CN106654580A - Beidou multi-system integrated antenna - Google Patents
Beidou multi-system integrated antenna Download PDFInfo
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- CN106654580A CN106654580A CN201710054316.2A CN201710054316A CN106654580A CN 106654580 A CN106654580 A CN 106654580A CN 201710054316 A CN201710054316 A CN 201710054316A CN 106654580 A CN106654580 A CN 106654580A
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- matrix
- antenna
- big dipper
- radiating layer
- feed pin
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Links
- 230000010354 integration Effects 0.000 claims abstract description 28
- 239000011159 matrix material Substances 0.000 claims description 111
- DMBHHRLKUKUOEG-UHFFFAOYSA-N diphenylamine Chemical compound C=1C=CC=CC=1NC1=CC=CC=C1 DMBHHRLKUKUOEG-UHFFFAOYSA-N 0.000 claims description 101
- 238000001465 metallisation Methods 0.000 claims description 46
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 239000011889 copper foil Substances 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 4
- 229940058401 polytetrafluoroethylene Drugs 0.000 claims description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 4
- 239000002002 slurry Substances 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 claims 2
- 238000002955 isolation Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
- H01Q1/521—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas
- H01Q1/523—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas between antennas of an array
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/30—Combinations of separate antenna units operating in different wavebands and connected to a common feeder system
Landscapes
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Waveguide Aerials (AREA)
Abstract
The invention discloses a Beidou multi-system integrated antenna which comprises the components of a base board, an antenna feed network circuit board, a plurality of Beidou antennae with different frequency bands, and an RF joint, wherein the antenna feed network circuit board, the plurality of Beidou antennae and the RF joint are successively arranged on the first surface of the base board. The antennae are connected and conducted with the antenna feed network circuit board through feed needle. The RF joint penetrates through the base board and is connected with the antenna feed network circuit board. The output end of the RF joint is arranged on the second surface of the base board. According to the Beidou multi-system integrated antenna, the plurality of antennae with different frequency bands are integrated in a vertical overlapping manner, thereby settling a problem of isolation between different frequency bands, particularly the frequency bands in receiving and transmitting. The Beidou multi-system integrated antenna has advantages of simple structure and high integration degree. Furthermore the Beidou multi-system integrated antenna satisfies requirements of multiple kinds of Beidou multi-system combined navigation equipment.
Description
Technical field
The present invention relates to antenna technical field, more particularly to a kind of Big Dipper mutli-system integration antenna.
Background technology
At present, mainly there are GPS, GLONASS, the Big Dipper, four navigation positioning systems of Galileo in global range, in order to carry
High Point-positioning Precision, increasing navigator employs multisystem integrated navigation and location technology, this is because can utilize
Navigation frequency it is more, the resolving information content for obtaining is more, then calculation accuracy is higher.Wherein, Chinese triones navigation system
Just it is divided into the Big Dipper generation system with communication transmission-receiving function and realizes Global coverage Beidou II system, in Beidou II system again
There are multiple frequency ranges to include B1 frequency ranges, B2 frequency ranges, B3 frequency ranges.
In military navigational equipment, at present the trend of development is the receiver for being integrated with multiple Beidou navigation frequency ranges, i.e.,
The short message communication function of a realistic existing Big Dipper generation, realizes again the positioning function of Beidou II, and many also requirements are realized
The hi-Fix orientating function of Beidou II bimodulus, this requires to need multiple corresponding antennas.And platform space is limited
Property requires that these antenna is integrated, after when multiple navigation antennas, especially high-precision antenna is integrated, while
There are receipts to have between antenna again to send out, the isolation of antenna just brings very big impact with their performance with single comparing, to day
The design of line brings very big challenge.
The content of the invention
The technical problem to be solved in the present invention is, there is provided a kind of Big Dipper mutli-system integration for being integrated with multiple band antennas
Antenna.
The technical solution adopted for the present invention to solve the technical problems is：A kind of Big Dipper mutli-system integration antenna is provided, is wrapped
Include the Big Dipper day of base plate, the antenna feeding network wiring board being successively set on the base plate first surface and multiple different frequency ranges
Line, radio-frequency joint；The Beidou antenna is connected conducting by feed pin with the antenna feeding network wiring board；The radio frequency connects
Head is located on the base plate and connects with the antenna feeding network wiring board, and the output end of radio-frequency joint is located at the base plate
Second surface.
Preferably, multiple Beidou antennas include the Big Dipper B3 being successively set on the antenna feeding network wiring board
Band antenna, Big Dipper B1 band antennas, Big Dipper generation L frequency range transmitting antenna and Big Dipper generation S UHF band reception antenna.
Preferably, the Big Dipper B3 band antennas include dielectric constant for 2-3 the first matrix, be arranged on first base
The first radiating layer on body surface face；
The Big Dipper B1 band antennas include the second matrix that dielectric constant is 2-3, are arranged on second matrix surface
On the second radiating layer；
The Big Dipper generation L frequency range transmitting antenna includes the 3rd matrix that dielectric constant is 12-16, is arranged on the described 3rd
The 3rd radiating layer on matrix surface；
The Big Dipper generation S UHF band reception antenna includes the 4th matrix that dielectric constant is 12-16, is arranged on the described 4th
The 4th radiating layer on matrix surface.
Preferably, first matrix and the second matrix are poly tetrafluoro ethylene matrix；First radiating layer and the second spoke
Layer is penetrated for Copper Foil；
3rd matrix and the 4th matrix are ceramic matrix；3rd radiating layer and the 4th radiating layer are silver slurry layer.
Preferably, the feed pin includes the first feed pin, the second feed pin, the 3rd feed pin and the 4th feed pin；
First feed pin passes through first matrix and connects conducting first radiating layer and antenna feeding network
Wiring board；Second feed pin passes through second matrix and connects conducting second radiating layer and antenna feeding network line
Road plate；3rd feed pin passes through the 3rd matrix and connects conducting the 3rd radiating layer and antenna feeding network circuit
Plate；4th feed pin passes through the 4th matrix and connects conducting the 4th radiating layer and antenna feeding network circuit
Plate.
Preferably, the Big Dipper B3 band antennas also include the first metal through first matrix and the first radiating layer
Change via, first feed pin is connected through the described first metallization via and with first radiating layer；
The Big Dipper B1 band antennas also include the second metallization via through second matrix and the second radiating layer,
Second feed pin is connected through the described second metallization via and with second radiating layer；
The Big Dipper generation L frequency range transmitting antenna also includes the 3rd metal through the 3rd matrix and the 3rd radiating layer
Change via, the 3rd feed pin is connected through the described 3rd metallization via and with the 3rd radiating layer；
The Big Dipper generation S UHF band reception antenna also includes the 4th metal through the 4th matrix and the 4th radiating layer
Change via, the 4th feed pin is connected through the described 4th metallization via and with the 4th radiating layer.
Preferably, the first through hole of connection relative with the described second metallization via is additionally provided with first matrix；Institute
State the second feed pin and connect the antenna feeding network line through the second metallization via and first through hole of relative connection
Road plate；
The second through hole of connection relative with the described 3rd metallization via is additionally provided with first matrix and the second matrix；
3rd feed pin connects the antenna feeding network through the 3rd metallization via and the second through hole of relative connection
Wiring board；
Connection relative with the described 4th metallization via is additionally provided with first matrix, the second matrix and the 3rd matrix
Third through-hole；4th feed pin connects the antenna through the 4th metallization via and third through-hole of relative connection
Feeding network wiring board.
Preferably, the feed pin include four first feed pins, four second feed pins, one described the
Three feed pins and the 4th feed pin.
Preferably, the antenna feeding network wiring board is provided with feeding network to connect with the feed pin.
Preferably, the Big Dipper mutli-system integration antenna includes a radio-frequency joint, and multiple Beidou antennas lead to
Cross the feeding network and connect the radio-frequency joint with output signal；Or,
The Big Dipper mutli-system integration antenna includes multiple radio-frequency joints, and multiple Beidou antennas are by the feedback
Electric network is connected respectively multiple radio-frequency joints with output signal.
Beneficial effects of the present invention：The antenna of multiple different frequency ranges is become one by way of being stacked up and down, is solved
Certainly different frequency range especially receives and dispatches the isolating problem between each frequency range.Simple structure, integrated height, it is adaptable to which various Big Dippeves are more
The requirement of system in combination navigator.
Wherein, by integrated Beidou II double frequency high-precision antenna and the dual-mode antenna of a Big Dipper generation, can provide high
While precision positioning and directing function, Big Dipper short message information is received and dispatched, while solving transceiver insulation between different Big Dipper frequency ranges
The problem of degree, obtains good using effect.
In addition, wiring board material of the antenna of lower floor using low-k, and the dual-mode antenna on upper strata adopts high dielectric
The wiring board material of constant, such design causes the feed distance between upper and lower antenna to maintain suitable distance.
Description of the drawings
Below in conjunction with drawings and Examples, the invention will be further described, in accompanying drawing：
Fig. 1 is the overlooking the structure diagram of the Big Dipper mutli-system integration antenna of one embodiment of the invention；
Fig. 2 is the side structure schematic diagram of the Big Dipper mutli-system integration antenna of one embodiment of the invention；
Fig. 3 be one embodiment of the invention Big Dipper mutli-system integration antenna in Big Dipper B3 band antennas structural representation；
Fig. 4 be one embodiment of the invention Big Dipper mutli-system integration antenna in Big Dipper B1 band antennas structural representation；
Fig. 5 be one embodiment of the invention Big Dipper mutli-system integration antenna in Big Dipper generation L frequency range transmitting antenna structure
Schematic diagram；
Fig. 6 be one embodiment of the invention Big Dipper mutli-system integration antenna in Big Dipper generation S UHF band reception antenna structure
Schematic diagram；
Fig. 7 be one embodiment of the invention Big Dipper mutli-system integration antenna in one of antenna feeding network wiring board enforcement
The structure schematic diagram of example；
Fig. 8 be one embodiment of the invention Big Dipper mutli-system integration antenna in antenna feeding network wiring board another reality
The structure schematic diagram applied.
Specific embodiment
In order to be more clearly understood to the technical characteristic of the present invention, purpose and effect, now compare accompanying drawing and describe in detail
The specific embodiment of the present invention.
As shown in Figure 1, 2, the Big Dipper mutli-system integration antenna of one embodiment of the invention, including base plate 10, it is successively set on
Beidou antenna, the radio-frequency joint 70 of antenna feeding network wiring board 20 and multiple different frequency ranges on the first surface of base plate 10.North
Bucket antenna is connected conducting by feed pin with antenna feeding network wiring board 20；Radio-frequency joint 70 be located on base plate 10 and with day
Line feeding network wiring board 20 is connected, and the output end of radio-frequency joint 70 is located at the second surface of base plate 10.
Multiple Beidou antennas and antenna feeding network wiring board 20 are arranged on base plate 10 by securing members such as screws.
Big Dipper B3 band antennas 30 that multiple Beidou antennas may include to be successively set on antenna feeding network wiring board 20,
Big Dipper B1 band antennas 40, Big Dipper generation L frequency range transmitting antenna 50 and Big Dipper generation S UHF band reception antenna 60, so as to four days
Line is overlayed successively from top to bottom on antenna feeding network wiring board 20 by the height of operating frequency.Big Dipper B3 band antennas 30 are
Big Dipper B3 frequency range high-precision antennas, Big Dipper B1 band antennas 40 are Big Dipper B1 frequency range high-precision antennas.
Wherein, Big Dipper B3 band antennas 30 include dielectric constant for 2-3 the first matrix 31, be arranged on the table of the first matrix 31
The first radiating layer 32 on face.The characteristics of first matrix 31 has low-loss, low-k, for example, polytetrafluoroethylmaterial material
Made by poly tetrafluoro ethylene matrix.First radiating layer 32 can be formed in the surface of the first matrix 31, adhesive force using hot pressing mode
Well；Predominantly the first matrix 31 is dorsad on the surface of base plate 10.First radiating layer 32 can be the shapes such as rectangle, circle, abnormity.
Alternatively, the first radiating layer 32 is Copper Foil.To ensure that Copper Foil has good oxidation resistance and weldability, surface can nickel plating or plating
Gold.
Preferably, the length of side of the first radiating layer 32 is the corresponding half-wavelength (number of wavelengths in the first matrix 31 of B3 frequency ranges
The two of value/mono-).
Big Dipper B1 band antennas 40 include the second matrix 41 that dielectric constant is 2-3, are arranged on the surface of the second matrix 41
The second radiating layer 42.The characteristics of second matrix 41 has low-loss, low-k, for example, polytetrafluoroethylmaterial material is made
Poly tetrafluoro ethylene matrix.Second radiating layer 42 can be formed in the surface of the second matrix 41 using hot pressing mode, and adhesive force is good；
Predominantly the second matrix 41 is dorsad on the surface of base plate 10.Second radiating layer 42 can be the shapes such as rectangle, circle, abnormity.As
Select, the second radiating layer 42 is Copper Foil.To ensure that Copper Foil has good oxidation resistance and weldability, surface can nickel plating or gold-plated.
Preferably, the length of side of the second radiating layer 42 is the corresponding half-wavelength (number of wavelengths in the second matrix 41 of B1 frequency ranges
The two of value/mono-).
Big Dipper generation L frequency range transmitting antenna 50 includes the 3rd matrix 51 that dielectric constant is 12-16, is arranged on the 3rd matrix
The 3rd radiating layer 52 on 51 surfaces.The characteristics of 3rd matrix 51 has low-loss, high-k, for example, ceramic material system
Into ceramic matrix.3rd radiating layer 52 can be the shapes such as rectangle, circle, abnormity.Alternatively, the 3rd radiating layer 52 can be silver
Pulp layer, silver slurry layer itself has good non-oxidizability and welding performance, and by high temperature curing process the 3rd matrix 51 is attached to
On, adhesive force is good.
Preferably, the length of side of the 3rd radiating layer 52 is the corresponding half-wavelength (wavelength values in the 3rd matrix 51 of L frequency ranges
Two/mono-).
Big Dipper generation S UHF band reception antenna 60 includes the 4th matrix 61 that dielectric constant is 12-16, is arranged on the 4th matrix
The 4th radiating layer 62 on 61 surfaces.The characteristics of 4th matrix 61 has low-loss, high-k, for example, ceramic material system
Into ceramic matrix.4th radiating layer 62 can be the shapes such as rectangle, circle, abnormity.Alternatively, the 4th radiating layer 62 can be silver
Pulp layer, silver slurry layer itself has good non-oxidizability and welding performance, and by high temperature curing process the 4th matrix 61 is attached to
On, adhesive force is good.
Preferably, the length of side of the 4th radiating layer 62 is the corresponding half-wavelength (wavelength values in the 4th matrix 61 of S frequency ranges
Two/mono-).
In multiple Beidou antennas, positioned at 40 two high accuracy of Big Dipper B3 band antennas 30 and Big Dipper B1 band antennas of lower floor
Antenna adopts the wiring board material (matrix) of low-k, positioned at the Big Dipper generation L frequency range transmitting antenna 50 and the Big Dipper on upper strata
60 two dual-mode antennas of generation S UHF band reception antenna adopt the wiring board material (matrix) of high-k so that levels day
Feed distance between line maintains suitable distance.
The multiple Beidou antennas of correspondence, feed pin includes the first feed pin, the second feed pin, the 3rd feed pin and the 4th feed
Pin, respectively by Big Dipper B3 band antennas 30, Big Dipper B1 band antennas 40, Big Dipper generation L frequency range transmitting antenna 50 and Big Dipper generation S
UHF band reception antenna 60 is connected conducting with antenna feeding network wiring board 20.
Wherein, the first feed pin passes through the first matrix 31 and connects the first radiating layer 32 of conducting and antenna feeding network circuit
Plate 20；Second feed pin passes through the second matrix 41 and connects the second radiating layer 42 of conducting and antenna feeding network wiring board 20；The
Three feed pins pass through the 3rd matrix 51 and connect the 3rd radiating layer 52 of conducting and antenna feeding network wiring board 20；4th feed pin
Through the 4th matrix 61 and connect conducting the 4th radiating layer 62 and antenna feeding network wiring board 20.Above-mentioned each feed pin with it is corresponding
Radiating layer and antenna feeding network wiring board 20 conducting can be connected by soldering mode.
Further, as shown in Figure 1,3, Big Dipper B3 band antennas 30 are also included through the first matrix 31 and the first radiating layer
32 the first metallization via 33, the first feed pin via 33 and is connected through the first metallization with the first radiating layer 32, by the
One radiating layer 32 is connected conducting with antenna feeding network wiring board 20.
As shown in Fig. 1,4, Big Dipper B1 band antennas 40 also include second through the second matrix 41 and the second radiating layer 42
Metallization via 43, the second feed pin is connected through the second metallization via 43 and with the second radiating layer 42, by the second radiating layer
42 are connected conducting with antenna feeding network wiring board 20
As shown in Figure 1,5, Big Dipper generation L frequency range transmitting antenna 50 is also included through the 3rd matrix 51 and the 3rd radiating layer 52
The 3rd metallization via 53, the 3rd feed pin via 53 and is connected through the 3rd metallization with the 3rd radiating layer 52, by the 3rd
Radiating layer 52 is connected conducting with antenna feeding network wiring board 20.
As a shown in Figure 6, Big Dipper generation S UHF band reception antenna 60 is also included through the 4th matrix 61 and the 4th radiating layer 62
The 4th metallization via 63, the 4th feed pin via 63 and is connected through the 4th metallization with the 4th radiating layer 62, by the 4th
Radiating layer 62 is connected conducting with antenna feeding network wiring board 20.
It is to be appreciated that because multiple Beidou antennas are to be stacked up and down, therefore the second feed pin is through after the second matrix 41
Also extend through the first matrix 31, and be not connected with the first radiating layer 32；3rd feed pin is through also extending through the after the 3rd matrix 51
Two matrixes 41 and the first matrix 31, and be not connected with the second radiating layer 42 and the first radiating layer 32；4th feed pin is through the
Also extend through the 3rd matrix 51, the second matrix 41 and the first matrix 31 after four matrixes 61, and not with the 3rd radiating layer 52, the second spoke
Penetrate the radiating layer 32 of layer 42 and first to connect.
For wearing for each feed pin, the first of connection relative with the second metallization via 43 is additionally provided with the first matrix 31
Through hole 34, second metallization via 43 and first through hole connection antenna feeding network circuit of second feed pin through relative connection
Plate 20；Diameter of the internal diameter of first through hole 34 more than the second feed pin, it is to avoid the first radiating layer 32 is contacted with the second feed pin leads
It is logical.
The second through hole of connection relative with the 3rd metallization via 53 is additionally provided with first matrix 31 and the second matrix 41, the
Threeth metallization via 53 and second through hole connection antenna feeding network wiring board 20 of three feed pins through relative connection；Second
Diameter of the internal diameter of through hole more than the 3rd feed pin, it is to avoid the second radiating layer 42 and the first radiating layer 32 are contacted with the 3rd feed pin
Conducting.As shown in Figure 3,4, the second through hole is included through the first hole section 35 of the first matrix 31 and through the second of the second matrix 41
Hole section 44, the first hole section 35 forms the second through hole with relative connection of the second hole section 44.
Connection relative with the 4th metallization via 63 is additionally provided with first matrix 31, the second matrix 41 and the 3rd matrix 51
Third through-hole, fourth metallization via 63 and third through-hole connection antenna feeding network line of the 4th feed pin through relative connection
Road plate 20；Diameter of the internal diameter of third through-hole more than the 4th feed pin, it is to avoid the 3rd radiating layer 52, the second radiating layer 42 and first
Radiating layer 32 contacts conducting with the 4th feed pin.As shown in Fig. 3,4,5, third through-hole is included through the first hole of the first matrix 31
Section 36, through second hole section 45 and the 3rd hole section 54 through the 3rd matrix 51 of the second matrix 41, the first hole section 36, second
Hole section 45 connects to form third through-hole relatively with the 3rd hole section 54.
In the present embodiment, feed pin includes four first feed pins, four second feed pins, the 3rd feed pins and
The feed pin of root the 4th.Therefore, Big Dipper B3 band antennas 30 include four first metallization vias 33, and Big Dipper B1 band antennas 40 are wrapped
Four second metallization vias 43 are included, Big Dipper generation L frequency range transmitting antenna 50 includes one the 3rd metallization via 53, the Big Dipper one
Include one the 4th metallization via 63 for S UHF band receptions antenna 60.
4th metallization via 63 is located at the center of Big Dipper generation S UHF band reception antenna 60, so as to the antenna is adopted
The mode of apex drive, improves the isolation between transmitting-receiving.In the horizontal direction, the 3rd metallization via 53 is located at the 4th gold medal
The peripheral and close 4th metallization via 63 of categoryization via 63 so that Big Dipper generation dual-mode antenna (launch by Big Dipper generation L frequency range
Antenna 50 and Big Dipper generation S UHF band reception antenna 60) to Beidou II high-precision antenna (Big Dipper B3 band antennas 30, Big Dipper B1
Band antenna 40) impact it is less.
In the horizontal direction, four second metallization vias 43 are separately distributed in the 3rd metallization gold medal of via 53 and the 4th
The periphery of categoryization via 63, four first metallization vias 33 are separately distributed in the periphery of the second metallization via 43.
Antenna feeding network wiring board 20 is provided with feeding network to connect with feed pin, so as to connect with multiple Beidou antennas
It is logical.Wherein, antenna feeding network wiring board 20 adopts the polytetrafluoroethylmaterial material of low-loss, dielectric constant 2-3 as matrix, feedback
Electric network is printed on matrix, is connected with corresponding radiating layer (first to fourth radiating layer) respectively.
As shown in fig. 7, in one embodiment that antenna feeding network wiring board 20 connects Beidou antenna, Big Dipper multisystem
It is antenna integrated including a radio-frequency joint 70, multiple Beidou antennas synthesize an outlet line by feeding network 21, and connect
Radio-frequency joint 70 is with output signal.
As shown in figure 8, in another embodiment that antenna feeding network wiring board 20 connects Beidou antenna, Big Dipper polyphyly
System is antenna integrated including multiple radio-frequency joints 70, and multiple Beidou antennas are connected respectively multiple radio-frequency joints by feeding network
70 with output signal, i.e. Big Dipper B3 band antennas 30, Big Dipper B1 band antennas 40, Big Dipper generation L frequency range transmitting antenna 50 and north
Bucket generation S UHF band reception antenna 60 connects a radio-frequency joint 70 with output signal by feeding network respectively.
Embodiments of the invention are the foregoing is only, the scope of the claims of the present invention is not thereby limited, it is every using this
Equivalent structure or equivalent flow conversion that bright specification and accompanying drawing content are made, or directly or indirectly it is used in other related skills
Art field, is included within the scope of the present invention.
Claims (10)
1. a kind of Big Dipper mutli-system integration antenna, it is characterised in that including base plate, be successively set on the base plate first surface
Antenna feeding network wiring board and multiple different frequency ranges Beidou antenna, radio-frequency joint；The Beidou antenna passes through feed pin
Be connected conducting with the antenna feeding network wiring board；The radio-frequency joint is located on the base plate and feeds with the antenna
Network line plate is connected, and the output end of radio-frequency joint is located at the second surface of the base plate.
2. Big Dipper mutli-system integration antenna according to claim 1, it is characterised in that multiple Beidou antennas include according to
The secondary Big Dipper B3 band antennas being arranged on the antenna feeding network wiring board, Big Dipper B1 band antennas, Big Dipper generation L frequency range
Transmitting antenna and Big Dipper generation S UHF band reception antenna.
3. Big Dipper mutli-system integration antenna according to claim 2, it is characterised in that the Big Dipper B3 band antennas include
First matrix, first radiating layer that be arranged on first matrix surface on of the dielectric constant for 2-3；
The Big Dipper B1 band antennas include the second matrix that dielectric constant is 2-3, are arranged on second matrix surface
Second radiating layer；
The Big Dipper generation L frequency range transmitting antenna includes the 3rd matrix that dielectric constant is 12-16, is arranged on the 3rd matrix
The 3rd radiating layer on surface；
The Big Dipper generation S UHF band reception antenna includes the 4th matrix that dielectric constant is 12-16, is arranged on the 4th matrix
The 4th radiating layer on surface.
4. Big Dipper mutli-system integration antenna according to claim 3, it is characterised in that first matrix and the second matrix
For poly tetrafluoro ethylene matrix；First radiating layer and the second radiating layer are Copper Foil；
3rd matrix and the 4th matrix are ceramic matrix；3rd radiating layer and the 4th radiating layer are silver slurry layer.
5. Big Dipper mutli-system integration antenna according to claim 3, it is characterised in that the feed pin includes the first feed
Pin, the second feed pin, the 3rd feed pin and the 4th feed pin；
First feed pin passes through first matrix and connects conducting first radiating layer and antenna feeding network circuit
Plate；Second feed pin passes through second matrix and connects conducting second radiating layer and antenna feeding network circuit
Plate；3rd feed pin passes through the 3rd matrix and connects conducting the 3rd radiating layer and antenna feeding network circuit
Plate；4th feed pin passes through the 4th matrix and connects conducting the 4th radiating layer and antenna feeding network circuit
Plate.
6. Big Dipper mutli-system integration antenna according to claim 5, it is characterised in that the Big Dipper B3 band antennas are also wrapped
The first metallization via through first matrix and the first radiating layer is included, first feed pin passes through first metal
Change via and be connected with first radiating layer；
The Big Dipper B1 band antennas also include the second metallization via through second matrix and the second radiating layer, described
Second feed pin is connected through the described second metallization via and with second radiating layer；
The Big Dipper generation L frequency range transmitting antenna also includes being metallized through the 3rd of the 3rd matrix and the 3rd radiating layer
Hole, the 3rd feed pin is connected through the described 3rd metallization via and with the 3rd radiating layer；
The Big Dipper generation S UHF band reception antenna also includes being metallized through the 4th of the 4th matrix and the 4th radiating layer
Hole, the 4th feed pin is connected through the described 4th metallization via and with the 4th radiating layer.
7. Big Dipper mutli-system integration antenna according to claim 6, it is characterised in that be additionally provided with first matrix with
The first through hole of the second metallization via connection relatively；Second metal of second feed pin through relative connection
Change via and first through hole connects the antenna feeding network wiring board；
The second through hole of connection relative with the described 3rd metallization via is additionally provided with first matrix and the second matrix；It is described
3rd feed pin connects the antenna feeding network circuit through the 3rd metallization via and the second through hole of relative connection
Plate；
The 3rd of connection relative with the described 4th metallization via the is additionally provided with first matrix, the second matrix and the 3rd matrix
Through hole；4th feed pin connects the antenna feed through the 4th metallization via and third through-hole of relative connection
Network line plate.
8. Big Dipper mutli-system integration antenna according to claim 5, it is characterised in that the feed pin is included described in four
First feed pin, four second feed pins, the 3rd feed pin and the 4th feed pins.
9. the Big Dipper mutli-system integration antenna according to any one of claim 1-8, it is characterised in that the antenna transmission network
Network wiring board is provided with feeding network to connect with the feed pin.
10. Big Dipper mutli-system integration antenna according to claim 9, it is characterised in that the Big Dipper mutli-system integration day
Line includes a radio-frequency joint, and multiple Beidou antennas connect the radio-frequency joint to export by the feeding network
Signal；Or,
The Big Dipper mutli-system integration antenna includes multiple radio-frequency joints, and multiple Beidou antennas pass through the transmission network
Network is connected respectively multiple radio-frequency joints with output signal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710054316.2A CN106654580A (en) | 2017-01-22 | 2017-01-22 | Beidou multi-system integrated antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710054316.2A CN106654580A (en) | 2017-01-22 | 2017-01-22 | Beidou multi-system integrated antenna |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106654580A true CN106654580A (en) | 2017-05-10 |
Family
ID=58842141
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710054316.2A Pending CN106654580A (en) | 2017-01-22 | 2017-01-22 | Beidou multi-system integrated antenna |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106654580A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107317107A (en) * | 2017-07-11 | 2017-11-03 | 深圳市鼎耀科技有限公司 | Anti-interference array is antenna integrated |
| CN111668602A (en) * | 2020-06-30 | 2020-09-15 | 陕西烽火诺信科技有限公司 | Double-frequency circularly polarized antenna assembly |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030201939A1 (en) * | 2002-04-29 | 2003-10-30 | Reece John K. | Integrated dual or quad band communication and GPS band antenna |
| CN102354809A (en) * | 2011-08-09 | 2012-02-15 | 华南理工大学 | Double-frequency and double-polarization antenna capable of operating in compass satellite navigation system and mobile third-generation (3G) network |
| CN202678508U (en) * | 2011-12-05 | 2013-01-16 | 上海海积信息科技有限公司 | Satellite microstrip receiving antenna for receiving frequency bands of GPS L1 and Beidou II B1 |
| CN103280633A (en) * | 2013-05-30 | 2013-09-04 | 深圳市华信天线技术有限公司 | Satellite positioning antenna device |
| CN103457029A (en) * | 2013-09-04 | 2013-12-18 | 北京合众思壮科技股份有限公司 | Dual-band antenna |
| CN103746192A (en) * | 2014-01-17 | 2014-04-23 | 福州福大北斗通信科技有限公司 | First-generation Compass/second-generation Compass B1/GPS (Global Positioning System) multisystem-compatible navigation antenna |
| CN103956584A (en) * | 2014-04-29 | 2014-07-30 | 陕西海通天线有限责任公司 | Handheld dual-mode miniaturized user machine antenna |
| CN104319467A (en) * | 2014-10-14 | 2015-01-28 | 陕西海通天线有限责任公司 | Five-frequency-section user machine antenna being compatible with Beidou and GPS (Global Positioning System) functions |
| CN105811077A (en) * | 2014-10-23 | 2016-07-27 | 现代自动车株式会社 | Antenna, circular polarized patch antenna, and vehicle having the same |
| CN206441870U (en) * | 2017-01-22 | 2017-08-25 | 深圳市鼎耀科技有限公司 | Big Dipper mutli-system integration antenna |
-
2017
- 2017-01-22 CN CN201710054316.2A patent/CN106654580A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030201939A1 (en) * | 2002-04-29 | 2003-10-30 | Reece John K. | Integrated dual or quad band communication and GPS band antenna |
| CN102354809A (en) * | 2011-08-09 | 2012-02-15 | 华南理工大学 | Double-frequency and double-polarization antenna capable of operating in compass satellite navigation system and mobile third-generation (3G) network |
| CN202678508U (en) * | 2011-12-05 | 2013-01-16 | 上海海积信息科技有限公司 | Satellite microstrip receiving antenna for receiving frequency bands of GPS L1 and Beidou II B1 |
| CN103280633A (en) * | 2013-05-30 | 2013-09-04 | 深圳市华信天线技术有限公司 | Satellite positioning antenna device |
| CN103457029A (en) * | 2013-09-04 | 2013-12-18 | 北京合众思壮科技股份有限公司 | Dual-band antenna |
| CN103746192A (en) * | 2014-01-17 | 2014-04-23 | 福州福大北斗通信科技有限公司 | First-generation Compass/second-generation Compass B1/GPS (Global Positioning System) multisystem-compatible navigation antenna |
| CN103956584A (en) * | 2014-04-29 | 2014-07-30 | 陕西海通天线有限责任公司 | Handheld dual-mode miniaturized user machine antenna |
| CN104319467A (en) * | 2014-10-14 | 2015-01-28 | 陕西海通天线有限责任公司 | Five-frequency-section user machine antenna being compatible with Beidou and GPS (Global Positioning System) functions |
| CN105811077A (en) * | 2014-10-23 | 2016-07-27 | 现代自动车株式会社 | Antenna, circular polarized patch antenna, and vehicle having the same |
| CN206441870U (en) * | 2017-01-22 | 2017-08-25 | 深圳市鼎耀科技有限公司 | Big Dipper mutli-system integration antenna |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107317107A (en) * | 2017-07-11 | 2017-11-03 | 深圳市鼎耀科技有限公司 | Anti-interference array is antenna integrated |
| CN107317107B (en) * | 2017-07-11 | 2023-09-08 | 深圳市鼎耀科技有限公司 | Anti-interference array integrated antenna |
| CN111668602A (en) * | 2020-06-30 | 2020-09-15 | 陕西烽火诺信科技有限公司 | Double-frequency circularly polarized antenna assembly |
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Application publication date: 20170510 |