CN106644150A - Method and device for determining a temperature at least of a first switching unit and a second switching unit of a control unit and control unit - Google Patents
Method and device for determining a temperature at least of a first switching unit and a second switching unit of a control unit and control unit Download PDFInfo
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- CN106644150A CN106644150A CN201610861095.5A CN201610861095A CN106644150A CN 106644150 A CN106644150 A CN 106644150A CN 201610861095 A CN201610861095 A CN 201610861095A CN 106644150 A CN106644150 A CN 106644150A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
- G01K7/24—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor in a specially-adapted circuit, e.g. bridge circuit
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/42—Circuits effecting compensation of thermal inertia; Circuits for predicting the stationary value of a temperature
- G01K7/427—Temperature calculation based on spatial modeling, e.g. spatial inter- or extrapolation
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- General Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Power Conversion In General (AREA)
- Control Of Electric Motors In General (AREA)
Abstract
The invention relates to a method for determining a temperature at least of a first switching unit and a second switching unit of a control unit by means of a temperature sensor thermally coupled to the first switching unit and the second switching unit. In the method, firstly a temperature value representing a temperature of the temperature sensor, a first power loss value representing a power loss of the first switching unit, a second power loss value representing a power loss of the second switching unit representing a transient thermal resistance of a thermal coupling of the second switching unit and the temperature sensor Second sensor heat value and a circuit heat value representing a transient thermal resistance of a thermal coupling of the first switching unit and the second switching unit. In a further method step, a temperature assist value is determined using the temperature value, the first power loss value and the first sensor heat value. The temperature of the first switching unit is then determined using the temperature auxiliary value, the second power dissipation value and the circuit heat value. In addition or alternatively, the temperature of the second switching unit is determined using the temperature assist value, the first power loss value and the circuit heat value.
Description
Technical field
The present invention relates to a kind of device or method described in independent claims.The object of the present invention is also a kind of computer
Program.
Background technology
The case temperature of MOSFET-B6 bridge circuits is measured generally by critesistor.Microcontroller can for example be passed through
Device analyzes the temperature of critesistor, wherein the switch of B6 electric bridges can be disconnected when more than maximum case temperature.If many
On a circuit board, then each in the B6 electric bridges for example can have such a critesistor to individual B6 electric bridges.
The content of the invention
In this context, with scheme described here according to main claim recommend it is a kind of for by with first switch
The temperature sensor of unit and second switch unit thermal coupling is obtaining at least one first switch unit and second of controller
The method of the temperature of switch element, it is also recommended that a kind of device of use the method, a kind of controller and one kind are corresponding in addition
Computer program.By measure cited in the dependent claims, can be to the device that is given in the independent claim
It is advantageously improved and is improved.
Recommend it is a kind of for by with the temperature sensor of first switch unit and second switch unit thermal coupling obtaining
The method of the temperature of at least one first switch unit and second switch unit of controller, wherein methods described include following step
Suddenly：
Reading represent temperature sensor temperature temperature value, represent first switch unit loss power first loss
Performance number, represent second switch unit loss power the second loss power value, represent first switch unit and temperature sensing
The first sensor calorific value of the transient thermal resistance of the thermal coupling of device, represent second switch unit and temperature sensor thermal coupling wink
The second sensor calorific value of state thermal resistance, represent first switch unit and second switch unit thermal coupling transient thermal resistance circuit
Calorific value；
The temperature instrumental value in the case of using temperature value, the first loss power value and first sensor calorific value；And
And
The temperature of first switch unit is obtained in the case of using temperature instrumental value, the second loss power value and circuit calorific value
Degree, and/or second switch unit is obtained in the case of using temperature instrumental value, the first loss power value and circuit calorific value
Temperature.
" switch element " can be the B6 electric bridges for example with three high side switches and three lower edge switches, and such as form is
MOSFET.The controller could be for the controller of controlled motor, especially gearbox control.For example can be by temperature
Sensor is embodied as critesistor, also referred to as NTC resistance.Two switch elements and temperature sensor can be arranged in common electricity
On the plate of road, and it is thermally coupled to each other by the circuit board.Using ZthFunction, represent thermal resistance transient changing curve situation
Under can obtain sensor calorific value and circuit calorific value, wherein the respective Z of each distribution that can be given in thermal couplingthFunction.Example
Such as can be by these ZthFunction is describing the ther mal network of the ther mal network including two switch elements and temperature sensor." temperature
Instrumental value " can be virtual temperature point.The temperature of two switch elements can be the housing (case) of such as switch element or
The temperature on barrier layer (junction).
Scheme described here based on the recognition that：By using a kind of suitable computational methods only only by a temperature
Sensor, such as critesistor, it becomes possible to determine the relevant temperature of multiple switch unit in particular, for example multiple B6 electric bridges.
For example it is possible thereby to estimate the case temperature and barrier layer temperature of the power switch of MOSFET-B6 electric bridges, and because
This protects MOSFET-B6 electric bridges in case thermal overload or breaking-up when quick thermal change.
Have the advantage that for this method tool that temperature determines, even if for example temperature sensor is not directly placed in shell
On body, by using the Z being for example present between the corresponding housing of switch element and temperature sensorthThermal resistance also can be enough
The quick thermic load of fast ground detection switch unit or temperature are raised.
The advantage is also arranged in the temperature on the barrier layer within switch element, barrier layer in a particular manner suitable for measurement
May be with the time constant less than housing.Now for example when by suitable temperature model, directly basis flows through related switch
When the change of the Current calculation housing of unit-and barrier layer temperature, even if when there is very fast thermic load
Related switch unit can be adequately protected in case overheated.
Additionally due to simply using a temperature sensor can also save manufacturing cost.
It is described in one embodiment, basis first switch unit and/or second can be distributed in calculation procedure
At least one component parameter of the intermediary circuit current and first switch unit of the intermediate circuit of switch element calculates first and damages
Consumption performance number.Additionally or alternatively scheme, can be in calculation procedure according to intermediary circuit current and second switch unit
At least one component parameter calculates the second loss power value." intermediate circuit " can be understood as a kind of device, the device conduct
Accumulator can pass through changer by the middle electric current aspect for accessing or the multiple electrical network electric coupling in voltage aspect.It is " middle
Circuital current " for example can be understood as the switching current provided by intermediate circuit.Component parameter can for example be description
One or the characteristic curve or corresponding characterisitic family of second switch element characteristic.Can be efficiently and smart by the embodiment
True ground computed losses performance number.
In addition following situations are favourable：It is determined that in step by will by the first loss power value and first sensor heat
The product that value is formed is deducted so that it is determined that temperature instrumental value from temperature value.Thus can be in little calculating step of save resources
Temperature instrumental value is calculated in rapid.
It is described in other embodiments, can be in obtaining step by temperature instrumental value is lost work(with by second
The product addition that rate value and circuit calorific value are formed is so as to obtain the temperature of first switch unit.Additionally or alternatively scheme, can
With by by temperature instrumental value with the product addition formed by the first loss power value and circuit calorific value so as to obtain second switch
The temperature of unit.By the embodiment it is also possible that the calculating when the relevant temperature of switch element is obtained spends and keeps to the greatest extent
Possible little degree.
In addition following situations are favourable：The temperature or the on the barrier layer of first switch unit is obtained in obtaining step
The temperature on the barrier layer of the temperature on the barrier layer of two switch elements or two switch elements.Additionally or alternatively scheme, with
Corresponding mode can obtain the temperature or two of the housing of the temperature or second switch unit of the housing of first switch unit
The temperature of the housing of individual switch element.By the embodiment can obtain in advance and exactly switch element Warm status and
Whether may be overheated.
Here, the product formed by the second loss power value and circuit calorific value, or additionally or alternatively scheme, by
The product that one loss power value and circuit calorific value are formed can especially represent the temperature change on housing or barrier layer.Thus can be real
Now according to time temperature instrumental value such that it is able to which the corresponding relevant temperature for quickly and accurately obtaining switch element is very
Fast change.
In addition the method can also include providing step, when the temperature of first switch unit is more than a threshold value,
Disabling signal can be provided to disable first switch unit in the offer step.Additionally or alternatively scheme, works as second switch
When the temperature of unit exceedes the threshold value, disabling signal can also be provided to disable second switch unit.For example can be with
Each of switch element is switched off by disabling signal.Certain hot critical temperature can reached by the embodiment
When interrupt and flow through the electric current of first or second switch unit.
In addition it is described in other embodiments, can also read in step is read at least one is represented with temperature biography
Another loss power value of the loss power of another switch element of sensor thermal coupling, represent another switch element and temperature
Spend another sensor calorific value of the transient thermal resistance of the thermal coupling of sensor, represent first switch unit and another switch element
Thermal coupling transient thermal resistance another the first circuit calorific value and represent second switch unit and another switch element
Another second circuit calorific value of the transient thermal resistance of thermal coupling.In addition it is determined that can be with using another loss work(in step
Temperature instrumental value in the case of rate value and another sensor calorific value.Correspondingly, can be using temperature in obtaining step
Degree instrumental value, the first loss power value, the second loss power value, another the first circuit calorific value and another second circuit calorific value
In the case of obtain the temperature of another switch element.Can be obtained by only one temperature sensor by the embodiment
The relevant temperature of multiple switch unit.
Following situations are particularly advantageous：Here in obtaining step also using another loss power value and another
The temperature of first switch unit is obtained in the case of first circuit calorific value.Additionally or alternatively scheme, here can be making
With the temperature that second switch unit is obtained in the case of another loss power value and another second circuit calorific value.By the reality
The mode of applying can spend each temperature for relatively rapidly obtaining multiple switch unit with little calculating.
The method for example can be in the way of software or hardware or to be made up of software and hardware mixed form example
As realized in the controller.
Additionally, scheme presented here also provides a kind of device, the device is configured to perform in corresponding device,
The step of manipulating or implement the flexible program of method presented here.The form that the present invention can also be passed through is these of device
Implement flexible program quickly and efficiently to solve the task that the present invention is based on.
" device " here can be understood as a kind of processing sensor signal and output control signal and/or number accordingly
It is believed that number electric equipment.The device can have an interface, and the interface can be constructed by way of hardware and/or software.
In the case of being constructed in the way of hardware, the interface can for example be so-called system ASIC comprising described device most
For a part for different functions.But interface can also be the integrated circuit of itself, or at least partly by discrete components and parts
Constitute.In the case of constructing in the way of software, the interface can be for example present in beside other software modules
Software module on microcontroller.
Scheme described here additionally provides the controller with following characteristics：
At least one first switch unit and second switch unit；
With first switch unit and the temperature sensor of second switch unit thermal coupling；And
Device according to embodiment described above.
The controller here can be understood as a kind of processing sensor signal and output control signal and/or number accordingly
It is believed that number electric equipment.Controller can have an interface, and the interface can be constructed in the way of hardware and/or software.
In the case of constructing in the way of hardware, the interface can for example be so-called system ASIC comprising controller most
For a part for different functions.But interface can also be the integrated circuit of itself, or at least partly by discrete components and parts
Constitute.In the case of constructing in the way of software, the interface can be for example present in beside other software modules
Software module on microcontroller.Computer program with program code or computer program are also advantageous, can
So that the code is stored on machine-readable carrier or storage medium, such as semiconductor memory, harddisk memory or light
Memorizer is learned, and especially when the program product or program are performed on computer or device, the code is used for
Execution, enforcement and/or manipulation are according to any one of above-mentioned embodiment the step of method.Description of the drawings：
Embodiments of the invention are shown in the drawings, and in the following description which is explained in detail.Wherein
Illustrate：
Accompanying drawing 1 is according to a kind of schematic diagram of the controller of embodiment；
Accompanying drawing 2 is according to a kind of schematic diagram of the controller of embodiment；
Accompanying drawing 3 is according to a kind of schematic diagram of the switch element of embodiment；
Accompanying drawing 4 is obtaining the schematic diagram of the model structure of temperature for by according to a kind of device of embodiment；
Accompanying drawing 5 is obtaining the schematic diagram of the model structure of temperature for by according to a kind of device of embodiment；
Accompanying drawing 6 is obtaining the PT of temperature for by according to a kind of device of embodiment1The schematic diagram of the coupling of element；
Accompanying drawing 7 is according to a kind of chart of the loss power of the switch element of embodiment for description；
Accompanying drawing 8 is according to a kind of chart of the loss power of the switch element of embodiment for description；
Accompanying drawing 9 is according to a kind of chart of the loss power of the switch element of embodiment for description；
Accompanying drawing 10 is the flow chart that loss power is calculated in the case where motor rotates；
Accompanying drawing 11 is the flow chart that loss power is calculated in the case where motor stops；And
Accompanying drawing 12 is the flow chart for obtaining the method for temperature according to a kind of embodiment.
Specific embodiment
In the description below of the beneficial embodiment of the present invention, for shown in different figures and similarly rise
The element of effect adopts same or like reference, wherein not repeated description these elements.
Accompanying drawing 1 show a kind of controller 100 according to embodiment, be for example used for motor controller schematic diagram.Control
Device processed 100 have not only directly, but also the first switch unit 102 and second that is thermally coupled to each other also by temperature sensor 106
Switch element 104.The two switch elements 102,104 are for example all B6 electric bridges, and the B6 electric bridges are especially as MOSFET
Output stage is realizing.It is mutual that such as the two switch elements 102,104 and temperature sensor 106 can pass through common circuit board
Thermal coupling.Use level connecting line represents corresponding between switch element 102,104 and temperature sensor 106 in fig. 1
Thermal coupling.
Device 108 is configured to from temperature sensor 106 temperature value for reading in the temperature for representing temperature sensor 106
110th, from first switch unit 102 read in represent first switch unit 102 loss power the first loss power value 112, and
And the second loss power value 114 of the loss power for representing second switch unit 104 is read in from second switch unit 104.In addition
Device 108 is also configured to read in the transient thermal resistance of the thermal coupling for representing first switch unit 102 and temperature sensor 106
First sensor calorific value 116, represent second switch unit 104 and temperature sensor 106 thermal coupling transient thermal resistance second
Sensor calorific value 118, and represent first switch unit 102 and second switch unit 104 thermal coupling transient thermal resistance electricity
Road thermal resistance 120.
Device 108 is first in the case of using temperature value 110, the first loss power value 112 and first sensor calorific value 116
First temperature instrumental value, the temperature instrumental value obtain the corresponding of two switch elements 102,104 as virtual temperature point
Temperature.Alternatively, device 108 is being substituted using the first loss using the second loss power value 114 and second sensor calorific value 118
Carry out temperature instrumental value in the case of performance number 112 and first sensor calorific value 116.
Device 108 is especially opened according to the relevant temperature that the temperature instrumental value for determining before obtains switch element 102,104
Close the respective housings of unit 102,104 or the temperature on corresponding barrier layer.Here, described device 108 using temperature instrumental value,
The temperature of first switch unit 102 is obtained in the case of second loss power value 114 and circuit calorific value 110.It is similar,
The temperature of second switch unit 104 is obtained in the case of using temperature instrumental value, the first loss power value 112 and circuit calorific value 110
Degree.
According to a kind of embodiment, device 108 is configured to the temperature according to acquired two switch elements 102,104
Produce and provide disabling signal 122.When associated temperature exceedes the threshold value of the maximum heating load for for example representing respective switch unit
When, will for example produce disabling signal 122.Disabling signal 122 is respectively used for disabling related switch element, that is use
In switch element and power supply are disconnected.
Accompanying drawing 2 is a kind of schematic diagram of the controller 100 according to embodiment.Controller 100 is, for example, as before by attached
Controller described in Fig. 1.Difference with accompanying drawing 1 is, in addition to two switch elements 102,104, controller
100 also for example include the 3rd switch element 200, the 4th switch element 202 and the 5th switch element 204.Two switch elements
102nd, 104 and three other switch elements 200,202,204 each with 106 thermal coupling of temperature sensor.Additionally, three another
Outer switch element 200,202,204 and second switch unit 104 also each with 102 thermal coupling of first switch unit.It is additional
Ground, second switch unit 104 also with the 3rd switch element 200 and 202 thermally coupled of the 4th switch element, the 3rd switch element 200
With the 4th switch element 202 and 204 thermally coupled of the 5th switch element, and the 4th switch element 202 and the 5th switch element 204
Thermally coupled.
According to the embodiment, controller 100 is for example with the first cooling body 206, the second cooling body 208 and the 3rd cooling body
210 realizing, wherein first cooling body 206 and 104 thermal coupling of first switch unit 102 and second switch unit, second
200 thermal coupling of cooling body 208 and the 3rd switch element, and the 3rd cooling body 210 and the 4th switch element 202 and the 5th switch
204 thermal coupling of unit.
By in fig 2 respectively with the Z of the determination of little box indicatingthFunction is to describe between five switch elements, five
Between individual switch element and temperature sensor 106, and five switch elements and three cooling bodies 206, the phases between 208,210
Answer the feature of hot linked transient thermal resistance.Depending on embodiment, each ZthFunction may be different from each other.
Correspondingly, the device being depicted without for clarity in fig 2 is configured to except reading in two switches
Outside the loss power value of unit 102,104, other losses with regard to three other switch elements 200,202,204 are also read in
Performance number, corresponding other sensor calorific values and corresponding other circuit calorific values, to be determined in the way of being described below in detail
The relevant temperature of three other switch elements 200,202,204.
Accompanying drawing 2 show the simplified diagram of the ther mal network of the multiple output stages on controller circuit board.Here passes through Zth
Function is representing the thermal coupling between respective switch unit and temperature sensor 106, such as critesistor.According to a kind of enforcement
Example, calculates virtual temperature value T-PCB as follows, is also referred to as temperature instrumental value before：
Loss power in Pv=components and parts
Zth=ther mal networks
The temperature of T-NTC=temperature sensors
In addition, equivalent to the first loss power value, value Pv2 is equivalent to the second loss power value, value Zth4 phase for such as value Pv1
When in first sensor calorific value, equivalent to second sensor calorific value, value Zth1 (x) is equivalent to circuit calorific value for value Zth7.
T-PCB=T-NTC- (Pv1*Zth4)-(Pv2*Zth7)-(Pv3*Zht5)-(Pv4*Zth9)
Show that output stage temperature is as follows accordingly：
T- switch element 1=(Pv2*Zth1 (x))+(Pv3*Zth8 (x))+(Pv4*Zth18 (x))+(Pv5*Zth17
(x))+T-PCB
T- switch element 2=(Pv1*Zth1 (x))+(Pv3*Zth2 (x))+(Pv4*Zth19 (x))+(Pv5*Zth21
(x))+T-PCB
T- switch element 3=(Pv1*Zth8 (x))+(Pv2*Zth2 (x))+(Pv4*Zth3 (x))+(Pv5*Zth20 (x))
+T-PCB
T- switch element 4=(Pv1*Zth18 (x))+(Pv3*Zth3 (x))+(Pv2*Zth19 (x))+(Pv5*Zth16
(x))+T-PCB
T- switch element 5=(Pv1*Zth17 (x))+(Pv3*Zth20 (x))+(Pv4*Zth16 (x))+(Pv2*Zth21
(x))+T-PCB
For example pass through PT1The coupling of element is simulating ZthFunction, as shown in below according to accompanying drawing 6.
According to a kind of embodiment, the corresponding unit of the switch element of switch mosfet is embodied as by intermediary circuit current and for example
Device parameters are calculating corresponding loss power.Component parameter is deposited the RMS value with switching current in software by here
(RMS=root mean square；Root-mean-square) as in the look-up table (Look-up-Table) of input variable.
10 and 11 corresponding loss power calculating will be described in detail below with reference to the accompanying drawings.
Accompanying drawing 3 show a kind of schematic diagram of the switch element 102 according to embodiment.The switch element 102
In this way above according to the switch element described by attached Fig. 1 and 2.Switch element 102 be implemented as with three high side switches S1,
The B6 electric bridges of S3, S5 and three lower edge switches S2, S4, S6, the switch respectively conductively with the electricity for applied voltage UZk
Source, for example rechargeable battery be connected or can be connected.
Accompanying drawing 4 show for by according to a kind of device of embodiment to obtain the schematic diagram of the model structure of temperature,
Device before for example with reference to the accompanying drawings described in 1 to 3.
The barrier layer temperature that the model structure includes for by three high side switches H1, H2, H3 obtaining switch element
The first process circuit 401.Here, square frame 400 represents the MOSFET losses of high side switches H1, H2, H3.For computed losses institute
Among the parameter for needing is stored in look-up table 402.
Square frame 404 represents the body diode losses of three high side switches H1, H2, H3.Correspondingly, in order to needed for computed losses
Parameter be stored in another look-up table 406 among.
First adder unit 408 processes the value for calculating from loss.First adder unit 408 itself and the first division
Unit 410 is connected.First computing unit 412 is couple in the first divider 410, and the second adder unit 414 is couple to the again
On one computing unit.
Second processing circuit 416 is used for the barrier layer temperature of three lower edge switches H1, H2, H3 for obtaining switch element.
Here, square frame 418 represents the MOSFET losses of lower edge switch H1, H2, H3.In order to the parameter needed for computed losses it is same
Among sample is stored in corresponding look-up table 420.
Square frame 422 represents the body diode losses of three lower edge switches H1, H2, H3.Correspondingly, in order to needed for computed losses
Parameter be stored in another look-up table 424 among.It is similar with the first process circuit 401, the 3rd adder unit 426,
The value in second processing circuit 416 is processed in double division method unit 428, the second computing unit 430 and the 4th adder unit 432.
According to the embodiment, two adder units 408,426 are respectively coupled in fifth adding unit 434, fifth adding
Unit itself is couple in the 3rd divider 436 again.3rd divider 436 is connected with the 3rd computing unit 438 again.Can be with
The case temperature of all switches is calculated by the 3rd computing unit 438.
It is used for the calculation procedure of computing environment temperature using big arrow logo.
Accompanying drawing 5 shows for by according to a kind of device of embodiment to obtain the schematic diagram of the model structure of temperature.
Difference with model structure with reference to the accompanying drawings described in 4 is that 5 model structure includes the first square frame 500 and second with reference to the accompanying drawings
Square frame 502, the first square frame include two process circuits 401,416, and first square frame is approximately equivalent to reference to the accompanying drawings described in 4
Model structure and can perform as 10-ms tasks according to the embodiment, the second square frame here for example can conduct
100-ms tasks are performing.For example ambient temperature is calculated in the 3rd process circuit 504, calculate in fourth process circuit 506
The case temperature of all switches, wherein the two process circuits 504,506 are a parts for the second square frame 502.
According to accompanying drawing 5, the second square frame 502 includes fifth adding unit 434, the 3rd divider 436, the 3rd computing unit
438 and such as six other computing units 508,510, three additions of another adder unit and subtrators 512 and
Individual multiplication unit 514.
Accompanying drawing 6 show for by according to a kind of device of embodiment to obtain the PT of temperature1The coupling of element is shown
It is intended to.The coupling is carried out for example by with device before with reference to the accompanying drawings described in 1 to 5, and for simulating ZthLetter
Number.Here, switch element is coupled with temperature sensor in the first coupling step 600, wherein corresponding loss power value is used
Make input variable.Output stage is coupled in another coupling step 602, the wherein corresponding case temperature of output stage is used as input
Variable.
Accompanying drawing 7 show for description according to a kind of switch element of embodiment, for example with according to accompanying drawing before
The chart of the loss power of the same switch element.Show the characterisitic family 700 with regard to loss power PvRdsOn.
Accompanying drawing 8 is shown for description according to a kind of chart of the loss power of the switch element of embodiment.With accompanying drawing 7
Difference is that the Te Sheng families of curves 800 in accompanying drawing 8 are related to loss power PvDiodeRms.
Accompanying drawing 9 is shown for description according to a kind of chart of the loss power of the switch element of embodiment.With accompanying drawing 7 and
8 difference is that the characterisitic family 900 in accompanying drawing 9 is related to loss power PvDiodeAvg.
Accompanying drawing 10 show the flow chart that loss power is calculated in the case where motor rotates.For example can be with reference to root before
Loss power calculating is carried out according to the device described in accompanying drawing 1 to 9.
Flash MOSFET conduction losses 1002 are calculated according to the RMS current value 1000 of high side switches.According to high side switches
Maximum current value 1004 calculates flash switch mosfet loss 1006.
Flash body diode losses 1010 are calculated as differential resistance according to the RMS current value 1008 of flash body diode.
Flash body diode losses 1014 are calculated as threshold voltage according to the average current value 1012 of flash body diode.
Loss 1002,1010,1014 is respectively supplied to into multiplier 1016, and is for example multiplied by three.Will switch
It is lost 1006 and utilizes the end value that multiplier 1016 performs multiplication to be supplied to for being added with flash loss power value
The first adder 1018.
Similarly, calculate the loss power for lower edge switch and low side body diode.
Low side MOSFET conduction losses 1022 are calculated according to the RMS current value 1020 of lower edge switch.According to lower edge switch
Maximum current value 1024 calculates low side switch mosfet loss 1026.
When calculating low according to the low RMS current value 1028 in body diode, body diode losses 1030 are used as differential resistance.
According to the low body diode losses 1034 when the average current value 1032 of body diode calculates low as threshold voltage.
Loss 1022,1030,1034 is respectively supplied to into multiplier 1016 again, and is for example multiplied by three.Will
Switching loss 1026 and utilize the end value that multiplier 1016 performs multiplication to be supplied to for low side loss power value
The second adder 1036 being added.
Flash loss power value is added with low side loss power value by the 3rd adder 1038, it is thus last to obtain
Output stage, namely switch element loss power value, such as the first loss power value 112.
The flow chart that loss power is calculated in the case where motor stops shown in accompanying drawing 11.Difference with accompanying drawing 10 is,
Loss power calculating is carried out in the case of no multiplier.In addition calculating flash body diode losses are also eliminated.
Accompanying drawing 12 show the flow chart for obtaining the method 1200 of temperature according to a kind of embodiment.Can for example tie
Device before conjunction with reference to the accompanying drawings described in 1 to 11 is performing methods described 1200.For by with first switch unit and second
The temperature sensor of switch element thermal coupling is obtaining at least one first switch unit and second switch unit of controller
The method 1200 of temperature includes step 1210, reads in the temperature value of the temperature for representing temperature sensor in this step, represents the
First loss power value of the loss power of one switch element, represent second switch unit loss power the second loss power
Value, represent first switch unit and temperature sensor thermal coupling transient thermal resistance first sensor calorific value, represent second and open
Close the second sensor calorific value of the transient thermal resistance of the thermal coupling of unit and temperature sensor and last reading represents first switch
The circuit calorific value of the transient thermal resistance of the thermal coupling of unit and second switch unit.
In another step 1220 in the case of using temperature value, the first loss power value and first sensor calorific value
Temperature instrumental value.Alternatively, determine in the case of using temperature value, the second loss power value and second sensor calorific value
Temperature instrumental value.
Subsequently obtain in the case of using temperature instrumental value, the second loss power value and circuit calorific value in step 1230
The temperature of first switch unit.Depending on embodiment, additionally or alternatively scheme, in step 1230 also auxiliary using temperature
The temperature of second switch unit is obtained in the case of helping value, the first loss power value and circuit calorific value.
For example can continuously perform in the course of work of controller step 1210,1220,1230.
It is in order to calculate the housing of switch element and the absolute temperature on barrier layer, according to described in a kind of embodiment, auxiliary with temperature
Help the form calculus virtual temperature of value.Ambient temperature can be obtained accordingly as follows：
Case temperature=virtual temperature point+case temperature change
Barrier layer temperature=virtual temperature point+barrier layer temperature change.
Profit for example can protect MOSFET output stages in this way in the thermal process being exceedingly fast in case overheated, because directly
Housing-and barrier layer temperature are calculated within the thermal time constant of housing-and barrier layer temperature.
If controller has multiple MOSFET output stages, advantageously using only one temperature sensor, for example
The housing-and barrier layer temperature of corresponding B6 bridge switches can be just obtained in the case of critesistor.Unit can thus be saved
Device simultaneously therefore saves on manufacturing cost.Also advantageously：Smaller printing can be used by saving other critesistor
Circuit board.
According to described in a kind of embodiment, by the intermediary circuit current, the parameter of MOSFET components and parts and machinery that are determined
The Z of structurethResistance estimates the housing-and barrier layer temperature of six switches of B6 bridge circuits.
If a kind of embodiment includes "and/or" relation between the first feature and second feature, this can solve
Reading is not only have the first feature according to a kind of embodiment of embodiment but also have second feature, and according to another
Or then only there is the embodiment of kind of embodiment the first feature only to have second feature.
Claims (13)
1. for by next with the temperature sensor (106) of first switch unit (102) and second switch unit (104) thermal coupling
The method for obtaining the temperature of at least one first switch unit (102) and second switch unit (104) of controller (100)
(1200), wherein methods described (1200) is comprised the following steps：
Reading (1210) represents the temperature value (110) of the temperature of temperature sensor (106), represents first switch unit (102)
First loss power value (112) of loss power, represent second switch unit (104) loss power the second loss power value
(114), represent the first sensor heat of the transient thermal resistance of the thermal coupling of first switch unit (102) and temperature sensor (106)
Value (116), represent second switch unit (104) and temperature sensor (106) thermal coupling transient thermal resistance second sensor
Calorific value (118), and represent first switch unit (102) and second switch unit (104) thermal coupling transient thermal resistance electricity
Road calorific value (120)；
Determine in the case of using temperature value (110), the first loss power value (112) and first sensor calorific value (116)
(1220) temperature instrumental value (T-PCB)；And
Obtain in the case of using temperature instrumental value (T-PCB), the second loss power value (114) and circuit calorific value (120)
(1230) temperature of first switch unit (102), and/or using temperature instrumental value (T-PCB), the first loss power value
(112) and in the case of circuit calorific value (120) obtain the temperature of (1230) second switch unit (104).
2. method (1200) according to claim 1, comprises the steps：According to distributing to first switch unit (102)
And/or at least one yuan of the intermediary circuit current and first switch unit (102) of the intermediate circuit of second switch unit (104)
Device parameters calculate the first loss power value (112), and/or according to intermediary circuit current and second switch unit (104)
At least one component parameter calculate the second loss power value (114).
3. method (1200) according to any one of the claims, it is determined that by will be by first in (1220) step
The product that loss power value (112) and first sensor calorific value (116) are formed is deducted from temperature value (110), so that it is determined that warm
Degree instrumental value (T-PCB).
4. method (1200) according to any one of the claims, by temperature is auxiliary in (1230) step is obtained
Value (T-PCB) and the product addition formed by the second loss power value (114) and circuit calorific value (120) are helped, so as to obtain first
The temperature of switch element (102), and/or by by temperature instrumental value (T-PCB) with by the first loss power value (112) and
The product addition that circuit calorific value (120) is formed, so as to obtain the temperature of second switch unit (104).
5. method (1200) according to any one of the claims, obtains first switch in (1230) step is obtained
The temperature on the barrier layer and/or housing of unit (102) and/or second switch unit (104).
6. the method (1200) according to claim 4 and 5, wherein by the second loss power value (114) and circuit calorific value
(120) product for being formed and/or the product formed by the first loss power value (112) and circuit calorific value (120) represent housing and/
Or the temperature change on barrier layer.
7. method (1200) according to any one of the claims, comprises the steps：When first switch unit
(102) temperature disables first switch unit (102) more than disabling signal (122) is provided when a threshold value, and/or
Disabling second switch unit (104) when the temperature of second switch unit (104) exceedes the threshold value.
8. method (1200) according to any one of the claims, also reads in (1210) step is read in and represents extremely
Lack another loss power value, the generation of one and the loss power of another switch element (200) of temperature sensor (106) thermal coupling
Another sensor calorific value of the transient thermal resistance of the thermal coupling of another switch element of table (200) and temperature sensor (106), represent
Another the first circuit calorific value of the transient thermal resistance of the thermal coupling of one switch element (102) and another switch element (200) and
Represent another second circuit heat of the transient thermal resistance of the thermal coupling of second switch unit (104) and another switch element (200)
Value, wherein it is determined that determination is warm also in the case of using another loss power value and another sensor calorific value in (1220) step
Degree instrumental value (T-PCB), and using temperature instrumental value (T-PCB), the first loss power value in (1230) step is obtained
(112), obtain in the case of the second loss power value (114), another the first circuit calorific value and another second circuit calorific value
The temperature of another switch element (200).
9. method (1200) according to claim 8, wherein also using another loss work(in (1230) step is obtained
The temperature of first switch unit (102) is obtained in the case of rate value and another the first circuit calorific value, and/or is also being used
The temperature of second switch unit (104) is obtained in the case of another loss power value and another second circuit calorific value.
10. a kind of device (108), the device are configured to perform and/or manipulate according to any one of the claims institute
State method (1200).
11. controllers (100) with following characteristics：
At least one first switch unit (102) and second switch unit (104)；
With the temperature sensor (106) of first switch unit (102) and second switch unit (104) thermal coupling；And
Device (108) according to claim 10.
12. computer programs, the computer program are designed to perform and/or manipulate according to any one of claim 1 to 9
Methods described (1200).
13. machine-readable storage mediums, save on the machine-readable storage medium according to claim 12
Computer program.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102015212298.0A DE102015212298A1 (en) | 2015-07-01 | 2015-07-01 | Method and device for determining a temperature of at least a first switching unit and a second switching unit of a control unit and control unit |
| DE102015212298.0 | 2015-07-01 |
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| CN106644150A true CN106644150A (en) | 2017-05-10 |
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| CN201610861095.5A Active CN106644150B (en) | 2015-07-01 | 2016-06-30 | Method and device for determining the temperature of at least one first and second switching unit of a control unit, and control unit |
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| CN110553746A (en) * | 2018-05-30 | 2019-12-10 | 罗伯特·博世有限公司 | method and circuit for determining the temperature of an electrical/electronic component |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1952631A (en) * | 2005-09-28 | 2007-04-25 | 洛克威尔自动控制技术股份有限公司 | Junction temperature prediction method and apparatus for use in a power conversion module |
| CN103364739A (en) * | 2012-03-29 | 2013-10-23 | 北京动力源科技股份有限公司 | Method for testing node temperature rise of switch tube in switch power source |
| GB2510658A (en) * | 2013-02-12 | 2014-08-13 | Rolls Royce Plc | A thermal controller for semiconductor power switching devices |
| CN104020801A (en) * | 2013-02-28 | 2014-09-03 | 控制技术有限公司 | Temperature controlling method, temperature calculating method and driver |
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2015
- 2015-07-01 DE DE102015212298.0A patent/DE102015212298A1/en active Pending
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- 2016-06-30 CN CN201610861095.5A patent/CN106644150B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1952631A (en) * | 2005-09-28 | 2007-04-25 | 洛克威尔自动控制技术股份有限公司 | Junction temperature prediction method and apparatus for use in a power conversion module |
| CN103364739A (en) * | 2012-03-29 | 2013-10-23 | 北京动力源科技股份有限公司 | Method for testing node temperature rise of switch tube in switch power source |
| GB2510658A (en) * | 2013-02-12 | 2014-08-13 | Rolls Royce Plc | A thermal controller for semiconductor power switching devices |
| CN104020801A (en) * | 2013-02-28 | 2014-09-03 | 控制技术有限公司 | Temperature controlling method, temperature calculating method and driver |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110553746A (en) * | 2018-05-30 | 2019-12-10 | 罗伯特·博世有限公司 | method and circuit for determining the temperature of an electrical/electronic component |
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| CN106644150B (en) | 2020-02-14 |
| DE102015212298A1 (en) | 2017-01-05 |
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