CN106648001A - Server node and whole cabinet server - Google Patents
Server node and whole cabinet server Download PDFInfo
- Publication number
- CN106648001A CN106648001A CN201710015858.9A CN201710015858A CN106648001A CN 106648001 A CN106648001 A CN 106648001A CN 201710015858 A CN201710015858 A CN 201710015858A CN 106648001 A CN106648001 A CN 106648001A
- Authority
- CN
- China
- Prior art keywords
- cpu
- server
- mainboard
- server node
- radiating airflow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/184—Mounting of motherboards
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a server node and a whole cabinet server. The server node comprises a server case, a main board and at least two CPUs, wherein the server case is provided with at least one channel, the main board is installed in the server case, the at least two CPUs are fixed to the main board, cooling air flow enters the server case from the at least one channel, and the positions of the at least two CPUs on the main board meet the requirement that the connection line of the centers of the two CPUs is different from the flowing direction of the cooling air flow. Because the connection line of the centers of the two CPUs is different from the flowing direction of the cooling air flow, the cooling air flow can pass through all the CPUs at the same time, the situation that the cooling air flow located in the rear CPU is heated when passing through the front CPU is not caused, each CPU has a good cooling environment, and the cooling capacity of the server node can be improved.
Description
Technical field
The present invention relates to field of computer technology, more particularly to a kind of server node and whole machine cabinet server.
Background technology
With developing rapidly for scientific and technological and Internet technology, the range of application of server constantly expands, and to service
The performance requirement more and more higher of device, whole machine cabinet server arises at the historic moment.Whole machine cabinet server mainly passes through each server node
On CPU (Central Processing Unit, central processing unit) be operated together the maximization for realizing system operation ability.
At present, the CPU on each server node of whole machine cabinet server adopts tandem layout type, cold wind
CPU above is first passed through after from the air inlet of whole machine cabinet server into server node, CPU below is then passed to again.
The distinguished and admirable heating that can be passed through in CPU above of so place CPU later so that the heat dissipation environment of place CPU later
Badly, cause the heat-sinking capability of server node poor.
The content of the invention
Embodiments provide a kind of server node and whole machine cabinet server, it is possible to increase server node dissipate
Heat energy power.
In a first aspect, embodiments providing a kind of server node, the server node includes：With at least one
The machine box for server in individual duct, mainboard and at least two CPU, wherein,
The mainboard is arranged on inside the machine box for server；
Each described duct, for connecting the inside and outside of the machine box for server, so that the machine box for server
Outside radiating airflow is entered inside the machine box for server；
At least two CPU is fixed on the mainboard；
Positions of at least two CPU on the mainboard meets：
The line that there is the center of two CPU is different from the flow direction of the radiating airflow.
Preferably, including：
Two CPU；
Positions of described two CPU on the mainboard meets：
The line at the center of described two CPU is with the scope of the angle of the flow direction of the radiating airflow：[45 °,
90°]。
Preferably, including：
Positions of described two CPU on the mainboard meets：
The line at the center of described two CPU is vertical with the flow direction of the radiating airflow.
Preferably, including：Multiple CPU；
The plurality of CPU is centrally located on same straight line；
Positions of the plurality of CPU on the mainboard meets：
The line at the center of the plurality of CPU is with the scope of the angle of the flow direction of the radiating airflow：[45 °,
90°]。
Preferably, including：
Positions of the plurality of CPU on the mainboard meets：
The line at the center of the plurality of CPU is vertical with the flow direction of the radiating airflow.
Preferably, the mainboard, including：L-shaped overall with two-way mainboard.
Preferably, " I " section in the L-shaped overall with two-way mainboard on the left of L-shaped is hung down with the flow direction of the radiating airflow
Directly；"-" section on the right side of L-shaped is identical with the flow direction of the radiating airflow.
Preferably, the server node is further included：Power supply pinboard and at least one hard disk；
The power supply pinboard is located at " I " section of the L-shaped overall with two-way mainboard and the angle of "-" section；
At least one hard disk and the power supply pinboard arranged adjacent；
Position of at least one hard disk on the mainboard meets：
The line of centres of hard disk described in any two is vertical with the flow direction of the radiating airflow.
Preferably, the server node is further included：Power-feed connector, wherein,
The power-feed connector is fixed on the machine box for server corresponding to outside power connector, so that the confession
The power connector docking of electric connector and the outside, the power connector for making the outside is supplied to the power-feed connector
Electricity.
Preferably, the server node is further included：Telecommunication management interface, wherein,
The telecommunication management interface is fixed on the machine box for server corresponding to outside communication interface, so that described logical
Letter management interface is docked with the communication interface of the outside.
Preferably, one or more be further fixed with the mainboard in internal memory, radiator and PCIE expansion cards.
Second aspect, embodiments provides a kind of whole machine cabinet server, and the whole machine cabinet server includes：Including：
Arbitrary described server node in cabinet, refrigerating plant and at least one claim 1 to 9, wherein,
The cabinet, for accommodating at least one server node；
The refrigerating plant, for providing radiating airflow, so that the radiating airflow is from least one server section
At least one duct of point is entered inside the machine box for server of the server node.
A kind of server node and whole machine cabinet server are embodiments provided, the server node includes having extremely
Lack machine box for server, mainboard and at least two CPU in a duct, by the way that mainboard is arranged on inside machine box for server, at least
Two CPU are fixed on mainboard, and radiating airflow is entered inside machine box for server from least one duct, and at least two CPU are leading
Position on plate meets：The line that there is the center of two CPU is different from the flow direction of radiating airflow.Due to there is two
The line at the center of CPU is different from the flow direction of radiating airflow, and radiating airflow can simultaneously pass through each CPU, so not
Can the radiating of the place of causing CPU later distinguished and admirable heated when in CPU above so that each CPU have compared with
Good heat dissipation environment, therefore, it is possible to improve the heat-sinking capability of server node.
Description of the drawings
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
The accompanying drawing to be used needed for having technology description is briefly described, it should be apparent that, drawings in the following description are the present invention
Some embodiments, for those of ordinary skill in the art, on the premise of not paying creative work, can be with basis
These accompanying drawings obtain other accompanying drawings.
Fig. 1 is a kind of structural representation of server node that one embodiment of the invention is provided；
Fig. 2-1 is a kind of structural representation of server node of the prior art；
Fig. 2-2 is the structural representation of another kind of server node that one embodiment of the invention is provided；
Fig. 3 is the structural representation of another server node that one embodiment of the invention is provided；
Fig. 4 is the structural representation of another server node that one embodiment of the invention is provided；
Fig. 5 is a kind of structural representation of L-shaped overall with two-way mainboard that one embodiment of the invention is provided；
Fig. 6 is the structural representation of another server node that one embodiment of the invention is provided；
Fig. 7 is the structural representation of another server node that one embodiment of the invention is provided；
Fig. 8 is a kind of structural representation of whole machine cabinet server that one embodiment of the invention is provided.
Specific embodiment
To make purpose, technical scheme and the advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention
In accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is
The a part of embodiment of the present invention, rather than the embodiment of whole, based on the embodiment in the present invention, those of ordinary skill in the art
The every other embodiment obtained on the premise of creative work is not made, belongs to the scope of protection of the invention.
A kind of server node is embodiments provided, the server node can include：With at least one hole
The machine box for server in road, mainboard and at least two CPU, wherein,
The mainboard is arranged on inside the machine box for server；
Each described duct, for connecting the inside and outside of the machine box for server, so that the machine box for server
Outside radiating airflow is entered inside the machine box for server；
At least two CPU is fixed on the mainboard；
Positions of at least two CPU on the mainboard meets：
The line that there is the center of two CPU is different from the flow direction of the radiating airflow.
In the above-described embodiments, by the way that mainboard is arranged on inside machine box for server, at least two CPU are fixed on mainboard
On, radiating airflow is entered inside machine box for server from least one duct, and positions of at least two CPU on mainboard meets：Deposit
It is different in the line at the center of two CPU and the flow direction of radiating airflow.Due to exist two CPU center line with dissipate
The flow direction of thermal current is different, and radiating airflow can simultaneously pass through each CPU, the so place of not resulting in CPU later
Radiating distinguished and admirable heated when in CPU above so that each CPU has preferable heat dissipation environment, therefore energy
Enough improve the heat-sinking capability of server node.
What deserves to be explained is, by making the line at center of two CPU different from the flow direction of radiating airflow, preferably
The cooling requirements to node server internal heat generation part are met, while the temperature of radiating airflow can be properly increased, is reduced and is
System energy consumption.
As shown in figure 1, in an embodiment of the invention, the server node can include：With at least one duct
Machine box for server 101, mainboard 102 and two CPU 103, wherein,
The mainboard 102 is arranged on inside the machine box for server 101；
Each described duct, for connecting the inside and outside of the machine box for server 101, so that the server machine
Radiating airflow outside case 101 is entered inside the machine box for server 101；
Described two CPU 103 are fixed on the mainboard 102；
Positions of the described two CPU 103 on the mainboard 102 meets：
The line at the center of two CPU 103 is different from the flow direction of the radiating airflow.
In order to further improve the heat-sinking capability of server node, in an embodiment of the invention, including：
Two CPU；
Positions of described two CPU on the mainboard meets：
The line at the center of described two CPU is with the scope of the angle of the flow direction of the radiating airflow：[45 °,
90°]。
In this embodiment, the server node can be 1U two-way servers, including two CPU.Due to two CPU's
Position relationship, determines the heat dispersal situations of two CPU.Fig. 2 is refer to, in 2-1, in existing machine box for server 201, two
The position relationship of individual CPU is in front and back to place two CPU on mainboard 202, that is, the line at the center of two CPU and radiating
The flow direction of air-flow is identical, and the line of figure kind A and 2 points of B is exactly the line at the center of two CPU, and radiating airflow just occurs
A CPU 203 is first passed through and then through the 2nd CPU 204, so as to affect the radiating of the 2nd CPU204.In 2-2, this
In the server node of bright offer, in existing machine box for server 205, the position relationship of two CPU is to lead two CPU
Left and right is placed on plate 206, that is, the line at the center of two CPU is different from the flow direction of radiating airflow, figure kind C and D two
The line of point is exactly the line at the center of two CPU, and in order to ensure the radiating effect of the 3rd CPU 207 and the 4th CPU 208,
So that the line at the center of two CPU is with the scope of the angle of the flow direction of radiating airflow：[45 °, 90 °].
In order that two rejecting heat to for CPU reach optimum, in an embodiment of the invention, including：
Positions of described two CPU on the mainboard meets：
The line at the center of described two CPU is vertical with the flow direction of the radiating airflow.
In this embodiment so that the line at the center of two CPU is vertical with the flow direction of radiating airflow, works as heat transmission gas
Stream is entered behind machine box for server inside from least one duct, while through two CPU, so that the radiating of two CPU reaches
Optimum state.Refer to Fig. 3, the line between the line i.e. M and N at the center of two CPU, the stream with the radiating airflow
Dynamic direction is vertical.
In order to further improve the heat-sinking capability of server node, in an embodiment of the invention, including：Multiple CPU；
The plurality of CPU is centrally located on same straight line；
Positions of the plurality of CPU on the mainboard meets：
The line at the center of the plurality of CPU is with the scope of the angle of the flow direction of the radiating airflow：[45 °,
90°]。
In this embodiment, for multipath server, have a case that multiple CPU are equally applicable.Multiple CPU refer to CPU's
Quantity is more than or equal to 3.
What deserves to be explained is, the center of multiple CPU is not located on the same line, but the center of two neighboring CPU
Line is with the scope of the angle of the flow direction of radiating airflow：[45 °, 90 °], equally with good radiating, therefore also may be used
To be suitable for.
In order that rejecting heat to for multiple CPU reaches optimum, in an embodiment of the invention, including：The plurality of CPU is in institute
The position stated on mainboard meets：
The line at the center of the plurality of CPU is vertical with the flow direction of the radiating airflow.
In this embodiment, the center of multiple CPU can be only positioned on same straight line, now when radiating airflow is from least one
Individual duct is entered behind machine box for server inside, while through multiple CPU, so that the radiating of multiple CPU is optimal state.Its
In, multiple CPU refer to the quantity of CPU and are more than or equal to 3.
As shown in figure 4, the manufacture of server node for convenience, the mainboard, including：L-shaped overall with two-way mainboard 1021.
In this embodiment, need not move through cutting using the L-shaped overall with two-way mainboard of standard directly to use, can simplify
The manufacturing process of server node, improves manufacture efficiency.But according to the actual requirements, cutting can be carried out to mainboard.Institute in figure
Show only schematic diagram, it is not proportional to actual size.
In order to ensure the heat dissipation environment of mainboard, in one embodiment of the invention, L in the L-shaped overall with two-way mainboard
" I " section on the left of shape is vertical with the flow direction of the radiating airflow；The flowing of the "-" section on the right side of L-shaped and the radiating airflow
Direction is identical.
In this embodiment, in order to clearly describe the shape of L-shaped overall with two-way mainboard, refer to Fig. 5.In Figure 5,501
" I " section in for characterizing L-shaped overall with two-way mainboard on the left of L-shaped, 502 are used to characterize in L-shaped overall with two-way mainboard on the right side of L-shaped
"-" section." I " section that generally CPU is fixed in L-shaped overall with two-way mainboard, due to CPU radiate it is larger, can be to other devices on mainboard
Part is impacted, and now, "-" section is located at the upstream of radiating airflow flow direction.
As shown in fig. 6, in order to make full use of the space in machine box for server, in an embodiment of the invention, further
Including：Power supply pinboard 601；
The power supply pinboard 601 is located at " I " section of the L-shaped overall with two-way mainboard 1021 and the angle of "-" section.
In this embodiment, on the one hand power supply pinboard is positioned over into the corner of L-shaped overall with two-way mainboard, can be abundant
Using the space in machine box for server；On the other hand power supply pinboard is positioned over the upstream of radiating airflow, radiating airflow elder generation is made
Through pinboard of powering again through CPU, CPU is first passed through so as to efficiently avoid radiating airflow, after radiating airflow is heated again
Through pinboard of powering so that the radiating airflow with higher temperature causes pinboard high temperature dwell of powering through power supply pinboard
Shield is so that quit work.
In order to make full use of the space in machine box for server, in an embodiment of the invention, further include：At least one
Individual hard disk；
At least one hard disk and the power supply pinboard arranged adjacent；
Position of at least one hard disk on the mainboard meets：
The line of centres of hard disk described in any two is vertical with the flow direction of the radiating airflow.
In this embodiment, on the one hand by hard disk and power supply pinboard be placed adjacent in the turning of L-shaped overall with two-way mainboard
Place, can make full use of the space in machine box for server；On the other hand hard disk is positioned over the upstream of radiating airflow flow direction,
Make radiating airflow first pass through hard disk again through CPU, so as to efficiently avoid radiating airflow CPU is first passed through, radiating airflow is added
Again through hard disk after heat so that the radiating airflow with higher temperature is through hard disk.And the center for making any two hard disk connects
Line is vertical with the flow direction of radiating airflow, and radiating airflow can be made simultaneously through hard disk, makes the heat dissipation environment of each hard disk
It is all optimised.
As shown in fig. 7, in an embodiment of the invention, further include：Two hard disks 701；
Described two hard disks 701 and the power supply arranged adjacent of pinboard 601；
Position of the described two hard disks 701 on the mainboard meets：
The line of centres of two hard disks 701 is vertical with the flow direction of the radiating airflow.
Server node is applied in whole machine cabinet server in order to good, in an embodiment of the invention,
The server node may further include：Telecommunication management interface (not shown), wherein,
The telecommunication management interface is fixed on the machine box for server corresponding to outside communication interface, so that described logical
Letter management interface is docked with the communication interface of the outside.
In this embodiment, by arrange telecommunication management interface, and the position of telecommunication management interface then with whole machine cabinet service
Communication interface correspondence on device so that telecommunication management interface and the perfect docking of communication interface, so that server node and whole machine
Cabinet server is connected.
Server node is applied in whole machine cabinet server in order to good, in an embodiment of the invention,
The server node may further include：Power-feed connector (not shown), wherein,
The power-feed connector is fixed on the machine box for server corresponding to outside power connector, so that the confession
The power connector docking of electric connector and the outside, the power connector for making the outside is supplied to the power-feed connector
Electricity.
In this embodiment, by arranging power-feed connector, it is connected with power connector in whole machine cabinet server, from whole machine
Power taking in cabinet server.Wherein, power-feed connector can be Power Clip, and power connector can be copper bar.Therefore, will
When server node is put into whole machine cabinet server, the position of power-feed connector will dock with power connector perfection, so that for
Electric connector is connected with the copper bar of whole machine cabinet server, completes the connection of circuit.
In order to ensure server node normal work, internal memory, radiator and PCIE are further fixed with the mainboard and are expanded
One or more of Zhan Kazhong.
In this embodiment, internal memory, the quantity of radiator and PCIE expansion cards and position can be according to actual conditions, users
Sets itself.
A kind of whole machine cabinet server is embodiments provided, the whole machine cabinet server can include：Including：Cabinet,
The server node that refrigerating plant and at least one any one embodiment of the invention are provided, wherein,
The cabinet, for accommodating at least one server node；
The refrigerating plant, for providing radiating airflow, so that radiating airflow is from least one server node
At least one duct is entered inside the machine box for server of the server node.
As shown in figure 8, in an embodiment of the invention, the whole machine cabinet server can include：Cabinet 801, refrigeration dress
The server node 803 of 802 and any one embodiment offer of the invention is provided, wherein,
The cabinet 801, for accommodating the server node 803；
The refrigerating plant 802, for providing radiating airflow so that radiating airflow from the server node 803 to
A few duct is entered inside the machine box for server of the server node.
To sum up, various embodiments of the present invention, at least have the advantages that：
1st, in an embodiment of the present invention, by the way that mainboard is arranged on inside machine box for server, at least two CPU are fixed on
On mainboard, radiating airflow is entered inside machine box for server from least one duct, and positions of at least two CPU on mainboard is expired
Foot：The line that there is the center of two CPU is different from the flow direction of radiating airflow.Due to the company at the center that there is two CPU
Line is different from the flow direction of radiating airflow, and radiating airflow can pass through each CPU, the so place of not resulting in later simultaneously
The radiating of CPU distinguished and admirable heated when in CPU above so that each CPU has preferable heat dissipation environment, because
This can improve the heat-sinking capability of server node.
2nd, in embodiments of the present invention, by making two or the flowing side of line to the center of individual CPU and radiating airflow
To difference, the cooling requirements to node server internal heat generation part are preferably met, while radiating airflow can be properly increased
Temperature, reduces system energy consumption.
3rd, in embodiments of the present invention, by the way that by mainboard, hard disk, cable, power supply pinboard is arranged in machine box for server,
Complete cabinet assembling；CPU, internal memory, cpu heat are required installed in the relevant position of mainboard according to assembling, part peace is completed
Dress.Server node is normally used.
4th, in embodiments of the present invention, by making the line at the center of two or more CPU and the flowing side of radiating airflow
To vertical, the lifting of the power consumption by 135W, 145W to 165W, 205W of CPU can be met, can effectively meet the radiating of CPU
Pressure.
It should be noted that herein, such as first and second etc relational terms are used merely to an entity
Or operation makes a distinction with another entity or operation, and not necessarily require or imply presence between these entities or operation
Any this actual relation or order.And, term " including ", "comprising" or its any other variant are intended to non-
Exclusiveness is included, so that a series of process, method, article or equipment including key elements not only includes those key elements,
But also including other key elements being not expressly set out, or also include solid by this process, method, article or equipment
Some key elements.In the absence of more restrictions, the key element for being limited by sentence "including a ...", it is not excluded that including
Also there is other identical factor in the process of the key element, method, article or equipment.
One of ordinary skill in the art will appreciate that：Realizing all or part of step of said method embodiment can pass through
Completing, aforesaid program can be stored in the storage medium of embodied on computer readable the related hardware of programmed instruction, the program
Upon execution, the step of including said method embodiment is performed；And aforesaid storage medium includes：ROM, RAM, magnetic disc or light
Disk etc. is various can be with the medium of store program codes.
It is last it should be noted that：Presently preferred embodiments of the present invention is the foregoing is only, the skill of the present invention is merely to illustrate
Art scheme, is not intended to limit protection scope of the present invention.All any modifications made within the spirit and principles in the present invention,
Equivalent, improvement etc., are all contained in protection scope of the present invention.
Claims (10)
1. a kind of server node, it is characterised in that include：Machine box for server with least one duct, mainboard and at least
Two CPU, wherein,
The mainboard is arranged on inside the machine box for server；
Each described duct, for connecting the inside and outside of the machine box for server, so that outside the machine box for server
Radiating airflow enter the machine box for server inside；
At least two CPU is fixed on the mainboard；
Positions of at least two CPU on the mainboard meets：
The line that there is the center of two CPU is different from the flow direction of the radiating airflow.
2. server node according to claim 1, it is characterised in that include：
Two CPU；
Positions of described two CPU on the mainboard meets：
The line at the center of described two CPU is with the scope of the angle of the flow direction of the radiating airflow：[45 °, 90 °].
3. server node according to claim 2, it is characterised in that include：
Positions of described two CPU on the mainboard meets：
The line at the center of described two CPU is vertical with the flow direction of the radiating airflow.
4. server node according to claim 1, it is characterised in that include：Multiple CPU；
The plurality of CPU is centrally located on same straight line；
Positions of the plurality of CPU on the mainboard meets：
The line at the center of the plurality of CPU is with the scope of the angle of the flow direction of the radiating airflow：[45 °, 90 °].
5. server node according to claim 4, it is characterised in that include：
Positions of the plurality of CPU on the mainboard meets：
The line at the center of the plurality of CPU is vertical with the flow direction of the radiating airflow.
6. server node according to claim 3, it is characterised in that the mainboard, including：L-shaped overall with two-way mainboard.
7. server node according to claim 6, it is characterised in that
" I " section in the L-shaped overall with two-way mainboard on the left of L-shaped is vertical with the flow direction of the radiating airflow；On the right side of L-shaped
"-" section is identical with the flow direction of the radiating airflow.
8. server node according to claim 7, it is characterised in that
Further include：Power supply pinboard and at least one hard disk；
The power supply pinboard is located at " I " section of the L-shaped overall with two-way mainboard and the angle of "-" section；
At least one hard disk and the power supply pinboard arranged adjacent；
Position of at least one hard disk on the mainboard meets：
The line of centres of hard disk described in any two is vertical with the flow direction of the radiating airflow.
9. according to the arbitrary described server node of claim 1 to 8, it is characterised in that
Further include：Telecommunication management interface, wherein,
The telecommunication management interface is fixed on the machine box for server corresponding to outside communication interface, so that the communication tube
Reason interface is docked with the communication interface of the outside；
And/or,
Further include：Power-feed connector, wherein,
The power-feed connector is fixed on the machine box for server corresponding to outside power connector, so that described for being electrically connected
The power connector docking of device and the outside is connect, the power connector for making the outside is powered to the power-feed connector；
And/or,
One or more be further fixed with the mainboard in internal memory, radiator and PCIE expansion cards.
10. a kind of whole machine cabinet server, it is characterised in that include：In cabinet, refrigerating plant and at least one claim 1 to 9
Arbitrary described server node, wherein,
The cabinet, for accommodating at least one server node；
The refrigerating plant, for providing radiating airflow, so that the radiating airflow is from least one server node
At least one duct is entered inside the machine box for server of the server node.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710015858.9A CN106648001A (en) | 2017-01-10 | 2017-01-10 | Server node and whole cabinet server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710015858.9A CN106648001A (en) | 2017-01-10 | 2017-01-10 | Server node and whole cabinet server |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106648001A true CN106648001A (en) | 2017-05-10 |
Family
ID=58843830
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710015858.9A Pending CN106648001A (en) | 2017-01-10 | 2017-01-10 | Server node and whole cabinet server |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106648001A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110794930A (en) * | 2019-09-17 | 2020-02-14 | 华为技术有限公司 | Server, floating connector and system |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201904980U (en) * | 2010-11-24 | 2011-07-20 | 汉柏科技有限公司 | Highly space-saving network equipment |
| CN102609042A (en) * | 2012-01-19 | 2012-07-25 | 百度在线网络技术（北京）有限公司 | Whole cabinet and node server thereof |
| CN203689288U (en) * | 2014-01-09 | 2014-07-02 | 曙光信息产业(北京)有限公司 | Complete equipment cabinet and node server of complete equipment cabinet |
| US20150120971A1 (en) * | 2013-10-25 | 2015-04-30 | Samsung Electronics Co., Ltd | Server system and storage system |
| CN106249818A (en) * | 2016-08-01 | 2016-12-21 | 浪潮电子信息产业股份有限公司 | A kind of server node and system |
-
2017
- 2017-01-10 CN CN201710015858.9A patent/CN106648001A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201904980U (en) * | 2010-11-24 | 2011-07-20 | 汉柏科技有限公司 | Highly space-saving network equipment |
| CN102609042A (en) * | 2012-01-19 | 2012-07-25 | 百度在线网络技术（北京）有限公司 | Whole cabinet and node server thereof |
| US20150120971A1 (en) * | 2013-10-25 | 2015-04-30 | Samsung Electronics Co., Ltd | Server system and storage system |
| CN203689288U (en) * | 2014-01-09 | 2014-07-02 | 曙光信息产业(北京)有限公司 | Complete equipment cabinet and node server of complete equipment cabinet |
| CN106249818A (en) * | 2016-08-01 | 2016-12-21 | 浪潮电子信息产业股份有限公司 | A kind of server node and system |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110794930A (en) * | 2019-09-17 | 2020-02-14 | 华为技术有限公司 | Server, floating connector and system |
| CN110794930B (en) * | 2019-09-17 | 2021-10-01 | 华为技术有限公司 | Server, floating connector and system |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8437129B2 (en) | Server cabinet | |
| US8514575B2 (en) | Multimodal cooling apparatus for an electronic system | |
| CN103687446B (en) | The high efficiency and heat radiation air-conditioning system of rack-mount server rack | |
| CN203951720U (en) | A kind of IDC heat dissipation system for computer room | |
| US20130077223A1 (en) | Server | |
| CN107656588B (en) | Server system with optimized heat dissipation and installation method | |
| CN108235655B (en) | Easy-to-plug server cabinet adopting liquid cooling heat dissipation | |
| CN105759926A (en) | Server framework integrating air cooling and liquid cooling | |
| WO2021129889A1 (en) | Heat dissipating panel for chip heat dissipation, server heat dissipating system, and heating apparatus | |
| CN102331044A (en) | Machine room energy-saving system | |
| CN104503556A (en) | Air cooling and liquid cooling combination-based redundant backup server radiation system | |
| CN104423504A (en) | Server | |
| CN107515657A (en) | A kind of liquid-cooled suit business device containing preposition liquid-cooled air-cooling apparatus | |
| CN104684356A (en) | Heat radiation structure and LED (light emitting diode) splicing display screen | |
| CN107479677B (en) | Intelligent temperature control computer case | |
| US8325482B2 (en) | Cooling apparatus for server rack | |
| CN203689288U (en) | Complete equipment cabinet and node server of complete equipment cabinet | |
| CN106648001A (en) | Server node and whole cabinet server | |
| CN104156037A (en) | High-density micro server based on cloud services | |
| CN212623908U (en) | Novel server framework | |
| CN104793717A (en) | Radiating method and radiating device of blade server | |
| CN101807100A (en) | High-density rack server radiating system | |
| TW201947350A (en) | Water cooling system using for rack server | |
| CN109922634A (en) | Cabinet-type cooling system | |
| CN114710931A (en) | Refrigerating system and liquid cooling rack of data center |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170510 |