CN106643809B - MEMS gyroscope testing device, system and method - Google Patents
MEMS gyroscope testing device, system and method Download PDFInfo
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- CN106643809B CN106643809B CN201710065869.8A CN201710065869A CN106643809B CN 106643809 B CN106643809 B CN 106643809B CN 201710065869 A CN201710065869 A CN 201710065869A CN 106643809 B CN106643809 B CN 106643809B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C25/00—Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass
- G01C25/005—Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass initial alignment, calibration or starting-up of inertial devices
Abstract
The invention discloses a device, a system and a method for testing an MEMS gyroscope, wherein the device comprises a high-low temperature box (4), a turntable table surface (3), a driving motor, a temperature control system, a slip ring and a single/multi-chip test board (1) are arranged in the high-low temperature box (4), and the turntable control system is arranged outside the high-low temperature box (4); a data acquisition board (2) is also arranged in the high-low temperature box (4), and the data acquisition board (2) is arranged on the table top (3) of the rotary table; the data acquisition board (2) receives an analog output signal from the single/multi-chip test board (1), and outputs a converted digital signal to the outside of the high-low temperature box (4) through the slip ring after analog-to-digital conversion. The invention arranges the data acquisition board in the high-low temperature box, converts the output signal of the tested single/multiple chips into a digital signal, and then transmits the converted digital signal to the upper computer through the slip ring, thereby obtaining a real and reliable measurement result with small error and high precision.
Description
Technical Field
The invention relates to a device, a system and a method for testing an MEMS gyroscope.
Background
Coriolis force, a Coriolis force, is a description of the deflection of a particle in a linear motion in a rotating system relative to the linear motion produced by the rotating system due to inertia. The gyroscope in rotation can reflect various forms of linear motion, and the motion can be measured and controlled by recording the Coriolis force applied to the gyroscope component.
The MEMS gyroscope is widely used in the fields of combined navigation, virtual reality, mobile phones, unmanned aerial vehicles, robots and the like, and has the advantages of small volume, light weight, low power consumption, high reliability, easiness in installation, low maintenance cost, vibration resistance and impact resistance. However, conventional gyroscopes such as fiber optic gyroscopes and laser gyroscopes are suffering from market impact from MEMS gyroscopes due to their disadvantages of large size, heavy weight, high power consumption, complex installation, high maintenance cost, etc. Manufacturers pay attention to the delivery quality of the MEMS gyroscope, and carry out a large amount of tests on the MEMS gyroscope before delivery, so that the quality of delivered products is ensured.
The utility model discloses a utility model with application number CN201020181149.1 discloses a MEMS top test system of biax revolving stage, to take the biax revolving stage and the MEMS gyro sensor test unit of high low-temperature box to combine, constitute a full-automatic MEMS top integrated test system, the incubator provides the temperature environment condition for the MEMS gyro test, the temperature control scope is-55 ℃ - +120 ℃, it is more complete to guarantee the test item, so that follow the demarcation to the MEMS top under each temperature, in order to increase its accuracy of demarcation, thereby the high rate that the MEMS top test required has been solved, test control by temperature change requires the scheduling problem, the efficiency of software testing is improved. However, the invention has the following disadvantages: (1) the test method of the test system is that the tested analog signal in the high-low temperature box is output to the external data acquisition equipment for analog-digital conversion through the slip ring of the rotary table, and the method can introduce large interference signals into the tested signal, so that the signal-to-noise ratio of useful signals is reduced, the test result has large error and low precision, and a real measurement result cannot be obtained; (2) the MEMS gyroscope is symmetrically arranged on the working table surface along the axis, and when the working table surface fails to obtain data correctly, the MEMS gyroscope is inconvenient to replace; (3) the test system cannot realize remote data transmission and cannot replace an adaptive circuit according to the model of the upper computer.
Disclosure of Invention
The invention aims to overcome the defects of the prior art, and provides a device, a system and a method for testing an MEMS gyroscope, which solve the problems that in the prior art, a tested analog signal in a high-temperature and low-temperature box is output to external data acquisition equipment through a slip ring of a rotary table for analog-to-digital conversion, a large interference signal is introduced into the tested signal, the signal-to-noise ratio of a useful signal is reduced, the error of a test result is large, the precision is low, and a real measurement result cannot be obtained.
The purpose of the invention is realized by the following technical scheme: an MEMS gyroscope testing device is characterized in that a turntable table top, a temperature control system, a slip ring and a single/multi-chip testing board are arranged inside a high-low temperature box, a driving motor and the turntable control system are arranged outside the high-low temperature box, the turntable control system controls the rotation direction and the speed of the turntable table top through the driving motor, the single/multi-chip testing board is installed on the turntable table top, a chip clamp is arranged on the single/multi-chip testing board, and the temperature control system controls the temperature inside the high-low temperature box; the inside of the high-low temperature box is also provided with a data acquisition board which is arranged on the table top of the rotary table; the data acquisition board receives analog output signals from the single/multi-chip test board, and outputs the converted digital signals to the outside of the high-low temperature box through the slip ring after analog-to-digital conversion.
The single/multi-chip test board comprises a chip clamp, a test circuit and a first signal interface, wherein a chip to be tested is arranged on the chip clamp, and an output signal of the chip to be tested reaches the first signal interface through the test circuit; the data acquisition board comprises a second signal interface, an analog-to-digital conversion circuit and a first data transmission interface, the second signal interface is connected with the first signal interface through a cable, and the analog-to-digital conversion circuit converts received analog signals into digital signals and sends the digital signals out through the first data transmission interface.
The single/multi-chip test board and the data acquisition board are fixedly arranged on the table top of the turntable through screws.
The device also comprises a control panel arranged outside the high-low temperature box, and the control panel controls the temperature in the high-low temperature box by controlling the temperature control system.
The MEMS gyroscope testing system comprises the MEMS gyroscope testing device and an upper computer system, wherein the upper computer system receives signals output by a data acquisition board and stores and analyzes data.
The upper computer system comprises a second data transmission interface, a concentrator and an upper computer, wherein the second data transmission interface receives signals output by the data acquisition board and transmits the signals to the concentrator, and the upper computer acquires data transmitted by the concentrator for storage and analysis.
The second data transmission interface and the data transmission interface of the data acquisition board are any one of a network interface, an RS422 interface, an RS232 interface and an RS485 interface; the concentrator is a concentrator with a model corresponding to the second data transmission interface and the data transmission interface of the data acquisition board, and comprises a network concentrator, an RS422 concentrator, an RS232 concentrator and an RS485 concentrator.
The MEMS gyroscope test system also comprises a power supply system arranged outside the high-low temperature box, wherein the power supply system comprises a direct-current multi-channel output power supply and a first power supply interface; the single/multi-chip test board comprises a second power supply interface, the data acquisition board comprises a third power supply interface, and the first power supply interface is respectively connected with the direct-current multi-channel output power supply, the second power supply interface and the third power supply interface through cables.
A MEMS gyroscope test method, comprising a test step, wherein the test step comprises the following steps:
installing a chip to be tested on a chip clamp of a single/multi-chip test board arranged in a high-low temperature box;
setting angular rate parameters and direction parameters of a turntable control system to control the rotating speed and direction of the table top of the turntable;
setting the internal temperature of the high-low temperature box;
the table surface of the rotary table drives the single/multi-chip test board to move according to the set angular speed and direction;
the output signal of the chip to be tested forms an analog signal through a single/multi-chip test board and is output to a data acquisition board arranged in the high-low temperature box;
the data acquisition board performs analog-to-digital conversion on the data and then transmits the data to an upper computer system through a slip ring;
and the upper computer system stores and analyzes data.
The method also comprises an installation step and a replacement step; before the chip to be tested is mounted on a chip clamp of a single/multi-chip test board arranged in a high and low temperature box, the mounting step comprises the following substeps:
the single/multi-chip test board and the data acquisition board are arranged on the table top of the turntable;
connecting single/multiple chip test board, data acquisition board and upper computer system through cable
The replacing step comprises:
when the single/multi-chip test board or the data acquisition board needs to be replaced, the power supply is closed;
detaching the cable connected with the single/multi-chip test board or the data acquisition board;
disassembling the single/multi-chip test board or the data acquisition board;
installing a new single/multi-chip test board or data acquisition board;
and the single/multi-chip test board, the data acquisition board and the upper computer system are connected through cables.
The invention has the beneficial effects that:
(1) in order to improve the anti-interference capability, the signal-to-noise ratio and the measurement precision and finally obtain a real and reliable measurement result through measurement, a data acquisition board is arranged in a high-low temperature box, the output signal of a tested single/multi-chip is converted into a digital signal, and then the converted digital signal is transmitted to an upper computer through a slip ring, so that the real and reliable measurement result with small error and high precision is finally obtained.
(2) The invention realizes the modularization of the test system, is convenient for replacement and maintenance, has low cost, simple and convenient operation, high efficiency, high precision and high reliability: specifically, through survey test panel, data acquisition board, upper computer system, electrical power generating system at single/the multicore piece and set up a plurality of interfaces through cable junction to and survey test panel and data acquisition board accessible screw fixed mounting at revolving stage mesa dual mode through single/the multicore piece, under the condition that even make a fault, also can rely on the convenient advantage of dismantling and survey test panel and data acquisition board convenient dismantlement of single/the multicore piece of interface, realize convenient the change.
(3) The temperature in the high-low temperature box can be conveniently and quickly controlled through the control panel outside the high-low temperature box.
(4) And a concentrator is arranged in the upper computer system, and the received signals are regenerated, shaped and amplified to realize the remote transmission distance data transmission of the test system.
(5) According to different upper computer systems, data transmission interfaces (data acquisition boards of different models) and corresponding hubs of different models can be selected, and the use of different interface devices and the data transmission are facilitated. Specifically, the method comprises the following steps: the interface comprises any one of a network interface, an RS422 interface, an RS232 interface and an RS485 interface; the hub is a hub with a model corresponding to the interface, and comprises a network hub, an RS422 hub, an RS232 hub and an RS485 hub.
(6) The invention can test a plurality of chips simultaneously and meet the requirement of batch test.
Drawings
FIG. 1 is a block diagram of the structure of the present invention;
FIG. 2 is a flow chart of the testing steps of the method of the present invention;
in the figure, 1-single/multi-chip test board, 2-data acquisition board, 3-turntable table, 4-high and low temperature box, 5-upper computer system, 6-power system, 7-turntable control system.
Detailed Description
The technical scheme of the invention is further described in detail by combining the attached drawings:
as shown in fig. 1, embodiment 1 discloses an MEMS gyroscope testing apparatus, which includes a high and low temperature box 4, a turntable table 3, a temperature control system, a slip ring, and a single/multi-chip test board 1 are disposed inside the high and low temperature box 4, a driving motor and a turntable control system 7 are disposed outside the high and low temperature box 4, the turntable control system 7 controls the rotation direction and speed of the turntable table 3 through the driving motor, the single/multi-chip test board 1 is mounted on the turntable table 3, a chip holder is disposed on the single/multi-chip test board 1, and the temperature control system controls the temperature inside the high and low temperature box 4; the high-low temperature box 4 is also internally provided with a data acquisition board 2, and the data acquisition board 2 is arranged on the table top 3 of the rotary table; the data acquisition board 2 receives the analog output signal from the single/multi-chip test board 1, and outputs the converted digital signal to the outside of the high-low temperature box 4 through the slip ring after analog-to-digital conversion.
Specifically, the data acquisition board 2 is arranged in the high-low temperature box 4, the output signals of the tested single/multiple chips are converted into digital signals, and then the converted digital signals are transmitted to the outside through the slip ring, so that the real and reliable measurement result with small error and high precision is finally obtained.
In this embodiment, the single/multi-chip test board 1 includes a chip clamp, a test circuit and a first signal interface, a chip to be tested is mounted on the chip clamp, and an output signal of the chip to be tested reaches the first signal interface through the test circuit; the data acquisition board 2 comprises a second signal interface, an analog-to-digital conversion circuit and a first data transmission interface, the second signal interface is connected with the first signal interface through a cable, and the analog-to-digital conversion circuit converts received analog signals into digital signals and sends the digital signals out through the first data transmission interface.
In this embodiment, the single/multi-chip test board 1 and the data acquisition board 2 are fixedly mounted on the turntable top 3 by screws. Preferably, the data acquisition board 2 may be fixedly mounted on the single/multi-chip test board 1 by screws.
By realizing the modularization of the test system, the test system is convenient to replace and maintain, low in cost, simple and convenient to operate, high in efficiency, high in precision and high in reliability.
In this embodiment, the apparatus further comprises a control panel disposed outside the high and low temperature box 4, and the control panel controls the temperature inside the high and low temperature box 4 by controlling the temperature control system.
Based on the implementation of the above device, the embodiment further provides a MEMS gyroscope test system, which includes the MEMS gyroscope test device and the upper computer system 5, where the upper computer system 5 receives the signal output from the data acquisition board 2, and stores and analyzes the data.
In this embodiment, the upper computer system 5 includes a second data transmission interface, a hub, and an upper computer, the second data transmission interface receives the signal output by the data acquisition board 2 and transmits the signal to the hub, and the upper computer obtains the data transmitted by the hub for storage and analysis.
Specifically, the upper computer comprises data acquisition and storage software, data analysis software and report generation software.
The second data transmission interface and the data transmission interface of the data acquisition board 2 are any one of a network interface, an RS422 interface, an RS232 interface and an RS485 interface; the concentrator is a concentrator with a model corresponding to the second data transmission interface and the data transmission interface of the data acquisition board 2, and comprises a network concentrator, an RS422 concentrator, an RS232 concentrator and an RS485 concentrator. Specifically, the hub connected with the second data transmission interface outside the high-low temperature rotary table can be replaced by a network hub, an RS422 hub, an RS232 hub, an RS485 hub and other devices as required, so that the use of different interface devices and the data transmission are facilitated.
The MEMS gyroscope test system also comprises a power supply system 6 arranged outside the high-low temperature box 4, wherein the power supply system 6 comprises a direct-current multi-channel output power supply and a first power supply interface; the single/multi-chip test board 1 comprises a second power supply interface, the data acquisition board 2 comprises a third power supply interface, and the first power supply interface is respectively connected with the direct-current multi-channel output power supply, the second power supply interface and the third power supply interface through cables.
Based on the implementation of the above system, this embodiment further provides a method for testing a MEMS gyroscope, which includes a testing step, as shown in fig. 2, where the testing step includes:
installing a chip to be tested on a chip clamp of a single/multi-chip test board 1 arranged in a high-low temperature box 4;
setting angular rate parameters and direction parameters of a turntable control system 7 to control the rotating speed and direction of the turntable surface 3;
setting the internal temperature of the high and low temperature box 4;
the turntable table surface 3 drives the single/multi-chip test board 1 to move according to the set angular speed and direction;
an output signal of a chip to be tested forms an analog signal through a single/multi-chip test board 1 and is output to a data acquisition board 2 arranged in a high-low temperature box 4;
the data acquisition board 2 performs analog-to-digital conversion on the data and then transmits the data to the upper computer system 5 through a slip ring;
the upper computer system 5 stores and analyzes data.
Correspondingly, the method also comprises an installation step and a replacement step; before the chip to be tested is mounted on the chip clamp of the single/multi-chip test board 1 arranged in the high-low temperature box 4, the mounting step comprises the following substeps:
a single/multi-chip test board 1 and a data acquisition board 2 are arranged on a turntable table surface 3;
the single/multi-chip test board 1, the data acquisition board 2 and the upper computer system 5 are connected through cables
The replacing step comprises:
when the single/multi-chip test board 1 or the data acquisition board 2 needs to be replaced, the power supply is closed;
detaching the cable connected with the single/multi-chip test board 1 or the data acquisition board 2;
disassembling the single/multi-chip test board 1 or the data acquisition board 2;
installing a new single/multi-chip test board 1 or a new data acquisition board 2;
the single/multi-chip test board 1, the data acquisition board 2 and the upper computer system 5 are connected through cables.
Specifically, the corresponding test method embodiment is as follows:
firstly, a multi-chip or single-chip test board and a data acquisition board 2 are fixedly installed on a rotary table top 3 inside a high-low temperature rotary table by using screws. Then, the tested chip of the MEMS gyroscope is installed in a chip clamp of a multi-chip or single-chip test board, data acquisition and storage software of the upper computer system 5 is started, and then the direct-current stabilized voltage power supply is started. The angular rate parameter of the turret control system 7 is then set to control the rotational speed of the turret (e.g., set at 10/s), which moves the multi-chip or single chip test board at the set angular rate, and then the internal temperature of the hot and cold compartments 4 is set (e.g., set at +30 c). Meanwhile, the output signal of the tested chip reaches the signal interface through the test circuit on the multi-chip test board. The data acquisition board 2 is connected with a multi-chip or single-chip test board through a signal interface. The data acquisition board 2 acquires and processes the output signal of the chip to be tested, and then the data acquisition board 2 outputs the processed data to the data transmission and power supply channel. Then the data collected is stored by the data collecting and storing software of the upper computer system 5, and the collected data is observed on the display of the upper computer system 5 in real time. And then, running data analysis software of the upper computer system 5 to obtain required test parameters, and then running report generation software of the upper computer system 5 to obtain a test report.
For example, in the test of the scale factor, different angular rate parameters of the turntable control system 7 are set, the acquired data are stored by using data acquisition and storage software of the upper computer system 5, and the acquired data are observed on a display of the upper computer system 5 in real time. And then, running data analysis software of the upper computer system 5 to obtain a scale factor, and then running report generation software of the upper computer system 5 to obtain a scale factor test report. And finally, judging whether the MEMS gyroscope chip to be tested is qualified or not according to the scale factor test report.
Claims (8)
1. An MEMS gyroscope testing device comprises a high-low temperature box (4), wherein a rotary table top (3), a temperature control system, a slip ring and a single/multi-chip testing board (1) are arranged inside the high-low temperature box (4), a driving motor and a rotary table control system (7) are arranged outside the high-low temperature box (4), the rotary table control system (7) controls the rotation direction and the speed of the rotary table top (3) through the driving motor, the single/multi-chip testing board (1) is installed on the rotary table top (3), a chip clamp is arranged on the single/multi-chip testing board (1), and the temperature control system controls the temperature inside the high-low temperature box (4); the method is characterized in that: the high-low temperature box (4) is also internally provided with a data acquisition board (2), and the data acquisition board (2) is arranged on the table top (3) of the rotary table; the data acquisition board (2) receives an analog output signal from the single/multi-chip test board (1), and outputs a converted digital signal to the outside of the high-low temperature box (4) through a slip ring after analog-to-digital conversion;
the single/multi-chip test board (1) comprises a chip clamp, a test circuit and a first signal interface, wherein a chip to be tested is arranged on the chip clamp, and an output signal of the chip to be tested reaches the first signal interface through the test circuit; the data acquisition board (2) comprises a second signal interface, an analog-to-digital conversion circuit and a first data transmission interface, wherein the second signal interface is connected with the first signal interface through a cable, and the analog-to-digital conversion circuit converts a received analog signal into a digital signal and sends the digital signal out through the first data transmission interface;
the single/multi-chip test board (1) and the data acquisition board (2) are fixedly arranged on the table top (3) of the rotary table through screws.
2. A MEMS gyroscope test apparatus as claimed in claim 1, wherein: the device also comprises a control panel arranged outside the high-low temperature box (4), and the control panel controls the temperature in the high-low temperature box (4) by controlling the temperature control system.
3. A MEMS gyroscope test system, characterized by: the MEMS gyroscope testing device comprises the MEMS gyroscope testing device as claimed in any one of claims 1-2 and an upper computer system (5), wherein the upper computer system (5) receives signals output by the data acquisition board (2) and stores and analyzes data.
4. A MEMS gyroscope test system as claimed in claim 3, wherein: the upper computer system (5) comprises a second data transmission interface, a hub and an upper computer, wherein the second data transmission interface receives signals output by the data acquisition board (2) and transmits the signals to the hub, and the upper computer acquires data transmitted by the hub for storage and analysis.
5. The MEMS gyroscope testing system of claim 4, wherein: the second data transmission interface and the data transmission interface of the data acquisition board (2) are any one of a network interface, an RS422 interface, an RS232 interface and an RS485 interface; the concentrator is a concentrator with a model corresponding to the second data transmission interface and the data transmission interface of the data acquisition board (2), and comprises a network concentrator, an RS422 concentrator, an RS232 concentrator and an RS485 concentrator.
6. A MEMS gyroscope test system according to any one of claims 3 to 5, wherein: the MEMS gyroscope test system also comprises a power supply system (6) arranged outside the high-low temperature box (4), wherein the power supply system (6) comprises a direct-current multi-channel output power supply and a first power supply interface; the single/multi-chip test board (1) comprises a second power supply interface, the data acquisition board (2) comprises a third power supply interface, and the first power supply interface is respectively connected with the direct-current multi-channel output power supply, the second power supply interface and the third power supply interface through cables.
7. A MEMS gyroscope test method is characterized in that: the method comprises a testing step, wherein the testing step comprises the following steps:
mounting a chip to be tested on a chip clamp of a single/multi-chip test board (1) arranged in a high-low temperature box (4);
setting angular rate parameters and direction parameters of a turntable control system (7) to control the rotating speed and direction of the turntable surface (3);
setting the internal temperature of the high-low temperature box (4);
the turntable table surface (3) drives the single/multi-chip test board (1) to move according to the set angular speed and direction;
an output signal of a chip to be tested forms an analog signal through a single/multi-chip test board (1) and is output to a data acquisition board (2) arranged in a high-low temperature box (4);
the data acquisition board (2) performs analog-to-digital conversion on the data and then transmits the data to the upper computer system (5) through the slip ring;
and the upper computer system (5) stores and analyzes data.
8. The MEMS gyroscope test method of claim 7, wherein: the method also comprises an installation step and a replacement step; before the chip to be tested is mounted on a chip clamp of a single/multi-chip test board (1) arranged in a high-low temperature box (4), the mounting step comprises the following substeps:
a single/multi-chip test board (1) and a data acquisition board (2) are arranged on a turntable table top (3);
the single/multi-chip test board (1), the data acquisition board (2) and the upper computer system (5) are connected through cables
The replacing step comprises:
when the single/multi-chip test board (1) or the data acquisition board (2) needs to be replaced, the power supply is closed;
detaching the cable connected with the single/multi-chip test board (1) or the data acquisition board (2);
disassembling the single/multi-chip test board (1) or the data acquisition board (2);
installing a new single/multi-chip test board (1) or a new data acquisition board (2);
the single/multi-chip test board (1), the data acquisition board (2) and the upper computer system (5) are connected through cables.
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| CN201710065869.8A CN106643809B (en) | 2017-02-06 | 2017-02-06 | MEMS gyroscope testing device, system and method |
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| CN110221194A (en) * | 2019-05-06 | 2019-09-10 | 湖北三江航天万峰科技发展有限公司 | A kind of no-welding test macro of analog MEMS gyroscope chip |
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| CN112629557A (en) * | 2020-11-13 | 2021-04-09 | 上海航天控制技术研究所 | Automatic test equipment of MEMS gyroscope |
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| CN104567924A (en) * | 2014-12-18 | 2015-04-29 | 歌尔声学股份有限公司 | Automatic test equipment for gyroscope |
| CN104677381A (en) * | 2015-01-29 | 2015-06-03 | 中国空空导弹研究院 | Testing system for micro-inertial measurement unit |
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