CN106653984A - 浇封型led防爆光源模组和防爆灯 - Google Patents
浇封型led防爆光源模组和防爆灯 Download PDFInfo
- Publication number
- CN106653984A CN106653984A CN201710077114.XA CN201710077114A CN106653984A CN 106653984 A CN106653984 A CN 106653984A CN 201710077114 A CN201710077114 A CN 201710077114A CN 106653984 A CN106653984 A CN 106653984A
- Authority
- CN
- China
- Prior art keywords
- explosion
- light source
- proof
- glue
- type led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004880 explosion Methods 0.000 title claims abstract description 59
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 52
- 238000007789 sealing Methods 0.000 claims abstract description 6
- 239000003292 glue Substances 0.000 claims description 78
- 238000005538 encapsulation Methods 0.000 claims description 23
- 229910000679 solder Inorganic materials 0.000 claims description 21
- 239000004033 plastic Substances 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 230000004888 barrier function Effects 0.000 claims description 5
- 238000005259 measurement Methods 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 abstract 2
- 230000001070 adhesive effect Effects 0.000 abstract 2
- 238000013461 design Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000010892 electric spark Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000001629 suppression Effects 0.000 description 3
- 241000218202 Coptis Species 0.000 description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000002360 explosive Substances 0.000 description 2
- 230000001012 protector Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012946 outsourcing Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S6/00—Lighting devices intended to be free-standing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
Description
标号 | 名称 | 标号 | 名称 |
1 | 安装板 | 11 | 安装槽 |
12 | 灌封孔 | 13 | 灌封腔 |
14 | 引线槽 | 15 | 锁定孔 |
2 | 光源组件 | 21 | 光源基板 |
22 | LED芯片 | 23 | 焊盘 |
24 | 正负极导线 | 3 | 防爆封装胶 |
4 | 透镜 | 5 | 弹性胶圈 |
6 | 压圈 |
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710077114.XA CN106653984B (zh) | 2017-02-13 | 2017-02-13 | 浇封型led防爆光源模组和防爆灯 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710077114.XA CN106653984B (zh) | 2017-02-13 | 2017-02-13 | 浇封型led防爆光源模组和防爆灯 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106653984A true CN106653984A (zh) | 2017-05-10 |
CN106653984B CN106653984B (zh) | 2019-07-26 |
Family
ID=58845079
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710077114.XA Active CN106653984B (zh) | 2017-02-13 | 2017-02-13 | 浇封型led防爆光源模组和防爆灯 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106653984B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111029335A (zh) * | 2019-12-20 | 2020-04-17 | 圆融光电科技股份有限公司 | 深紫外发光装置 |
CN112002848A (zh) * | 2020-07-14 | 2020-11-27 | 华瑞矿业科技有限公司 | 防爆电池 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100311193A1 (en) * | 2009-06-03 | 2010-12-09 | Hsuan-Chih Lin | Led module fabrication method |
US20120002407A1 (en) * | 2009-09-14 | 2012-01-05 | Li Qing Charles | Light emitting diode light source modules |
CN203910845U (zh) * | 2014-04-01 | 2014-10-29 | 密强 | 一种朗伯型led大功率封装结构 |
CN204420665U (zh) * | 2015-02-09 | 2015-06-24 | 福州恒达利电子科技有限公司 | 一体化防水led照明模组 |
CN105588020A (zh) * | 2014-10-09 | 2016-05-18 | 汪绍芬 | 一种大功率led液冷模组灯 |
CN206490092U (zh) * | 2017-02-13 | 2017-09-12 | 陶尊伍 | 浇封型led防爆光源模组和防爆灯 |
-
2017
- 2017-02-13 CN CN201710077114.XA patent/CN106653984B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100311193A1 (en) * | 2009-06-03 | 2010-12-09 | Hsuan-Chih Lin | Led module fabrication method |
US20120002407A1 (en) * | 2009-09-14 | 2012-01-05 | Li Qing Charles | Light emitting diode light source modules |
CN203910845U (zh) * | 2014-04-01 | 2014-10-29 | 密强 | 一种朗伯型led大功率封装结构 |
CN105588020A (zh) * | 2014-10-09 | 2016-05-18 | 汪绍芬 | 一种大功率led液冷模组灯 |
CN204420665U (zh) * | 2015-02-09 | 2015-06-24 | 福州恒达利电子科技有限公司 | 一体化防水led照明模组 |
CN206490092U (zh) * | 2017-02-13 | 2017-09-12 | 陶尊伍 | 浇封型led防爆光源模组和防爆灯 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111029335A (zh) * | 2019-12-20 | 2020-04-17 | 圆融光电科技股份有限公司 | 深紫外发光装置 |
CN111029335B (zh) * | 2019-12-20 | 2022-04-12 | 圆融光电科技股份有限公司 | 深紫外发光装置 |
CN112002848A (zh) * | 2020-07-14 | 2020-11-27 | 华瑞矿业科技有限公司 | 防爆电池 |
Also Published As
Publication number | Publication date |
---|---|
CN106653984B (zh) | 2019-07-26 |
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Legal Events
Date | Code | Title | Description |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20180810 Address after: 518028 5 building, 612 Bagua two road 12, Futian District, Shenzhen, Guangdong. Applicant after: Shao Zeyu Applicant after: Dai Xingjian Address before: 116000 720 the Yellow River Road, Shahekou District, Dalian, Liaoning 16-3 Applicant before: Tao Zunwu Applicant before: Shao Zeyu |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20200219 Address after: 518028 5 building, 612 Bagua two road 12, Futian District, Shenzhen, Guangdong. Co-patentee after: Yiang Industrial Technology (Dalian) Co.,Ltd. Patentee after: Shao Zeyu Address before: 518028 5 building, 612 Bagua two road 12, Futian District, Shenzhen, Guangdong. Co-patentee before: Dai Xingjian Patentee before: Shao Zeyu |
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IP01 | Partial invalidation of patent right | ||
IP01 | Partial invalidation of patent right |
Commission number: 4W114307 Conclusion of examination: Declare partial invalidity of invention patent right No. 201710077114. X, and maintain the validity of this patent right on the basis of claims 1-8 submitted by the patentee on July 11, 2022 Decision date of declaring invalidation: 20221102 Decision number of declaring invalidation: 58952 Denomination of invention: Encapsulated LED explosion-proof light source module and explosion-proof lamp Granted publication date: 20190726 Patentee: Shao Zeyu|Yiang Industrial Technology (Dalian) Co.,Ltd. |