery of electric power can be increased because space reduces.This can increase battery charging
Use time once.
Tertiary circuit 140, the first via (via) 150 may also include according to the printed circuit board (PCB) of the first example
With the second via 160.
Tertiary circuit 140 can be embedded in the bottom of insulating barrier 110, specifically be embedded in the bottom of ground floor 111.
The thickness of tertiary circuit 140 can be equal to the thickness of the first circuit 120 and less than the thickness of second circuit 130.
Tertiary circuit 140 can by additive process, subtract into technique, half additive process, cap bore technique, change
Half good additive process etc. is forming.However, the technique for forming tertiary circuit 140 can not limited to this.
Tertiary circuit 140 can by with good electrical property metal (for example, such as Cu, Ag, Pd,
Al, Ni, Ti, Au, Pt etc.) formed.
First via 150 may pass through the ground floor 111 of insulating barrier 110, with second circuit 130 and
It is electrically connected between three-circuit 140.A part for tertiary circuit 140 may be formed at second circuit 130
Lower section.Even if tertiary circuit 140 is formed in the lower section of second circuit 130, tertiary circuit 140 and second is electric
Road 130 also can be spaced apart from each other.When tertiary circuit 140 is formed in 130 lower section of second circuit, can be excellent
Change space utilization.
Second via 160 may pass through both ground floor 111 and second layer 112, with the first circuit 120
It is electrically connected between tertiary circuit 140.
First via 150 and the second via 160 are formed as taper, and its sectional dimension is from core 100 to outer
Portion increases.
Lamination may also include according to the printed circuit board (PCB) of the first example.
Lamination may be formed between insulating barrier 110 and core 100 and/or on insulating barrier 110.
Fig. 1 shows the lamination L1 formed between insulating barrier 110 and core 100 and in insulating barrier 110
The example of the lamination L2 of upper formation.
The lamination L1 formed on the surface of core 100 may include the circuit C1 in embedded insulating materials.Product
Layer L1 may additionally include the via V1 formed between circuit C1 and tertiary circuit 140.In core 100
The through hole 101 of formation can be connected electrically in the circuit C1 formed in the upper and lower surface of core 100.
Lamination L2 may include the circuit C2 for being formed on the insulating material.Lamination L2 may additionally include first
Between circuit 120 and circuit C2 formed via V2 and between second circuit 130 and circuit C2
The via V3 of formation.
With reference to Fig. 1, lamination is interpreted to form two-layer.However it is not limited to this.Lamination can be unrestricted
Ground is formed as multilayer.On the other hand, lamination can not be formed.Upper table except being formed in insulating barrier 110
Beyond on face, lamination can also be formed in Anywhere.It is formed on the first circuit 120 and second circuit
The quantity of 130 insulating barrier 110 can be unrestricted.
Fig. 1 shows the example of the printed circuit board (PCB) with the symmetrical structure based on core 100.However, root
Can have based on the unsymmetric structure of core 100 according to the printed circuit board (PCB) of example.It is formed on the first circuit
120 and the insulating barrier 110 of second circuit 130 can be made only on a surface of core.Even if insulating barrier
110 are formed on two surfaces of core 100, and the position of insulating barrier 110 can also be different.
The quantity of insulating barrier 110 and lamination on the upper surface of core 100 can be with the insulating barrier 110 on lower surface
It is different with the quantity of lamination.
Fig. 2 is the view of the second example for illustrating printed circuit board (PCB).
Different click-through from the printed circuit board (PCB) of the first example will be directed to according to the printed circuit board (PCB) of the second example
Row is explained, and the explanation for repeating will be minimized or omit.
With reference to Fig. 2, insulating barrier 110, the first circuit 120 may include according to the printed circuit board (PCB) of the second example
With second circuit 130.The thickness of second circuit 130 is big than the thickness of the first circuit 120.
Tertiary circuit 140, the first via 150 and may also include according to the printed circuit board (PCB) of the second example
Two vias 160.
Different from the second via 160 in the first example, the second via 160 is formed as two-layer.Second
Via 160 may include the first conductor 161 formed on the ground floor 111 of insulating barrier 110 and exhausted
The second conductor 162 formed on the second layer 112 of edge layer 110.
Interface may be formed between the first conductor and the second conductor.The shape of the first conductor can be led with second
The shape of body is different.
For example, the first conductor may be formed to have the taper of the trapezoid cross section area being reduced or increased, and
Two conductors are formed as the constant rectangle of area of section.
At interface, the area of section of the first conductor can be more than the area of section of the second conductor or contrary.
However, this is not limited to this.
Shape difference between first conductor and the second conductor be likely due to for formed ground floor 111 and
The method difference of the material difference of the second layer 112 and the via for forming the first conductor and the second conductor is led
Cause.The method for manufacturing printed circuit board (PCB) is eplained in more detail below.
Fig. 3 is the view of the 3rd example for illustrating printed circuit board (PCB).
Different click-through from the printed circuit board (PCB) of the first example will be directed to according to the printed circuit board (PCB) of the 3rd example
Row is explained, and the explanation for repeating will be minimized or omit.
With reference to Fig. 3, insulating barrier 110, the first circuit 120 may include according to the printed circuit board (PCB) of the 3rd example
With second circuit 130.The thickness of second circuit 130 is big than the thickness of the first circuit 120.
Tertiary circuit 140, the first via 150 and may also include according to the printed circuit board (PCB) of the 3rd example
Two vias 160.
A part for second circuit 130, rather than whole second circuit 130, can be embedded in insulating barrier 110.
A part for second circuit 130 can be embedded in insulating barrier 110, and the remainder of second circuit 130
Dividing can be prominent to the upper surface of insulating barrier 110.The projecting height of second circuit 130 can be equal to the first circuit
120 thickness.When a part for second circuit 130 is embedded in insulating barrier 110 and the insulating barrier 110 of the example
The thickness insulating barrier 110 that is equal to the first example thickness when, the thickness of second circuit 130 can be more than the
The thickness of the second circuit 130 of one example.This means second circuit 130 width can reduce it is so much,
So as to cause the reduction of the width of printed circuit board (PCB).
Fig. 4 to Figure 10 is to illustrate the view for manufacturing the first example of the method for printed circuit board (PCB).
With reference to Fig. 4 to Figure 10, may include according to the method for manufacturing printed circuit board (PCB) of the first example：
Insulating barrier 110 is formed on core 100, at least a portion is embedded in the upper surface of insulating barrier 110 second is formed
Circuit 130 and the first circuit 120 is formed on the upper surface of insulating barrier 110.
Insulating barrier 110 is formed on core 100 be may include：On core 100 formed ground floor 111 and
The second layer 112 is formed on the upper surface of ground floor 111.
May also include according to the method for manufacturing printed circuit board (PCB) of the first example：Formed on core 100
Before insulating barrier 110, tertiary circuit 140 is formed on core 100.
With reference to Fig. 4 to Fig. 7, insulating barrier 110 can be formed on core 100.
With reference to Fig. 4 and Fig. 5, through hole 101 and lamination L1 can be formed in core 100 and on core 100 respectively.
Lamination L1 may include circuit C1 and via V1.The circuit C1 of lamination L1 may be formed at the upper of core 100
On surface and lower surface.The through hole 101 of core 100 is attached to shape in the upper and lower surface of core 100
Into circuit C1.
With reference to Fig. 5, tertiary circuit 140, wherein lamination L1 shapes can be formed on the upper surface of lamination L1
On Cheng Xin 100.The thickness of tertiary circuit 140 is smaller than the thickness of second circuit 130.
Tertiary circuit 140 can by additive process, subtract into technique, half additive process, cap bore technique, change
Half good additive process etc. is forming.However, the technique for forming tertiary circuit 140 can not limited to this.
A part for tertiary circuit 140 may be formed on via V1, and via V1 is in circuit C1 and the 3rd
It is electrically connected between circuit 140.
With reference to Fig. 6, the ground floor 111 of insulating barrier 110 can be formed.With reference to Fig. 7, insulating barrier 110 can be formed
The second layer 112.Ground floor 111 and the second layer 112 can be formed using resin different from each other.First
Layer 111 and the second layer 112 may include reinforcing agent different from each other.
May also include according to the method for manufacturing printed circuit board (PCB) of the first example：Forming second circuit
Forming the first via 150 before 130 in ground floor 111 is used in second circuit 130 and tertiary circuit
It is attached between 140, and second was formed in insulating barrier 110 before the first circuit 120 is formed
Via 160 is used to be attached between the first circuit 120 and tertiary circuit 140.
With reference to Fig. 6, the first opening portion O1 can be formed in ground floor 111.When ground floor 111 is non-
During photosensitive resin, the first opening portion can be formed using laser technology.First opening portion can have inclines
Oblique inwall.
First opening portion may be formed in a part for tertiary circuit 140.First opening portion can be filled out
It is filled with to form the first via 150.First via 150 can tertiary circuit 140 and second circuit 130 it
Between be electrically connected.
With reference to Fig. 7, the second opening portion O2 can be formed in the second layer 112, and can be in ground floor 111
With the 3rd opening portion O3 of formation in the second layer 112.Second opening portion can be formed to extend only through second
Layer 112, and the 3rd opening portion can be formed through both ground floor 111 and second layer 112.
When different with for the resin that forms the second layer 112 or wrap for forming the resin of ground floor 111
When the reinforcing agent being contained in ground floor 111 is different from the reinforcing agent being included in the second layer 112, first opens
Oral area point and the 3rd opening portion can be formed using laser technology, but can by control laser intensity and
Lasing light emitter is controlling respective depth.
When the second layer 112 is photosensitive, the second opening portion can be by including exposed and developed technique
Photoetching process being formed.The second layer 112 directly can be formed using photoetching process and not use extra light
Resist (photoresist).
When the second opening portion is formed by photoetching process, the shape of the second opening portion can swash with utilizing
The shape of the first opening portion that light technique is formed is different.The area of section of the second opening portion is in the second layer
Can be constant on 112 height, and the area of section of the first opening portion is in the height of ground floor 111
On increased or decrease.
As described above, the volume of second circuit 130 needs to be held constant at predetermined value.Second opening portion
Filled with conductive material forming second circuit 130.Here, when the inwall of the second opening portion has perseverance
When fixed area of section rather than the inwall with tilted shape, the volume of second circuit 130 can be by control
The thickness and width of second circuit processed 130 and easily control.
On the other hand, the 3rd opening portion can be formed in ground floor 111 and the second layer 112 using laser technology
In.3rd opening portion is also formed in ground floor 111 and using photoetching process shape using laser technology
Into in the second layer 112.
When the 3rd opening portion using laser technology to be formed when, the inwall of the 3rd opening portion is formed as
Inclined shape.
With reference to Fig. 8, the first via 150, the second via 160 and second circuit 130 can be formed.
First opening portion can be filled with conductive material to form the first via 150.Second opening portion can
Filled with conductive material forming second circuit 130.3rd opening portion can be filled with conductive material with shape
Into the second via 160.
Conductive material can be conductive paste or coating.
First opening portion, the second opening portion and the 3rd opening portion can be filled using plating method.
When using plating method fill opening portion when, can the first opening portion, the second opening portion and
Chemical deposit is formed on 3rd opening portion, electrodeposited coating then can be formed on chemical deposit.
When the volume of the first opening portion, the second opening portion and the 3rd opening portion is different each other,
The synthesis speed of coating can be controlled using leveller (leveler) or can be held after coating is formed
Row glossing is with identical coating upper surface.
With reference to Fig. 9, the first circuit 120 can be formed.
First circuit 120 may be formed on the upper surface of the second layer 112.First circuit 120 can be by adding
Into technique, subtract into technique, half additive process, cap bore technique, half additive process of improvement etc. to be formed.
However, the technique for forming the first circuit 120 can not limited to this.
The thickness of the first circuit 120 is smaller than the thickness of second circuit 130.First circuit 120 is at least
A part may be formed on the second via 160.
With reference to Figure 10, another lamination L2 can be formed.Lamination L2 can cover the first circuit 120.Lamination L2
May include circuit C2 and via V2, V3.
Figure 11 to Figure 17 is to illustrate the view for manufacturing the second example of the method for printed circuit board (PCB).
By for the first example for manufacture printed circuit board (PCB) method difference to showing according to second
The method for manufacturing printed circuit board (PCB) of example is explained, and the explanation for repeating will be minimized or save
Slightly.
With reference to Figure 11 to Figure 17, may include according to the method for manufacturing printed circuit board (PCB) of the second example：
Insulating barrier 110 is formed on core 100, at least a portion is embedded in the upper surface of insulating barrier 110 second is formed
Circuit 130, and the first circuit 120 is formed on the upper surface of insulating barrier 110.
Insulating barrier 110 is formed on core 100 be may include：On core 100 formed ground floor 111 and
The second layer 112 is formed on the upper surface of ground floor 111.
May also include according to the method for manufacturing printed circuit board (PCB) of the second example：Formed on core 100
Before insulating barrier 110, tertiary circuit 140 is formed on core 100.
With reference to Figure 11, through hole 101 and circuit C1 can be formed in core 100 and on core 100 respectively.
With reference to Figure 12, lamination L1 and tertiary circuit 140 can be formed on core 100.
With reference to Figure 13, the ground floor 111 of insulating barrier 110 may be formed on lamination L1, wherein lamination L1
It is formed on core 100.Ground floor 111 can be photosensitive with right and wrong.
The first opening portion O1 can be formed in ground floor 111.First opening portion may be formed to form
On the region of one via 150 and the second via 160.First opening portion can be formed using laser technology.
Herein, first switch part is formed as taper.
With reference to Figure 14, the second layer 112 of insulating barrier 110 may be formed on ground floor 111.The second layer 112
Can be photosensitive.
The second opening portion O2 can be formed in the second layer 112.Second opening portion can utilize photoetching process
Formed.Herein, the area of section of the second opening portion can keep constant on the height of the second layer 112.
Second opening portion may be formed on the first opening portion, with the first opening portion and the second opening portion
Between be attached.
With reference to Figure 15, the first opening portion and the second opening portion can be filled with conductive material, to form the
One via 150, the second via 160 and second circuit 130.
With reference to Figure 16, the first circuit 120 can be formed.The thickness of the first circuit 120 is smaller than second circuit
130 thickness, and the first circuit 120 may be formed on the upper surface of the second layer 112.Herein,
Can not be embedded into for two layer 112.
With reference to Figure 17, another lamination L2 can be formed.
Figure 18 to Figure 24 is to illustrate the view for manufacturing the 3rd example of the method for printed circuit board (PCB).
By for first example for manufacture printed circuit board (PCB) method difference to showing according to the 3rd
The method for manufacturing printed circuit board (PCB) of example is explained, and the explanation for repeating will be minimized or save
Slightly.
With reference to Figure 18 to Figure 24, may include according to the method for manufacturing printed circuit board (PCB) of the 3rd example：
Insulating barrier 110 is formed on core 100, at least a portion is embedded in the upper surface of insulating barrier 110 second is formed
Circuit 130, and the first circuit 120 is formed on the upper surface of insulating barrier 110.
Insulating barrier 110 is formed on core 100 be may include：On core 100 formed ground floor 111 and
The second layer 112 is formed on the upper surface of ground floor 111.
May also include according to the method for manufacturing printed circuit board (PCB) of the 3rd example：Formed on core 100
Before insulating barrier 110, tertiary circuit 140 is formed on core 100.
With reference to Figure 18, through hole 101 and circuit C1 can be formed in core 100 and on core 100 respectively.
With reference to Figure 19, lamination L1 and tertiary circuit 140 can be formed on core 100.
With reference to Figure 20, the ground floor 111 of insulating barrier 110 may be formed on lamination L1, wherein lamination L1
It is formed on core 100.The first opening portion O1 can be formed in ground floor 111.
With reference to Figure 21, the second layer 112 can be formed, and the second opening portion can be formed in the second layer 112
Divide O2.The 3rd opening portion O3 can be formed in ground floor 111 and the second layer 112.
Ground floor 111 can by from formed for the different resin of resin that forms the second layer 112.It is included in
Reinforcing agent in ground floor 111 can be different from the reinforcing agent being included in the second layer 112.
With reference to Figure 22, the first via 150 can be formed by the first opening portion, and the one of second circuit 130
Part can be formed by the second opening portion, and the second via 160 can be formed by the 3rd opening portion.
With reference to Figure 23, the first circuit 120 and second circuit 130 can be formed.Second circuit 130 can be formed
It is to project from the upper surface of the second layer 112.The technique of Figure 22 and the technique of Figure 23 can be performed simultaneously.
With reference to Figure 24, another lamination L2 can be formed.
Although the disclosure includes specific example, for those of ordinary skill in the art will be clear that,
In the case of the spirit and scope without departing from claim and their equivalent, can be in form
Various change is done to these examples with details.Example as described herein only is seen as descriptive sense,
Rather than for the purpose for limiting.The description of feature or aspect in each example will be considered as to fit
For similar features or aspect in other examples.If the technology of description is executed in different order, and/
Or if the component and/or use in the system of description, construction, device or circuit is combined in a different manner
Other components either their equivalent replacing the either system of additional notes, construction, device or electricity
Component in road, then can obtain appropriate result.Therefore, the scope of the present disclosure is not by being embodied as
What mode was limited, but limited by claim and their equivalent, and claim and they
Equivalent in the range of all modifications be to be interpreted as being contained in the disclosure.
Label declaration
100：Core
101：Through hole
110：Insulating barrier
111：Ground floor
112：The second layer
120：First circuit
130：Second circuit
140：Tertiary circuit
150：First via
160：Second via
L1,L2：Lamination
C1,C2：Integrated circuit
V1,V2,V3：Lamination via
Claims (16)
1. a kind of printed circuit board (PCB), including：
Insulating barrier, is formed on core；
First circuit, is formed on the upper surface of insulating barrier；
Second circuit, the upper surface of the embedded insulating barrier of at least a portion of second circuit,
Wherein, thickness of the thickness of second circuit more than the first circuit.
2. printed circuit board (PCB) as claimed in claim 1, wherein, insulating barrier includes ground floor and formation
The second layer on the first layer,
Wherein, the first circuit is formed on the upper surface of the second layer, and the embedded second layer of second circuit.
3. printed circuit board (PCB) as claimed in claim 2, wherein, ground floor by with for forming the second layer
The different resin of resin formed.
4. printed circuit board (PCB) as claimed in claim 2, wherein, ground floor is non-photosensitive, and
The second layer is photosensitive.
5. printed circuit board (PCB) as claimed in claim 2, also includes：Tertiary circuit, is embedded in ground floor
Bottom,
Wherein, thickness of the thickness of tertiary circuit less than second circuit.
6. printed circuit board (PCB) as claimed in claim 5, also includes：First via, through ground floor with
It is attached between second circuit and tertiary circuit.
7. printed circuit board (PCB) as claimed in claim 5, also includes：Second via, through insulating barrier with
It is attached between the first circuit and tertiary circuit,
Wherein, the second via includes：First conductor, forms on the first layer；Second conductor, is formed in
Being attached with the first conductor on the second layer.
8. printed circuit board (PCB) as claimed in claim 1, wherein, the embedded insulation of a part of second circuit
Layer, and the remainder of second circuit is prominent to the upper surface of insulating barrier.
9. printed circuit board (PCB) as claimed in claim 1, wherein, the first circuit is for signal transmission
Circuit, and second circuit is the circuit for power transmission.
10. a kind of method for manufacturing printed circuit board (PCB), including：
Insulating barrier is formed on core；
Form second circuit, the upper surface of the embedded insulating barrier of at least a portion of second circuit；
The first circuit is formed on the upper surface of insulating barrier,
Wherein, thickness of the thickness of second circuit more than the first circuit.
11. methods for being used to manufacture printed circuit board (PCB) as claimed in claim 10, wherein, the shape on core
Operation into insulating barrier is included on core and forms ground floor and on the upper surface of ground floor form second
Layer,
The operation for forming second circuit is included in formation second circuit in the second layer.
12. methods for being used to manufacture printed circuit board (PCB) as claimed in claim 11, also include：On core
Before forming insulating barrier, tertiary circuit is formed on core,
Wherein, the bottom of the embedded ground floor of tertiary circuit, and the thickness of tertiary circuit is less than second circuit
Thickness.
13. the method for being used to manufacture printed circuit board (PCB) as claimed in claim 12, also includes：Formed
Before second circuit, formed the first via, wherein, the first via through ground floor with second circuit with
It is attached between tertiary circuit.
14. methods for being used to manufacture printed circuit board (PCB) as claimed in claim 12, also include：Formed
Before first circuit, formed the second via, wherein, the second via through insulating barrier with the first circuit with
It is attached between tertiary circuit.
15. methods for being used to manufacture printed circuit board (PCB) as claimed in claim 10, wherein, ground floor is
Non-photosensitive, and the second layer is photosensitive.
The 16. as claimed in claim 10 methods for being used to manufacture printed circuit board (PCB), wherein, when forming the
During two circuits, the embedded insulating barrier of a part of second circuit, and the remainder of second circuit is to insulation
The upper surface of layer projects.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020150151411A KR20170050192A (en) | 2015-10-29 | 2015-10-29 | Printed circuit board and method for manufacturing the same |
| KR10-2015-0151411 | 2015-10-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106658937A true CN106658937A (en) | 2017-05-10 |
Family
ID=58741775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610320464.XA Pending CN106658937A (en) | 2015-10-29 | 2016-05-16 | Printed circuit board and method for manufacturing the same |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR20170050192A (en) |
| CN (1) | CN106658937A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109905957A (en) * | 2017-12-11 | 2019-06-18 | 欣兴电子股份有限公司 | Circuit board and its manufacturing method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1359256A (en) * | 2000-07-27 | 2002-07-17 | 索尼化学株式会社 | Flexible wire distribution board and making method |
| US20050199681A1 (en) * | 2002-12-24 | 2005-09-15 | Samsung Electro-Mechanics Co., Ltd | Printed circuit board with embedded capacitors therein, and process for manufacturing the same |
| CN1956635A (en) * | 2005-10-27 | 2007-05-02 | 全懋精密科技股份有限公司 | Structure of thin wire of multi-dielectric layer circuit board and its manufacturing method |
| CN103731979A (en) * | 2012-10-16 | 2014-04-16 | 三星电机株式会社 | Hybrid lamination substrate, manufacturing method thereof and package substrate |
-
2015
- 2015-10-29 KR KR1020150151411A patent/KR20170050192A/en unknown
-
2016
- 2016-05-16 CN CN201610320464.XA patent/CN106658937A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1359256A (en) * | 2000-07-27 | 2002-07-17 | 索尼化学株式会社 | Flexible wire distribution board and making method |
| US20050199681A1 (en) * | 2002-12-24 | 2005-09-15 | Samsung Electro-Mechanics Co., Ltd | Printed circuit board with embedded capacitors therein, and process for manufacturing the same |
| CN1956635A (en) * | 2005-10-27 | 2007-05-02 | 全懋精密科技股份有限公司 | Structure of thin wire of multi-dielectric layer circuit board and its manufacturing method |
| CN103731979A (en) * | 2012-10-16 | 2014-04-16 | 三星电机株式会社 | Hybrid lamination substrate, manufacturing method thereof and package substrate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109905957A (en) * | 2017-12-11 | 2019-06-18 | 欣兴电子股份有限公司 | Circuit board and its manufacturing method |
| CN109905957B (en) * | 2017-12-11 | 2021-04-23 | 欣兴电子股份有限公司 | Circuit board and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20170050192A (en) | 2017-05-11 |
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