CN106648202B - Electronic equipment, touch display screen, touch assembly and touch conductive film - Google Patents
Electronic equipment, touch display screen, touch assembly and touch conductive film Download PDFInfo
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- CN106648202B CN106648202B CN201610871706.4A CN201610871706A CN106648202B CN 106648202 B CN106648202 B CN 106648202B CN 201610871706 A CN201610871706 A CN 201610871706A CN 106648202 B CN106648202 B CN 106648202B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
Abstract
The invention relates to an electronic device, a touch display screen, a touch component and a touch conductive film, wherein the touch conductive film comprises a transparent substrate, a first conductive layer, a first electrode lead, a first pin, a second conductive layer, a second electrode lead and a second pin, a through hole is formed in the transparent substrate corresponding to the second pin, and a conductive material is filled in the through hole to form a connecting piece, so that the end part of the second electrode lead positioned on the second surface is electrically connected with the second pin positioned on the first surface through the conductive connecting piece formed in the through hole.
Description
Technical Field
The invention relates to the technical field of electronics, in particular to electronic equipment, a touch display screen, a touch assembly and a touch conductive film.
Background
With the development of electronic technology, touch screen electronic devices are becoming more and more popular with young consumers. Generally, the thin film touch screen electronic device is usually a single-sided circuit double-layer thin film or a double-sided circuit single-layer thin film structure.
Because the double-sided circuit single-layer film adopts a single-layer film structure, the thin design can be realized on the structure. However, due to the fact that the double-sided circuit single-layer film is provided with the pins on the front side and the back side at the binding position, the film material needs to be reversed in the binding operation process due to the requirement of positive and negative contraposition binding in the production process, so that the binding operation is difficult to contraposition, the process is complex, and the technical requirement on binding equipment is high.
Disclosure of Invention
Accordingly, there is a need to provide an electronic device, a touch display screen, a touch device and a touch conductive film that can optimize the binding operation and reduce the technical requirements of the binding device.
A touch conductive film, comprising:
the transparent substrate comprises a first surface and a second surface opposite to the first surface;
the first conducting layer is arranged on the first surface of the transparent substrate;
the first electrode lead is arranged on the first surface, and one end of the first electrode lead is connected with the first conducting layer;
the first pin is arranged on the first surface and is connected with the other end of the first electrode lead;
the second conducting layer is arranged on the second surface of the transparent substrate;
the second electrode lead is arranged on the second surface, and one end of the second electrode lead is connected with the second conducting layer; and
the second pin is arranged on the first surface, a through hole penetrating through the first surface and the second surface is formed in the position, corresponding to the second pin, of the transparent substrate, a conductive material is filled in the through hole to form a connecting piece, and the other end of the second electrode lead is electrically connected with the second pin through the connecting piece.
In one embodiment, the method further comprises the following steps:
the first insulating protective layer is covered on the surfaces of the first conductive layer and the first electrode lead;
the first bonding layer is arranged on the first surface of the transparent substrate, is arranged around the edge of the first insulating protection layer and is positioned between the edge of the first insulating protection layer and the first surface of the transparent substrate, the edge of the first insulating protection layer is attached to the first surface of the transparent substrate through the first bonding layer, and the first bonding layer and the first conducting layer are arranged at intervals;
the second insulating protective layer is covered on the second conducting layer and the surface of the second electrode lead; and
the second bonding layer is arranged on the second surface of the transparent substrate, the second bonding layer surrounds the edge of the second insulating protection layer and is positioned between the edge of the second insulating protection layer and the second surface of the transparent substrate, the edge of the second insulating protection layer is attached to the second surface of the transparent substrate through the second bonding layer, and the second bonding layer and the second conducting layer are arranged at intervals.
In one embodiment, the number of the second pins is multiple, the second pins are distributed on the first surface at intervals, and the through holes formed in the transparent substrate corresponding to each second pin are staggered with each other.
In one embodiment, the through hole extends through the second pin, and the connector extends through the second pin.
In one embodiment, the second surface is further provided with a connection block, the connection block has a width greater than that of the second electrode lead, and the other end of the second electrode lead is connected to the connection member through the connection block.
A touch assembly, comprising:
the flexible circuit board is provided with a third pin and a fourth pin, and the third pin and the fourth pin are positioned on the same side of the flexible circuit board; and
in the touch conductive film, the first pin and the third pin are bonded to each other to achieve electrical connection, and the second pin and the fourth pin are bonded to each other to achieve electrical connection.
In one embodiment, a first conductive adhesive layer is arranged between the first pin and the third pin; and a second conductive adhesive layer is arranged between the second pin and the fourth pin.
In one embodiment, the through hole penetrates through the second conductive adhesive layer, and the connecting element extends to penetrate through the second pin to be directly connected with the fourth pin.
A touch display screen, comprising:
the touch control device comprises a display screen and the touch control assembly, wherein the display screen and the touch control assembly are arranged in a laminated mode.
An electronic device, comprising:
the touch display screen is as described above.
The touch control assembly and the touch control conductive film thereof at least have the following advantages:
the through hole is formed in the position, corresponding to the second pin, of the transparent substrate, the through hole is filled with the conductive material to form the connecting piece, the end portion, located on the second surface, of the second electrode lead is electrically connected with the second pin located on the first surface through the conductive connecting piece formed in the through hole, and the second pin and the first pin are located on the first surface, so that when the touch-control conductive film is bound with the flexible circuit board, the touch-control conductive film does not need to be reversed, binding operation is optimized, binding operation time is shortened, technical requirements for binding equipment are lowered, and equipment cost is reduced.
Drawings
FIG. 1 is a schematic structural diagram of a touch device according to an embodiment;
FIG. 2 is a partial cross-sectional view of FIG. 1;
FIG. 3 is a partial cross-sectional view of another embodiment of FIG. 2;
fig. 4 is a partial cross-sectional view of another location in fig. 1.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, but rather should be construed as broadly as the present invention is capable of modification in various respects, all without departing from the spirit and scope of the present invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
In one embodiment, an electronic device includes a touch display screen. The touch display screen comprises a display screen and a touch component, wherein the display screen is used for displaying various information such as characters, graphs, images, animations, quotations, videos and video signals. The display screen and the touch control component are arranged in a stacked mode.
Referring to fig. 1, the touch device 10 includes a touch conductive film 100 and a flexible circuit board 200, wherein the touch conductive film 100 is electrically connected to the flexible circuit board 200. Referring to fig. 2, the touch conductive film 100 is a double-sided circuit single-layer film structure. Specifically, the touch conductive film 100 includes a transparent substrate 110, a first conductive layer 120, a first electrode lead 130, a first lead 140, a second conductive layer 150, a second electrode lead 160, a second lead 170, and a connector 180.
The transparent substrate 110 includes a first surface 111 and a second surface 112 opposite to the first surface 111. The transparent substrate 110 may be made of transparent glass or transparent PET.
The first conductive layer 120 is disposed on the first surface 111 of the transparent substrate 110. In this embodiment, the first conductive layer 120 may be formed by exposing, developing and etching a transparent conductive material. For example, the first conductive layer 120 may be a transparent material such as ITO. The first conductive layer 120 includes a plurality of first conductive patterns 121 in a shape of a long bar, and the plurality of first conductive patterns 121 are disposed in parallel at intervals.
The first electrode lead 130 is disposed on the first surface 111, and one end of the first electrode lead 130 is connected to the first conductive layer 120, so that the first electrode lead 130 is electrically connected to the first conductive layer 120. Specifically, the number of the first electrode leads 130 is plural, and one end of one first electrode lead 130 is connected to one first conductive pattern 121. The first electrode lead 130 and the first conductive pattern 121 are located in the first surface 111.
The first lead 140 is disposed on the first surface 111, and the first lead 140 is connected to the other end of the first electrode lead 130. Accordingly, the number of the first pins 140 corresponds to the number of the first electrode leads 130, and the first conductive pattern 121 is electrically connected to the first pins 140 through the first electrode leads 130. The first pin 140 is used to bind with the flexible circuit board 200.
The second conductive layer 150 is disposed on the second surface 112 of the transparent substrate 110, so that the first conductive layer 120 and the second conductive layer 150 are respectively located on different sides of the transparent substrate 110. The second conductive layer 150 may be formed of a transparent conductive material by an exposure-development-etching process. For example, the second conductive layer 150 may be a transparent material such as ITO. The second conductive layer 150 includes a plurality of second conductive patterns 151 in a bar shape, and the plurality of second conductive patterns 151 are disposed in parallel at intervals.
The second electrode lead 160 is disposed on the second surface 112, and one end of the second electrode lead 160 is connected to the second conductive layer 150, so that the second electrode lead 160 is electrically connected to the second conductive layer 150. Specifically, the number of the second electrode leads 160 is plural, and one end of one second electrode lead 160 is connected to one second conductive pattern 151. The second electrode lead 160 and the second conductive pattern 151 are located in the second surface 112.
The second leads 170 are disposed on the first surface 111, so that the second leads 170 and the first leads 140 are disposed on the same side of the transparent substrate 110. The transparent substrate 110 has a through hole 110a penetrating through the first surface 111 and the second surface 112 at a position corresponding to the second lead 170, and the through hole 110a is filled with a conductive material to form the connecting member 180. Therefore, the connection member 180 has conductivity. The other end of the second electrode lead 160 is electrically connected to the second pin 170 through a connection member 180.
Specifically, the through-hole 110a has a cylindrical shape, which facilitates the adhesion of the conductive material on the wall of the through-hole 110 a. The conductive material may be a metallic material.
The number of the second leads 170 is plural, and a second lead 170 is electrically connected to a second electrode lead 160. The plurality of second pins 170 are distributed on the first surface 111 at intervals, and the through holes 110a formed in the transparent substrate 110 corresponding to each second pin 170 are staggered with each other. That is, the through holes 110a on the transparent substrate 110 are not aligned, so as to prevent the transparent substrate 110 from being cracked due to stress concentration after the hole is formed.
In the embodiment shown in fig. 3, the through hole 110a penetrates through the second lead 170, and the connecting member 180 extends to penetrate through the second lead 170, so that the connecting member 180 is embedded in the second lead 170. The conductive performance of the connecting member 180 and the second pins 170 can be increased, and the adhesion between the connecting member 180 and the transparent substrate 110 and the adhesion between the second pins 170 and the transparent substrate 110 can also be increased.
The second surface 112 is further provided with a connection block 190, the connection block 190 having a width greater than that of the second electrode lead 160, and the other end of the second electrode lead 160 is connected to the connection member 180 through the connection block 190. Since the width of the connection block 190 is greater than that of the second electrode lead 160, when the second electrode lead 160 is connected to the connection member 180 through the connection block 190, the contact area of the connection member 180 with the connection block 190 can be increased, thereby ensuring the electrical conductivity of the second electrode lead 160 with the connection block 190.
The flexible circuit board 200 is provided with a third pin (not shown) and a fourth pin 210, and the third pin and the fourth pin 210 are located on the same side of the flexible circuit board 200. The first pin 140 and the third pin are bound to each other to realize electrical connection, and the second pin 170 and the fourth pin 210 are bound to each other to realize electrical connection.
Specifically, a first conductive adhesive layer is disposed between the first pin 140 and the third pin, and the first conductive adhesive layer has both conductivity and viscosity, so that the viscosity between the first pin 140 and the third pin can be ensured, and the conductivity between the first pin 140 and the third pin can be ensured. The first conductive adhesive layer may be a conductive particle adhesive.
A second conductive adhesive layer 300 is disposed between the second pin 170 and the fourth pin 210, and the second conductive adhesive layer 300 has both conductivity and viscosity, so that the viscosity between the second pin 170 and the fourth pin 210 and the conductivity between the second pin 170 and the fourth pin 210 can be ensured. The second conductive adhesive layer 300 may be a conductive particle adhesive.
In the embodiment shown in fig. 3, the through hole 110a penetrates through the second conductive adhesive layer 300, and the connecting member 180 extends through the second lead 170 to be directly connected to the fourth lead 210.
Referring to fig. 4, in the present embodiment, the touch conductive film 100 further includes a first insulating protection layer 410, a first adhesive layer 420, a second insulating protection layer 430 and a second adhesive layer 440.
The first insulating protection layer 410 covers the first conductive layer 120 and the surface of the first electrode lead 130. Specifically, the area of the first insulating protection layer 410 is larger than the area of the whole functional circuit formed by the first conductive layer 120 and the first electrode lead 130, so as to ensure that the first insulating protection layer 410 protects the first conductive layer 120 and the first electrode lead 130, protect the circuit from oxidation, isolate moisture, and improve the reliability of the product. The first insulating protective layer 410 may be formed of an insulating ink or a photosensitive resin dry film.
The first adhesive layer 420 is disposed on the first surface 111 of the transparent substrate 110, and the first adhesive layer 420 is disposed around the edge of the first insulating protection layer 410 and between the edge of the first insulating protection layer 410 and the first surface 111 of the transparent substrate 110. The edge of the first insulating protection layer 410 is attached to the first surface 111 of the transparent substrate 110 through a first adhesive layer 420, and the first adhesive layer 420 is used for increasing the adhesion between the first insulating protection layer 410 and the transparent substrate.
The first adhesive layer 420 is spaced apart from the first conductive layer 120. The first adhesive layer 420 and the first conductive layer 120 are made of the same material, and are formed on the first surface 111 of the transparent substrate 110 simultaneously with the first conductive layer 120. Because the added first adhesive layer 420 and the first conductive layer 120 are made of the same material and are made of the transparent conductive material, and the first adhesive layer 420 is not connected with the first conductive layer 120, the influence of the peripheral static electricity on the first conductive layer 120 can be isolated, and the first adhesive layer 420 and the first conductive layer 120 are formed simultaneously through the same process, so that the process steps can be simplified, and the production efficiency can be improved.
In particular, in the present embodiment, the first adhesive layer 420 includes a plurality of first adhesive blocks 421 disposed at intervals. The first adhesive blocks 421 have a substantially rectangular shape, and the plurality of first adhesive blocks 421 collectively surround the large rectangular shape of the first insulating and protecting layer 410. Therefore, the first insulating protection layer 410 is attached to the transparent substrate through one small rectangular first adhesive block 421, and when one or some of the first adhesive blocks 421 fall off, the whole first insulating protection layer 410 is not affected to fall off from the transparent substrate.
Specifically, in this embodiment, a portion of the first adhesive layer 420 is located between the edge of the first insulating protection layer 410 and the transparent substrate 110, and the remaining portion is exposed out of the first insulating protection layer 410. Therefore, the influence of the static electricity at the periphery on the first conductive layer 120 can be effectively isolated. Of course, in other embodiments, the first adhesive layer 420 may be entirely located between the edge of the first insulating protection layer 410 and the transparent substrate 110, that is, the entire surface of the first adhesive layer 420 is connected to the first insulating protection layer 410, so as to increase the adhesion between the first adhesive layer 420 and the first insulating protection layer 410.
The second insulating protection layer 430 covers the second conductive layer 150 and the surface of the second electrode lead 160. Specifically, the area of the second insulating protection layer 430 is larger than the area of the whole functional circuit formed by the second conductive layer 150 and the second electrode lead 160, so as to ensure that the second insulating protection layer 430 protects the second conductive layer 150 and the second electrode lead 160, protect the circuit from oxidation, isolate moisture, and improve the reliability of the product. The second insulating protective layer 430 may be formed of an insulating ink or a dry film of a photosensitive resin.
The second adhesive layer 440 is disposed on the second surface 112 of the transparent substrate 110, and the second adhesive layer 440 is disposed around the edge of the second insulating protection layer 430 and between the edge of the second insulating protection layer 430 and the second surface 112 of the transparent substrate 110. The edge of the second insulating protection layer 430 is attached to the second surface 112 of the transparent substrate 110 by a second adhesive layer 440, and the second adhesive layer 440 is used to increase the adhesion between the second insulating protection layer 430 and the transparent substrate.
The second adhesive layer 440 is spaced apart from the second conductive layer 150. The second adhesive layer 440 and the second conductive layer 150 are made of the same material, and are formed on the second surface 112 of the transparent substrate 110 simultaneously with the second conductive layer 150. Because the added second adhesive layer 440 and the second conductive layer 150 are made of the same material and are made of transparent conductive materials, and the second adhesive layer 440 is not connected with the second conductive layer 150, the influence of peripheral static electricity on the second conductive layer can be simultaneously isolated, and the second adhesive layer 440 and the second conductive layer 150 are simultaneously formed through the same process, so that the process steps can be simplified, and the production efficiency can be improved.
In this embodiment, the second adhesive layer 440 includes a plurality of spaced second adhesive blocks (not shown). The second adhesive blocks are substantially rectangular, and a plurality of the second adhesive blocks collectively surround the large rectangular shape of the second insulating protective layer 430. Therefore, the second insulating and protecting layer 430 is attached to the transparent substrate by a small rectangular second adhesive block, and when one or some of the second adhesive blocks are peeled off, the whole second insulating and protecting layer 430 is not affected to be peeled off from the transparent substrate.
Specifically, in this embodiment, a portion of the second adhesive layer 440 is located between the edge of the second insulating protection layer 430 and the transparent substrate 110, and the remaining portion is exposed out of the second insulating protection layer 430. Therefore, the influence of the static electricity at the periphery on the second conductive layer 150 can be effectively isolated. Of course, in other embodiments, the second adhesive layer 440 may be entirely located between the edge of the second insulating protection layer 430 and the transparent substrate 110, that is, the entire surface of the second adhesive layer 440 is connected to the second insulating protection layer 430, so as to increase the adhesion between the second adhesive layer 440 and the second insulating protection layer 430.
The first adhesive layer 420 surrounding the edge of the first insulating protection layer 410 is arranged, the first adhesive layer 420 is located between the edge of the first insulating protection layer 410 and the transparent substrate 110, the edge of the first insulating protection layer 410 is attached to the transparent substrate 110 through the first adhesive layer 420, the second adhesive layer 440 surrounding the edge of the second insulating protection layer 430 is arranged, the second adhesive layer 440 is located between the edge of the second insulating protection layer 430 and the transparent substrate 110, the edge of the second insulating protection layer 430 is attached to the transparent substrate 110 through the second adhesive layer 440, therefore, the first adhesive layer 420, the adhesive force between the second adhesive layer 440 and the transparent substrate 110, the first insulating protection layer 410 and the first adhesive layer 420, the adhesive force between the second insulating protection layer 430 and the second adhesive layer 440 is larger than the first insulating protection layer 410, the adhesive force when the second insulating protection layer 430 is directly attached to the transparent substrate 110, the first adhesive layer 420 and the second adhesive layer 440 have certain thickness, the first insulating protection layer 410, the tensile force generated at the edge of the second insulating protection layer 430 is smaller than the first insulating protection layer 410, the tensile force generated at the edge of the second insulating protection layer 430 is directly attached to the transparent substrate 110, and the appearance of the second insulating protection layer 410 can be effectively prevented from falling off.
The touch device 10 and the touch conductive film 100 thereof have the following advantages:
the through hole 110a is formed in the transparent substrate 110 corresponding to the second pin 170, and the through hole 110a is filled with a conductive material to form a connecting member 180, so that the end of the second electrode lead 160 on the second surface 112 is electrically connected to the second pin 170 on the first surface 111 through the conductive connecting member 180 formed in the through hole 110a, and the second pin 170 and the first pin 140 are both located on the first surface 111, so that when the flexible circuit board 200 is bonded, the touch conductive film 100 does not need to be reversed, the bonding operation time is optimized, the technical requirement for bonding equipment is reduced, and the equipment cost is reduced.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A touch conductive film, comprising:
the transparent substrate comprises a first surface and a second surface opposite to the first surface;
the first conducting layer is arranged on the first surface of the transparent substrate;
the first electrode lead is arranged on the first surface, and one end of the first electrode lead is connected with the first conducting layer;
the first pin is arranged on the first surface and is connected with the other end of the first electrode lead;
the second conducting layer is arranged on the second surface of the transparent substrate;
the second electrode lead is arranged on the second surface, and one end of the second electrode lead is connected with the second conducting layer; the transparent substrate is provided with a through hole penetrating through the first surface and the second surface corresponding to the second pin, a conductive material is filled in the through hole to form a connecting piece, and the other end of the second electrode lead is electrically connected with the second pin through the connecting piece;
the through hole penetrates through the second pin.
2. The touch conductive film of claim 1, further comprising: the first insulating protective layer is covered on the first conductive layer and the surface of the first electrode lead;
the first bonding layer is arranged on the first surface of the transparent substrate, is arranged around the edge of the first insulating protection layer and is positioned between the edge of the first insulating protection layer and the first surface of the transparent substrate, the edge of the first insulating protection layer is attached to the first surface of the transparent substrate through the first bonding layer, and the first bonding layer and the first conductive layer are arranged at intervals;
the second insulating protective layer is covered on the second conducting layer and the surface of the second electrode lead; and the second bonding layer is arranged on the second surface of the transparent substrate, the second bonding layer is arranged around the edge of the second insulating protection layer and is positioned between the edge of the second insulating protection layer and the second surface of the transparent substrate, the edge of the second insulating protection layer is attached to the second surface of the transparent substrate through the second bonding layer, and the second bonding layer and the second conducting layer are arranged at intervals.
3. The touch conductive film of claim 1, wherein the number of the second pins is multiple, the second pins are distributed on the first surface at intervals, and the transparent substrate is disposed in a staggered manner with respect to the through holes formed at the positions corresponding to the second pins.
4. The touch conductive film of claim 1, wherein the connecting member extends through the second pin.
5. The touch conductive film of claim 1, wherein the second surface is further provided with a connection block, the width of the connection block is larger than that of the second electrode lead, and the other end of the second electrode lead is connected to the connection member through the connection block.
6. A touch assembly, comprising:
the flexible circuit board is provided with a third pin and a fourth pin, and the third pin and the fourth pin are positioned on the same side of the flexible circuit board; the touch conductive film according to any one of claims 1 to 5, wherein the first pin and the third pin are bonded to each other to achieve electrical connection, and the second pin and the fourth pin are bonded to each other to achieve electrical connection.
7. The touch assembly of claim 6, wherein a first conductive adhesive layer is disposed between the first lead and the third lead; and a second conductive adhesive layer is arranged between the second pin and the fourth pin.
8. The touch-control assembly of claim 7, wherein the through hole penetrates through the second conductive adhesive layer, and the connecting member extends through the second pin to directly connect with the fourth pin.
9. A touch display screen, comprising:
a display screen and the touch device of any one of claims 6-8, wherein the display screen and the touch device are stacked.
10. An electronic device, comprising:
the touch display screen of claim 9.
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| CN201610871706.4A CN106648202B (en) | 2016-09-30 | 2016-09-30 | Electronic equipment, touch display screen, touch assembly and touch conductive film |
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| CN201610871706.4A CN106648202B (en) | 2016-09-30 | 2016-09-30 | Electronic equipment, touch display screen, touch assembly and touch conductive film |
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| CN106648202B true CN106648202B (en) | 2023-03-28 |
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| CN107368215B (en) * | 2017-06-01 | 2020-12-01 | 昆山龙腾光电股份有限公司 | Touch panel, preparation method thereof and display device |
| CN107195755A (en) * | 2017-06-30 | 2017-09-22 | 深圳市联建光电股份有限公司 | A kind of flexible and transparent LED display and its processing method |
| CN107422918B (en) * | 2017-08-04 | 2020-12-08 | 业成科技（成都）有限公司 | Touch sensing structure and manufacturing method thereof |
| CN107544185B (en) * | 2017-09-25 | 2020-08-18 | 京东方科技集团股份有限公司 | Array substrate, display panel and display device |
| CN109753175A (en) * | 2017-11-07 | 2019-05-14 | 南昌欧菲显示科技有限公司 | Inductive module and preparation method |
| CN109343748B (en) * | 2018-12-20 | 2022-04-08 | 盈天实业(深圳)有限公司 | Preparation method of flexible touch sensor |
| CN111459334B (en) * | 2020-04-03 | 2024-03-19 | 维沃移动通信有限公司 | Display module and electronic equipment |
| CN111506219A (en) * | 2020-04-21 | 2020-08-07 | 南昌欧菲显示科技有限公司 | Touch sensor and touch display device |
| KR20210131780A (en) * | 2020-04-24 | 2021-11-03 | 동우 화인켐 주식회사 | Touch sensor and image display device including the same |
| CN112462976A (en) * | 2020-12-09 | 2021-03-09 | 业成光电(无锡)有限公司 | Touch control film and manufacturing method thereof |
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