CN106658302A - Method of suppressing Pop noise in chip audio processing - Google Patents
Method of suppressing Pop noise in chip audio processing Download PDFInfo
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- CN106658302A CN106658302A CN201610952675.5A CN201610952675A CN106658302A CN 106658302 A CN106658302 A CN 106658302A CN 201610952675 A CN201610952675 A CN 201610952675A CN 106658302 A CN106658302 A CN 106658302A
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R3/00—Circuits for transducers, loudspeakers or microphones
- H04R3/04—Circuits for transducers, loudspeakers or microphones for correcting frequency response
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
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Abstract
The invention provides a method of suppressing Pop noise in chip audio processing. The method mainly comprises steps: a power amplifier of a DAC of a detected chip is opened, and through acquiring audio data played by the DAC of the detected chip, a DAC compensation value of the detected chip is acquired; compensation audio data corresponding to the DAC compensation value of the detected chip is constructed, and before the DAC of the detected chip is power-on to open the PA or the DAC is power-off to close the PA, the DAC of the detected chip plays the compensation audio data to suppress and optimize inherent Pop noise of the PA. The method of the invention can effectively suppress or eliminate unfriendly pop noise generated when the PA of the DAC of the chip is opened and closed, the user experience of the chip in the case of audio opening and closing can be improved obviously, the audio performance of the system and the chip is improved, and more customers and market shares can be won.
Description
Technical field
The present invention relates to noise management technique field, more particularly to it is a kind of suppress chip audio to process in Pop noises side
Method.
Background technology
For media product, audio frequency is a critically important part, although in the playing process of audio file, Ke Yitian
Plus various adjustment and optimization, but when the broadcasting beginning and end of audio file, can produce for Consumer's Experience is bad
Pop noise (noise), the pop noises are not a parts for voice data, but audio frequency apparatus open and close PA (work(
Rate amplifier, PowerAmplifier) when, current potential etc. is produced produced by certain saltus step.
At present, also without a kind of method of the Pop noises effectively suppressed in audio file playing process in prior art.
The content of the invention
The embodiment provides a kind of method for suppressing Pop noises in chip audio process, to realize effectively
Suppress the Pop noises in audio file playing process.
To achieve these goals, this invention takes following technical scheme.
A kind of method for suppressing Pop noises in chip audio process, including：
The power amplifier of the DAC of chip under test is opened, by gathering the audio frequency number that the DAC of the chip under test is played
According to the DAC offsets of the acquisition chip under test；
The corresponding compensating audio data of DAC offsets of the chip under test are constructed, the electricity on the DAC of the chip under test
Open before PA or be electrically turn off before PA under DAC, allow the DAC of the chip under test to play the compensating audio data.
Further, the power amplifier of the DAC of described opening chip under test, by gathering the chip under test
The voice data that DAC is played, obtains the DAC offsets of the chip under test, including：
Open the PA of the DAC of chip under test, the chip under test continuous output test tone frequency under current DAC gains
According to；
Opening standard surveys the PA, the DAC of the N number of chip under test of ADC continuous acquisitions of the standard chips of the ADC of chip
The sample point data of output, calculates the peak value M of each sample point datai, i=1-N, if the peak value of testing audio data is M0,
The ADC offsets of standard chips are P, then the computing formula of chip under test corresponding DAC offsets T under current DAC gains
It is as follows：
Further, described method also includes：
The DAC gains of chip under test are sequentially adjusted in, chip under test is calculated successively in each DAC according to above-mentioned processing procedure
Corresponding DAC offsets under gain, by each DAC gain of chip under test with corresponding DAC offsets associated storage in compensation
In database.
Further, the corresponding compensating audio data of DAC offsets of the described construction chip under test, including：
After the DAC offsets for calculating chip under test, the DAC compensation of the chip under test is constructed according to test order
It is worth corresponding compensating audio data, the compensating audio data include that electricity opens the upper electronic compensating audio frequency number played before PA on DAC
According to DAC under be electrically turn off the lower electronic compensating voice data played before PA, the upper electronic compensating voice data and the lower electronic compensating
Voice data is different, by the upper electronic compensating voice data, the lower electronic compensating voice data and corresponding chip under test
DAC gains, DAC offsets together associated storage in the compensation database.
Further, described lower electronic compensating voice data is to be gradient to the voice data of DAC offsets from " 0 ", described
Upper electronic compensating voice data is the voice data that " 0 " is gradient to from DAC offsets.
Further, before the described electricity on the DAC of the chip under test is opened before PA or is electrically turn off PA under DAC, allow
The DAC of the chip under test plays the compensating audio data, including：
Before electricity opening PA on the DAC of chip, first the compensation database is inquired about according to the current DAC gains of chip, obtained
Take the corresponding upper electronic compensating voice data of current DAC gains；
Allow the DAC of chip to play the upper electronic compensating voice data for a period of time, play electronic compensating audio frequency number on described
The PA of the DAC opened according to during, the voice data for being actually subjected to play DAC normal plays are given.
Further, before the described electricity on the DAC of the chip under test is opened before PA or is electrically turn off PA under DAC, allow
The DAC of the chip under test plays the compensating audio data, including：
Before being electrically turn off PA under the DAC of chip, first the compensation database is inquired about according to the current DAC gains of chip, obtained
Take the corresponding lower electronic compensating voice data of current DAC gains；
After normal voice data is played, the DAC of chip under test is first allowed to play the lower electronic compensating voice data one
The section time, the PA of DAC is closed during the lower electronic compensating voice data is played.
The technical scheme provided by embodiments of the invention described above can be seen that the method for the embodiment of the present invention by collection
The DAC offsets of chip, construct compensating audio data, before being electrically turn off PA before electricity opening PA on the DAC of chip or under DAC,
Allow the DAC of chip to play compensating audio data, produce not during the PA switches of the DAC that can effectively suppress or eliminate chip
Friendly pop noises, can significantly improve Consumer's Experience of the chip in audio switch, improve the audio performance of system and chip,
Strive for more clients and occupation rate of market.
The additional aspect of the present invention and advantage will be set forth in part in the description, and these will become from the following description
Obtain substantially, or recognized by the practice of the present invention.
Description of the drawings
In order to be illustrated more clearly that the technical scheme of the embodiment of the present invention, below will be to use needed for embodiment description
Accompanying drawing be briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for this
For the those of ordinary skill of field, without having to pay creative labor, can be obtaining other according to these accompanying drawings
Accompanying drawing.
Fig. 1 is the handling process of the method for Pop noises during a kind of suppression chip audio provided in an embodiment of the present invention is processed
Figure.
Specific embodiment
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the drawings, wherein ad initio
Same or similar element is represented to same or similar label eventually or the element with same or like function.Below by ginseng
The embodiment for examining Description of Drawings is exemplary, is only used for explaining the present invention, and is not construed as limiting the claims.
Those skilled in the art of the present technique are appreciated that unless expressly stated, singulative " " used herein, "
It is individual ", " described " and " being somebody's turn to do " may also comprise plural form.It is to be further understood that arranging used in the specification of the present invention
Diction " including " refers to there is the feature, integer, step, operation, element and/or component, but it is not excluded that existing or adding
One or more other features, integer, step, operation, element, component and/or their group.It should be understood that when we claim unit
Part is " connected " or during " coupled " to another element, and it can be directly connected or coupled to other elements, or can also exist
Intermediary element.Additionally, " connection " used herein or " coupling " can include wireless connection or couple.Wording used herein
"and/or" includes one or more associated any cells for listing item and all combination.
Those skilled in the art of the present technique are appreciated that unless otherwise defined all terms used herein are (including technology art
Language and scientific terminology) have with art of the present invention in those of ordinary skill general understanding identical meaning.Should also
It is understood by, those terms defined in such as general dictionary should be understood that the meaning having with the context of prior art
The consistent meaning of justice, and unless defined as here, will not be with idealizing or excessively formal implication is explaining.
For ease of the understanding to the embodiment of the present invention, do by taking several specific embodiments as an example further below in conjunction with accompanying drawing
Explanation, and each embodiment does not constitute the restriction to the embodiment of the present invention.
Based on the analysis to problem, the pop noise (noise) in upward and downward electric process are really that audio parts current potential becomes
" burr " produced during change, then we can be made in power-on and power-off by certain method, the change difference very little of current potential, this
The POP noises that sample is produced will obtain very big optimization, or even POP noises are eliminated；In addition, each chip is because manufacture process etc.
Will not be just the same, then the offset that its DAC (Digital to analog converter, digital analog converter) is exported
(compensation) is also different, then need to measure its own DAC offset and record for each chip in volume production test
Get off, and one section of compensating audio data generated with reference to the DAC offset, the DAC of chip formally play audio file it
Before, allow the DAC of the chip under test to play the compensating audio data, while coordinating the PA to DAC to be operable to eliminate pop
Noise.
Handling process such as Fig. 1 of the method for Pop noises in a kind of suppression chip audio process provided in an embodiment of the present invention
Shown, the method is a kind of software solution, including following process step：
Step S110.The power amplifier of the DAC of chip under test is opened, is played by gathering the DAC of the chip under test
Voice data, obtain the DAC offsets of the chip under test.
Test is needed to obtain the corresponding DAC offset (offset) of the chip in the volume production test phase of chip.The part
Need, when test is started, to chip under test an instruction to be sent, allow it to open the PA of DAC, and according to the data break of setting
The testing audio data specified are repeated playing, the testing audio data can be " 0 " or " 1 " etc..
Also need to arrange a standard chips, known to the DAC offsets of the standard chips.A finger is sent to standard chips
Order, allows standard chips to open ADC (Analog-to-Digital Converte, analog-digital converter) and gather chip under test DAC
The testing audio data of broadcasting.Then counted according to information such as the ADC offsets and current gain value of standard chips itself
Calculate, obtain distinguishing corresponding DAC offsets under each DAC gain of chip under test.By each DAC gain of chip under test with it is right
The DAC offset associated storages answered are in compensation database.
Under current DAC gains, continuous output testing audio data such as export " 0 ", while standard core to chip under test
Piece has opened ADC and has carried out data acquisition, and the sample point data of the DAC outputs of the N number of chip under test of continuous acquisition calculates each sampling
The peak value M of point datai, i=1-N, if the peak value of testing audio data is M0, the ADC offsets of standard chips are P, then tested core
The computing formula of piece corresponding DAC offsets T under current DAC gains is as follows：
Such as sample point data peak value is after " 47,48,48,49,47 ... ", to do average computation, obtains chip under test and is working as
DAC offsets (such as average rear for 48) under front gain.
Then, the DAC gains of chip under test are sequentially adjusted in, chip under test is calculated successively each according to above-mentioned processing procedure
Corresponding DAC offsets under individual DAC gains.Then, by the corresponding relation between the DAC gains of chip under test and DAC offsets
In being stored in compensation database.
Step S120.The corresponding compensating audio data of DAC offsets of construction chip under test.
After the DAC offsets for calculating chip under test, above-mentioned DAC offsets are converted to sound by needs according to test order
The parameter information of frequency evidence, according to the corresponding compensating audio number of DAC offsets that the parameter information constructs the chip under test
According to.
Above-mentioned compensating audio data include that electricity opens electric under the upper electronic compensating voice data and DAC played before PA closing on DAC
The lower electronic compensating voice data played before PA is closed, upper electronic compensating voice data and lower electronic compensating voice data are different.By institute
State DAC gains, the DAC offsets one of electronic compensating voice data, the lower electronic compensating voice data with corresponding chip under test
Rise associated storage in the compensation database.
Lower electronic compensating voice data can be to be gradient to the voice data of correspondence DAC offsets, upper electronic compensating audio frequency from " 0 "
Data are gradient to the voice data of " 0 " from DAC offsets.
Corresponding DAC offsets are 48 under such as current gain, the lower electronic compensating voice data of construction can for " 0,0,1,
1 ... 47,47,48,48 ", upper electronic compensating voice data can be " 48,48,47,47 ..., 1,1,0,0 ".
Step S130.Before electricity is opened before PA or is electrically turn off PA under DAC on the DAC of chip under test, chip under test is allowed
DAC plays compensating audio data.
The pop produced during the DAC power-on and power-off that chip is eliminated in compensating audio data used in the real work of chip makes an uproar
Sound.Before electricity opening PA on the DAC of chip, first above-mentioned compensation database is inquired about according to the current DAC gains of chip, obtain current
The corresponding upper electronic compensating voice data of DAC gains.
Then, allow electronic compensating voice data in the DAC broadcastings of chip, and kept for a period of time wait circuit stability, broadcasting
The PA of the DAC opened during putting the upper electronic compensating voice data, then going up the pop noises of electricity will be suppressed well
And can't hear, then give DAC normal plays the voice data for being actually subjected to play.
Accordingly, before being electrically turn off PA under DAC, after normal voice data is played, first according to the current DAC of chip
Above-mentioned compensation database is inquired about in gain, obtains the corresponding lower electronic compensating voice data of current DAC gains.First allow chip under test
DAC plays lower electronic compensating voice data, and after being kept for a period of time, closes during the lower electronic compensating voice data is played
PA is closed, is then descended the pop noises of electricity also optimised and be can't hear, then can completely close DAC.
Compensating audio data in the present invention be for disappear pop noises service, in theory, if compensating audio data with
If the offset of current chip DAC itself is consistent, can exactly there is no pop noises, but due to the error for measuring, so can produce
Give birth to pop noises that are very little but hardly being heard by human ear, it is also possible to what just better pop noises did not all have.Pop noises
Produce when opening or closing PA, need to operate PA when offset of the compensating audio data in DAC is played.
In sum, the DAC offsets that the method for the embodiment of the present invention passes through acquisition chip, construct compensating audio data,
Before being electrically turn off PA before electricity opening PA on the DAC of chip or under DAC, the DAC of chip is allowed to play compensating audio data, Ke Yiyou
Effect ground suppresses or eliminates the unfriendly pop noises that the PA of the DAC of chip is produced when switching, and can significantly improve chip in audio frequency
Consumer's Experience during switch, improves the audio performance of system and chip, strives for more clients and occupation rate of market.
The cost of implementation of the method for the embodiment of the present invention is relatively low, and application prospect is extensive.
One of ordinary skill in the art will appreciate that：Accompanying drawing is the schematic diagram of one embodiment, module in accompanying drawing or
Flow process is not necessarily implemented necessary to the present invention.
As seen through the above description of the embodiments, those skilled in the art can be understood that the present invention can
Realize by the mode of software plus required general hardware platform.Based on such understanding, technical scheme essence
On prior art is contributed part in other words can be embodied in the form of software product, the computer software product
Can be stored in storage medium, such as ROM/RAM, magnetic disc, CD, including some instructions are used so that a computer equipment
(can be personal computer, server, either network equipment etc.) performs some of each embodiment of the invention or embodiment
Method described in part.
Each embodiment in this specification is described by the way of progressive, identical similar portion between each embodiment
Divide mutually referring to what each embodiment was stressed is the difference with other embodiment.Especially for device or
For system embodiment, because it is substantially similar to embodiment of the method, so describing fairly simple, related part is referring to method
The part explanation of embodiment.Apparatus and system embodiment described above is only schematic, wherein the conduct
Separating component explanation unit can be or may not be it is physically separate, can be as the part that unit shows or
Person may not be physical location, you can be located at a place, or can also be distributed on multiple NEs.Can be with root
The factually purpose for needing to select some or all of module therein to realize this embodiment scheme on border.Ordinary skill
Personnel are not in the case where creative work is paid, you can to understand and implement.
The above, the only present invention preferably specific embodiment, but protection scope of the present invention is not limited thereto,
Any those familiar with the art the invention discloses technical scope in, the change or replacement that can be readily occurred in,
All should be included within the scope of the present invention.Therefore, protection scope of the present invention should be with scope of the claims
It is defined.
Claims (7)
1. a kind of method of Pop noises during suppression chip audio is processed, it is characterised in that include：
The power amplifier of the DAC of chip under test is opened, by gathering the voice data that the DAC of the chip under test is played, is obtained
Take the DAC offsets of the chip under test；
The corresponding compensating audio data of DAC offsets of the chip under test are constructed, electricity is opened on the DAC of the chip under test
It is electrically turn off before PA before PA or under DAC, allows the DAC of the chip under test to play the compensating audio data.
2. the method for Pop noises during suppression chip audio according to claim 1 is processed, it is characterised in that described beats
The power amplifier of the DAC of chip under test is driven, by gathering the voice data that the DAC of the chip under test is played, is obtained described
The DAC offsets of chip under test, including：
Open the PA of the DAC of chip under test, the chip under test continuous output testing audio data under current DAC gains；
Opening standard surveys the PA of the ADC of chip, the DAC outputs of the N number of chip under test of ADC continuous acquisitions of the standard chips
Sample point data, calculate the peak value M of each sample point datai, i=1-N, if the peak value of testing audio data is M0, standard
The ADC offsets of chip are P, then the computing formula of chip under test corresponding DAC offsets T under current DAC gains is as follows：
3. the method for Pop noises during suppression chip audio according to claim 2 is processed, it is characterised in that described side
Method also includes：
The DAC gains of chip under test are sequentially adjusted in, chip under test is calculated successively in each DAC gain according to above-mentioned processing procedure
Under corresponding DAC offsets, by each DAC gain of chip under test with corresponding DAC offsets associated storage in offset data
In storehouse.
4. the method for Pop noises during suppression chip audio according to claim 3 is processed, it is characterised in that described structure
The corresponding compensating audio data of DAC offsets of the chip under test are made, including：
After the DAC offsets for calculating chip under test, the DAC offsets pair of the chip under test are constructed according to test order
The compensating audio data answered, the compensating audio data include the upper electricity of DAC open the upper electronic compensating voice data played before PA with
The lower electronic compensating voice data played before PA, the upper electronic compensating voice data and the lower electronic compensating audio frequency are electrically turn off under DAC
Data are different, by the upper electronic compensating voice data, the DAC of the lower electronic compensating voice data and corresponding chip under test
Gain, DAC offsets together associated storage in the compensation database.
5. the method for Pop noises during suppression chip audio according to claim 4 is processed, it is characterised in that under described
Electronic compensating voice data is to be gradient to the voice data of DAC offsets from " 0 ", and the upper electronic compensating voice data is to mend from DAC
Repay the voice data that value is gradient to " 0 ".
6. the method for Pop noises during the suppression chip audio according to claim 4 or 5 is processed, it is characterised in that described
The electricity on the DAC of the chip under test open before PA or be electrically turn off PA under DAC before, allow the DAC of the chip under test to play
The compensating audio data, including：
Before electricity opening PA on the DAC of chip, first the compensation database is inquired about according to the current DAC gains of chip, obtain and work as
The corresponding upper electronic compensating voice data of front DAC gains；
Allow the DAC of chip to play the upper electronic compensating voice data for a period of time, play electronic compensating voice data on described
During open DAC PA, be actually subjected to play voice data give DAC normal plays.
7. the method for Pop noises during the suppression chip audio according to claim 4 or 5 is processed, it is characterised in that described
The electricity on the DAC of the chip under test open before PA or be electrically turn off PA under DAC before, allow the DAC of the chip under test to play
The compensating audio data, including：
Before being electrically turn off PA under the DAC of chip, first the compensation database is inquired about according to the current DAC gains of chip, obtain and work as
The corresponding lower electronic compensating voice data of front DAC gains；
After normal voice data is played, when first allowing the DAC of chip under test to play one section of the lower electronic compensating voice data
Between, the PA of DAC is closed during the lower electronic compensating voice data is played.
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| KR920004925B1 (en) * | 1989-06-30 | 1992-06-22 | 삼성전자 주식회사 | Noise muting and constant voltage control circuit |
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Effective date of registration: 20201203 Address after: No.602, 6 / F, shining building, 35 Xueyuan Road, Haidian District, Beijing 100191 Patentee after: BEIJING ZHONGXINGTIANSHI TECHNOLOGY Co.,Ltd. Address before: 100191, Haidian District, Xueyuan Road, Beijing No. 35, Nanjing Ning building, 16 floor Patentee before: Vimicro Corp. |