CN106621068A - Semiconductor laser module and method for noninvasive medical treatment - Google Patents
Semiconductor laser module and method for noninvasive medical treatment Download PDFInfo
- Publication number
- CN106621068A CN106621068A CN201610901567.5A CN201610901567A CN106621068A CN 106621068 A CN106621068 A CN 106621068A CN 201610901567 A CN201610901567 A CN 201610901567A CN 106621068 A CN106621068 A CN 106621068A
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- China
- Prior art keywords
- semiconductor laser
- module
- light source
- output type
- direct output
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Classifications
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N5/00—Radiation therapy
- A61N5/06—Radiation therapy using light
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N5/00—Radiation therapy
- A61N5/06—Radiation therapy using light
- A61N5/067—Radiation therapy using light using laser light
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N5/00—Radiation therapy
- A61N5/06—Radiation therapy using light
- A61N2005/0635—Radiation therapy using light characterised by the body area to be irradiated
- A61N2005/0642—Irradiating part of the body at a certain distance
Abstract
The invention provides a semiconductor laser module and method for noninvasive medical treatment. The module comprises a direct output type semiconductor laser light source for emitting laser with a fast axis divergence angle of 0 to 50 degrees and a slow axis divergence angle of 0 to 8 degrees for noninvasive medical treatment. According to the semiconductor laser module and method, external irradiation is carried out to achieve an objective of treatment under the circumstance that the human body has no injury. Moreover, the cost is low and the treatment effect is good.
Description
Technical field
The present invention relates to field of semiconductor lasers, more particularly to a kind of semiconductor laser module for non-invasive medical
And method.
Background technology
At present, laser medicine and laser beautifying develop very fast as a key areas of laser application.Semiconductor
The characteristics of laser instrument with small volume, lightweight, life-span length, wavelength because covering wide, is particularly well-suited to medical and beauty treatment equipment.Partly lead
Application of the body laser in medical and beauty treatment fields mainly has depilation, tender skin, fat melting etc..
By taking fat melting as an example, fat melting scheme of the prior art mainly includes following three kinds：
The first：Using fiber coupling class laser instrument direct irradiation fat sites, the shortcoming of the program is high cost, and structure is multiple
It is miscellaneous.
Second：Perform the operation internal liposuction, body fat is directly peeled off by surgical operation, reach fat-reducing purpose.The program
Shortcoming be have wound, recover slow, risk is higher.
The third：Ultrasonic wave fat melting, by focusing ultrasonic wave body fat layer, heating fat, makes adipose tissue inside generation
Thank, so as to reach the purpose of fat-reducing.The shortcoming of the program be it is necessary to have enough fat deposit thickness could be realized, meanwhile, gather
Burnt depth is not easy to control, and the indifference heating carried out to adipose tissue has the risk of injured nerve.
In view of the deficiency of such scheme, in the urgent need to a kind of hurtless measure and the laser medicine method of effect is significant.
The content of the invention
In view of this, the purpose of the present invention essentially consist in provide a kind of semiconductor laser module for non-invasive medical and
The characteristics of method, program, is realized based on direct output type of semiconductor laser instrument, that is to say, that the technical scheme is that base
The laser gone out in semiconductor laser after shaping, with carrying out the noninvasive of correlation controlled by direct irradiation region to be treated
Treat.By technical solutions according to the invention, can to human body without any wound in the case of, by extracorporeal irradiation, reach
The purpose for the treatment of, and low cost, therapeutic effect is good.
Technical scheme is as follows：
The present invention provides a kind of semiconductor laser module for non-invasive medical, it is characterised in that the module includes：Directly
Output type of semiconductor laser light source, for carrying out nothing by the laser of 0 ~ 50 ° of transmitting fast axis divergence angle, 0 ~ 8 ° of slow axis divergence
Wound treatment.
In such scheme, the direct output type of semiconductor laser light source is：Single-tube semiconductor laser, single bar are partly led
Body laser.
In such scheme, the module also includes light-beam forming unit；The light-beam forming unit is including lens and instead
Light part, both are successively set on the light direction of the semiconductor laser light source, for the semiconductor laser light
The laser that source is launched is homogenized and expanded.
In such scheme, the quantity of the lens is one or more；The reflecting part is reflector or reflection shield.
In such scheme, the module also includes refrigerating plant, and the refrigerating plant is liquid refrigerating type, for for described
Direct output type of semiconductor laser optical source heat-dissipating.
In such scheme, the module also includes sealing device, for sealing and supporting the semiconductor laser module.
In such scheme, the sealing device is hollow shell component, and is provided with light-emitting window, and the light-emitting window is used for will
It is described homogenize and expand after laser, region to be treated is acted in the way of extracorporeal irradiation.
The present invention also provides a kind of method for non-invasive medical, and methods described includes：Direct output type of semiconductor is swashed
Light device launches the laser of 0 ~ 50 ° of fast axis divergence angle, 0 ~ 8 ° of slow axis divergence as light source using the light source；By the laser
Region to be treated is acted in the way of extracorporeal irradiation, non-invasive therapy is carried out.
In such scheme, the wavelength correspondence region to be treated of the direct output type of semiconductor laser instrument transmitting laser beam
The absorbing wavelength of tissue.
In such scheme, the direct output type of semiconductor laser instrument includes above-described semiconductor laser module.
Technical scheme disclosed in this invention, as light source, is made full use of and is partly led using direct output type of semiconductor laser instrument
The characteristics of body laser angle of divergence is big, realizes non-invasive therapy in the way of the irradiation of large area hot spot in vitro.By institute of the present invention
The technical scheme of offer, can reach very good therapeutic effect in the case where human body is without any wound, successfully realize nothing
Wound medical treatment, and from cost for, the present invention solves traditional fiber based on the scheme of direct output type of semiconductor laser instrument
The problem of coupling class scheme high cost.
Description of the drawings
Fig. 1 is semiconductor laser module structure composition schematic diagram of the present invention for non-invasive medical；
Fig. 2 is semiconductor laser module structure connection diagram of the present invention for non-invasive medical.
Drawing reference numeral explanation：1 is direct output type of semiconductor laser light source, and 2 is lens, and 3 is reflecting part, and 4 are system
Device for cooling, 5 is sealing device, and 6 is fixed screw.
Specific embodiment
In the embodiment of the present invention, by providing a kind of semiconductor laser module for non-invasive medical, can to human body without
In the case of any wound, significant medical effect is reached.Medical treatment of the present invention can include but is not limited to fat melting, tender skin
Deng the embodiment of the present invention is illustrated by taking noninvasive fat melting as an example.
The present invention principle be：Selection wavelength is the semiconductor laser of 700nm-1550nm, especially 1064nm（Fat
Organize the assimilation effect to the wavelength laser optimal, if its hetero-organization, then select half corresponding with the tissue resorption wavelength
Conductor laser）, using semiconductor laser divergence angle it is big the characteristics of, by way of large area hot spot irradiates, intermittently
The adipose tissue of irradiation human body so that the adipose tissue reaches its emulsifying temperature, and the adipose tissue is under its emulsifying temperature
Decompose, be further absorbed by the body excretion, reaches the effect of noninvasive fat melting.
Fig. 1 is semiconductor laser module structure composition schematic diagram of the present invention for non-invasive medical, and Fig. 2 is present invention use
In the semiconductor laser module structure connection diagram of non-invasive medical.Direct output type of semiconductor in the embodiment of the present invention swashs
Light device light source 1 can be single bar semiconductor laser, single-tube semiconductor laser, or other kinds of semiconductor laser
Device.As shown in figure 1, the semiconductor laser module mainly includes：Direct output type of semiconductor laser light source 1, the light
Source is used for by 0 ~ 50 ° of transmitting fast axis divergence angle, the laser of 0 ~ 8 ° of slow axis divergence, and noninvasive controlling is carried out in the way of extracorporeal irradiation
Treat.
Further, the module also includes light-beam forming unit；Specifically, the light-beam forming unit includes lens 2
And reflecting part 3, what the lens 2 and the reflecting part 3 were successively set on the semiconductor laser light source 1 goes out light side
To, for the laser that the semiconductor laser light source is launched to be homogenized and expanded, will be described anti-by fixed screw 6
Light part 3 is secured together with lens 2, and on the reflecting part screw is provided with, for the reflecting part 3 to be filled with sealing
Put 5 to be affixed to together.It should be noted that the quantity of the lens can be one or more, specifically can be according to reality
Demand determines that the reflecting part can be including but not limited to：Reflection shield, reflector etc. laser beam can be expanded and
Homogenized Optical devices.
Further, the module can also include：Refrigerating plant 4, the refrigerating plant can be liquid refrigerating type system
Device for cooling, is mainly used in as the direct output type of semiconductor laser optical source heat-dissipating, to ensure the semiconductor laser light
Source being capable of normal continuous sex work.
Further, the module can also include：Sealing device 5；The sealing device 5 is mainly used in sealing and supports
The semiconductor laser module.
Specifically, the sealing device 5 is hollow shell component, and is provided with light-emitting window, and the light-emitting window is used for institute
The laser after homogenizing and expanding is stated, region to be treated is acted in the way of extracorporeal irradiation.In practice, can according to demand,
The sealing device is manufactured into variously-shaped.It should be noted that in noninvasive fat melting embodiment, the semiconductor laser
The wavelength of transmitting light beam is preferably 1064nm.
The embodiment of the present invention also provides a kind of method for non-invasive medical based on above-mentioned semiconductor laser module, institute
The method of stating includes：Using direct output type of semiconductor laser instrument as light source, using 0 ~ 50 ° of light source transmitting fast axis divergence angle,
The laser that 0 ~ 8 ° of slow axis divergence；The laser is acted on into region to be treated in the way of extracorporeal irradiation, non-invasive therapy is carried out.
It should be noted that to be treated group of the wavelength correspondence of the direct output type of semiconductor laser instrument transmitting laser beam
The absorbing wavelength knitted.
The above, only presently preferred embodiments of the present invention is not intended to limit protection scope of the present invention.For
For those skilled in the art, the present invention can have various modifications and variations.All institutes within the spirit and principles in the present invention
Any modification, equivalent substitution and improvements done etc., should be included within the scope of the present invention.
Claims (10)
1. a kind of semiconductor laser module for non-invasive medical, it is characterised in that the module includes：Direct output type half
Conductor laser light source, for launching 0 ~ 50 ° of fast axis divergence angle, the laser of 0 ~ 8 ° of slow axis divergence carry out non-invasive therapy.
2. semiconductor laser module according to claim 1, it is characterised in that the direct output type of semiconductor laser
Device light source is：Single-tube semiconductor laser, single bar semiconductor laser.
3. semiconductor laser module according to claim 1, it is characterised in that the module is also filled including beam shaping
Put；The light-beam forming unit includes lens and reflecting part, and both are successively set on the semiconductor laser light source
Light direction, for the laser that the semiconductor laser light source is launched to be homogenized and expanded.
4. semiconductor laser module according to claim 3, it is characterised in that the quantity of the lens is or many
It is individual；The reflecting part is reflector or reflection shield.
5. semiconductor laser module according to claim 1, it is characterised in that the module also includes refrigerating plant,
The refrigerating plant is liquid refrigerating type, for for the direct output type of semiconductor laser optical source heat-dissipating.
6. the semiconductor laser module according to claim 1 or 3, it is characterised in that the module also includes sealing dress
Put, for sealing and supporting the semiconductor laser module.
7. semiconductor laser module according to claim 6, it is characterised in that the sealing device is hollow shelly portion
Part, and be provided with light-emitting window, the light-emitting window be used for by it is described homogenize and expand after laser, acted in the way of extracorporeal irradiation
In region to be treated.
8. a kind of method for non-invasive medical, it is characterised in that methods described includes：
Using direct output type of semiconductor laser instrument as light source, using 0 ~ 50 ° of light source transmitting fast axis divergence angle, slow axis divergence
The laser that 0 ~ 8 ° of angle；The laser is acted on into region to be treated in the way of extracorporeal irradiation, non-invasive therapy is carried out.
9. method according to claim 8, it is characterised in that the direct output type of semiconductor laser instrument launches laser light
The absorbing wavelength of the wavelength correspondence regional organization to be treated of beam.
10. method according to claim 8, it is characterised in that the direct output type of semiconductor laser instrument includes right
Require the semiconductor laser module described in 1 to 7 any one.
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610901567.5A CN106621068A (en) | 2016-10-17 | 2016-10-17 | Semiconductor laser module and method for noninvasive medical treatment |
| US16/341,937 US20190239951A1 (en) | 2016-10-17 | 2017-09-28 | Semiconductor laser module and method for application in noninvasive medical treatment |
| EP17863036.4A EP3527260B1 (en) | 2016-10-17 | 2017-09-28 | Semiconductor laser module for application in noninvasive medical treatment |
| KR1020197014164A KR102293502B1 (en) | 2016-10-17 | 2017-09-28 | Semiconductor laser modules and non-invasive medical methods |
| RU2019113825A RU2723337C1 (en) | 2016-10-17 | 2017-09-28 | Semiconductor laser module and method of use thereof for non-invasive treatment |
| PCT/CN2017/104023 WO2018072610A1 (en) | 2016-10-17 | 2017-09-28 | Semiconductor laser module and method for application in noninvasive medical treatment |
| CN201780002184.7A CN108348766B (en) | 2016-10-17 | 2017-09-28 | A kind of semiconductor laser module and the method for non-invasive medical |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610901567.5A CN106621068A (en) | 2016-10-17 | 2016-10-17 | Semiconductor laser module and method for noninvasive medical treatment |
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| Publication Number | Publication Date |
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| CN106621068A true CN106621068A (en) | 2017-05-10 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201610901567.5A Pending CN106621068A (en) | 2016-10-17 | 2016-10-17 | Semiconductor laser module and method for noninvasive medical treatment |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107174751A (en) * | 2017-06-22 | 2017-09-19 | 北京宏强富瑞技术有限公司 | Near infrared no-wound treatment hand tool |
| WO2018072610A1 (en) * | 2016-10-17 | 2018-04-26 | 西安炬光科技股份有限公司 | Semiconductor laser module and method for application in noninvasive medical treatment |
| CN108837331A (en) * | 2018-06-27 | 2018-11-20 | 武汉洛芙科技股份有限公司 | Laser fiber double chin weight reducing apparatus |
| CN109718477A (en) * | 2019-03-05 | 2019-05-07 | 罗宇鹏 | A kind of laser constipation treating instrument and its treatment method |
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| US20140371730A1 (en) * | 2013-03-15 | 2014-12-18 | Cynosure, Inc. | Picosecond Optical Radiation Systems and Methods of Use |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018072610A1 (en) * | 2016-10-17 | 2018-04-26 | 西安炬光科技股份有限公司 | Semiconductor laser module and method for application in noninvasive medical treatment |
| CN107174751A (en) * | 2017-06-22 | 2017-09-19 | 北京宏强富瑞技术有限公司 | Near infrared no-wound treatment hand tool |
| CN108837331A (en) * | 2018-06-27 | 2018-11-20 | 武汉洛芙科技股份有限公司 | Laser fiber double chin weight reducing apparatus |
| CN109718477A (en) * | 2019-03-05 | 2019-05-07 | 罗宇鹏 | A kind of laser constipation treating instrument and its treatment method |
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| SE01 | Entry into force of request for substantive examination | ||
| CB03 | Change of inventor or designer information |
Inventor after: Mu Mingang Inventor after: Yang Kai Inventor after: Wang Qiang Inventor after: Cai Lei Inventor after: Mu Jianfei Inventor after: Liu Xingsheng Inventor before: Mu Mingang Inventor before: Yang Kai Inventor before: Wang Qiang Inventor before: Liu Xingsheng |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20170825 Address after: 710077 Xi'an province hi tech Zone, Shaanxi Zhang Road No. 86, No. 56 Applicant after: Focuslight Technologies Inc. Address before: The river Wuzhong Economic Development Zone Suzhou Street Wuzhong road in Suzhou city of Jiangsu Province in 215104 2888, building 6, room 515 D513 Applicant before: Raymond (Suzhou) micro optics technology Co.,Ltd. |
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Application publication date: 20170510 |
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| WD01 | Invention patent application deemed withdrawn after publication |