CN106636792B - A kind of composition metal of high conductivity - Google Patents

A kind of composition metal of high conductivity Download PDF

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Publication number
CN106636792B
CN106636792B CN201611247532.0A CN201611247532A CN106636792B CN 106636792 B CN106636792 B CN 106636792B CN 201611247532 A CN201611247532 A CN 201611247532A CN 106636792 B CN106636792 B CN 106636792B
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composition metal
alloy
stage
high conductivity
copper alloy
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CN106636792A (en
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张广飞
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Rugao Kaiyuan Electrical Equipment Co., Ltd
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Ningbo Shengyuan Technology Transmission Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C21/00Alloys based on aluminium
    • C22C21/02Alloys based on aluminium with silicon as the next major constituent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22DCASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D18/00Pressure casting; Vacuum casting
    • B22D18/04Low pressure casting, i.e. making use of pressures up to a few bars to fill the mould
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • C22C9/04Alloys based on copper with zinc as the next major constituent
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14Metallic material, boron or silicon
    • C23C14/16Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14Metallic material, boron or silicon
    • C23C14/16Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • C23C14/165Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Conductive Materials (AREA)

Abstract

The present invention relates to a kind of composition metals of high conductivity, belong to technical field of alloy material.The composition metal includes aluminium alloy core and is coated on the copper alloy outer layer of core surface, aluminium alloy is Fe0.5-0.7%, Si2.2-2.8%, Cu0.06-0.15%, Mg0.12-0.2%, Ti0.025-0.035%, B0.005-0.02%, Zr0.05-0.15%, V0.022-0.025%, Sc0.1-0.2%, surplus is Al, copper alloy is Mn0.06-0.35%, Zn0.8-1.5%, Ni0.30-0.45%, Si0.12-0.20%, Sn0.52-0.58%, Al0.18-0.25%, Ag0.01-0.025%, surplus Cu.The composition metal electric conductivity is high, mechanical property is good, and production cost is low.

Description

A kind of composition metal of high conductivity
Technical field
The present invention relates to a kind of composition metal more particularly to a kind of composition metals of high conductivity, belong to alloy material skill Art field.
Background technology
Alloy is that by two or more metal and metal or nonmetallic synthesized by certain methods have metal The substance of characteristic.Generally obtained by fusing into uniform liquid and solidification.According to the number of component, binary conjunction can be divided into Gold, ternary alloy three-partalloy and multicomponent alloy.Electrical conductivity alloy, for conducting the alloy material of electric energy, dosage is very big in lower industry, and purposes is very Extensively.Village rate, good processing performance and corrosion resistance are led with higher, only certain intensity and modeling ratio use a few days ago Electrical conductivity alloy more than grade is copper alloy and aluminium alloy, one also uses mild steel sometimes.And single copper alloy is used in the prior art Cost will certainly be improved by doing conductive material, influence the market competitiveness.And the electric conductivity of single aluminium alloy can not be with copper alloy It matches in excellence or beauty.
Invention content
The purpose of the present invention is there is the above problem in view of the prior art, it is proposed that it is a kind of it is at low cost, electric conductivity is high Composition metal.
Object of the invention can be realized by the following technical scheme:A kind of composition metal of high conductivity, described answers Alloy category includes aluminium alloy core and is coated on the copper alloy outer layer on aluminium alloy core surface, the composition of the aluminium alloy at Divide and mass percent is Fe0.5-0.7%, Si2.2-2.8%, Cu0.06-0.15%, Mg0.12-0.2%, Ti0.025- 0.035%, B0.005-0.02%, Zr0.05-0.15%, V0.022-0.025%, Sc0.1-0.2%, surplus are Al and can not The impurity avoided, the constituent and mass percent of the copper alloy be Mn0.06-0.35%, Zn0.8-1.5%, Ni0.30-0.45%, Si0.12-0.20%, Sn0.52-0.58%, Al0.18-0.25%, Ag0.01-0.025%, surplus Cu And inevitable impurity.
If only using copper alloy, although electric conductivity is excellent, copper it is expensive, necessarily cause of high cost, market is competing It strives small.And can not ensure its electric conductivity if aluminium alloy is used alone, limit its use.The composition metal of the present invention is selected The preferable aluminium alloy of electric conductivity is ensureing composition metal as core in the preferable copper alloy of core surface coated with conductive performance Production cost is greatly lowered while the electric conductivity of material.
Wherein, the Al alloys of core of the present invention are Al-Mg-Si-Cu-Fe based alloys, although the addition of Mg can reduce conduction Rate, but Mg in the alloy with a large amount of Mg of base aluminum Element generation5Al phases, and whole Mg can be made by heat treatment5Al phases are dissolved into In alloy matrix aluminum α phases so that alloy has higher intensity and excellent mechanical property, and especially, Mg and Si while makes With Mg and Si forms Mg2Si hardening constituents, hence it is evident that increase tensile strength and yield strength, and Si and Al can form Al+Si eutectic liquids Phase is the main component for improving aluminium alloy casting fluidity.Similarly, although Cu can cause conductivity slightly to reduce, add Add suitable Cu, Mg, the disperse degree of particle can be enhanced, enhance the intensity of the particle of instant precipitated phase, enhance portion significantly The areas G.P of the interphase η ' and coherence of point coherence, therefore in the base, the phase particle that when timeliness is precipitated is mainly to be total to by slightly thick The areas lattice G.P and tiny η ' phase compositions, and then alloy strength is improved, so 0.06-0.15%Cu is added in core aluminum alloy Its intensity is further increased while ensureing wiring pawl electric conductivity.Although excessive Si can influence the electric conductivity of alloy, Contain the elements such as Zr, Ti, V, B in wiring pawl aluminium alloy of the present invention, will produce various synergistic effects between element, so The present invention substantially increases Si contents, still can further improve the intensity of alloy.Aluminium alloy of the present invention passes through each basic element Synergistic effect, ensure employ in composition metal electric conductivity in the case of, increase substantially its intensity.Fe in general aluminium alloy For impurity, even if containing Fe in pack alloy, in order to be conducive to demould, the content of Fe is generally 0.8-1.0%, because being less than 0.7% is unfavorable for demoulding, and metallic compound can be generated higher than 1.2%, forms hard spot, reduces alloy flowability, damages product product Matter shortens life of product.However 0.5-0.7% is added in the core aluminum alloy of composition metal of the present invention plus only, using Al-Fe, The forms of the intermetallic compounds such as Al-Fe-Si is crystallized or is precipitated, the crystal or precipitate as crystal grain miniaturization material and It plays a role, intensity and mechanical property is improved while ensureing conductivity.In the core aluminum alloy of composition metal of the present invention If the content of Fe is more than 0.7%, the conductivity of alloy can be seriously affected, and then influence the electric conductivity of composition metal.
Cr, Mn are not contained in the core aluminum alloy of composition metal of the present invention, containing Zr, Ti, V, B, by between each element The synergistic effect of generation, crystal grain thinning further increase intensity, the wearability of alloy.Wherein, the addition of element Zr can be with Al Form Al3Zr becomes the external heterogeneous crystallization nuclei of solid solution, can hinder recrystallization process, refines recrystal grain, refinement Intensity, the wearability of alloy improve in cast sturcture, and Zr can also be reacted with the hydrogen in aluminium alloy, produce ZrH, are dissolved in aluminium alloy Play getter action, reduce pin hole, it is loose the defects of, and then significantly improve the mechanical property of alloy.It is added while Ti and B, B members Element can make the part Zr elements in alloy be changed into precipitation state by solid solution state, in the form of tiny en plaque second phase particles It is present in intra-die and grain boundaries, reduces distortion of lattice, improve the order of alloy matrix aluminum, so as to improve the strong of aluminium alloy Degree, wearability.Ti and Al forms TiAl2Phase becomes heterogeneous necleus when crystallization, plays refinement cast sturcture and seam organization Effect.Although can only contain one or more of Zr, Ti, V, B, the present invention contains there are four types of element simultaneously, keeps refinement brilliant The effect of body structure is enhanced.And the effect not instead of individualism between field of aluminum alloys, each element, by each Ingredient and the percentage of component form an entirety, and the core aluminum alloy of composition metal of the present invention is exactly based on whole reasonable Compatibility further increases electric conductivity, wear-resisting property and the mechanical property of alloy.Being added to Zr in micro Sc and alloy can be The Al that comes into being is formed in process of setting3(Sc, Zr), can notable refining alloy as-cast grain, play auxiliary crystal grain thinning with control again The effect of crystalline structure.And the secondary Al formed when homogenizing3(Sc, Zr) particle can strong pinning dislocation and sub boundary, have Effect inhibits the recrystallization of Deformation structure, and then significantly improves the mechanical property of alloy, is improved particularly its wearability.
And without common elements such as Cr, Ti, Bi in the copper alloy of outer layer, by reducing the content of Ni, improve containing for Si, Sn Amount, and appropriate Ag is added, by the collaboration generated between each element, increase substantially the electric conductivity, intensity, punching press of copper alloy The performances such as property, resistance to stress, wear-resisting.Wherein, it is 15.8% that solid solubility of the Zn in Cu, which is 39.9%, Sn solid solubility in Cu, and Ni can be with Cu infinitely dissolves, they form continuous solid solution with copper, have broad monophase field, they can significantly be improved The mechanical performance of copper.Sn contents in existing copper alloy generally all control within 0.5%, but by constantly testing discovery, The content of Sn has been properly increased in copper alloy of the present invention, is improved to 0.52-0.58%, can more effectively be promoted crystal grain refinement And increase intensity.Suitable Mn can improve the intensity of copper alloy, and because copper-manganese resistance temperature system is seldom, due to there is homoatomic Xenocryst changes, and keeps phase transformation under cupromanganese solid-state sufficiently complex, has spinodal decomposition, the processes such as metacrystal transformation, into one under solid phase Step improves the impact resistance of copper alloy of the present invention.And Si can be with limited solid solution in copper, solid solubility is fierce with temperature change Variation, when being begun to decline after temperature is completed from alloy crystallization, their solid solubility in copper also begin to reduce, with metal Compound or elemental form are precipitated from solid phase, when these element solid solutions are in copper, can significantly improve its intensity, have solid Molten strengthening effect when they are precipitated from solid phase, and produces dispersion-strengthened effect, and conductive and heat conductivility has obtained extensive Multiple, Si, which is added, can not only improve the intensity and resistance to stress of copper alloy, but also can improve the conductivity of alloy.If if but in the present invention The content of Si be less than 0.1% effect that can not play Si, and if Si is more than 0.20%, the conduction of alloy can be largely effected on Rate.Stampability, resistance to stress and the intensity that can promote alloy in copper alloy more of the present invention added with suitable Ag, especially work as alloy In aged, the performance for resisting high temperature stress can be further improved by being added to the above-mentioned copper alloy of Ag.With other alloys member Element is compared, and aluminium can not only increase the mobility of copper water, improve the casting character of the alloy material, moreover it is possible to most significantly be improved copper and be closed The intensity of gold.Since aluminium normal potential is more negative relative to zinc, thus there is the ionization of bigger to tend to, prior to the oxygen in environment In conjunction with preferentially forming micro- close and hard pellumina, the further oxidation of alloy, the Al of formation can be prevented2O3Film has retardance The effect of matrix corrosion.Aluminium is added in the present invention, alpha phase zone can be made significantly to shift to copper angle.It will appear when aluminium content is high hard And crisp γ phases, the intensity and hardness of alloy are improved, while its plasticity is greatly lowered.In addition in outer layer copper alloy of the present invention 0.18-0.25%Al is added, can be preferably combined together with the aluminium alloy of core.But excessive aluminium element instead can be Copper water liquid level generates a large amount of alumite, so that slag inclusion in copper liquid is also formed interlayer in subsequently casting copper casting, causes casting The generation of defect.When working containing elements one such as Sn, Ti, Ni, Bi in copper alloy, effects of the Al in copper alloy can be maximum Change ground to play.
Preferably, the constituent and mass percent of the aluminium alloy be Fe0.6-0.7%, Si2.3-2.5%, Cu0.08-0.12%, Mg0.14-0.18%, Ti0.028-0.033%, B0.008-0.016%, Zr0.06-0.12%, V0.022-0.024%, Sc0.12-0.18%, surplus are Al and inevitable impurity.
Preferably, the mass ratio of Mg and Si is 0.05≤Mg/Si≤0.07 in aluminium alloy.Because same in core aluminum alloy When be added with suitable Zr, Ti, B, V, by between each element synergistic effect improve aluminium alloy conductivity and intensity, so In core aluminum alloy when Mg/Si is less than 0.05, then can not play Mg can improve the effect of intensity, and when Mg/Si is more than When 0.7, especially greater than 0.8, then conductivity will be caused to be greatly reduced, and then influence the electric conductivity of composition metal entirety.
Preferably, the constituent and mass percent of the copper alloy are Mn0.08-0.3%, Zn0.88- 1.25%, Ni0.32-0.42%, Si0.15-0.18%, Sn0.53-0.56%, Al0.20-0.24%, Ag0.02- 0.024%, surplus Cu and inevitable impurity.
Preferably, the mass ratio of Ni and Si is 2.2-2.8 in copper alloy:1.In the copper alloy alloy of outer layer of the present invention The main function of Ni is to make structure refinement, improves impact flexibility, especially Si is coordinated to be added, can form the wear-resisting particles of NiSi, carry The abrasion resistance properties of high material, while nickel can expand alpha phase zone in a certain range, increase α Phase Proportions, guarantor is played to wear-resisting particle Shield acts on, the phenomenon that preventing wear-resisting particle from largely falling off in friction process, but excessively high nickel content can cause α phases excessive, lead It causes the mechanical performance of material to decline, therefore nickel and silicon is added in copper alloy alloy of the present invention, and when the content of Ni and Si is than control System is in 2.2-2.8:It is better both when 1.
Preferably, the thickness of the outer layer is 0.05-1mm.
The processing method of the composition metal of above-mentioned high conductivity includes the following steps:Aluminium alloy solution is cast by low pressure Cause core;Copper alloy solution is deposited into the composition metal that core surface forms copper alloy outer layer to get high conductivity again.
Preferably, the low pressure casting be by aluminium alloy solution sprue inject mold in, injection pressure gradually on 0.28MPa is risen to, 0MPa is then down to, core is taken out in demoulding.
Further preferably, injection pressure rises and decline process is divided into following several stages:
Rise the liquid stage:The liquid stage is risen in preceding 15s, relative pressure rises to 0.08MPa from 0MPa;
Fill the type stage:The type stage is filled in 15-35s, and relative pressure rises to 0.12MPa from 0.08MPa;
The crust stage:For crust in 35-50s, relative pressure rises to 0.15MPa from 0.12MPa;
Pressurization stages:For crust in 50-70s, relative pressure rises to 0.28MPa from 0.15MPa;
Pressurize crystallization stage:For pressurize crystallization stage in 20-250s, relative pressure is maintained at 0.28MPa;
The release stage:The release stage, relative pressure dropped to 0MPa from 0.28MPa in 250-350s.
Core aluminum alloy of the present invention further increases group in aluminium alloy by the casting technique casting and forming in six stage as above The compactness knitted, and then improve its conductivity, mechanical property.
Preferably, the copper alloy outer layer includes by sputtering sedimentation, thermal response evaporation, pulsed laser deposition and its group Conjunction is deposited on core surface.
Compared with prior art, composition metal of the invention selects the preferable aluminium alloy of electric conductivity as core, in core Coated with conductive performance preferable copper alloy in surface is greatly lowered while ensureing the electric conductivity of composite material and is produced into This.
Specific implementation mode
The following is specific embodiments of the present invention, and technical scheme of the present invention will be further described, but the present invention is simultaneously It is not limited to these embodiments.
Embodiment 1
A kind of composition metal of high conductivity, the composition metal include aluminium alloy core and are coated on aluminium alloy core The thickness on portion surface is the copper alloy outer layer of 0.05-1mm, and the constituent and mass percent of the aluminium alloy are Fe0.65%, Si2.4%, Cu0.10%, Mg0.16%, Ti0.032%, B0.012%, Zr0.08%, V0.023%, Sc0.15%, surplus are Al and inevitable impurity;The constituent and mass percent of the copper alloy be Mn0.18%, Zn1.05%, Ni0.38%, Si0.16%, Sn0.54%, Al0.22%, Ag0.022%, surplus Cu and can not The impurity avoided.
The composition metal of high conductivity in the embodiment is made by the following method:
Aluminium alloy as described above is melt into solution and is injected in mold by sprue, six stage casting and formings are passed through: Rise the liquid stage:The liquid stage is risen in preceding 15s, relative pressure rises to 0.08MPa from 0MPa;Fill the type stage:The type stage is filled In 15-35s, relative pressure rises to 0.12MPa from 0.08MPa;The crust stage:Crust in 35-50s, relative pressure from 0.12MPa rises to 0.15MPa;Pressurization stages:In 50-70s, relative pressure rises to crust from 0.15MPa 0.28MPa;Pressurize crystallization stage:For pressurize crystallization stage in 20-250s, relative pressure is maintained at 0.28MPa;Release rank Section:The release stage, relative pressure dropped to 0MPa from 0.28MPa in 250-350s;Core is taken out to obtain in demoulding.
Copper alloy solution as described above is formed into copper alloy outer layer to get this hair by sputtering deposited onto core surface again The composition metal of bright high conductivity.
Embodiment 2
A kind of composition metal of high conductivity, the composition metal include aluminium alloy core and are coated on aluminium alloy core The thickness on portion surface is the copper alloy outer layer of 0.05-1mm, and the constituent and mass percent of the aluminium alloy are Fe0.2%, Si2.3%, Cu0.11%, Mg0.15%, Ti0.032%, B0.01%, Zr0.08%, V0.022%, Sc0.16%, surplus are Al and inevitable impurity;The constituent and mass percent of the copper alloy be Mn0.3%, Zn0.88%, Ni0.42%, Si0.18%, Sn0.53%, Al0.24%, Ag0.02%, surplus Cu and can not keep away The impurity exempted from.
The composition metal of high conductivity in the embodiment is made by the following method:
Aluminium alloy as described above is melt into solution and is injected in mold by sprue, six stage casting and formings are passed through: Rise the liquid stage:The liquid stage is risen in preceding 15s, relative pressure rises to 0.08MPa from 0MPa;Fill the type stage:The type stage is filled In 15-35s, relative pressure rises to 0.12MPa from 0.08MPa;The crust stage:Crust in 35-50s, relative pressure from 0.12MPa rises to 0.15MPa;Pressurization stages:In 50-70s, relative pressure rises to crust from 0.15MPa 0.28MPa;Pressurize crystallization stage:For pressurize crystallization stage in 20-250s, relative pressure is maintained at 0.28MPa;Release rank Section:The release stage, relative pressure dropped to 0MPa from 0.28MPa in 250-350s;Core is taken out to obtain in demoulding.
Copper alloy solution as described above is formed into copper alloy outer layer by thermal response hydatogenesis to core surface again, i.e., Obtain the composition metal of high conductivity of the present invention.
Embodiment 3
A kind of composition metal of high conductivity, the composition metal include aluminium alloy core and are coated on aluminium alloy core The thickness on portion surface is the copper alloy outer layer of 0.05-1mm, and the constituent and mass percent of the aluminium alloy are Fe0.6%, Si2.5%, Cu0.12%, Mg0.17%, Ti0.028%, B0.016%, Zr0.06%, V0.024%, Sc0.12%, surplus are Al and inevitable impurity;The constituent and mass percent of the copper alloy be Mn0.08%, Zn1.25%, Ni0.35%, Si0.15%, Sn0.56%, Al0.20%, Ag0.024%, surplus Cu and can not The impurity avoided.
The composition metal of high conductivity in the embodiment is made by the following method:
Aluminium alloy as described above is melt into solution and is injected in mold by sprue, six stage casting and formings are passed through: Rise the liquid stage:The liquid stage is risen in preceding 15s, relative pressure rises to 0.08MPa from 0MPa;Fill the type stage:The type stage is filled In 15-35s, relative pressure rises to 0.12MPa from 0.08MPa;The crust stage:Crust in 35-50s, relative pressure from 0.12MPa rises to 0.15MPa;Pressurization stages:In 50-70s, relative pressure rises to crust from 0.15MPa 0.28MPa;Pressurize crystallization stage:For pressurize crystallization stage in 20-250s, relative pressure is maintained at 0.28MPa;Release rank Section:The release stage, relative pressure dropped to 0MPa from 0.28MPa in 250-350s;Core is taken out to obtain in demoulding.
Copper alloy solution as described above is formed into copper alloy outer layer by thermal response hydatogenesis to core surface again, i.e., Obtain the composition metal of high conductivity of the present invention.
Embodiment 4
A kind of composition metal of high conductivity, the composition metal include aluminium alloy core and are coated on aluminium alloy core The copper alloy outer layer on portion surface, the constituent and mass percent of the aluminium alloy be Fe0.5%, Si2.8%, Cu0.06%, Mg0.2%, Ti0.025%, B0.02%, Zr0.05%, V0.025%, Sc0.1%, surplus are Al and can not keep away The impurity exempted from, the constituent and mass percent of the copper alloy be Mn0.06%, Zn1.5%, Ni0.30%, Si0.20%, Sn0.52%, Al0.25%, Ag0.01%, surplus Cu and inevitable impurity.
The composition metal of high conductivity in the embodiment is made by the following method:
Aluminium alloy as described above is melt into solution and is injected in mold by sprue, six stage casting and formings are passed through: Rise the liquid stage:The liquid stage is risen in preceding 15s, relative pressure rises to 0.08MPa from 0MPa;Fill the type stage:The type stage is filled In 15-35s, relative pressure rises to 0.12MPa from 0.08MPa;The crust stage:Crust in 35-50s, relative pressure from 0.12MPa rises to 0.15MPa;Pressurization stages:In 50-70s, relative pressure rises to crust from 0.15MPa 0.28MPa;Pressurize crystallization stage:For pressurize crystallization stage in 20-250s, relative pressure is maintained at 0.28MPa;Release rank Section:The release stage, relative pressure dropped to 0MPa from 0.28MPa in 250-350s;Core is taken out to obtain in demoulding.
Copper alloy solution as described above is formed into copper alloy outer layer to get this hair by sputtering deposited onto core surface again The composition metal of bright high conductivity.
Embodiment 5
A kind of composition metal of high conductivity, the composition metal include aluminium alloy core and are coated on aluminium alloy core The copper alloy outer layer on portion surface, the constituent and mass percent of the aluminium alloy be Fe0.7%, Si2.2%, Cu0.15%, Mg0.12%, Ti0.035%, B0.005%, Zr0.15%, V0.022%, Sc0.2%, surplus are Al and can not The impurity avoided, the constituent and mass percent of the copper alloy be Mn0.35%, Zn0.8%, Ni0.45%, Si0.12%, Sn0.58%, Al0.18%, Ag0.025%, surplus Cu and inevitable impurity.
The composition metal of high conductivity in the embodiment is made by the following method:
Aluminium alloy as described above is melt into solution and is injected in mold by sprue, six stage casting and formings are passed through: Rise the liquid stage:The liquid stage is risen in preceding 15s, relative pressure rises to 0.08MPa from 0MPa;Fill the type stage:The type stage is filled In 15-35s, relative pressure rises to 0.12MPa from 0.08MPa;The crust stage:Crust in 35-50s, relative pressure from 0.12MPa rises to 0.15MPa;Pressurization stages:In 50-70s, relative pressure rises to crust from 0.15MPa 0.28MPa;Pressurize crystallization stage:For pressurize crystallization stage in 20-250s, relative pressure is maintained at 0.28MPa;Release rank Section:The release stage, relative pressure dropped to 0MPa from 0.28MPa in 250-350s;Core is taken out to obtain in demoulding.
Copper alloy solution as described above is formed into copper alloy outer layer by thermal response hydatogenesis to core surface again, i.e., Obtain the composition metal of high conductivity of the present invention.
Comparative example 1
Common aluminium alloy in the prior art.
Comparative example 2
Common copper alloy in the prior art.
Comparative example 3
Single alloy, the only aluminium alloy described in embodiment 1.
Comparative example 4
Single alloy, copper alloy only as described in example 1 above.
Comparative example 5
With differing only in embodiment 1, the comparative example is using aluminium alloy as described in example 1 above by commonly adding Work method is molded.
Table 1:The performance of embodiment 1-5 and the alloy in comparative example 1-5
In conclusion the composition metal of the present invention selects the preferable aluminium alloy of electric conductivity as core, in core surface packet The preferable copper alloy of electric conductivity is covered, production cost is greatly lowered while ensureing the electric conductivity of composite material.And The aluminium alloy compatibility of core is reasonable in composition metal of the present invention, by the synergistic effect generated between each element, and passes through six ranks The casting technique of section is made, and further increases its conductivity, wearability, mechanical property.The copper alloy compatibility of outer layer is reasonable, passes through The synergistic effect generated between each element, and being made up of the casting technique in six stages further increases its conductivity, wear-resisting Property, mechanical property.Copper alloy is deposited on core surface layer by depositional mode, is further increased between aluminium alloy and copper alloy Binding force, and then improve electric conductivity, wearability and other mechanical properties of composition metal.
Specific embodiment described herein is only an example for the spirit of the invention.Technology belonging to the present invention is led The technical staff in domain can make various modifications or additions to the described embodiments or replace by a similar method In generation, however, it does not deviate from the spirit of the invention or beyond the scope of the appended claims.

Claims (7)

1. a kind of composition metal of high conductivity, which is characterized in that the composition metal includes aluminium alloy core and cladding Copper alloy outer layer on aluminium alloy core surface, the constituent and mass percent of the aluminium alloy be Fe0.5-0.7%, Si2.2-2.8%, Cu0.06-0.15%, Mg0.12-0.2%, Ti0.025-0.035%, B0.005-0.02%, Zr0.05- 0.15%, V0.022-0.025%, Sc0.1-0.2%, surplus are Al and inevitable impurity, the composition of the copper alloy Ingredient and mass percent be Mn0.06-0.35%, Zn0.8-1.5%, Ni0.30-0.45%, Si0.12-0.20%, Sn0.52-0.58%, Al0.18-0.25%, Ag0.01-0.025%, surplus Cu and inevitable impurity;
The processing method of the composition metal of the high conductivity includes the following steps:Aluminium alloy solution is passed through into low pressure casting Cheng Xin Portion;Copper alloy solution is deposited into the composition metal that core surface forms copper alloy outer layer to get high conductivity again;
The low pressure casting is to inject aluminium alloy solution sprue in mold, and injection pressure gradually rises to 0.28MPa, so After be down to 0MPa, core is taken out in demoulding;Wherein injection pressure rises and decline process is divided into following several stages:Rise the liquid stage: The liquid stage is risen in preceding 15s, relative pressure rises to 0.08MPa from 0MPa;Fill the type stage:The type stage is filled in 15-35s, Relative pressure rises to 0.12MPa from 0.08MPa;The crust stage:Crust is in 35-50s, and relative pressure is from 0.12MPa It is raised to 0.15MPa;Pressurization stages:For crust in 50-70s, relative pressure rises to 0.28MPa from 0.15MPa;Pressurize crystallizes Stage:For pressurize crystallization stage in 20-250s, relative pressure is maintained at 0.28MPa;The release stage:The release stage is In 250-350s, relative pressure drops to 0MPa from 0.28MPa.
2. the composition metal of high conductivity according to claim 1, which is characterized in that the constituent of the aluminium alloy And mass percent is Fe0.6-0.7%, Si2.3-2.5%, Cu0.08-0.12%, Mg0.14-0.18%, Ti0.028- 0.033%, B0.008-0.016%, Zr0.06-0.12%, V0.022-0.024%, Sc0.12-0.18%, surplus be Al and Inevitable impurity.
3. the composition metal of high conductivity according to claim 1 or 2, which is characterized in that the matter of Mg and Si in aluminium alloy Amount is than being 0.05≤Mg/Si≤0.07.
4. the composition metal of high conductivity according to claim 1, which is characterized in that the constituent of the copper alloy And mass percent is Mn0.08-0.3%, Zn0.88-1.25%, Ni0.32-0.42%, Si0.15-0.18%, Sn0.53- 0.56%, Al0.20-0.24%, Ag0.02-0.024%, surplus Cu and inevitable impurity.
5. the composition metal of high conductivity according to claim 1 or 4, which is characterized in that the matter of Ni and Si in copper alloy Amount is than being 2.2-2.8:1.
6. the composition metal of high conductivity according to claim 1, which is characterized in that the thickness of the outer layer is 0.05- 1mm。
7. the composition metal of high conductivity according to claim 1, which is characterized in that the copper alloy outer layer includes logical It crosses sputtering sedimentation, thermal response evaporation, pulsed laser deposition and a combination thereof and is deposited on core surface.
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