CN106633211A - Formula of radiating fin material for computer mainboard - Google Patents
Formula of radiating fin material for computer mainboard Download PDFInfo
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- CN106633211A CN106633211A CN201610917543.9A CN201610917543A CN106633211A CN 106633211 A CN106633211 A CN 106633211A CN 201610917543 A CN201610917543 A CN 201610917543A CN 106633211 A CN106633211 A CN 106633211A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L5/00—Compositions of polysaccharides or of their derivatives not provided for in groups C08L1/00 or C08L3/00
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention relates to a formula of a radiating fin material for a computer mainboard. The formula comprises silver, aluminum, copper, gold, lead, epoxy resin, silicone grease, polyvinyl alcohol, polyester, polyacrylonitrile, phenolic resin, amino plastics, silicate, graphite powder, carbon fibers, aminopropyltriethoxysilane, methyl triethoxy silane, fatty alcohol polyoxyethylene ether, alkyl phenol polyoxyethylene ether, polyvinyl alcohol, hydrophobically modified polyacrylate, fatty amine, polyamide, dimethyl glutarate, dimethyl adipate, xanthan gum and aluminium-magnesium silicate in parts by weight. A radiating fin manufactured by the radiating fin material formula provided by the invention can greatly enhance the effects of heat absorption, storage and evacuation of the radiating fin, so as to avoid the burning phenomenon of a circuit board.
Description
Technical field
The present invention relates to field of computer technology, more particularly to a kind of computer motherboard fin material material formula.
Background technology
Computer (computer) is commonly called as computer, is a kind of modern electronic computer device for supercomputing, Ke Yijin
Row numerical computations, can carry out logical calculated, also with store-memory function again.It is can to run according to program, automatically, at a high speed
Process the modernization intelligent electronic device of mass data.It is made up of hardware system and software systems, is fitted without any software
Computer be referred to as bare machine.Supercomputer, industrial control computer, network computer, personal computer, embedded can be divided into
The class of computer five, more advanced computer has biocomputer, photonic computer, quantum computer etc..
In prior art, the workload of computer is related to various fields, and particularly some fields need computer long-term
Open, the electronic devices and components of computer are always maintained at the state run that is powered, so as to the temperature for causing circuit board remains high,
Often lowered the temperature using radiator fan, the normal operation of holding circuit plate is adopted on the circuit board of present computer
The effect of fin is by the heat absorption of electronic devices and components generation on circuit board on fin, then by radiator fan general
Temperature on fin is discharged, and present fin major part is all made of the efficiency that heat energy is absorbed using aluminium or aluminium alloy
It is limited, it is easy to cause a large amount of heat energy effectively to evacuate, so as to the phenomenon for causing circuit board to burn occurs.
The content of the invention
The present invention according to the deficiencies in the prior art, the present invention provides one kind and can improve absorption heat energy, is easy to heat energy to dredge
Scattered computer motherboard fin material material formula.
The present invention is achieved in that a kind of computer motherboard fin material material formula, includes according to weight ratio：
0.035～0.065 part of silver, 5.5～8.5 parts of aluminium, 4～12 parts of copper, 0.015～0.035 part of gold, 0.25～0.58 part of lead, epoxy
2～4 parts of resin, 2～4 parts of silicone grease, 2～4 parts of polyvinyl alcohol, 5～8 parts of polyester, 1～2 part of polyacrylonitrile, phenolic resin 8～16
Part, 3～6 parts of aminoplast, 10～12 parts of silicate, 6～12 parts of graphite powder, 5～10 parts of carbon fiber, aminopropyl-triethoxy silicon
2～5 parts of alkane, 3.8～6.6 parts of MTES, 1.5～4.4 parts of AEO, alkylphenol-polyethenoxy
0.6～1.2 part of ether, 1～3 part of polyvinyl alcohol, 0.8～1.6 part of hydrophobically modified polyacrylate, 2～3 parts of fatty amine, polyamide 1
～2 parts, 4～8 parts of dimethyl glutarate, 0.3～1.2 part of dimethyl adipate, 12～16 parts of xanthans and aluminium-magnesium silicate 3～5
Part.
Further, include according to weight ratio：0.035 part of silver, 5.5 parts of aluminium, 4 parts of copper, golden 0.015 part, lead 0.25
Part, 2 parts of epoxy resin, 2 parts of silicone grease, 2 parts of polyvinyl alcohol, 5 parts of polyester, 1 part of polyacrylonitrile, 8 parts of phenolic resin, aminoplast 3
Part, 10 parts of silicate, 6 parts of graphite powder, 5 parts of carbon fiber, 2 parts of aminopropyl triethoxysilane, MTES 3.8
Part, 1.5 parts of AEO, 0.6 part of APES, 1 part of polyvinyl alcohol, hydrophobically modified polyacrylate
0.8 part, 2 parts of fatty amine, 1 part of polyamide, 4 parts of dimethyl glutarate, 0.3 part of dimethyl adipate, 12 parts of xanthans and silicic acid
3 parts of magnalium.
Further, include according to weight ratio：0.065 part of silver, 8.5 parts of aluminium, 12 parts of copper, golden 0.035 part, lead 0.58
Part, 4 parts of epoxy resin, 4 parts of silicone grease, 4 parts of polyvinyl alcohol, 8 parts of polyester, 2 parts of polyacrylonitrile, 16 parts of phenolic resin, aminoplast 6
Part, 12 parts of silicate, 12 parts of graphite powder, 10 parts of carbon fiber, 5 parts of aminopropyl triethoxysilane, MTES 6.6
Part, 4.4 parts of AEO, 1.2 parts of APES, 3 parts of polyvinyl alcohol, hydrophobically modified polyacrylate
1.6 parts, 3 parts of fatty amine, 2 parts of polyamide, 8 parts of dimethyl glutarate, 1.2 parts of dimethyl adipate, 16 parts of xanthans and silicic acid
5 parts of magnalium.
Further, include according to weight ratio：0.045 part of silver, 6.5 parts of aluminium, 8 parts of copper, golden 0.025 part, lead 0.45
Part, the modeling of 3 parts of epoxy resin, 3 parts of silicone grease, 3 parts of polyvinyl alcohol, 6 parts of polyester, 1.5 parts of polyacrylonitrile, 12 parts of phenolic resin, amino
5 parts of material, 11 parts of silicate, 9 parts of graphite powder, 7.5 parts of carbon fiber, 3.5 parts of aminopropyl triethoxysilane, methyltriethoxy silane
4.6 parts of alkane, 2.8 parts of AEO, 0.9 part of APES, 2 parts of polyvinyl alcohol, hydrophobically modified poly- third
1.2 parts of olefin(e) acid ester, 2.5 parts of fatty amine, 1.5 parts of polyamide, 6 parts of dimethyl glutarate, 0.75 part of dimethyl adipate, xanthans
14 parts and 4 parts of aluminium-magnesium silicate.
The advantage of a kind of computer motherboard fin material material formula that the present invention is provided is：The formula that the present invention is provided
Proportioning, by by silver, aluminium, copper, gold, lead, epoxy resin, silicone grease, polyvinyl alcohol, polyester, polyacrylonitrile, phenolic resin, amino
Plastics, silicate, graphite powder, carbon fiber, aminopropyl triethoxysilane, MTES, aliphatic alcohol polyethenoxy
Ether, APES, polyvinyl alcohol, hydrophobically modified polyacrylate, fatty amine, polyamide, dimethyl glutarate, oneself
The fin that acid dimethyl, xanthans and aluminium-magnesium silicate are produced according to proportioning, gold and silver have very strong heat-sinking capability,
Ability of the copper with very strong heat absorption and storage heat energy, aluminium and lead are used as auxiliary heat dissipation base material, epoxy resin, silicone grease, polyethylene
The heat absorption of alcohol, polyester, polyacrylonitrile, phenolic resin and aminoplast and heat dispersion are very strong, coordinate silver, aluminium, copper, Jin He
Lead, is mutually mixed, and can substantially increase the efficiency of they itself heat absorption and radiating, and by adding silicate, graphite
The combination of powder and carbon fiber, increases the expansive force and adhesion of later stage shaping, by aminopropyl triethoxysilane and methyl three
Ethoxysilane as levelling agent, AEO and APES as dispersant, polyvinyl alcohol and
Hydrophobically modified polyacrylate as surfactant, fatty amine and polyamide as curing agent, dimethyl glutarate and oneself two
Used as diluent, xanthans and aluminium-magnesium silicate can be greatly enhanced between above-mentioned each formula mutually dimethyl phthalate as thickener
Combination, greatly enhance the fin made absorbs heat energy, storage heat energy and evacuating the effect of heat energy, so as to avoid leading
The phenomenon that circuit board burns is caused to occur.
Specific embodiment
In order that the objects, technical solutions and advantages of the present invention become more apparent, with reference to embodiments, to the present invention
It is further elaborated.It should be appreciated that specific embodiment described herein is not used to only to explain the present invention
Limit the present invention.
Embodiment one：
A kind of computer motherboard fin material material formula, includes according to weight ratio：Silver-colored 0.035 part, 5.5 parts of aluminium,
4 parts of copper, gold 0.015 part, 0.25 part of lead, 2 parts of epoxy resin, 2 parts of silicone grease, 2 parts of polyvinyl alcohol, 5 parts of polyester, 1 part of polyacrylonitrile,
8 parts of phenolic resin, 3 parts of aminoplast, 10 parts of silicate, 6 parts of graphite powder, 5 parts of carbon fiber, 2 parts of aminopropyl triethoxysilane,
3.8 parts of MTES, 1.5 parts of AEO, 0.6 part of APES, polyvinyl alcohol 1
Part, 0.8 part of hydrophobically modified polyacrylate, 2 parts of fatty amine, 1 part of polyamide, 4 parts of dimethyl glutarate, dimethyl adipate
3 parts of 0.3 part, 12 parts of xanthans and aluminium-magnesium silicate.
Embodiment two：
A kind of computer motherboard fin material material formula, includes according to weight ratio：Silver-colored 0.065 part, 8.5 parts of aluminium,
12 parts of copper, 0.035 part of gold, 0.58 part of lead, 4 parts of epoxy resin, 4 parts of silicone grease, 4 parts of polyvinyl alcohol, 8 parts of polyester, polyacrylonitrile 2
Part, 16 parts of phenolic resin, 6 parts of aminoplast, 12 parts of silicate, 12 parts of graphite powder, 10 parts of carbon fiber, aminopropyl-triethoxy silicon
5 parts of alkane, 6.6 parts of MTES, 4.4 parts of AEO, 1.2 parts of APES, poly- second
3 parts of enol, 1.6 parts of hydrophobically modified polyacrylate, 3 parts of fatty amine, 2 parts of polyamide, 8 parts of dimethyl glutarate, adipic acid two
5 parts of 1.2 parts of methyl esters, 16 parts of xanthans and aluminium-magnesium silicate.
Embodiment three：
A kind of computer motherboard fin material material formula, includes according to weight ratio：Silver-colored 0.045 part, 6.5 parts of aluminium,
8 parts of copper, 0.025 part of gold, 0.45 part of lead, 3 parts of epoxy resin, 3 parts of silicone grease, 3 parts of polyvinyl alcohol, 6 parts of polyester, polyacrylonitrile 1.5
Part, 12 parts of phenolic resin, 5 parts of aminoplast, 11 parts of silicate, 9 parts of graphite powder, 7.5 parts of carbon fiber, aminopropyl-triethoxy silicon
It is 3.5 parts of alkane, 4.6 parts of MTES, 2.8 parts of AEO, 0.9 part of APES, poly-
2 parts of vinyl alcohol, 1.2 parts of hydrophobically modified polyacrylate, 2.5 parts of fatty amine, 1.5 parts of polyamide, 6 parts of dimethyl glutarate, oneself
4 parts of 0.75 part of acid dimethyl, 14 parts of xanthans and aluminium-magnesium silicate.
In actual mechanical process, the fin using effect manufactured according to the proportioning of embodiment three is optimal.
The advantage of a kind of computer motherboard fin material material formula that the present invention is provided is：The formula that the present invention is provided
Proportioning, by by silver, aluminium, copper, gold, lead, epoxy resin, silicone grease, polyvinyl alcohol, polyester, polyacrylonitrile, phenolic resin, amino
Plastics, silicate, graphite powder, carbon fiber, aminopropyl triethoxysilane, MTES, aliphatic alcohol polyethenoxy
Ether, APES, polyvinyl alcohol, hydrophobically modified polyacrylate, fatty amine, polyamide, dimethyl glutarate, oneself
The fin that acid dimethyl, xanthans and aluminium-magnesium silicate are produced according to proportioning, gold and silver have very strong heat-sinking capability,
Ability of the copper with very strong heat absorption and storage heat energy, aluminium and lead are used as auxiliary heat dissipation base material, epoxy resin, silicone grease, polyethylene
The heat absorption of alcohol, polyester, polyacrylonitrile, phenolic resin and aminoplast and heat dispersion are very strong, coordinate silver, aluminium, copper, Jin He
Lead, is mutually mixed, and can substantially increase the efficiency of they itself heat absorption and radiating, and by adding silicate, graphite
The combination of powder and carbon fiber, increases the expansive force and adhesion of later stage shaping, by aminopropyl triethoxysilane and methyl three
Ethoxysilane as levelling agent, AEO and APES as dispersant, polyvinyl alcohol and
Hydrophobically modified polyacrylate as surfactant, fatty amine and polyamide as curing agent, dimethyl glutarate and oneself two
Used as diluent, xanthans and aluminium-magnesium silicate can be greatly enhanced between above-mentioned each formula mutually dimethyl phthalate as thickener
Combination, greatly enhance the fin made absorbs heat energy, storage heat energy and evacuating the effect of heat energy, so as to avoid leading
The phenomenon that circuit board burns is caused to occur.
Presently preferred embodiments of the present invention is the foregoing is only, not to limit the present invention, all essences in the present invention
Any modification, equivalent and improvement made within god and principle etc., should be included within the scope of the present invention.
Claims (4)
1. a kind of computer motherboard fin material material formula, it is characterised in that include according to weight ratio：Silver 0.035～
0.065 part, 5.5～8.5 parts of aluminium, 4～12 parts of copper, gold 0.015～0.035 part, 0.25～0.58 part of lead, epoxy resin 2～4
Part, the modeling of 2～4 parts of silicone grease, 2～4 parts of polyvinyl alcohol, 5～8 parts of polyester, 1～2 part of polyacrylonitrile, 8～16 parts of phenolic resin, amino
Material 3～6 parts, 10～12 parts of silicate, 6～12 parts of graphite powder, 5～10 parts of carbon fiber, 2～5 parts of aminopropyl triethoxysilane,
3.8～6.6 parts of MTES, 1.5～4.4 parts of AEO, APES 0.6～
1.2 parts, 1～3 part of polyvinyl alcohol, 0.8～1.6 part of hydrophobically modified polyacrylate, 2～3 parts of fatty amine, 1～2 part of polyamide,
3～5 parts of 4～8 parts of dimethyl glutarate, 0.3～1.2 part of dimethyl adipate, 12～16 parts of xanthans and aluminium-magnesium silicate.
2. a kind of computer motherboard fin material material formula according to claim 1, it is characterised in that according to weight portion
Ratio includes：0.035 part of silver, 5.5 parts of aluminium, 4 parts of copper, 0.015 part of gold, 0.25 part of lead, 2 parts of epoxy resin, 2 parts of silicone grease, poly- second
2 parts of enol, 5 parts of polyester, 1 part of polyacrylonitrile, 8 parts of phenolic resin, 3 parts of aminoplast, 10 parts of silicate, 6 parts of graphite powder, carbon are fine
5 parts of dimension, 2 parts of aminopropyl triethoxysilane, 3.8 parts of MTES, 1.5 parts of AEO, alkyl
0.6 part of phenol polyethenoxy ether, 1 part of polyvinyl alcohol, 0.8 part of hydrophobically modified polyacrylate, 2 parts of fatty amine, 1 part of polyamide, penta
3 parts of 4 parts of acid dimethyl, 0.3 part of dimethyl adipate, 12 parts of xanthans and aluminium-magnesium silicate.
3. a kind of computer motherboard fin material material formula according to claim 1, it is characterised in that according to weight portion
Ratio includes：0.065 part of silver, 8.5 parts of aluminium, 12 parts of copper, 0.035 part of gold, 0.58 part of lead, 4 parts of epoxy resin, 4 parts of silicone grease, poly- second
4 parts of enol, 8 parts of polyester, 2 parts of polyacrylonitrile, 16 parts of phenolic resin, 6 parts of aminoplast, 12 parts of silicate, 12 parts of graphite powder, carbon
10 parts of fiber, 5 parts of aminopropyl triethoxysilane, 6.6 parts of MTES, 4.4 parts of AEO, alkane
1.2 parts of base phenol polyethenoxy ether, 3 parts of polyvinyl alcohol, 1.6 parts of hydrophobically modified polyacrylate, 3 parts of fatty amine, 2 parts of polyamide,
5 parts of 8 parts of dimethyl glutarate, 1.2 parts of dimethyl adipate, 16 parts of xanthans and aluminium-magnesium silicate.
4. a kind of computer motherboard fin material material formula according to claim 1, it is characterised in that according to weight portion
Ratio includes：0.045 part of silver, 6.5 parts of aluminium, 8 parts of copper, 0.025 part of gold, 0.45 part of lead, 3 parts of epoxy resin, 3 parts of silicone grease, poly- second
3 parts of enol, 6 parts of polyester, 1.5 parts of polyacrylonitrile, 12 parts of phenolic resin, 5 parts of aminoplast, 11 parts of silicate, 9 parts of graphite powder,
7.5 parts of carbon fiber, 3.5 parts of aminopropyl triethoxysilane, 4.6 parts of MTES, AEO 2.8
Part, 0.9 part of APES, 2 parts of polyvinyl alcohol, 1.2 parts of hydrophobically modified polyacrylate, 2.5 parts of fatty amine, polyamides
4 parts of 1.5 parts of amine, 6 parts of dimethyl glutarate, 0.75 part of dimethyl adipate, 14 parts of xanthans and aluminium-magnesium silicate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610917543.9A CN106633211A (en) | 2016-10-21 | 2016-10-21 | Formula of radiating fin material for computer mainboard |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610917543.9A CN106633211A (en) | 2016-10-21 | 2016-10-21 | Formula of radiating fin material for computer mainboard |
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| CN106633211A true CN106633211A (en) | 2017-05-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610917543.9A Pending CN106633211A (en) | 2016-10-21 | 2016-10-21 | Formula of radiating fin material for computer mainboard |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110835427A (en) * | 2019-11-15 | 2020-02-25 | 西安海的电子科技有限公司 | Preparation method of computer mainboard heat dissipation material |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101815772A (en) * | 2007-09-14 | 2010-08-25 | 汉高股份两合公司 | Thermally conductive composition |
| CN105462378A (en) * | 2015-12-02 | 2016-04-06 | 铜陵市肆得科技有限责任公司 | Water-borne antirust coating having good heat dissipation and applied to pump valve |
| CN105722375A (en) * | 2016-01-29 | 2016-06-29 | 白德旭 | Graphene radiating apparatus and preparation method therefor |
| CN105969024A (en) * | 2016-06-27 | 2016-09-28 | 上海多希石墨烯材料科技有限公司 | Heat conduction coating material with physically stripped graphene and method for preparing heat conduction coating material |
-
2016
- 2016-10-21 CN CN201610917543.9A patent/CN106633211A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101815772A (en) * | 2007-09-14 | 2010-08-25 | 汉高股份两合公司 | Thermally conductive composition |
| CN105462378A (en) * | 2015-12-02 | 2016-04-06 | 铜陵市肆得科技有限责任公司 | Water-borne antirust coating having good heat dissipation and applied to pump valve |
| CN105722375A (en) * | 2016-01-29 | 2016-06-29 | 白德旭 | Graphene radiating apparatus and preparation method therefor |
| CN105969024A (en) * | 2016-06-27 | 2016-09-28 | 上海多希石墨烯材料科技有限公司 | Heat conduction coating material with physically stripped graphene and method for preparing heat conduction coating material |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110835427A (en) * | 2019-11-15 | 2020-02-25 | 西安海的电子科技有限公司 | Preparation method of computer mainboard heat dissipation material |
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