CN106653363A - Capacitor and manufacturing method of the same - Google Patents
Capacitor and manufacturing method of the same Download PDFInfo
- Publication number
- CN106653363A CN106653363A CN201610921161.3A CN201610921161A CN106653363A CN 106653363 A CN106653363 A CN 106653363A CN 201610921161 A CN201610921161 A CN 201610921161A CN 106653363 A CN106653363 A CN 106653363A
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- electrode
- main body
- external electrode
- auxiliary outer
- external
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- 239000003990 capacitor Substances 0.000 title claims abstract description 126
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 238000000576 coating method Methods 0.000 claims description 39
- 239000011248 coating agent Substances 0.000 claims description 38
- 238000000034 method Methods 0.000 claims description 37
- 229910052751 metal Inorganic materials 0.000 claims description 29
- 239000002184 metal Substances 0.000 claims description 29
- 239000010949 copper Substances 0.000 claims description 14
- 239000006071 cream Substances 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 230000005611 electricity Effects 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 238000005266 casting Methods 0.000 claims 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 18
- 239000010410 layer Substances 0.000 description 18
- 230000032798 delamination Effects 0.000 description 9
- 239000000976 ink Substances 0.000 description 7
- 239000011521 glass Substances 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 239000003985 ceramic capacitor Substances 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910002113 barium titanate Inorganic materials 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 238000001802 infusion Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000013528 metallic particle Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000002105 nanoparticle Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910002370 SrTiO3 Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000002003 electrode paste Substances 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052809 inorganic oxide Inorganic materials 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910001338 liquidmetal Inorganic materials 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000005289 physical deposition Methods 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Abstract
The present invention discloses a capacitor and a method of manufacturing the capacitor, the capacitor comprising a main body, a first external electrode and a second external electrode, and a first auxiliary external electrode and a second auxiliary external electrode. Wherein the main body includes a first inner electrode and a second inner electrode respectively having a first lead portion and a second lead portion exposed to one surface of the main body. The first external electrode and the second external electrode are provided on the one surface of the main body and are electrically connected to the first internal electrode and the second internal electrode, respectively. The first auxiliary external electrode and the second auxiliary external electrode are electrically connected to the first external electrode and the second external electrode, respectively, and cover a part of the surface of the main body connected to the one surface of the main body.
Description
This application claims the 10-2015-0151068 submitted in Korean Intellectual Property Office on October 29th, 2015 and in
The priority of the 10-2016-0021731 korean patent applications submitted in Korean Intellectual Property Office on 2 24th, 2016
Rights and interests, the disclosure of the korean patent application is all incorporated herein by quoting.
Technical field
It relates to a kind of capacitor and the method for manufacturing the capacitor.
Background technology
According to the improvement of the performance of miniaturization information technology (IT) product, increase to providing the same of ultra-high capacity
When have little size product demand.Therefore, in existing multilayer ceramic capacitor (MLCC), by external electrode shape
Into bottom land ceramic capacitor (bottom land ceramic capacitor, BLCC) on a mounting surface as new
Capacitor is studied.External electrode formed on a mounting surface, so as to can increase interior electrode provided electric capacity region with
And capacitor size in the longitudinal direction.As a result, the overlapping region increase between interior electrode so that resulting capacitor
Electric capacity can significantly increase compared with the electric capacity of the common capacitor with same size.Additionally, capacitor specific characteristics aspect
Other improvement can ensure that the reduction of noise, buckling strength etc..
However, BLCC can be restricted because external electrode is made only in the installation surface of hexahedron main body.Specifically,
Because capacitor only should be loaded when loading on the direction of the installation surface for being formed thereon external electrode, therefore product
The convenience that machinability and consumer use can be lowered.Additionally, compared with the MLCC according to prior art, bonding area subtracts
It is little so that capacitor and to make the bond strength between capacitor circuit board mounted thereto can be weakened.
Accordingly, it would be desirable to developing the capacitor and capacitor of production operation can be promoted and to make capacitor mounted thereto
The structure of the bond strength between circuit board.
The content of the invention
Exemplary embodiment in the disclosure can provide a kind of capacitor, and the capacitor includes being formed in the side table of main body
Auxiliary outer electrode on face so that the bond strength when capacitor is installed on circuit board between capacitor and circuit board can
Improved, and the outward appearance of main body can be protected due to closing the effect of the side surface of main body.A kind of manufacture institute is also provided
The method for stating capacitor.
According to exemplary embodiment, a kind of capacitor may include main body, the first external electrode and the second external electrode and first
Auxiliary outer electrode and the second auxiliary outer electrode.The main body include be respectively provided with the lower surface for being exposed to main body the first leading part and
Electrode and the second inner electrode in the first of second leading part.The first external electrode and the second external electrode are arranged on the lower surface of main body
And it is electrically connected respectively to electrode and the second inner electrode in first.First auxiliary outer electrode and the second auxiliary outer electrode are electrically connected
To the first external electrode and the second external electrode, and it is separately positioned on the part of two side surfaces of main body.Electricity can significantly be increased
The electric capacity of container simultaneously can improve the bond strength between capacitor and circuit board.
According to exemplary embodiment, a kind of capacitor includes：Electrode and the second inner electrode, described in main body, including first
Electrode has first leading part on a surface for being exposed to main body in first, and the second inner electrode is by the electricity in first
Electrode is alternately stacked and with a table for being exposed to main body in each dielectric layer and first between pole and the second inner electrode
Second leading part in face；The first external electrode and the second external electrode, are arranged on one surface of main body and are electrically connected
Electrode and the second inner electrode in first；First auxiliary outer electrode and the second auxiliary outer electrode, are electrically connected respectively to the first dispatch from foreign news agency
Pole and the second external electrode, and cover the part on the surface on the one surface for being connected to main body of main body.
According to exemplary embodiment, a kind of capacitor includes：Main body, with upper surface, lower surface and by upper surface and
The side surface that lower surface is connected to each other, and including having the of the first leading part and the second leading part for being exposed to lower surface respectively
Electrode and the second inner electrode in one；The first external electrode and the second external electrode, are arranged on the lower surface of main body, and are electrically connected
Second leading part of the first leading part of electrode and the second inner electrode in first；First auxiliary outer electrode and the second auxiliary dispatch from foreign news agency
Pole, is electrically connected respectively to the first external electrode and the second external electrode, and is separately positioned on the part of two side surfaces of main body.
According to exemplary embodiment, a kind of method of manufacture capacitor includes：Stacking is formed with the dielectric of interior electrode pattern
Layer, to form the laminate of the interior electrode pattern with a surface for being exposed to laminate；External electrode cream pattern is applied to
One surface of laminate；Laminate and external electrode cream pattern are fired, to obtain the main body for being formed with external electrode；Form electricity
It is connected to external electrode and covers the auxiliary outer electrode of the part on a surface for being connected to main body on the surface of main body.
According to exemplary embodiment, a kind of capacitor includes：Electrode and the second inner electrode in main body, including first, first
Interior electrode and the second inner electrode are alternately stacked, with the dielectric layer in first between electrode and the second inner electrode, wherein
Each in first in electrode and the second inner electrode extends to the same outer surface of only one of main body；Outside the first external electrode and second
Electrode, is arranged on the described same outer surface of main body, and is connected respectively to electrode and the second inner electrode in first；First is auxiliary
Help external electrode and the second auxiliary outer electrode, be connected to the first external electrode and the second external electrode, and be arranged on main body except main body
Described same outer surface outside each different surfaces on.
According to exemplary embodiment, a kind of component includes：Circuit board, with arranging the first contact on circuit boards and the
Two contacts；Capacitor, is attached to the first contact and the second contact；Wherein, the capacitor includes：Main body, including being stacked on master
Electrode and the second inner electrode in body first, wherein, electrode and the second inner electrode extend to the same appearance of main body in first
Face, the first external electrode and the second external electrode, are arranged on the described same outer surface of main body, and are connected respectively to electrode in first
And the second inner electrode, the first auxiliary outer electrode and the second auxiliary outer electrode, it is arranged on the different outer surface of main body, and respectively
The first external electrode and the second external electrode, the first coating and the second coating are connected to, the first auxiliary outer electrode and is separately positioned on
On two auxiliary outer electrodes, and it is respectively incorporated to first contact and the second contact of circuit board.
Description of the drawings
By the detailed description for carrying out below in conjunction with the accompanying drawings, it will be more clearly understood that the above and other side of the disclosure
Face, feature and advantage, in the accompanying drawings：
Fig. 1 is the perspective view for schematically showing the capacitor according to exemplary embodiment；
Fig. 2 and Fig. 3 are respectively the exploded views and perspective view for schematically showing the main body according to exemplary embodiment；
Fig. 4 is the sectional view for schematically showing the capacitor according to exemplary embodiment；
Fig. 5 A to Fig. 5 D, Fig. 6 A and Fig. 6 B are the amplifications of the part A for schematically showing the Fig. 4 in various illustrative embodiments
Figure.
Fig. 7 is the sectional view for schematically showing the capacitor according to another exemplary embodiment；
Fig. 8 A to Fig. 8 D are the enlarged drawings of the part B for schematically showing the Fig. 7 in various illustrative embodiments；
Fig. 9 is the sectional view for schematically showing the capacitor according to another exemplary embodiment；
Figure 10 A to Figure 10 D are the enlarged drawings of the C portion for schematically showing the Fig. 9 in various illustrative embodiments；
Figure 11 is the sectional view for schematically showing the capacitor according to another exemplary embodiment；
Figure 12 A to Figure 12 D are the enlarged drawings of the D parts for schematically showing the Figure 11 in various illustrative embodiments；
Figure 13 A to Figure 13 C are the sequential steps of the method for schematically showing the manufacture capacitor according to exemplary embodiment
Figure；
Figure 14 is to schematically show wherein to install the saturating of component on circuit boards according to the capacitor of exemplary embodiment
View.
Specific embodiment
Hereinafter, the exemplary embodiment of the disclosure is described in detail with reference to the accompanying drawings.Specifically, description basis is shown
The capacitor of example property embodiment.
Fig. 1 is the perspective view for schematically showing the capacitor according to exemplary embodiment；Fig. 2 and Fig. 3 are respectively schematic
The exploded view and perspective view of main body according to exemplary embodiment are shown；Fig. 4 is schematically shown according to exemplary embodiment
The sectional view of capacitor.
Referring to figs. 1 to Fig. 3, main body 110 may include according to the capacitor 100 of exemplary embodiment, main body 110 includes：The
Electrode 120 in one, the first leading part 124 with a surface 6 for being exposed to main body；The second inner electrode 130, and electricity in first
Pole 120 is alternately stacked with intervenient each dielectric layer 111 and dielectric layer 112, and with being exposed to a table of main body
Second leading part 134 in face 6.The first external electrode 141 and the second external electrode 143 are formed on a surface 6 of main body 110, and
It is electrically connected respectively to electrode 120 and the second inner electrode 130 in first.153 points of first auxiliary outer electrode 151 and the second auxiliary electrode
The first external electrode 141 and the second external electrode 143 are not electrically connected to, and cover a surface for being connected to main body 110 of main body 110
The part on 6 surface 1, surface 2, surface 3 and surface 4.
Main body 110 can have a surface 6 and one surface back to another surface 5 of (or back to arrange) and
One surface 6 and another surface 5 are connected into mutual side surface 1, side surface 2, side surface 3 and side surface 4.That is,
Main body can have to be included along the stacking direction (width (W) direction) of main body 110 first surface 1 away form one another and second surface
2, along length (L) direction the 3rd surface 3 away form one another and the 4th surface 4 and away form one another along thickness (T) direction
5th surface 5 and the hexahedral shape on the 6th surface 6, but not limited to this.
In the illustrative embodiment illustrated in Fig. 1 to Fig. 3, the 6th surface 6 of main body and the 5th surface 5 respectively with main body
One surface it is corresponding with another surface.
Main body 110 can have upper surface 5, lower surface 6 and upper surface 5 and lower surface 6 are connected into (or each leisure each other
Between upper surface 5 and lower surface 6 extend) side (or outside) surface 1 to side (or outside) surface 4.Main body 110 may include each
Electrode 120 and second in the first of the first leading part 124 with the lower surface 6 for extending to main body 110 and the second leading part 134
Interior electrode 130, the lower surface 6 of main body 110 may correspond to a surface 6 of main body 110.That is, described the one of main body 110
Individual surface can be the lower surface of main body 110 and/or the 6th surface, it is possible to be to be configured to be arranged on the installing zone of circuit board
The installation surface in domain.
Can pass through stacking have respectively be disposed thereon each in first electrode 120 and the second inner electrode 130 it is multiple
Dielectric layer 111 and dielectric layer 112 form main body 110.
The multiple dielectric layers for constituting main body 110 can be sintered state, and adjacent dielectric layer can be bonded to each other so as to them
Between border be not easy for naked eyes obviously.
Ceramic green sheet of the sintering comprising ceramic powder particle, organic solvent and organic bond can be passed through and form dielectric layer.
The ceramic powders of high dielectric constant material may include perovskite material.Perovskite material can be barium titanate (BaTiO3) sill
Or strontium titanates (SrTiO3) sill etc., but not limited to this.
Electrode 120 and interior electrode 130 in being formed in main body 110.Interior electrode may include respectively have the first polarity and
Second polarity and be arranged in pairs first in electrode 120 and the second inner electrode 130.Electrode 120 and the second inner electrode 130 in first
Can be stacked as facing each other by each dielectric layer between electrode in first 120 and the second inner electrode 130.
Electrode 120 and the second inner electrode 130 in first, wherein main body can be set perpendicular to one surface of main body
One surface is used as the installation surface of capacitor.
Electrode 120 and the second inner electrode 130 can be formed by the conductive paste pattern comprising metal in first.The metal can be with
It is nickel (Ni), copper (Cu), palladium (Pd) or their alloy, but not limited to this.
Can by the print process of such as silk screen print method or woodburytype using conductive paste pattern by electrode in first and
The second inner electrode is printed on the ceramic green sheet for constituting dielectric layer.
The ceramic green sheet for being printed with electrode and the second inner electrode in first thereon is alternately stacked and sintered to form master
Body.
In the disclosure, the first polarity and the second polarity refer to different polarity.
Electrode 120 and the second inner electrode 130 can include respectively being exposed to the first of one surface of main body in first
The leading part 134 of leading part 124 and second.
Following structure is had according to the capacitor of prior art：Electrode and the second inner electrode are exposed to making for main body in first
One surface of main body and main body with one surface back to each side surface for being connected of another surface.Compare it
Under, according to the capacitor of the disclosure there is electrode and the second inner electrode in first to be all exposed to the knot on a surface of main body
Structure.Due to structure described above, compared with the capacitor according to prior art, it is possible to increase corresponding with the region for providing capacitance part
Adjacent first in overlapping region between electrode 120 and the second inner electrode 130.As a result, being capable of achieving than according to existing
The high capacitance level of the capacitance level (level of capacitance) of the capacitor of technology.
Can be vertical stacking type capacitor according to the capacitor of exemplary embodiment.
What the first leading part 124 and the second leading part 134 referred to electrode and the second inner electrode in first is exposed to main body
A surface region.Increase can be passed through and form the interior electrode pattern of electrode and the second inner electrode in first in thickness direction (T
Direction) on length forming the first leading part 124 and the second leading part 134.
Electrode 120 and the second inner electrode 130 can form electricity by the region 122 that overlaps each other and region 132 in first
Hold.Generally, it is connected to first leading part 124 and of the first external electrode 141 with different polarity and the second external electrode 143
Two leading parts 134 do not have the region for overlapping each other.
It is insulated from each other because the first leading part 124 and the second leading part 134 do not overlap each other, therefore they will not lead
Cause to increase such as because the interior electrode faced each other when cutting is for the laminate for manufacturing main body receives the phenomenon of cutting stress extruding
And the generation of the short-circuit defect between caused interior electrode.
With reference to Fig. 3, it is to be appreciated that, the first leading part 124 and the second leading part 134 are alternately exposed to main body 110
One surface, i.e. the lower surface of main body 110.
Additionally, the first leading part 124 and the second leading part 134 can be separately pre- with the edge on a surface of main body 110
Set a distance.
With reference to Fig. 4, may include according to the capacitor of exemplary embodiment：The first external electrode 141, is connected to electrode in first
A surface 6 for being exposed to main body 110 the first leading part 124；The second external electrode 143, is connected to the sudden and violent of the second inner electrode
Reveal second leading part 134 on a surface 6 of main body 110.That is, the first external electrode 141 and the second external electrode 143 can
It is formed on a surface 6 of main body 110, i.e. the lower surface of main body.
The first external electrode 141 and the second external electrode 143 may be formed at and separate 10 μm extremely with the edge on a surface 6 of main body
50 μm of position, and the distance between the first external electrode 141 and the second external electrode 143 can be 30 μm to 40 μm.
When the distance between the first external electrode 141 and the second external electrode 143 are 30 μm to 40 μm, the first dispatch from foreign news agency can be prevented
Short circuit between pole 141 and the second external electrode 143.
The first external electrode 141 and the second external electrode 143 can include metal.
The metal can be nickel (Ni), copper (Cu), tin (Sn) or their alloy.
The first external electrode 141 and the second external electrode 143 may also include insulating materials.The insulating materials can be such as glass
Glass.
The first external electrode 141 and the second external electrode 143 may be formed on a surface 6 of main body 110 to be connected respectively to
First leading part 124 and the second leading part 134.
In the case where the first external electrode 141 and the second external electrode 143 are made only on a surface 6 of main body 110, can
Reduce the part that fillet of solder (solder fillets) is projected from main body 110, and the size of chip can increase corresponding to reduction
Ledge region.As a result, the electric capacity of capacitor can significantly be increased under identical size.However, first
In the case that external electrode 141 and the second external electrode 143 are made only on a surface 6 of main body, the first external electrode 141 can be reduced
The region of the fillet of solder of the contact with the second external electrode 143 so that the bond strength between capacitor and circuit board can be weakened.
Fig. 5 A to Fig. 5 D, Fig. 6 A and Fig. 6 B are the enlarged drawings of the part A for schematically showing Fig. 4.
With reference to Fig. 4, Fig. 5 A to Fig. 5 D, Fig. 6 A and Fig. 6 B, may include to be electrically connected respectively according to the capacitor of exemplary embodiment
It is connected to the first external electrode 141 and the second external electrode 143 and covers the surface 1 being connected with a surface 6 of main body of main body to table
First auxiliary outer electrode 151 and the second auxiliary outer electrode 153 of the part in face 4.
First auxiliary outer electrode 151 and the second auxiliary outer electrode 153 are formed as covering main body and are formed with first thereon
The part on a surface 6 and the connection of main body of external electrode 141 and the second external electrode 143 connect with a surface 6 of main body
The part on surface 1 to the surface 4 for connecing.
First auxiliary outer electrode 151 and the second auxiliary outer electrode 153 can respectively from the first external electrode 141 and the second external electrode
143 to surface 1 to the surface 5 for not forming the first external electrode and the second external electrode thereon of main body extends.
First auxiliary outer electrode 151 and the second auxiliary outer electrode 153 may be formed on surface 1 to the surface 6 of main body and
On the surface of external electrode 141 and 143.
First auxiliary outer electrode 151 and the second auxiliary outer electrode 153 are different from the first external electrode 141 and external electrode 143, with
It is different with the external electrode of glass comprising conducting metal, can be formed by metal.For example, in some instances, the first auxiliary outer electrode
151 and second auxiliary outer electrode 153 include the metals different from the metal for forming the first external electrode 141 and the second external electrode 143.
The metal can be nickel (Ni), copper (Cu), tin (Sn) or their alloy.
In the case where the metal of the first auxiliary outer electrode 151 and the second auxiliary outer electrode 153 is copper (Cu), copper is used for
The gold (Au) of precious metal and silver-colored (Ag) etc. are cheap, and with the electric conductivity higher than the electric conductivity of golden (Au) and silver-colored (Ag) etc..Cause
This, it is possible to decrease the cost needed for the first auxiliary outer electrode 151 of manufacture and the second auxiliary outer electrode 153, and the first auxiliary can be improved
The auxiliary outer electrode 153 of external electrode 151 and second and the electrical connection between the first external electrode 141 and the second external electrode 143.
First auxiliary outer electrode 151 can make one surface and the master of main body 110 from the first external electrode 141 to main body
Described another surface of body 110 is connected to mutual surface and (for example, 3) extends.
First auxiliary outer electrode 151 and the second auxiliary outer electrode 153 may extend away to cover a table for making main body of main body
Another surface 5 of face 6 and main body is connected to mutual surface 3 and surface 4, and covers the part on another surface 5 of main body.
That is, with the electrode including external electrode 141 and 143 and the double-layer structure of auxiliary outer electrode 151 and 153
May be formed on a surface 6 of main body, the electrode with the single layer structure including auxiliary outer electrode 151 and 153 may be formed at
On surface 1 to the surface 4 being connected with a surface 6 of main body of main body.
Capacitor includes the first auxiliary outer electrode 151 and the second auxiliary outer electrode 153, so as to increase in main body 110
The region of conductive material is formed on surface.Therefore, coating can be readily formed so that the electric capacity of capacitor can significantly increase simultaneously
The bond strength between capacitor and circuit board can be improved.Additionally, can improve when capacitor is loaded that processing for work is loaded
Property and easiness, and the outward appearance of capacitor can be protected because of the effect on the surface of sealed body 110.
First auxiliary outer electrode 151 and the second auxiliary outer electrode 153 are with the first external electrode 141 and the second external electrode 143 not
Together, it is different from the external electrode comprising conducting metal and glass, can be formed by metal.For example, in some instances, the first auxiliary is outer
The auxiliary outer electrode 153 of electrode 151 and second includes different from the metal for forming the first external electrode 141 and the second external electrode 143
Metal.The metal can be nickel (Ni), copper (Cu), tin (Sn) or their alloy.
First auxiliary outer electrode 151 and the second auxiliary outer electrode 153 can be used as forming the Seed Layer of coating.Therefore,
Coating may be formed on the first external electrode 141 and the second external electrode 143 and the first auxiliary outer electrode 151 and the second auxiliary dispatch from foreign news agency
On pole 153.
That is, coating may be formed on the surface of main body and the first external electrode 141 and the second external electrode 143 on,
To increase the region of the fillet of solder of the contact with the second external electrode 143 of the first external electrode 141 when capacitor is installed, so as to can
Improve the bond strength between capacitor and circuit board.
The first external electrode 141 and the second external electrode 143 being formed on a surface 6 of main body 110 can be actually used as electricity
The electrode of outside is connected to, the first auxiliary outer electrode 151 and the second auxiliary outer electrode 153 can be formed with minimum thickness, with
When capacitor is installed on circuit boards for improving the bond strength between capacitor and circuit board.
Although the first auxiliary outer electrode 151 and the second auxiliary outer electrode 153 are not directly connected to interior electrode 120 and 130,
Electrode 120 and the second inner electrode 130 in first can be connected indirectly to by the first external electrode 141 or the second external electrode 143.
The thickness of the first auxiliary outer electrode 151 and the second auxiliary outer electrode 153 be formed in the first auxiliary outer electrode 151 and
The summation of the thickness (not shown) of the coating on the second auxiliary outer electrode 153 can be the first external electrode 141 and the second external electrode
The 10% to 60% of 143 thickness.
The thickness (except coating) of the first auxiliary outer electrode 151 and the second auxiliary outer electrode 153 can be 0.05 μm to 10 μ
m.The first auxiliary outer electrode 151 as the Seed Layer for being used to form coating and the second auxiliary outer electrode 153 can be with minimums
Thickness is formed.
Coating is formed as covering the part of the first external electrode 141 and the second external electrode 143 and main body.As a result,
The electric capacity of achievable capacitor simultaneously can increase the bond strength between capacitor and circuit board so that can reduce noise.
Further, since coating is formed in main body 110 by the first auxiliary outer electrode 151 and the second auxiliary outer electrode 153
In a part, therefore the outward appearance of main body can be protected.
Hereinafter, will describe outside the first auxiliary outer electrode 151 and first with reference to Fig. 4, Fig. 5 A to Fig. 5 D, Fig. 6 A and Fig. 6 B
Electrode 141.The description is not limited to the first auxiliary outer electrode 151 and the first external electrode 141, but is also applied to outside the second auxiliary
Electrode 153 and the second external electrode 143.
With reference to Fig. 4, Fig. 5 A to Fig. 5 D, Fig. 6 A and Fig. 6 B, the first external electrode 141 is formed as a table with main body 110
The edge in face 6 separates.
First auxiliary outer electrode 151 is formed as covering a part for the first external electrode 141.
Main body 110 can have a surface 6 and with a surface back to another surface 5, the first external electrode 141 can have
One side surface, another side surface and a side surface and another side surface is set to be connected to mutual lower surface.
Fig. 5 A show that the first auxiliary outer electrode 151 is formed on the lower surface of the first external electrode 141 and all side surfaces
On so that around the situation of the first external electrode 141, Fig. 5 B show that the first auxiliary outer electrode 151 is formed in the first external electrode 141
On lower surface and a side surface with encirclement the first external electrode 141 in addition to another side surface of the first external electrode 141
The situation of remaining area, Fig. 5 C show the first auxiliary outer electrode 151 from a part for the lower surface of the first external electrode 141 to master
The situation that the part on another surface 5 of body 110 extends, Fig. 5 D show the first auxiliary outer electrode 151 from the first external electrode 141
Another side surface 5 from one side surface to main body 110 a part extend situation.
The thickness being formed in the part on another surface 5 of main body 110 of the first auxiliary outer electrode 151 can be auxiliary with first
Help external electrode 151 be formed in main body 110 make the table that a surface 6 of main body and another surface 5 of main body be connected to each other
Face (for example, 3) on thickness it is identical, or than the table for making main body for being formed in main body 110 of the first auxiliary outer electrode 151
Surface that another surface 5 of face 6 and main body is connected to each other (for example, 3) on thickness of thin.
Reference picture 6A to Fig. 6 B, the first auxiliary outer electrode 151 may include to make the exposed not connected part in surface of main body (not
Illustrate).For example, Fig. 6 A show that the first auxiliary outer electrode 151 is formed on the lower surface of the first external electrode 141 and all side tables
To surround the situation of the first external electrode 141 on face, Fig. 6 B show that the first auxiliary outer electrode 151 is made only in the first external electrode
With the remaining area in addition to a side surface of the first external electrode 141 of encirclement the first external electrode 141 on 141 lower surface
Situation.
The first auxiliary outer electrode 151 as the Seed Layer for forming coating can have minimum thickness.In such case
Under (for example, illustrative to be illustrated in Fig. 6 A and Fig. 6 B), the first auxiliary outer electrode 151 may include the exposed area in surface for making main body
Domain.
When the first auxiliary outer electrode 151 is formed, not connecting for the first auxiliary outer electrode 151 can be formed after Technology for Heating Processing
Socket part point.
Because the region of not connected part becomes big, it is impossible to guarantee uniform coating.Therefore, not connected portion can be limited
The area for dividing, can ensure that in the range of uniform coating to be maintained at.
Fig. 7 is the sectional view for schematically showing the capacitor 200 according to another exemplary embodiment；Fig. 8 A to Fig. 8 D are to show
Meaning property illustrates the enlarged drawing of the part B of Fig. 7.
Fig. 7 and Fig. 8 A to Fig. 8 D will be omitted and the component phase that illustrates in Fig. 1 to Fig. 4, Fig. 5 A to Fig. 5 D, Fig. 6 A and Fig. 6 B
The description of same component.
With reference to Fig. 7 and Fig. 8 A to Fig. 8 D, the first external electrode 241 may extend into that is connected to main body 210 of main body 210
The part on the surface 3 on surface 6.In this case, the first external electrode 241 can be in two Hes of surface 3 for extending to main body 210
L-shaped on 6.Each in the first external electrode 241 and the second external electrode 242 may extend away to be arranged on having thereon for main body 210
On each different surface of first auxiliary outer electrode 251 and the second auxiliary outer electrode 253.
In this case, the first auxiliary outer electrode 251 and the second auxiliary outer electrode 253 can be from the Hes of the first external electrode 241
The second external electrode 242 extend to cover main body make that a surface 6 of main body and another surface 5 of main body be connected to each other it is whole
Surface 3 and whole surface 4, or extend to the part on another surface 5 of main body.
Outside including the first external electrode 241 and the auxiliary outer electrode 251 of the second external electrode 242 and first and the second auxiliary
The electrode of the double-layer structure of electrode 253 and with the individual layer including the first auxiliary outer electrode 251 and the second auxiliary outer electrode 253
The electrode of structure may be formed on surface 1 to the surface 4 being connected with a surface 6 of main body 210 of main body 210.
Fig. 8 A show that the first auxiliary outer electrode 251 is formed on the lower surface of the first external electrode 241 and all side surfaces
To surround the situation of the first external electrode 241, Fig. 8 B show that the first auxiliary outer electrode 251 is formed under the first external electrode 241
On surface and a side surface on surround the first external electrode 241 except the first external electrode 241 another side surface residue
The situation in region, Fig. 8 C show the first auxiliary outer electrode 251 from a part for the lower surface of the first external electrode 241 to main body
The situation that the part on 210 another surface 5 extends, Fig. 8 D illustrate the first auxiliary outer electrode 251 from the one of the first external electrode 241
The situation that individual side surface extends to the part on another surface 5 of main body 210.
Fig. 9 is the sectional view for schematically showing the capacitor 300 according to another exemplary embodiment；Figure 10 A to Figure 10 D are
Schematically show the enlarged drawing of the part C of Fig. 9.
Fig. 9 and Figure 10 A to Figure 10 D will be omitted and the component that illustrates in Fig. 1 to Fig. 4, Fig. 5 A to Fig. 5 D, Fig. 6 A and Fig. 6 B
The description of identical component.
The first external electrode 341 can form the edge on a surface of main body 310, for example, cause the first external electrode 341
One side surface is concordant (or alignment) with the side surface 3 of main body 310.
Figure 10 A show that the first auxiliary outer electrode 351 is formed on the lower surface of the first external electrode 341 and all side surfaces
To surround the situation of the first external electrode 341, Figure 10 B show that the first auxiliary outer electrode 351 is formed under the first external electrode 341
On surface and a side surface on surround the first external electrode 341 except the first external electrode 341 another side surface residue
The situation in region, Figure 10 C show the first auxiliary outer electrode 351 from a part for the lower surface of the first external electrode 341 to main body
The situation that the part on 310 another surface 5 extends, Figure 10 D illustrate the first auxiliary outer electrode 351 from the first external electrode 341
The situation that one side surface extends to the part on another surface 5 of main body 310.
That is, the first auxiliary outer electrode 351 can be with minimum thickness from a side table of the first external electrode 341
Face, lower surface and another side surface are thinly applied to the part on another surface 5 of main body 310.
The thickness being formed in the part on another surface 5 of main body 310 of the first auxiliary outer electrode 351 can be auxiliary with first
Help external electrode 351 be formed in main body 310 make the surface 3 that a surface 6 of main body and another surface 5 of main body be connected to each other
On thickness it is identical or smaller.
First auxiliary outer electrode 351 can make a surface 6 of main body 310 and master from the first external electrode 341 to main body 310
The surface 3 that another surface 5 of body 310 is connected to each other extends.
Figure 11 is the sectional view for schematically showing the capacitor 400 according to another exemplary embodiment；Figure 12 A to Figure 12 D
It is the enlarged drawing of the D parts for schematically showing the Figure 11 in various illustrative embodiments.
Figure 11 and Figure 12 A to Figure 12 D will be omitted and the group that illustrates in Fig. 1 to Fig. 4, Fig. 5 A to Fig. 5 D, Fig. 6 A and Fig. 6 B
The description of part identical component.
First auxiliary outer electrode 451 can form the edge on a surface of main body 410, for example so that the first auxiliary is outer
The upper end of electrode 451 is concordant (or alignment) with the surface 5 of main body 410.
Figure 14 is to schematically show the component that will be arranged on according to the capacitor 100 of exemplary embodiment on circuit board 180
Perspective view.
With reference to Figure 14, coating 152 and 154 may be formed at the first external electrode and the second external electrode (for example, 141 and 143) with
And first auxiliary outer electrode and the second auxiliary outer electrode (for example, 151 and 153) on.
Coating 152 and 154 can be formed in the first external electrode and the second external electrode (for example, 141 He with uniform thickness
143) and the first auxiliary outer electrode and the second auxiliary outer electrode (for example, 151 and surface 153) on.That is, coating
152 and 154 can have the form for making them extend to another surface 5 of main body 110 from a surface 6 of main body 110.Therefore,
Can protective condenser 100 outward appearance, and the bond strength between capacitor 100 and circuit board 180 can be improved.
Coating 152 and 154 can be attached to fillet of solder 160 when capacitor 100 is installed on circuit board 180.Specifically
Coating can be attached to ground, fillet of solder 160 electric contact 171 and 172 of circuit board 180.
Coating 152 and 154 can be formed by nickel (Ni), tin (Sn) or their alloy, but not limited to this.
Coating 152 and 154 can have 1 μm to 10 μm of thickness.
[table 1]
*：Comparative examples
Table 1 illustrates the thickness according to the auxiliary outer electrode in the capacitor of invention example, the uniformity of coating, auxiliary
The delamination (delamination) of external electrode, the bond strength between capacitor and circuit board and whether meet the thickness of capacitor
The characteristic evaluation of degree scope.
The uniformity of coating refers to whether the thickness of coating is uniform, and the delamination of auxiliary outer electrode refers to main body or external electrode and auxiliary
Combination degree between external electrode.In the case where auxiliary outer electrode does not have from the lower surface of external electrode to peel off, delamination is expressed as
"○", in the case that the auxiliary outer electrode in coating is peeled off from a part for the lower surface of external electrode, delamination is expressed as " △ ",
In the case where auxiliary outer electrode is peeled off from the whole lower surface of external electrode, delamination is expressed as "×".
Bond strength between capacitor and circuit board indicates whether delamination between capacitor and circuit board, if
There is the shear (shear) of main body, and whether master is produced after the time for exerting a force to capacitor and circuit board scheduled volume
The sign of the delamination between the shear of body and capacitor and circuit board.In the case where binding deficient is 0%, bond strength table
"○" is shown as, in the case where binding deficient is 5% to 15%, bond strength is expressed as " △ ", in binding deficient more than 15%
In the case of, bond strength is expressed as "×".
Auxiliary outer electrode can form the thickness of coating, and the not connected portion on the surface that may include to expose main body be enough to
Point.
However, in the area of the not connected part of auxiliary outer electrode and the ratio of the whole area of auxiliary outer electrode more than 10%
In the case of (for example, the packet 1 in table 1), the uniformity of coating can be reduced so that be cannot ensure between capacitor and circuit board
Bond strength.
Auxiliary outer electrode thickness more than 10 μm (for example, the packet 8 in table 1 and packet 9) in the case of, aid in dispatch from foreign news agency
Pole is not tightly integrated to main body and external electrode so that space can be produced between auxiliary outer electrode and main body and external electrode.Therefore,
Delamination can occur between coating and external electrode, and plating can not be performed, so as to guarantee between capacitor and circuit board
Bond strength.Further, since the increase of the thickness of auxiliary outer electrode, the thickness of capacitor can be more than the desired thickness of capacitor
Degree scope.
Therefore, auxiliary outer electrode can be formed with the minimum thickness that be enough to be formed coating, it is possible to not connect not increasing
Formed in the thickness range (0.05 μm to 10 μm) in the region of socket part point.
Hereinafter, by the method for describing the manufacture capacitor according to the disclosure.
May include according to the method for the manufacture capacitor of exemplary embodiment：Stacking is formed with thereon Jie of interior electrode pattern
Electric layer, to form the laminate with the interior electrode pattern for being exposed to one surface；External electrode cream pattern is applied into lamination
One surface of part；Laminate and external electrode cream pattern (external electrode paste patterns) are fired, to obtain
Obtain the main body for being formed with external electrode thereon；And form the surface for being electrically connected to external electrode and covering main body be connected to main body
The auxiliary outer electrode of the part on said one surface.
Multiple dielectric layers formation laminate that stacking is formed with thereon interior electrode pattern can be passed through.
Interior electrode pattern can be exposed to a surface of main body, external electrode may be formed on one surface of main body with
Just it is electrically connected to interior electrode pattern.
The main body 110 of external electrode 141 and 143 can be thereon formed with by burning process after external electrode is formed.
External electrode 141 and 143 can be formed by the way that external electrode cream pattern is applied into laminate.
External electrode cream pattern can be applied using embossing and carving clamp, or printed by wheeled devices or silk screen print method
External electrode cream pattern.
After external electrode 141 and 143 is formed, sinterable laminate and external electrode include being connected to external electrode to obtain
The main body 110 of interior electrode.
Figure 13 A to Figure 13 C are the method figures for schematically showing the manufacture capacitor according to exemplary embodiment.
Reference picture 13A, it is sinterable that external electrode cream pattern is applied into laminate thereon to be formed with dispatch from foreign news agency thereon
The main body 110 of pole 141 and 143.
External electrode cream pattern is formed as separating with the edge on a surface of laminate, can form of laminate
The edge on surface, or may extend into the surface of laminate and be connected in the part on one surface of laminate.
Next, reference picture 13B and Figure 13 C, can be formed on forming auxiliary outer electrode in the main body of external electrode, and
Coating 152 and 154 can be formed.
Different from the external electrode comprising glass, auxiliary outer electrode 151 and 153 can be formed by metal.
Auxiliary outer electrode 151 and 153 is formed as covering the part of external electrode.
Auxiliary outer electrode 151 and 153 may be formed on the surface of main body and external electrode.
When main body 110 have a surface and with one surface back to another surface when, the He of auxiliary outer electrode 151
153 can extend from external electrode 141 and 143 to another surface of main body or make the one of main body to main body from external electrode 141 and 143
The surface that another surface of individual surface and main body is connected to each other extends.
Auxiliary outer electrode 151 and 153 is not directly connected to interior electrode, but can be connected indirectly to interior electricity by external electrode
Pole.
Auxiliary outer electrode 151 and 153 can be used as forming the Seed Layer of coating 152 and 154.
Auxiliary outer electrode 151 and 153 can be formed with 0.05 μm to 10 μm of thickness (that is, minimum thickness).
Auxiliary outer electrode 151 and 153 can pass through the one or more of method shapes in wet application method and dry type cladding process
Into.
Wet application method can be infusion process, and dry type cladding process can be sputtering method.However, wet application method and dry type coating
Method not limited to this.
In the case of infusion process, can be by impregnating shape thereon in metal ink or nano-particle liquid metal ink etc.
Auxiliary outer electrode 151 and 153 is formed into the main body for having external electrode, then the main body to impregnating is heat-treated.In this feelings
Under condition, the thickness of auxiliary outer electrode can be 5 μm to 10 μm.
In the case of low viscosity metal ink in several metal inks, metal ion or nano-particle are dispersed in low gluing
In the dispersant of degree, existing metal firing temperature (firing (can be less than by the temperature at 200 DEG C to 500 DEG C
Temperature temperature)) under be heat-treated the main body that is formed with external electrode thereon and grow metal.In this case, by
There is little size in metallic particles, therefore thin metal layer can be formed.
Due to inorganic oxide of the metal ink not comprising such as glass, therefore formed thereon when metal ink is applied to
When the main body and the main body to being applied with metal ink for having external electrode is heat-treated, the auxiliary formed by metallic particles can be obtained
External electrode.
In the case of sputtering method, can use will make the particle of target (target) be in ion by using plasma
State and apply electric fields in ionic condition particle and make the particle deposition to be formed physical deposition techniques onboard with
And a kind of method in formation film, and auxiliary outer electrode can be formed as with the film that thickness is 0.2 μm to 1 μm.
Target can be the one kind in copper (Cu), titanium (Ti), nickel (Ni) and silver (Ag).
Because auxiliary outer electrode has minimum thickness, therefore their not connected portions on surface for may include to be exposed to main body
Point.
When plating technic is performed after forming auxiliary outer electrode, can be formed on the surface of external electrode and auxiliary outer electrode
Coating 152 and 154 with uniform thickness.That is, coating can be formed on the surface of auxiliary outer electrode, subsequently will
Capacitor can increase the area of coating when being formed on circuit boards so that the combination that can improve between capacitor and circuit board is strong
Degree.
As described above, the auxiliary dispatch from foreign news agency that may include to be formed on the side surface of main body according to the capacitor of exemplary embodiment
Pole so that the electric capacity of capacitor can significantly increase, can improve capacitor and circuit when capacitor is installed on circuit boards
Bond strength between plate, and the machinability and convenience that work is loaded when capacitor is loaded can be improved.
Although having been shown above and describing exemplary embodiment, those skilled in the art will become apparent to
It is in the case of without departing from the scope of the invention defined by the claims, modification and modification can be made.
Claims (43)
1. a kind of capacitor, the capacitor includes：
Electrode and the second inner electrode in main body, including first, electrode is with a surface for being exposed to main body in described first
First leading part, the second inner electrode is by each dielectric layer and first in first between electrode and the second inner electrode
Interior electrode is alternately stacked and with second leading part on a surface for being exposed to main body；
The first external electrode and the second external electrode, are arranged on one surface of main body and are electrically connected respectively to electrode in first
And the second inner electrode；
First auxiliary outer electrode and the second auxiliary outer electrode, are electrically connected respectively to the first external electrode and the second external electrode, and cover
The part on the surface being connected with one surface of main body of main body.
2. capacitor as claimed in claim 1, wherein, first auxiliary outer electrode and the second auxiliary outer electrode are by metal shape
Into.
3. capacitor as claimed in claim 2, wherein, first auxiliary outer electrode and the second auxiliary outer electrode are by copper shape
Into.
4. capacitor as claimed in claim 1, wherein, first auxiliary outer electrode and the second auxiliary outer electrode are arranged on master
On the surface of body and it is separately positioned on the first external electrode and the second external electrode.
5. capacitor as claimed in claim 1, wherein, first auxiliary outer electrode and the second auxiliary outer electrode are respectively provided with
To cover a part for the first external electrode and a part for the second external electrode.
6. capacitor as claimed in claim 1, wherein, first auxiliary outer electrode and the second auxiliary outer electrode are extended to and covered
The table being connected back to another surface for arranging with one surface for making one surface of main body and main body of lid main body
Face.
7. capacitor as claimed in claim 1, wherein, first auxiliary outer electrode and the second auxiliary outer electrode are extended to and covered
The table being connected back to another surface for arranging with one surface for making one surface of main body and main body of lid main body
Face, and cover main body with one surface back to another surface for arranging a part.
8. capacitor as claimed in claim 1, wherein, first auxiliary outer electrode and the second auxiliary outer electrode are respectively provided with
0.05 μm to 10 μm of thickness.
9. capacitor as claimed in claim 1, wherein, first auxiliary outer electrode and the second auxiliary outer electrode include making
The exposed not connected part in surface of main body.
10. capacitor as claimed in claim 1, wherein, first auxiliary outer electrode and the second auxiliary outer electrode are from first
External electrode and the second external electrode extend to the surface of contact main body.
11. capacitors as claimed in claim 1, wherein, the first external electrode and the second external electrode are set to and main body
The edge on one surface separates.
12. capacitors as claimed in claim 1, wherein, the first external electrode and the second external electrode are set to make described
The side surface of one external electrode and the second external electrode and the justified margin on one surface of main body.
13. capacitors as claimed in claim 1, wherein, the first external electrode and the second external electrode extend to main body with
In the part on the surface of one surface connection of main body.
14. capacitors as claimed in claim 1, the capacitor also include be arranged on the first external electrode and the second external electrode with
And first auxiliary outer electrode and the coating on the second auxiliary outer electrode.
15. capacitors as claimed in claim 1, wherein, one surface of the main body is the lower surface of main body.
A kind of 16. capacitors, including：
Main body, the side surface being connected to each other with upper surface, lower surface and by upper and lower surface, and including having respectively
It is exposed to electrode and the second inner electrode in the first of the first leading part of lower surface and the second leading part；
The first external electrode and the second external electrode, are arranged on the lower surface of main body, and are electrically connected respectively to of electrode in first
Second leading part of one leading part and the second inner electrode；
First auxiliary outer electrode and the second auxiliary outer electrode, are electrically connected respectively to the first external electrode and the second external electrode, and difference
It is arranged on the part of two side surfaces of main body.
17. capacitors as claimed in claim 16, wherein, first auxiliary outer electrode and the second auxiliary outer electrode are arranged on
On the surface of main body and be separately positioned on the first external electrode and the second external electrode on.
18. capacitors as claimed in claim 16, wherein, first auxiliary outer electrode and the second auxiliary outer electrode are set to
Cover a part for the first external electrode and a part for the second external electrode.
19. capacitors as claimed in claim 16, wherein, first auxiliary outer electrode and the second auxiliary outer electrode are extended to
Cover a part for the upper surface of each side surface and main body of main body.
20. capacitors as claimed in claim 16, wherein, first auxiliary outer electrode and the second auxiliary outer electrode include making
The exposed not connected part in surface of main body.
A kind of 21. methods of manufacture capacitor, methods described includes：
Stacking is formed with the dielectric layer of interior electrode pattern, to form the interior electrode pattern with a surface for being exposed to laminate
Laminate；
External electrode cream pattern is applied into one surface of laminate；
Laminate and external electrode cream pattern are fired, to obtain the main body for being formed with external electrode；
Outside the auxiliary for the part that formation is electrically connected to external electrode and covers the surface being connected with a surface of main body of main body
Electrode.
22. methods as claimed in claim 21, wherein, by wet method and dry method in one or more of methods form described
Auxiliary outer electrode.
23. methods as claimed in claim 21, wherein, the auxiliary outer electrode is formed by metal.
24. methods as claimed in claim 21, wherein, the auxiliary outer electrode is formed in the on the surface of the body and external electrode
On.
25. methods as claimed in claim 21, wherein, the auxiliary outer electrode extends to and covers main body and make the described of main body
One surface and main body with one surface of main body back to the surface that is connected of another surface, and cover main body with master
A part of one surface of body back to another surface for arranging.
26. methods as claimed in claim 21, wherein, the auxiliary outer electrode extends to and covers main body and make the described of main body
One surface and main body with the surface of main body back to the surface that is connected of another surface.
27. methods as claimed in claim 21, wherein, the auxiliary outer electrode has 0.05 μm to 10 μm of thickness.
28. methods as claimed in claim 21, wherein, the auxiliary outer electrode includes making the surface of main body exposed not connected
Part.
29. methods as claimed in claim 21, wherein, the external electrode cream pattern is formed as into one with laminate
The edge on surface separates.
30. methods as claimed in claim 21, wherein, by the external electrode cream pattern be formed as have with described in laminate
The side surface of the justified margin on one surface.
31. methods as claimed in claim 21, wherein, the external electrode cream pattern extends to coating casting die and laminate
One surface connection surface a part.
A kind of 32. capacitors, the capacitor includes：
Electrode and the second inner electrode in main body, including first, electrode and the second inner electrode are alternately stacked in first, between
Dielectric layer in first between electrode and the second inner electrode, wherein each in first in electrode and the second inner electrode extends to master
The same outer surface of only one of body；
The first external electrode and the second external electrode, are arranged on the described same outer surface of main body, and are connected respectively in first
Electrode and the second inner electrode；
First auxiliary outer electrode and the second auxiliary outer electrode, are connected to the first external electrode and the second external electrode, and are arranged on main body
Each the different surface in addition to the described same outer surface of main body on.
33. capacitors as claimed in claim 32, wherein, each in the first external electrode and the second external electrode and main body
The described same outer surface for being provided with the first external electrode and the second external electrode edge separate.
34. capacitors as claimed in claim 32, wherein, each in the first external electrode and the second external electrode have with
The side surface of the justified margin of the described same outer surface for being provided with the first external electrode and the second external electrode of main body.
35. capacitors as claimed in claim 32, wherein, each in the first external electrode and the second external electrode is extended
To be arranged on each different surface with the first auxiliary outer electrode or the second auxiliary outer electrode of main body.
36. capacitors as claimed in claim 32, wherein, first auxiliary outer electrode and the second auxiliary outer electrode include with
The first external electrode metal different with the metal of the second external electrode.
37. capacitors as claimed in claim 32, wherein, first auxiliary outer electrode and the second auxiliary outer electrode cover respectively
At least one surface of lid the first external electrode and the second external electrode.
38. capacitors as claimed in claim 32, wherein, first auxiliary outer electrode and the second auxiliary outer electrode lead to respectively
Cross electrode and the second inner electrode in first and be each connected indirectly to electrode and the second inner electrode in first.
A kind of 39. components, the component includes：
Circuit board, with the first contact and the second contact that arrange on circuit boards；
Capacitor, is attached to the first contact and the second contact；
Wherein, the capacitor includes：
Main body, including being stacked on electrode and the second inner electrode in first in main body, wherein, electrode and the second inner electrode in first
The same outer surface of main body is extended to,
The first external electrode and the second external electrode, are arranged on the described same outer surface of main body, and are connected respectively to electricity in first
Pole and the second inner electrode,
First auxiliary outer electrode and the second auxiliary outer electrode, are arranged on the different outer surface of main body, and are connected respectively to
One external electrode and the second external electrode,
First coating and the second coating, are separately positioned on the first auxiliary outer electrode and the second auxiliary outer electrode, and respectively in connection with
To first contact and the second contact of circuit board.
40. components as claimed in claim 39, wherein, the capacitor is attached to the first contact and the second contact so that main
The described same outer surface thereon with the first external electrode and the second external electrode of body faces circuit board.
41. components as claimed in claim 39, wherein, electrode and the second inner electrode extend only into the institute of main body in described first
There is the described same outer surface of the main body in outer surface.
42. components as claimed in claim 39, wherein, the first external electrode and the second external electrode are provided only on the institute of main body
Have on the described same outer surface of the main body in outer surface.
43. components as claimed in claim 42, wherein, first auxiliary outer electrode and the second auxiliary outer electrode pass through respectively
The first external electrode and the second external electrode are each connected indirectly to electrode and the second inner electrode in first.
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| KR10-2015-0151068 | 2015-10-29 | ||
| KR20150151068 | 2015-10-29 | ||
| KR1020160021731A KR101792396B1 (en) | 2015-10-29 | 2016-02-24 | Capacitor and manufacturing method of the same |
| KR10-2016-0021731 | 2016-02-24 |
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| CN106653363A true CN106653363A (en) | 2017-05-10 |
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| CN201610921161.3A Active CN106653363B (en) | 2015-10-29 | 2016-10-21 | Capacitor and the method and component for manufacturing the capacitor |
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|---|---|---|---|---|
| CN110660586A (en) * | 2018-06-29 | 2020-01-07 | 三星电机株式会社 | Multilayer ceramic capacitor |
| CN111029148A (en) * | 2018-10-10 | 2020-04-17 | 三星电机株式会社 | Multilayer ceramic electronic component |
| CN115331961A (en) * | 2022-09-06 | 2022-11-11 | 池州昀冢电子科技有限公司 | Multilayer ceramic capacitor and method for manufacturing the same |
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| CN104282435A (en) * | 2013-07-09 | 2015-01-14 | 三星电机株式会社 | Multilayer ceramic capacitor and mounting circuit board therefor |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110660586A (en) * | 2018-06-29 | 2020-01-07 | 三星电机株式会社 | Multilayer ceramic capacitor |
| CN110660586B (en) * | 2018-06-29 | 2022-05-24 | 三星电机株式会社 | Multilayer ceramic capacitor |
| CN111029148A (en) * | 2018-10-10 | 2020-04-17 | 三星电机株式会社 | Multilayer ceramic electronic component |
| CN111029148B (en) * | 2018-10-10 | 2022-08-23 | 三星电机株式会社 | Multilayer ceramic electronic component |
| CN115331961A (en) * | 2022-09-06 | 2022-11-11 | 池州昀冢电子科技有限公司 | Multilayer ceramic capacitor and method for manufacturing the same |
| CN115331961B (en) * | 2022-09-06 | 2023-08-11 | 池州昀冢电子科技有限公司 | Multilayer ceramic capacitor and method for manufacturing the same |
| WO2024051192A1 (en) * | 2022-09-06 | 2024-03-14 | 池州昀冢电子科技有限公司 | Multilayer ceramic capacitor and manufacturing method therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101792396B1 (en) | 2017-11-02 |
| CN106653363B (en) | 2019-04-26 |
| KR20170051129A (en) | 2017-05-11 |
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