CN106650010A - Reliability simulation method of microaccelerometer under temperature, humidity and vibration combined stress - Google Patents

Reliability simulation method of microaccelerometer under temperature, humidity and vibration combined stress Download PDF

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Publication number
CN106650010A
CN106650010A CN201611042333.6A CN201611042333A CN106650010A CN 106650010 A CN106650010 A CN 106650010A CN 201611042333 A CN201611042333 A CN 201611042333A CN 106650010 A CN106650010 A CN 106650010A
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China
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micro
acceleration
acceleration gauge
humidity
gauge
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CN201611042333.6A
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Inventor
马喜宏
王忠庆
刘俊
鲍爱达
秦立君
王威
何程
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North University of China
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North University of China
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00Computer-aided design [CAD]
    • G06F30/20Design optimisation, verification or simulation

Abstract

The invention relates to a reliability simulation technology of microaccelerometers, in particular to a reliability simulation method of a microaccelerometer under temperature, humidity and vibration combined stress. The problem that at present, no microaccelerometer reliability simulation method based on the high accelerated life test technology is available is solved. The reliability simulation method of the microaccelerometer under the temperature, humidity and vibration combined stress comprises the following steps that 1, a simulation model of a microaccelerometer is established through simulation software, and the mature characteristics of the microaccelerometer are confirmed through the simulation model; 2, reliability simulation is carried out on the microaccelerometer under the temperate stress; 3, reliability simulation is carried out on the microaccelerometer under the vibration stress; 4, reliability simulation is carried out on the microaccelerometer under the temperature, humidity and vibration combined stress. The method is suitable for reliability simulation of various microaccelerometers.

Description

Reliablility simulation method of the micro-acceleration gauge under warm, wet, combined stress of shaking
Technical field
The present invention relates to the Reliablility simulation technology of micro-acceleration gauge, specifically a kind of micro-acceleration gauge it is warm, wet, shake it is comprehensive Reliablility simulation method under combined stress.
Background technology
As microelectromechanical systems(MEMS)An important branch, micro-acceleration gauge is in Aeronautics and Astronautics, automobile, state The field such as anti-has a wide range of applications.The use environment of micro-acceleration gauge is typically more harsh, therefore in order to ensure that it was used Reliability in journey, needs are carrying out Reliablility simulation using front to it.With the system complexity of micro-acceleration gauge it is more next Higher, traditional micro-acceleration gauge Reliablility simulation technology is limited due to itself principle, simulation time generally occurs long and imitative The problem of true high cost.In recent years, a kind of emerging, widely accepted method for testing reliability --- high accelerated aging examination Test(HALT)Technology quickly grows.The principle of this kind of technology is:In a stepwise manner a series of single stress are applied to product(Such as multiaxis Random vibration, temperature cycles, electric stress etc.)And combined stress, and intensity is stepped up up to product failure, then to generation Each failure carries out basic reason analysis, is constantly tested, analyzes, verified and is improved.Practice have shown that, this kind of technology pair The latent defect of exposing product, the intensity and reliability for improving product are highly effective.Based on this, it is necessary to which invention is a kind of based on height The micro-acceleration gauge Reliablility simulation method of accelerated life test technology.But such a method is there is no at present.
The content of the invention
The present invention is imitated to solve to there is no at present a kind of micro-acceleration gauge reliability based on Highly Accelerated Life Test technology A kind of problem of true method, there is provided Reliablility simulation method of micro-acceleration gauge under warm, wet, combined stress of shaking.
The present invention adopts the following technical scheme that realization:
Reliablility simulation method of the micro-acceleration gauge under warm, wet, combined stress of shaking, the method is realized using following steps 's:
1)The simulation model of micro-acceleration gauge is set up using simulation software;It is special by the material of simulation model validation micro-acceleration gauge Property;According to the material behavior of micro-acceleration gauge, draw the maximum permissible stress [τ] of micro-acceleration gauge, allow range of strain, maximum Yield strength [σ];
2)Reliablility simulation is carried out to micro-acceleration gauge under temperature stress, is comprised the following steps that:
2.1)According to the use environment of micro-acceleration gauge, a vibration of foundation parameter and a base of micro-acceleration gauge are primarily determined that Plinth humidity parameter;
2.2)According to the use temperature range of micro-acceleration gauge, the testing temperature that heated of setting emulation is less than using temperature range Higher limit, setting 5 DEG C≤temperature variation Δ T≤10 DEG C;
2.3)According to simulation model, temperature loading is applied to micro-acceleration gauge using the thermodynamic analysis module of simulation software;Temperature Degree load proceeds by increase by testing temperature has been heated, and often increases maximum temperature variation Δ Tmax and is set as a sub-step;Temperature Degree load is increasedd to over after the higher limit using temperature range, is further added by two sub-steps;
2.4)Temperature loading is loaded and solved, solving result is checked;Stress distribution cloud atlas in solving result, draws micro- adding The stress maximum distributed points of speedometer and region of stress concentration;Last sub-step checked in solving result;Assume now Maximum stress value suffered by micro-acceleration gauge is τt
2.5)If τt<[τ], shows that the function of micro-acceleration gauge is normal, then continue to increase temperature loading to micro-acceleration gauge, often increases Plus maximum temperature variation Δ Tmax is set as a sub-step;Repeat step 2.4), until τt>When [τ], show micro-acceleration gauge Dysfunction;The previous sub-step now checked in solving result, determines the minimum during dysfunction of micro-acceleration gauge Temperature loading;Continue to increase temperature loading to micro-acceleration gauge, often increase by 1 DEG C and be set as a sub-step;Repeat step 2.4), really Make the upper limit of rupture temperature of micro-acceleration gauge;
3)Reliablility simulation is carried out to micro-acceleration gauge under vibration stress, is comprised the following steps that:
3.1)According to the use environment of micro-acceleration gauge, a basal temperature parameter and a base of micro-acceleration gauge are primarily determined that Plinth humidity parameter;
3.2)According to the use acceleration range of micro-acceleration gauge, the initial vibration acceleration of emulation is set as 1gn, setting vibration Acceleration change amount Δ a is 0.5gn
3.3)According to simulation model, vibration acceleration is applied to micro-acceleration gauge using the static numerical simulation module of simulation software and is carried Lotus;Vibration acceleration load proceeds by increase by initial vibration acceleration, often increases vibration acceleration variation delta a and is set as One sub-step, the retention time of each sub-step is 10min;
3.4)Vibration acceleration load is loaded and solved, solving result is checked;Stress and strain distribution in solving result Cloud atlas, draws stress maximum distributed points, region of stress concentration and the strain maximum distributed points of micro-acceleration gauge;Assume now Maximum stress value suffered by micro-acceleration gauge is τs
3.5)If τs<[τ], shows that the function of micro-acceleration gauge is normal, then continue to increase micro-acceleration gauge vibration acceleration load Lotus;Repeat step 3.4), until τs>When [τ], show the dysfunction of micro-acceleration gauge;Assume that vibration acceleration now is carried Lotus is a1, it is assumed that now the maximum strain value suffered by micro-acceleration gauge is εs;If maximum strain value εsPermitting less than micro-acceleration gauge Perhaps range of strain, then continue to increase vibration acceleration load to micro-acceleration gauge;Repeat step 3.4), until maximum strain value εs More than the permission range of strain of micro-acceleration gauge;Assume that vibration acceleration load now is a2;If a1>A2, then determine a2 For the maximum vibration acceleration that micro-acceleration gauge can bear;If a1<A2, then be defined as what micro-acceleration gauge can bear by a1 Maximum vibration acceleration;
4)Reliablility simulation is carried out to micro-acceleration gauge under temperature, humidity, vibration integrated stress, is comprised the following steps that:
4.1)Repeat step 2.2);Repeat step 3.2);According to the use humidity range of micro-acceleration gauge, the starting of emulation is set Humidity, sets humidity variation delta H;
4.2)According to simulation model, temperature loading is applied to micro-acceleration gauge using the thermodynamic analysis module of simulation software;Temperature Degree load proceeds by increase by testing temperature has been heated;According to simulation model, using the static numerical simulation module pair of simulation software Micro-acceleration gauge applies vibration acceleration load;Vibration acceleration load proceeds by increase by initial vibration acceleration;According to Simulation model, to micro-acceleration gauge humidity load is applied;Humidity load proceeds by increase by start humidity, often increases humidity and becomes Change amount Δ H is set as a sub-step;Humidity load is increasedd to over after the higher limit using humidity range, is further added by two sons Step;
4.3)Humidity load is loaded and solved, solving result is checked;Stress and strain cloud charts in solving result, obtain Go out stress maximum distributed points, region of stress concentration and the strain maximum distributed points of micro-acceleration gauge;Assume now micro- acceleration The suffered maximum concentrated stress value of degree meter is Σ;
4.4)If Σ<[σ], shows that the function of micro-acceleration gauge is normal, then continue to increase humidity load to micro-acceleration gauge;Repeat Step 4.3), until Σ>When [σ], show the dysfunction of micro-acceleration gauge;The previous height now checked in solving result Step, determines the minimum humidity load during dysfunction of micro-acceleration gauge, and the minimum humidity load is defined as into Current Temperatures The working limit humidity of corresponding micro-acceleration gauge under load and current vibration acceleration load;
4.5)Continue to increase vibration acceleration load to micro-acceleration gauge;Often increase vibration acceleration variation delta a and be set as one Individual sub-step;Humidity load is applied to micro-acceleration gauge;Humidity load proceeds by increase by start humidity again, often increases humidity Variation delta H is set as a sub-step;Repeat step 4.3)-4.4), determine that each vibration acceleration is carried under Current Temperatures load The working limit humidity of the corresponding micro-acceleration gauge of lotus;
4.6)Continue to increase temperature loading to micro-acceleration gauge;Often increase maximum temperature variation Δ Tmax and be set as a son Step;Vibration acceleration load is applied to micro-acceleration gauge;Vibration acceleration load is proceeded by by initial vibration acceleration again Increase, often increase vibration acceleration variation delta a and be set as a sub-step;Humidity load is applied to micro-acceleration gauge;Humidity is carried Loading newly proceeds by increase by start humidity, often increases humidity variation delta H and is set as a sub-step;Repeat step 4.3)- 4.4), determine that the working limit of corresponding micro-acceleration gauge under each temperature loading and each vibration acceleration load any combination is wet Degree.
Reliablility simulation method of the micro-acceleration gauge of the present invention under warm, wet, combined stress of shaking takes into account temperature, wet The impact of degree, three kinds of stress of vibration to micro-acceleration gauge, and realized to micro-acceleration gauge based on Highly Accelerated Life Test technology Carry out Reliablility simulation, thus effectively overcome that traditional micro-acceleration gauge Reliablility simulation technology simulation time is long and emulation The problem of high cost.
The present invention is efficiently solved and there is no a kind of micro-acceleration gauge reliability based on Highly Accelerated Life Test technology at present The problem of emulation mode, it is adaptable to the Reliablility simulation of various micro-acceleration gauges.
Specific embodiment
Reliablility simulation method of the micro-acceleration gauge under warm, wet, combined stress of shaking, the method is using following steps reality Existing:
1)The simulation model of micro-acceleration gauge is set up using simulation software;It is special by the material of simulation model validation micro-acceleration gauge Property;According to the material behavior of micro-acceleration gauge, draw the maximum permissible stress [τ] of micro-acceleration gauge, allow range of strain, maximum Yield strength [σ];
2)Reliablility simulation is carried out to micro-acceleration gauge under temperature stress, is comprised the following steps that:
2.1)According to the use environment of micro-acceleration gauge, a vibration of foundation parameter and a base of micro-acceleration gauge are primarily determined that Plinth humidity parameter;
2.2)According to the use temperature range of micro-acceleration gauge, the testing temperature that heated of setting emulation is less than using temperature range Higher limit, setting 5 DEG C≤temperature variation Δ T≤10 DEG C;
2.3)According to simulation model, temperature loading is applied to micro-acceleration gauge using the thermodynamic analysis module of simulation software;Temperature Degree load proceeds by increase by testing temperature has been heated, and often increases maximum temperature variation Δ Tmax and is set as a sub-step;Temperature Degree load is increasedd to over after the higher limit using temperature range, is further added by two sub-steps;
2.4)Temperature loading is loaded and solved, solving result is checked;Stress distribution cloud atlas in solving result, draws micro- adding The stress maximum distributed points of speedometer and region of stress concentration;Last sub-step checked in solving result;Assume now Maximum stress value suffered by micro-acceleration gauge is τt
2.5)If τt<[τ], shows that the function of micro-acceleration gauge is normal, then continue to increase temperature loading to micro-acceleration gauge, often increases Plus maximum temperature variation Δ Tmax is set as a sub-step;Repeat step 2.4), until τt>When [τ], show micro-acceleration gauge Dysfunction;The previous sub-step now checked in solving result, determines the minimum during dysfunction of micro-acceleration gauge Temperature loading;Continue to increase temperature loading to micro-acceleration gauge, often increase by 1 DEG C and be set as a sub-step;Repeat step 2.4), really Make the upper limit of rupture temperature of micro-acceleration gauge;
3)Reliablility simulation is carried out to micro-acceleration gauge under vibration stress, is comprised the following steps that:
3.1)According to the use environment of micro-acceleration gauge, a basal temperature parameter and a base of micro-acceleration gauge are primarily determined that Plinth humidity parameter;
3.2)According to the use acceleration range of micro-acceleration gauge, the initial vibration acceleration of emulation is set as 1gn, setting vibration Acceleration change amount Δ a is 0.5gn
3.3)According to simulation model, vibration acceleration is applied to micro-acceleration gauge using the static numerical simulation module of simulation software and is carried Lotus;Vibration acceleration load proceeds by increase by initial vibration acceleration, often increases vibration acceleration variation delta a and is set as One sub-step, the retention time of each sub-step is 10min;
3.4)Vibration acceleration load is loaded and solved, solving result is checked;Stress and strain distribution in solving result Cloud atlas, draws stress maximum distributed points, region of stress concentration and the strain maximum distributed points of micro-acceleration gauge;Assume now Maximum stress value suffered by micro-acceleration gauge is τs
3.5)If τs<[τ], shows that the function of micro-acceleration gauge is normal, then continue to increase micro-acceleration gauge vibration acceleration load Lotus;Repeat step 3.4), until τs>When [τ], show the dysfunction of micro-acceleration gauge;Assume that vibration acceleration now is carried Lotus is a1, it is assumed that now the maximum strain value suffered by micro-acceleration gauge is εs;If maximum strain value εsPermitting less than micro-acceleration gauge Perhaps range of strain, then continue to increase vibration acceleration load to micro-acceleration gauge;Repeat step 3.4), until maximum strain value εs More than the permission range of strain of micro-acceleration gauge;Assume that vibration acceleration load now is a2;If a1>A2, then determine a2 For the maximum vibration acceleration that micro-acceleration gauge can bear;If a1<A2, then be defined as what micro-acceleration gauge can bear by a1 Maximum vibration acceleration;
4)Reliablility simulation is carried out to micro-acceleration gauge under temperature, humidity, vibration integrated stress, is comprised the following steps that:
4.1)Repeat step 2.2);Repeat step 3.2);According to the use humidity range of micro-acceleration gauge, the starting of emulation is set Humidity, sets humidity variation delta H;
4.2)According to simulation model, temperature loading is applied to micro-acceleration gauge using the thermodynamic analysis module of simulation software;Temperature Degree load proceeds by increase by testing temperature has been heated;According to simulation model, using the static numerical simulation module pair of simulation software Micro-acceleration gauge applies vibration acceleration load;Vibration acceleration load proceeds by increase by initial vibration acceleration;According to Simulation model, to micro-acceleration gauge humidity load is applied;Humidity load proceeds by increase by start humidity, often increases humidity and becomes Change amount Δ H is set as a sub-step;Humidity load is increasedd to over after the higher limit using humidity range, is further added by two sons Step;
4.3)Humidity load is loaded and solved, solving result is checked;Stress and strain cloud charts in solving result, obtain Go out stress maximum distributed points, region of stress concentration and the strain maximum distributed points of micro-acceleration gauge;Assume now micro- acceleration The suffered maximum concentrated stress value of degree meter is Σ;
4.4)If Σ<[σ], shows that the function of micro-acceleration gauge is normal, then continue to increase humidity load to micro-acceleration gauge;Repeat Step 4.3), until Σ>When [σ], show the dysfunction of micro-acceleration gauge;The previous height now checked in solving result Step, determines the minimum humidity load during dysfunction of micro-acceleration gauge, and the minimum humidity load is defined as into Current Temperatures The working limit humidity of corresponding micro-acceleration gauge under load and current vibration acceleration load;
4.5)Continue to increase vibration acceleration load to micro-acceleration gauge;Often increase vibration acceleration variation delta a and be set as one Individual sub-step;Humidity load is applied to micro-acceleration gauge;Humidity load proceeds by increase by start humidity again, often increases humidity Variation delta H is set as a sub-step;Repeat step 4.3)-4.4), determine that each vibration acceleration is carried under Current Temperatures load The working limit humidity of the corresponding micro-acceleration gauge of lotus;
4.6)Continue to increase temperature loading to micro-acceleration gauge;Often increase maximum temperature variation Δ Tmax and be set as a son Step;Vibration acceleration load is applied to micro-acceleration gauge;Vibration acceleration load is proceeded by by initial vibration acceleration again Increase, often increase vibration acceleration variation delta a and be set as a sub-step;Humidity load is applied to micro-acceleration gauge;Humidity is carried Loading newly proceeds by increase by start humidity, often increases humidity variation delta H and is set as a sub-step;Repeat step 4.3)- 4.4), determine that the working limit of corresponding micro-acceleration gauge under each temperature loading and each vibration acceleration load any combination is wet Degree.
When being embodied as, the step 1)-4)In, simulation software is ANSYS simulation softwares.

Claims (2)

1. Reliablility simulation method of a kind of micro-acceleration gauge under warm, wet, combined stress of shaking, it is characterised in that:The method is Realized using following steps:
1)The simulation model of micro-acceleration gauge is set up using simulation software;It is special by the material of simulation model validation micro-acceleration gauge Property;According to the material behavior of micro-acceleration gauge, draw the maximum permissible stress [τ] of micro-acceleration gauge, allow range of strain, maximum Yield strength [σ];
2)Reliablility simulation is carried out to micro-acceleration gauge under temperature stress, is comprised the following steps that:
2.1)According to the use environment of micro-acceleration gauge, a vibration of foundation parameter and a base of micro-acceleration gauge are primarily determined that Plinth humidity parameter;
2.2)According to the use temperature range of micro-acceleration gauge, the testing temperature that heated of setting emulation is less than using temperature range Higher limit, setting 5 DEG C≤temperature variation Δ T≤10 DEG C;
2.3)According to simulation model, temperature loading is applied to micro-acceleration gauge using the thermodynamic analysis module of simulation software;Temperature Degree load proceeds by increase by testing temperature has been heated, and often increases maximum temperature variation Δ Tmax and is set as a sub-step;Temperature Degree load is increasedd to over after the higher limit using temperature range, is further added by two sub-steps;
2.4)Temperature loading is loaded and solved, solving result is checked;Stress distribution cloud atlas in solving result, draws micro- adding The stress maximum distributed points of speedometer and region of stress concentration;Last sub-step checked in solving result;Assume now Maximum stress value suffered by micro-acceleration gauge is τt
2.5)If τt<[τ], shows that the function of micro-acceleration gauge is normal, then continue to increase temperature loading to micro-acceleration gauge, often increases Plus maximum temperature variation Δ Tmax is set as a sub-step;Repeat step 2.4), until τt>When [τ], show micro-acceleration gauge Dysfunction;The previous sub-step now checked in solving result, determines the minimum during dysfunction of micro-acceleration gauge Temperature loading;Continue to increase temperature loading to micro-acceleration gauge, often increase by 1 DEG C and be set as a sub-step;Repeat step 2.4), really Make the upper limit of rupture temperature of micro-acceleration gauge;
3)Reliablility simulation is carried out to micro-acceleration gauge under vibration stress, is comprised the following steps that:
3.1)According to the use environment of micro-acceleration gauge, a basal temperature parameter and a base of micro-acceleration gauge are primarily determined that Plinth humidity parameter;
3.2)According to the use acceleration range of micro-acceleration gauge, the initial vibration acceleration of emulation is set as 1gn, setting vibration Acceleration change amount Δ a is 0.5gn
3.3)According to simulation model, vibration acceleration is applied to micro-acceleration gauge using the static numerical simulation module of simulation software and is carried Lotus;Vibration acceleration load proceeds by increase by initial vibration acceleration, often increases vibration acceleration variation delta a and is set as One sub-step, the retention time of each sub-step is 10min;
3.4)Vibration acceleration load is loaded and solved, solving result is checked;Stress and strain distribution in solving result Cloud atlas, draws stress maximum distributed points, region of stress concentration and the strain maximum distributed points of micro-acceleration gauge;Assume now Maximum stress value suffered by micro-acceleration gauge is τs
3.5)If τs<[τ], shows that the function of micro-acceleration gauge is normal, then continue to increase micro-acceleration gauge vibration acceleration load Lotus;Repeat step 3.4), until τs>When [τ], show the dysfunction of micro-acceleration gauge;Assume that vibration acceleration now is carried Lotus is a1, it is assumed that now the maximum strain value suffered by micro-acceleration gauge is εs;If maximum strain value εsPermitting less than micro-acceleration gauge Perhaps range of strain, then continue to increase vibration acceleration load to micro-acceleration gauge;Repeat step 3.4), until maximum strain value εs More than the permission range of strain of micro-acceleration gauge;Assume that vibration acceleration load now is a2;If a1>A2, then determine a2 For the maximum vibration acceleration that micro-acceleration gauge can bear;If a1<A2, then be defined as what micro-acceleration gauge can bear by a1 Maximum vibration acceleration;
4)Reliablility simulation is carried out to micro-acceleration gauge under temperature, humidity, vibration integrated stress, is comprised the following steps that:
4.1)Repeat step 2.2);Repeat step 3.2);According to the use humidity range of micro-acceleration gauge, the starting of emulation is set Humidity, sets humidity variation delta H;
4.2)According to simulation model, temperature loading is applied to micro-acceleration gauge using the thermodynamic analysis module of simulation software;Temperature Degree load proceeds by increase by testing temperature has been heated;According to simulation model, using the static numerical simulation module pair of simulation software Micro-acceleration gauge applies vibration acceleration load;Vibration acceleration load proceeds by increase by initial vibration acceleration;According to Simulation model, to micro-acceleration gauge humidity load is applied;Humidity load proceeds by increase by start humidity, often increases humidity and becomes Change amount Δ H is set as a sub-step;Humidity load is increasedd to over after the higher limit using humidity range, is further added by two sons Step;
4.3)Humidity load is loaded and solved, solving result is checked;Stress and strain cloud charts in solving result, obtain Go out stress maximum distributed points, region of stress concentration and the strain maximum distributed points of micro-acceleration gauge;Assume now micro- acceleration The suffered maximum concentrated stress value of degree meter is Σ;
4.4)If Σ<[σ], shows that the function of micro-acceleration gauge is normal, then continue to increase humidity load to micro-acceleration gauge;Repeat Step 4.3), until Σ>When [σ], show the dysfunction of micro-acceleration gauge;The previous height now checked in solving result Step, determines the minimum humidity load during dysfunction of micro-acceleration gauge, and the minimum humidity load is defined as into Current Temperatures The working limit humidity of corresponding micro-acceleration gauge under load and current vibration acceleration load;
4.5)Continue to increase vibration acceleration load to micro-acceleration gauge;Often increase vibration acceleration variation delta a and be set as one Individual sub-step;Humidity load is applied to micro-acceleration gauge;Humidity load proceeds by increase by start humidity again, often increases humidity Variation delta H is set as a sub-step;Repeat step 4.3)-4.4), determine that each vibration acceleration is carried under Current Temperatures load The working limit humidity of the corresponding micro-acceleration gauge of lotus;
4.6)Continue to increase temperature loading to micro-acceleration gauge;Often increase maximum temperature variation Δ Tmax and be set as a son Step;Vibration acceleration load is applied to micro-acceleration gauge;Vibration acceleration load is proceeded by by initial vibration acceleration again Increase, often increase vibration acceleration variation delta a and be set as a sub-step;Humidity load is applied to micro-acceleration gauge;Humidity is carried Loading newly proceeds by increase by start humidity, often increases humidity variation delta H and is set as a sub-step;Repeat step 4.3)- 4.4), determine that the working limit of corresponding micro-acceleration gauge under each temperature loading and each vibration acceleration load any combination is wet Degree.
2. Reliablility simulation method of the micro-acceleration gauge according to claim 1 under warm, wet, combined stress of shaking, it is special Levy and be:The step 1)-4)In, simulation software is ANSYS simulation softwares.
CN201611042333.6A 2016-11-24 2016-11-24 Reliability simulation method of microaccelerometer under temperature, humidity and vibration combined stress Pending CN106650010A (en)

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CN101639488A (en) * 2009-08-22 2010-02-03 中北大学 Test method of micro-accelerometer reliability intensifying test
WO2014099419A1 (en) * 2012-12-17 2014-06-26 Abbott Point Of Care Inc A portable clinical analysis system for hematocrit measurement
CN103258080A (en) * 2013-04-10 2013-08-21 中北大学 Microaccelerometer reliability simulation method

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Title
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Application publication date: 20170510