CN106653746B - A kind of array substrate and display device - Google Patents
A kind of array substrate and display device Download PDFInfo
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- CN106653746B CN106653746B CN201611158777.6A CN201611158777A CN106653746B CN 106653746 B CN106653746 B CN 106653746B CN 201611158777 A CN201611158777 A CN 201611158777A CN 106653746 B CN106653746 B CN 106653746B
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- metal
- cylindrical hole
- array substrate
- contact wires
- data line
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
Abstract
The present invention relates to In-Cell touch panel manufacturing fields, array substrate proposed by the present invention, including data line layer, it further include the GND metal routing along the setting of array substrate peripheral edge, being connected per two adjacent data lines by the first metal contact wires in the data line layer, data line on the outermost side is connected by the second metal contact wires with GND metal trend, to, the electrostatic generated in array substrate processing procedure can spread rapidly along data wire metal net and by GND metal routing flow direction the earth, eliminate the harm of electrostatic generation, the product yield in processing procedure is improved to a certain extent.In the follow-up process of array substrate, the first metal contact wires and the second metal contact wires are fully disconnected respectively by etching technique, ensure that the normal display of liquid crystal display panel.The present invention proposes a kind of display device including the array substrate simultaneously.
Description
Technical field
The present invention relates to In-Cell touch panel manufacturing field more particularly to a kind of array substrates and display device.
Background technique
All can in liquid crystal display manufacturing process, such as in drying, etching, alignment film friction, cutting and carrying technique
Lead to the generation of electrostatic.Static discharge, which may puncture insulating layer, causes double layer of metal to be directly connected, to directly affect
Produce the yield of liquid crystal display panel.Static discharge is a kind of accumulation of static electricity, between different objects the phenomenon that electrostatic charge transfer release.
The time of Electro-static Driven Comb is very short, generally only nano-scale.Electrostatic discharges within the time short in this way can generate very big wink
Between electric current, device will be burnt when electric current high in this way passes through integrated circuit, lead to circuit cisco unity malfunction.Therefore, exist
The generation of reduction electrostatic can be gone with some such as ion blower equipment in semiconductors manufacture, or be arranged in the fabrication process
Electrostatic discharge protection circuit, thus the problem of being conducive to the diffusion of electrostatic, preventing electrostatic from wound, and then improve product yield.
The making technology of In-Cell touch panel is complicated and yields is lower, includes array in In-Cell touch panel
Substrate, the grid line and data line of the ground configuration definition pixel region that intersects in array substrate, configures in each pixel region
Pixel electrode and thin film transistor (TFT).Traditional array substrate manufactures the Electro-static Driven Comb ring design method using thin film transistor (TFT) to reach
To the effect destaticed, this neutralizing method must be just able to achieve after thin film transistor (TFT) forms completely, and in film crystal
Electrostatic cannot be still removed in the formation process of pipe, leads in the processing procedure on substrate that charge is accumulative, be wound, reduced with other layer of electrostatic
The yields of processing procedure.
Summary of the invention
In order to solve the problems, such as the electrostatic hazard in array substrate thin film transistor (TFT) formation process, the present invention proposes a kind of array
Substrate.
Array substrate proposed by the present invention, be disposed with glass substrate, grid line layer, the first insulating layer, data line layer,
Second insulating layer, third insulating layer, third metal layer.
The array substrate includes that pixel region, peripheral region and the GND metal along the setting of array substrate peripheral edge are walked
Line, wherein the peripheral region includes the region between the outer edge of the pixel region and GND metal routing.
It is provided with multiple data lines in the data line layer, every data line both passes through the pixel region, and every
The both ends of the data line are respectively positioned in the peripheral region, and in the peripheral region, two adjacent data lines are logical
It crosses the first metal contact wires to be connected, first metal contact wires are set in the data line layer.
Since adjacent data line is connected by the first metal contact wires, so that all data lines are linked as a metal mesh,
When there is electrostatic generation in processing procedure, electrostatic can prevent electrostatic charge is accumulative from causing by the data wire metal net quick release
Harm.
As a further refinement of the present invention, in the peripheral region, two data lines on the outermost side
Two ends pass through the second metal contact wires respectively and be connected with GND metal routing, second metal contact wires are set to institute
It states in data line layer.
Data wire metal net is further connected with GND metal routing, the online electrostatic of data wire metal can be passed through GND
Metal routing is discharged into the earth, eliminates electrostatic hazard
In one embodiment, second metal contact wires be separately connected two datas line on the outermost side and with institute
Data line GND metal routing line segment relatively disposed in parallel is stated, this structure can guarantee that the second metal contact wires linearly connect
It connects, avoids electrostatic charge and accumulated in corner, so that electrostatic charge flows to the earth quickly through GND metal routing.
Due to when liquid crystal display panel is normally shown, between data line cannot short circuit, data line can not be with GND metal routing
Short circuit, so in array substrate processing procedure, when making second insulating layer, first metal contact wires top, described the
The first cylindrical hole is provided with above two metal contact wires, when making third insulating layer, in the upper of first cylindrical hole
Side is provided with the second cylindrical hole, the center overlapping of axles of the central axis of first cylindrical hole and second cylindrical hole, and described
The aperture of second cylindrical hole is equal to the aperture of the first cylindrical hole.Herein, it is desirable that the central axis of the second cylindrical hole and the first cylinder
The aperture that the center overlapping of axles in hole and the aperture of the second cylindrical hole are equal to the first cylindrical hole can be square when making third metal layer
Just third metal layer is made to connect with the first metal contact wires or the second metal contact wires.
As a further refinement of the present invention, the aperture of the first cylindrical hole or the aperture of the second cylindrical hole are greater than described the
The trace width of one metal contact wires, and the aperture of the first cylindrical hole or the aperture of the second cylindrical hole are greater than second metal
The trace width of connecting line.
When making third metal layer, third metal layer is connect by the second cylindrical hole and the first cylindrical hole with the first metal
Line or the second metal contact wires connect, then by etching technique that the metal at the second cylindrical hole and below the second cylindrical hole is complete
It etches away entirely, until the first metal contact wires, the second metal contact wires are fully disconnected, to guarantee the normal aobvious of liquid crystal display panel
Show.
The invention also provides a kind of display device, which includes above-described array substrate.
Array substrate proposed by the present invention, in the processing procedure of array substrate, the electrostatic that pixel region is formed can pass through connection
It is quickly spread for the data line of metal mesh, prevents electrostatic charge accumulative, the electrostatic charge spread apart is further by outside array substrate
The GND metal routing of edge flows to the earth, eliminates the electrostatic in array substrate processing procedure, improves the good of product to a certain extent
Rate, due to when liquid crystal display panel is normally shown, between data line cannot short circuit, data line can not with GND metal routing short circuit,
So in the follow-up process of array substrate processing procedure, using etching technique by between data line metal contact wires, data line with
Metal contact wires between GND metal routing are fully disconnected, and ensure that the normal display of liquid crystal display panel.
Detailed description of the invention
The invention will be described in more detail below based on embodiments and refering to the accompanying drawings.Wherein:
Fig. 1 is the section partial schematic diagram of array substrate in the present invention (before production third layer metal)；
Fig. 2 is the section partial schematic diagram of array substrate in the present invention (before third layer metal etch)；
Fig. 3 is the section partial schematic diagram of array substrate in the present invention (after third layer metal etch)；
Fig. 4 is schematic top plan view (the main display production third layer gold that array substrate is observed along normal direction in the present invention
Belong to previous gate line layer, data line layer, the connection schematic diagram of GND metal routing)；
Fig. 5 is schematic top plan view (the main display third layer metal erosion that array substrate is observed along normal direction in the present invention
Carve post tensioned unbonded prestressed concrete line layer, data line layer, the connection schematic diagram of GND metal routing)；
In the accompanying drawings, identical component uses identical appended drawing reference.Attached drawing is not according to actual ratio.
Specific embodiment
Carry out the specific embodiment that the present invention will be described in detail below in conjunction with accompanying drawings and embodiments.
Depending on upper and lower, left and right hereinafter, top, lower part, left part, right part are both with respect to figure direction, it should not constitute
Limitation of the present invention.
Fig. 1 shows partial cutaway schematic of the array substrate of the present invention before making third layer metal, from bottom to top according to
Secondary includes glass substrate 1, grid line layer 2, the first insulating layer 3, data line layer 4, second insulating layer 5, third insulating layer 6, wherein
Include several data lines 40 and data line on the outermost side 401 and data line 402 in data line layer 4, is wrapped in grid line layer 2
Containing several grid lines 20 and data line on the outermost side 201 and data line 202.Normal direction along array substrate is observed,
Such as the schematic diagram that Fig. 4 is the direction, Fig. 4 mainly shows production third layer metal previous gate line layer, data line layer, GND metal
The connection schematic diagram of cabling, the array substrate include pixel region 4020, peripheral region 4008 and along array substrate peripheral edge
The GND metal routing of setting, in Fig. 4, GND metal routing includes line segment 8, line segment 81 and line segment 82, pixel region 4020 by
Outermost data line 401, outermost data line 402, outermost grid line 201, outermost grid line 202 are surrounded
It forms, peripheral region 4008 includes the region between 4020 outer edge of pixel region and GND metal routing.Every data line 40 is
Across pixel region 4020, the both ends of data line 40 are located at the upper area and lower area of peripheral region 4008.
In peripheral region 4008, two adjacent data lines are connected by the first metal routing 411, it is preferable that
The upper area and lower area of peripheral region 4008 are provided with the first metal routing 411, it is preferable that the first metal routing
411 are set in data line layer 4, so that the top and bottom per two adjacent data lines pass through the first metal routing 411
It is connected, forms a data line metal mesh, the electrostatic generated in array substrate processing procedure can be fast by the data wire metal net
Speed diffusion prevents electrostatic charge is accumulative from causing damages.
In this embodiment, it is preferred that the top and bottom of data line 401 on the outermost side and data line 402 are distinguished
It is connected by the second metal routing 412 with GND metal routing, second metal routing 412 in left side preferably connects data line
401 and it is relatively parallel with data line 401 and close to data line 401 GND metal routing line segment 81, second metal routing on right side
412 preferably connect data line 402 and GND metal routing line segment relatively parallel with data line 402 and close to data line 402
82, preferably linearly connection, the second metal routing 412 are preferably located in data line layer 4 the second metal routing 412.It is this
Set-up mode can be such that the electrostatic on data line walks by GND metal so that data wire metal net is connected with GND metal routing
Line flow direction the earth, to eliminate the electrostatic generated in array substrate processing procedure.
Due to when liquid crystal display panel is normally shown, between data line cannot short circuit, data line can not be with GND metal routing
Short circuit such as Fig. 1, after the data line layer that completes 4, makes second insulating layer 5, is making so in the processing procedure of array substrate
After second insulating layer 5, pass through etching skill in the surface of the first metal routing 411 and the surface of the second metal routing 412
Art etches the first cylindrical hole 51, then make third insulating layer 6, again by etching technique the first cylindrical hole 51 just on
Side etches the second cylindrical hole 61 identical with 51 aperture of the first cylindrical hole, it is preferable that the central axis of the second cylindrical hole 61 and the
The center overlapping of axles of one cylindrical hole 51.Then third metal layer 7 is made, third metal layer 7 passes through the second cylindrical hole 61, first circle
Post holes 51 connects with the first metal routing 411 or the second metal routing 412 respectively, as shown in Fig. 2, in actual production technique,
For the needs of technique and the spreadability of raising third metal layer 7, the first cylindrical hole 51, the second cylindrical hole 61 are made into successively
The bellmouth being gradually increased from bottom to top stacked, is advantageous for third metal layer completely for the first cylindrical hole 51 and second in this way
Cylindrical hole 61 is completely covered, and then by etching technique, metal at the second cylindrical hole 61 and below is fully etched, such as
Shown in Fig. 3, to completely disconnect the first metal routing 411, while the second metal routing 412 being disconnected completely, so that adjacent
Data line disconnect, data line 401 and GND metal routing line segment 81 disconnects, data line 402 and GND metal routing
Line segment 82 disconnects, and obtains effect as shown in Figure 5, ensures that the normal display of liquid crystal display panel in this way.
Display device proposed by the present invention, including array substrate proposed by the present invention.
Finally, it is stated that the above examples are only used to illustrate the technical scheme of the present invention rather than limit, although referring to compared with
Good embodiment describes the invention in detail, those skilled in the art should understand that, it can be to skill of the invention
Art scheme is modified or replaced equivalently, and without departing from the objective and range of technical solution of the present invention, should all be covered at this
In the scope of the claims of invention.
Claims (3)
1. a kind of array substrate is disposed with glass substrate, grid line layer, the first insulating layer, data line layer, the second insulation
Layer, third insulating layer, third metal layer,
The array substrate include pixel region, peripheral region and along array substrate peripheral edge setting GND metal routing,
In,
The peripheral region includes the region between the outer edge of pixel region and GND metal routing,
Multiple data lines are provided in the data line layer, every data line both passes through the pixel region, described in every
The both ends of data line are respectively positioned in the peripheral region,
In the peripheral region, two adjacent data lines are connected by the first metal contact wires, on the outermost side
Two ends of two data lines pass through the second metal contact wires respectively and are connected with GND metal routing, first metal
Connecting line and second metal contact wires are all set in the data line layer；Wherein,
In array substrate processing procedure, when making second insulating layer, surface, second gold medal in first metal contact wires
Belong to connecting line right above be provided with the first cylindrical hole, when making third insulating layer, first cylindrical hole just on
Side is provided with the second cylindrical hole, the center overlapping of axles of the central axis of second cylindrical hole and first cylindrical hole, and described the
The aperture of two cylindrical holes is equal with the aperture of first cylindrical hole；The aperture of first cylindrical hole or second cylindrical hole
Aperture be greater than the trace widths of first metal contact wires, the aperture of first cylindrical hole or second cylindrical hole
Aperture is greater than the trace width of second metal contact wires；
When making third metal layer, third metal layer by the second cylindrical hole and the first cylindrical hole and the first metal contact wires or
Second metal contact wires connect, then by etching technique that the metal at the second cylindrical hole and below second cylindrical hole is complete
It etches away entirely, until the first metal contact wires, the second metal contact wires are fully disconnected.
2. array substrate according to claim 1, which is characterized in that second metal contact wires connect the data line
The opposite GND metal routing line segment disposed in parallel with the data line.
3. a kind of display device, which is characterized in that include array substrate of any of claims 1 or 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611158777.6A CN106653746B (en) | 2016-12-15 | 2016-12-15 | A kind of array substrate and display device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611158777.6A CN106653746B (en) | 2016-12-15 | 2016-12-15 | A kind of array substrate and display device |
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| CN106653746A CN106653746A (en) | 2017-05-10 |
| CN106653746B true CN106653746B (en) | 2019-09-06 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107275328B (en) * | 2017-07-25 | 2020-07-31 | 武汉华星光电技术有限公司 | Array substrate and display device |
| CN108508664B (en) * | 2018-03-28 | 2020-10-30 | 深圳市华星光电技术有限公司 | Manufacturing method of array substrate |
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|---|---|---|---|---|
| CN104297967A (en) * | 2014-10-16 | 2015-01-21 | 昆山龙腾光电有限公司 | Arrayed mother substrate and heating device thereof |
| CN104900589A (en) * | 2015-06-16 | 2015-09-09 | 京东方科技集团股份有限公司 | Array substrate, manufacturing method thereof, and display device |
| CN104965369A (en) * | 2015-07-28 | 2015-10-07 | 深圳市华星光电技术有限公司 | Array substrate, display panel and display device |
| CN105097847A (en) * | 2015-09-15 | 2015-11-25 | 京东方科技集团股份有限公司 | Array substrate, display panel and display device |
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2016
- 2016-12-15 CN CN201611158777.6A patent/CN106653746B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104297967A (en) * | 2014-10-16 | 2015-01-21 | 昆山龙腾光电有限公司 | Arrayed mother substrate and heating device thereof |
| CN104900589A (en) * | 2015-06-16 | 2015-09-09 | 京东方科技集团股份有限公司 | Array substrate, manufacturing method thereof, and display device |
| CN104965369A (en) * | 2015-07-28 | 2015-10-07 | 深圳市华星光电技术有限公司 | Array substrate, display panel and display device |
| CN105097847A (en) * | 2015-09-15 | 2015-11-25 | 京东方科技集团股份有限公司 | Array substrate, display panel and display device |
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