CN106605456A - Method for producing an electronic module in particular for a motor vehicle transmission control unit - Google Patents
Method for producing an electronic module in particular for a motor vehicle transmission control unit Download PDFInfo
- Publication number
- CN106605456A CN106605456A CN201580048346.1A CN201580048346A CN106605456A CN 106605456 A CN106605456 A CN 106605456A CN 201580048346 A CN201580048346 A CN 201580048346A CN 106605456 A CN106605456 A CN 106605456A
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- circuit board
- sensor element
- board component
- plasticizing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16H—GEARING
- F16H61/00—Control functions within control units of change-speed- or reversing-gearings for conveying rotary motion ; Control of exclusively fluid gearing, friction gearing, gearings with endless flexible members or other particular types of gearing
- F16H61/0003—Arrangement or mounting of elements of the control apparatus, e.g. valve assemblies or snapfittings of valves; Arrangements of the control unit on or in the transmission gearbox
- F16H61/0006—Electronic control units for transmission control, e.g. connectors, casings or circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
A method for producing an electronic module (10) is proposed in which a sensor element (18) having a mounting device (30) is attached to an external surface (16) of a printed circuit board element (14), wherein the sensor element (18) has a sensor area (22) and a base area (20) that can be plasticized at least in sections. The method is characterized in particular in that the base area (20) is plasticized up to a plasticization length (44) that is measured from the base surface (19) of the sensor element (18) in a z direction (24); the plasticized base area (20) and the external surface (16) of the printed circuit board element (14) are joined together such that the sensor area (22) is arranged with a defined positioning accuracy at a target distance (50) to a reference point (36a) which is fixed relative to the external surface (16), and the plasticized base area (20) is subsequently solidified, wherein the positioning accuracy is smaller than the plasticization length (44). As a result of this, the sensor area (22) can be arranged with accuracy at the target distance (50) independently of the component tolerance of the printed circuit board element (14) and/or of the sensor element (18), which accuracy is exclusively determined by the mounting device (30).
Description
Technical field
The present invention relates to a kind of method for manufacturing electronic module, the electronic module have printed circuit board component and
The sensor element being placed at the printed circuit board component, as the sensor element can be used particularly for Automatic transmission
Device control device is such.
Background technology
Electronic module is generally used for constructing electric switch circuit.The electric switch circuit can for example be the portion of control device
Point.In Vehicle structure, electronic module be particularly useful for provide vehicle control apparatus, as such as variator control arrangement.In electronics
In module, here arrange typically at the printed circuit board component multiple electronic devices and components pictures for example sensor, connector element,
Capacitor and/or other components and parts, the plurality of electronic devices and components are electrically connected to each other in an appropriate manner by means of conductor circuit.
Sensor here can for example perceive the state of vehicle interior, the position of such as transmission assembly and by corresponding signal transmission
To the control logic circuit assembled by other components and parts.
During the electronic devices and components of electronic module are generally functionally integrated into the plastic pallet of complexity and by punching press
Grid is electrically connected to each other.Therefore, the change of layout of the components and parts on the plastic pallet may require that：To the complete of plastic tool
Complete, complicated, expensive and time-consuming change and the adjustment to punching press grid and/or stamping tool.This again can be with
The production of expensive instrument and the long production time correlation connection with the instrument.Additionally, for this electronic module, multilamellar
Conductor circuit guidance part and/or conductor circuit cross part generally only difficulty can realize.
Therefore, the electronic module for variator control arrangement is generally configured printing-circuit board module, in the printing
In circuit board module, printed circuit board (PCB) wiring of the printed circuit board component for the components and parts in other words.The printed circuit
Panel element can be fixed on loading plate and similarly be directly in transmission oil with the punching press grid through injection encapsulated.
This module is for example described in 10 2,012 213 917 A1 of DE.
But, it can be trouble and costliness that components and parts are disposed and/or are fixed on this printed circuit board component.By
In for example can be made of aluminum loading plate with the printed circuit board component generally by made by glass fibre and epoxy resin not
Same thermal coefficient of expansion, it is also possible to thermal and mechanical stress occur in the electronic module.By the pin that flexibly constructs and decoupled
Element can balance the thermal and mechanical stress.
Components and parts can for example be provided with alignment pin and rivet hole for fixation, and the alignment pin and rivet hole can be directed to
Through the printed circuit board component and it is passed in the loading plate.In the printed circuit board component for needed for this
Space may require that certain scope of freedom in other words in hole, and the scope of freedom is then just no longer able to for electric lead.
Components and parts can also utilize complicated support and flange be fixed on the printed circuit board component and/or
Contact on the printed circuit board component, because if the conductor circuit for the electrical contact of the components and parts is in the print
In region around printed circuit board element, then the region is consequently not used for the fixation of the components and parts.
In addition known following electronic modules, described in the electronic module, components and parts are integrated in plastic plate, the modeling
Flitch can be fixed on loading plate again.As for the components and parts wire element, can be arranged on the plastic plate with
The fexible film arranged between the loading plate, can be electrically contacted by means of components and parts described in the fexible film.This
In design, the change in terms of the layout of the components and parts of electronic module is also may require that to plastics spraycan and/or metal punching
The change of pressure instrument.
The content of the invention
A kind of method for manufacturing electronic module is proposed according to the embodiment of the present invention, and methods described can be real
It is existing：Components and parts, especially sensor element are neatly disposed accurately and in terms of layout and/or the electronic die is positioned at
On the printed circuit board component of block.
The method according to the invention at least has steps of：
Printed circuit board component is provided and sensor element is placed in into the printed circuit board component using assembling device
Outer surface, wherein the sensor element is abutted against with basal plane on the outer surface of the printed circuit board component.The sensing
Device element has the base regions of sensor region and at least part of region plasticization.The feature of the method for being proposed especially exists
In, dispose the sensor element the step of there is following sub-step：The base regions are plastified until following plasticizing length：Institute
Plasticizing length is stated from the basal plane of the sensor element in the z-direction measuring, the z is oriented parallel to the printed circuit board (PCB)
The normal vector of the outer surface of element；The base regions of plasticizing and the outer surface of the printed circuit board component will be passed through with following sides
Formula is bonded together：So that with the positioning precision that specifies relative to reference point with specified spacing arranging the sensor region,
Wherein described reference point is fixed relative to the outer surface；And it is subsequently cured the base regions through plasticizing.It is described fixed
Position precision is less than the plasticizing length.
" plasticizing " this concept here and can hereinafter represent：The base regions of the sensor element can
Change into inversely it is plastic, namely viscosity and/or liquid and thus the state of plastically deformable and solidify again.
The plasticizing is thus, it is possible to represent the fusing of the subregion of the base regions.Additionally, " positioning precision " can represent with
The departure of rated value." the plasticizing length " can represent base regions length in the z-direction, in the length range
The base regions of the interior sensor element sensor element in other words are plasticized.
The design of embodiments of the present invention enables in particular to be counted as based on thought described below and understanding.Printing electricity
Road panel element, sensor element and/or other installation components and parts in the electronic module, as such as connector or capacitor can
There can be relatively large component tolerance disparity in other words.For example, printed circuit board component may have in terms of thickness
The difference of about +/- 0.15mm, and sensor element in terms of length may with the difference of about +/- 0.1mm so that
Up to the present be only capable of it is enough the sensor element is placed in the maximum positioning precision of about 0.5mm in the z-direction described in
On printed circuit board component.But in order to guarantee reliably to insert electronic module in such as variator control arrangement, meeting
Need：The sensor region of components and parts, especially sensor element is more accurately arranged on printed circuit board component.Therefore, arrive
So far, the production of electronic module can only reach the sensing station tolerance in scope mentioned above.By basis
The base regions of present invention plasticizing sensor element are until the plasticizing length --- and the plasticizing length can be located at the structure
On part tolerance --- and the base regions of plasticizing and the outer surface of the printed circuit board component will be subsequently passed through with following
Mode is bonded together：So that the sensor region is arranged with high position precision, can compensate in an advantageous manner and/or
Balance and/or eliminate the component tolerance.For the electronic module production process thus, it is possible to due to less waste product
More efficiently and cost much less expensively structure sets.
Additionally, for example with electronic module --- for the electronic module, components and parts are integrated in plastic pallet ---
Production process compare, the production process can be in the side of components and parts layout relative to each other geometric arrangement mode in other words
Face is neatly designed, because the method according to the invention can allow for：Components and parts are positioned and/or the printed circuit is placed in
At arbitrary, freely programmable position on the outer surface of panel element, and expensive injection moulding tool, stamping tool need not be changed
And/or assembling device.The production process is thus, it is possible to freely can compile in terms of position of sensor element and/or component locations
The design of journey ground, and the instrument for different components and parts need not be changed.Additionally, different flexible programs of electronic module and technical
Change for example can be realized by the reprogramming of the assembling device and/or outfit device at short notice, and not opposite
Producing line is changed.Thus, it is possible to generally neatly design, for example its mode is the production process：The dress can be utilized
The sensor element and other components and parts are arranged on into position that is arbitrary, could dictate that in the way of coordinate control with device
Place.
It is furthermore possible to reduce assembly cost, the investment for production, number of components and material cost.Electrical connection also can
It is reliably achieved in thermomechanical mode in the case of no additional expense.
Furthermore it is possible to before the unit is for example fixed on loading plate, realize by the sensor element and/or its
His components and parts assembling is on printed circuit board component.This is enabled in particular in the sensor element and/or the components and parts with pricker
Welding technology is favourable when being connected with the printed circuit board component.The loading plate for passing through installation can make soldering become tired
Difficulty, because standard brazing process can only process the printed circuit board component being also not attached on loading plate.Loading plate is this
Must additionally be heated and cool down, this can extend brazing process and thus can make the printed circuit board component and the unit
Device additionally bears thermic load.Thus, it is possible to avoid between loading plate described in production period and the printed circuit board component
Machinery interaction because the shearing for for example causing due to different thermal coefficient of expansions in components and parts can be avoided
Power, the components and parts would generally be fixed at the loading plate and be also secured at the printed circuit board component.
By sensor element and other components and parts being placed on printed circuit board component according to the present invention, these yuan
Part need not for example pass through the hot joint filling of plastic pin and/or screw, rivets or in the form of highlighted component, for example with sensor group
Form be aggregated in plastics or metal submodule this mode to be fixed in loading plate system.It is described thus, it is possible to save
The fixing hole in steady pin and the printed circuit board component at components and parts and/or can save for loading plate system
The centring pin of system and corresponding hole.
Also centering pin, the centering can be accurately arranged independently of component tolerance using the method according to the invention
Pin for example can navigate to electronic module within variator especially for the position of sensor element.Sensor can also be made
The position skew of element is minimized, and the position skew is caused by the length change caused by heat of electronic module.This is especially
Be related to following sensor elements, the sensor element is integrated in plastic pallet at present, the plastic pallet generally by
Polyamide is constituted, and the polyamide can have relatively large thermal expansivity compared with the metal parts of the variator.
A kind of embodiment of the invention, the positioning precision are only determined by the precision of the assembling device.Here
Can make full use of：Component tolerance can be eliminated by the plasticizing of the previous subregion of the base regions makes structure in other words
Part tolerance does not work, and the component tolerance can otherwise affect the positioning precision, can be with the positioning precision described three
The sensor element and/or other components and parts are positioned on individual direction in space.
A kind of embodiment of the invention, the positioning precision independently of the printed circuit board component in the z-direction
Thickness and/or sensor element length in the z-direction determine.The positioning precision is thus, it is possible to only be filled by the assembling
The precision put is determining and thus be maximized.
A kind of embodiment of the invention, the positioning precision are less than 1mm, preferably smaller than 0.5mm and further
Preferably smaller than 0.2mm.Thus, it is possible to complete equipilibrium in an advantageous manner for example the printed circuit board component thickness and/or
Component tolerance in terms of the length of the sensor element.
A kind of embodiment of the invention, the base regions of the sensor element are plastified using steam.Here
Can carry out neatly to adjust and/or change the temperature of the steam in an advantageous manner, and also being capable of targetedly only office
Portion ground and/or the subregion ground plasticizing base regions.
The step of a kind of embodiment of the invention, plasticizing, has following sub-step：Determine the printing electricity
Thickness of the road panel element on the z directions；Determine length of the sensor element on the z directions；And based on institute
State printed circuit board component thickness and/or the sensor element in the z-direction length in the z-direction to adjust the plasticizing length
Degree.Adjust described by terms of the length of the thickness of the printed circuit board component and/or the sensor element respectively
This mode of plasticizing length, the production process being capable of the designs of efficient overall ground.Thus can also ensure that：The electronic module
Can be manufactured with same precision.
A kind of embodiment of the invention, the plasticizing length are moulded by adjusting plasticization temperature and/or by adjusting
Change the persistent period to adjust.The plasticizing length is set thus, it is possible to accurately adjust." plasticization temperature " here can be represented down
Temperature is stated, the base regions for melting the sensor element in other words are plastified using the temperature, and described " plasticizing continues
Time " can represent following time periods, and the base regions undergo plasticizing process, are namely heated simultaneously within the time period
And here is melted.
A kind of embodiment of the invention, methods described additionally have steps of：Using the assembling device
Clamping device be respectively relative to the reference point for each direction in space to position along three mutually orthogonal direction in spaces
Sensor element is stated, wherein each reference point is fixed both relative to the printed circuit board component.Institute can for example be utilized for this
State clamping device the sensor element is moved and navigated at the backstop of the assembling device, so that the sensing
Device element can be relative to the printed circuit board component and/or the reference point and/or relative in the printed circuit board (PCB)
Other components and parts on element are positioned as accurately as possible.
A kind of embodiment of the invention, the base regions and the printed circuit board component through plasticizing
The subregion of outer surface is bonded together, and the subregion is using recess come micro-structural.The printed circuit board component
For example can be made up of the thermosets for example based on epoxy resin, the thermosets only can difficulty using tradition
Method enduringly, mechanically, be stably connected with other materials.The micro structure portion is in the printed circuit board component
Can be caused by the recess in the surface in terms of the roughness on surface, so that the process plasticizing of the sensor element
Material can be embedded in the recess, and so can mechanically, stably dispose and/or solid the sensor element
It is scheduled on the printed circuit board component.
A kind of embodiment of the invention, through the subregion of micro-structural recess by using laser shining
Penetrate generation.The part for being close to surface of the printed circuit board component can be targetedly removed by absorbing the laser,
So as to produce small recess, the small recess can constitute micro structure portion.
It is noted that some heres in the feasible feature of the present invention, step and advantage are with regard to different embodiments
Described.Those skilled in the art will know that：These features and step can be combined in an appropriate manner, adjust or be adjusted
Change, to realize the other embodiment of the present invention.
Description of the drawings
Hereinafter, embodiment with reference to the accompanying drawings to describe the present invention, wherein either accompanying drawing or description be not
Can be understood in the way of limiting the present invention.
Fig. 1 shows the electronic module according to manufactured by the present invention；And
Fig. 2A, 2B and 2C illustrate the procedure of processing for manufacturing the method for electronic module of the invention.
Accompanying drawing is only illustrative and not by correct proportions.Identical reference represents identical in the accompanying drawings
Or the feature of phase same-action.
Specific embodiment
Fig. 1 shows the electronic module 10 according to manufactured by the present invention, and the electronic module is used for example as transmission control
Transmission control module in equipment.
The electronic module 10 has loading plate 12, and the loading plate can be metallic plate or metal-plastic composite plate.
The loading plate 12 enables in particular to the cooling body as the electronic module 10 and is provided for discharging heat.
On the side 13 of the loading plate 12, complete plane earth arranges printed circuit board component 14.The printed circuit
Panel element 14 for example being capable of, soldering bonding with the side 13 of the loading plate 12 with lateral surface 15 and/or melting welding.
As above and as being described in detail below, in the printed circuit board component 14, and the lateral surface 15
Arrange on outer surface 16 positioned opposite and two sensor elements 18 are fixed with according to the present invention.The sensor element 18
It can be so-called protrusion type sensor（Sensordome）.Each sensor element 18 has base regions 20, the base
Portion region has basal plane 19, and the basal plane is adjacent and/or clings at the outer surface 16 of the printed circuit board component 14.Each
Sensor element 18 additionally has sensor region 22, longitudinal extension of the sensor region along the sensor element 18
Direction is opposed with the base regions 20, and by means of 18 structure of sensor element described in the sensor region set for：Sense
Know there are measurement parameters to be detected.Thus each sensor element 18 24 is stretched out from the printed circuit board component 14 in the z-direction,
The z is oriented parallel to the normal vector of the outer surface 16 of the printed circuit board component 14.
Connector element 21 is arranged at the outer surface 16 additionally, the connector element is for the electronic die
The electrical contact of block 10 can be connected with connector complementary elements.
The sensor element 18 of the electronic module 10, connector element 21 and/or other components and parts can have connection
Pin, the connecting pin for example can be stretched out from by the side of corresponding components and parts, and the connecting pin is producing the electronic die
Can electrically connect with the connection gasket being arranged at the outer surface 16 of the printed circuit board component 14 during block 10.The connection gasket example
If it is in advance tin plating and/or with solder paste covering and for example utilize in brazing process continuous-type furnace, spoke
Penetrate source（Laser instrument, Halogen light）, arch solder equipment（Bügellotanlage）And/or vapour phase soldering equipment and corresponding connection
Pin electrical connection.Subsequently, for example can be protected using protective paint and/or be sealed at corresponding soldering.
Electronic circuit cell 26 is arranged additionally at the outer surface 16 of the printed circuit board component 14, and it is described
Electronic circuit cell such as, soldering bonding with the outer surface and/or melting welding, the electronic circuit cell are also referred to as " speed change
Case control unit "（Transmission Control Unit：TCU）.The circuit unit 26 can for example have at least one
Microprocessor, capacitor and other electronic devices and components.The circuit unit 26 also can be in the printed circuit board component 14
It is directly arranged in space on the loading plate 12.The circuit unit 26 passes through suitable electrical connection section and the electronic module
10 other assemblies, electrically connect as such as sensor element 18.In order to protect, the circuit unit 26 can use thick cap bag
Enclose and/or the cast of the protection system with polymer, such as mould material and/or protective paint.
During the component of the circuit unit 26 also can be integrated into the printed circuit board component 14 and for example with SMD skills
Art（" surface mount device " Surfaced-Mounted Device：SMD）Or as the nude film of pressure welding（Bare-Dies）,
Exactly it is fixed on the printed circuit board component 14, is electrically contacted and also uses as the electronic unit of the non-shell adding body of pressure welding
The protection system protection of cap and/or polymer.
Fig. 2A, 2B and 2C respectively illustrate the printed circuit board (PCB) unit for there is electronic module 10 to be manufactured according to the present invention
Part 14 and sensor element 18 formerly followed by process segment during situation.
The printed circuit board component 14 is kept flat with the 15 complete plane earth of lateral surface positioned opposite with the outer surface 16
On the fitting surface 32 of assembling device 30, wherein for the reclining of complete plane of the lateral surface 15, it is no electric
Pin and/or contact element are arranged at the lateral surface 15 and/or stretch out from the lateral surface.32 here of the fitting surface
Can act as the plane of reference in the z directions 24.The printed circuit board component 14 for example can be drawn onto described by aspirator
It is pressed at fitting surface 32 and/or otherwise at the fitting surface.The printed circuit board component 14 can also be arranged
On loading plate 12, and the side opposed with the printed circuit board component 14 of the loading plate 12 being capable of plane earth completely
Abut at the fitting surface 32.
The assembling device 30 has clamping device 34, and the clamping device is for clamping components and parts, position and/or pacify
Put on the printed circuit board component 14.The clamping device 34 can have the x-y-z systems of axis, the x-y-z coordinates
Shafting can be realized：Freely programmable ground, coordinate control ground and neatly by the components and parts in all three direction in space
On be placed in any position on the printed circuit board component 14.
First reference point 36a（See Fig. 2 C）Can be used in the positioning of the components and parts and/or be used as the printing electricity
The outer surface 16 of road panel element 14 24 reference and for example specifies the origin in z directions 24 in the z-direction.Second reference point 36b and
3rd reference point 36c can be used in the printed circuit board component 14 in other words the outer surface 16 at two each other and phases
The direction in space orthogonal for z directions 24（X directions and y directions）On positioning.The second reference point 36b and the 3rd ginseng
Take point 36c and also can be used in the positioning and the components and parts according to plane of the components and parts on the outer surface 16 picture to each other
To geometric arrangement mode.The second reference point 36b and the 3rd reference point 36c can be represented in the assembling device 30
Part at, the reference point at such as assembling side 32, or second reference point and the 3rd reference point can
As being integrated in the printed circuit board component 14 with reference to space.
In the production period of the electronic module 10, the binding clasp 38 of the clamping device can be in the sensor region
Sensor element 18 is clamped at 22.In order to orient in all three spatial directions and/or position, can be by the binding clasp 38
Move at the stop dog position that could dictate that.The stop dog position here can act as the sensor head of the sensor element 18 or
Person says the reference point of the position 40 of sensor cover.
Subsequently, the sensor element 18 is moved to the warm table of the assembling device 30 using the clamping device 34
42.The warm table 42 can for example be hot-gas welding equipment or other thermals source.
At the warm table 42, for example, the base regions 20 of the sensor element 18 are plastified directly by means of steam 46
To plasticizing length 44.Plasticizing 44 here of length is from the basal plane 19 of the sensor element 18 in the z-direction 24 measuring.Institute
The base regions 20 for stating sensor element 18 can be by plastics, especially thermoplastic for example by polyamide for this（Such as PA66）
Constitute.The basal plane 19 can be configured to plane or have peak（Zinne）And/or rib.In order to efficiently plastify in other words
The base regions 20 are melted, the plasticization temperature of the steam 46 for example can be more than 220 DEG C, preferably greater than 250 DEG C.
In order to enduringly and stably the sensor element 18 is fixed on the printed circuit board component 14, institute
Micro structure can be carried out by means of small recess in the subregion 48 that could dictate that for stating the outer surface 16 of printed circuit board component 14
Change, the sensor element 18 should be arranged at the subregion.The recess for example can be produced with laser.It is described
Assembling device 30 can have laser instrument, for example low-energy laser instrument labelling laser instrument in other words for this.
After the base regions 20 for plastifying the sensor element 18, by the sensor element 18 and the printing electricity
The subregion 48 of the outer surface 16 of road panel element 14 is bonded together.For this preferably by the clamping device 34 by the biography
Sensor component 18 is moved at the subregion 48 in the way of Stroke Control, at the subregion is put down and is extruded
The sensor element.As an alternative or additional aspects, it is also possible to the movement printed circuit board component 14 and will
Which is expressed at the sensor element 18.Subsequently, the base for being plastified come the process for solidifying the sensor element 18 by cooling down
Portion region 20, so that the sensor element 18 enduringly and is stably connected with the printed circuit board component 14
Connect.Also can have chiller, such as cooling with aerator for this in order to accelerate production process, the assembling device 30
Assembly.From the warm table 42 to the shift motion phase being positioned on the subregion 48 of the printed circuit board component 14
Between, the sensor element 18, plasticizing can be further heated to the base regions 20 for plastifying length 44, or for example
The temperature of substantial constant is held it in by means of heat radiator and/or hot air blowers and hinders which to cool down.
After the base regions 20 are solidified, the sensor region 22 of the sensor element 18 sensor cover in other words
Or sensor head is positioned on the printed circuit board component 14 with degree of accuracy as high as possible.Especially in the z-direction 24, the biography
Sensor region 22 should be with the positioning precision of regulation relative to the first reference point 36a and/or the printed circuit board component
14 outer surface 16 is arranged on the printed circuit board component 14 with specified spacing 50, so as to ensure the electronic module
10 complete feature.But, the printed circuit board component 14 may have in terms of in the z-direction 24 thickness for being measured
Relatively large difference tolerance in other words, and the sensor element 18 may have in terms of in the z-direction 24 length for being measured
There is tolerance, the z is oriented parallel to the longitudinal extension direction of the sensor element 18.The difference of the thickness may for example be
About +/- 0.15mm, and the difference of the length may for example be of about +/- 0.1mm.In order to the sensor is first
Part 18 is disposed independently of actual (real) thickness and length with specified spacing 50, it is therefore necessary to ensured：The plasticizing length 44 is more than institute
State positioning precision.Under these conditions, in the z-direction 24 positioning precision can only by it is described assembling device 30 precision determine or
Person says determination.According to component tolerance value as given above, thus the plasticizing length 44 should be more than 0.5mm, and described
Positioning precision should be less than 0.5mm.
In order to ensure：The positioning precision, can be based on printed circuit board (PCB) unit less than the plasticizing length 44
The thickness of part 14 and/or based on the length of the sensor element 18, for example by adjust plasticization temperature and/or plasticizing hold
The continuous time adjusts the plasticizing length 44.The assembling device 30 can have suitable measurement apparatus for this, described suitable
Measurement apparatus be used for determine the thickness and/or the length.The thickness and/or the length also can be individually true
Determine and manually, for example filled in the assembling by this mode of terminal that corresponding value is input to the assembling device 30
It is prescribed in putting 30.Compared with the case where part is thin and/or short, the base regions 20 are thick in printed circuit board component 14
In the case of and/or sensor element 18 grow in the case of can be heated slightly longer.With part it is thin and/or
Compare in the case of short, the basal plane 19 is placed on the printed circuit board (PCB) unit earlier in the case where part is thick and/or long
On part 14.In this case, the basal plane 19 and the base regions 20 are it is thus necessary to plastified by further melting in other words,
So as to the sensor element 18 is pressed further by towards the direction of the outer surface 16 of the printed circuit board component 14, and
So as to the sensor region 22 is arranged on the outer surface with the specified spacing 50.
Therefore, for the sensor element 18, the position of the sensor region 22 of especially described sensor element and
For the degree of accuracy of the position, following parameter is conclusive：In the z-direction 24, as the plane of reference of the assembling device 30
Fitting surface 32（The first reference point 36a in other words）；At two relative to z directions 24 and mutually orthogonal direction in space（x
Direction and y directions）On, the printed circuit board component 14 relative to described second and the 3rd reference point 36b, 36c positioning；Institute
State abutment face of the sensor element 18 in the binding clasp 38 of the clamping device 34；The clamping device 34 is empty in all three
Between positioning precision on direction and the base regions 20 sufficiently long plasticizing length 44.In contrast, the printed circuit
The physical length and/or its tolerance in terms of width of the actual (real) thickness of panel element 14 and the sensor element 18 is to positioning accurate
Degree is without impact.Because in order to fix the sensor element 18, do not use immobilising device in addition, as such as rivet or pin
Nail, so these immobilising devices equally do not affect the positioning precision.
The plasticizing length 44 also purely can determine size in the following manner and be selected：The base regions 20
All the time sufficiently large degree it is plasticized within the maximum component tolerance, that is to say, that the plasticizing length 44 is considering maximum all the time
Select enough to big in the case of tolerance.
Finally it is noted that：The concept as " having ", " including " etc. is not excluded for other elements or step, and picture
Concept as " one " is not excluded for multiple.In addition to point out：With reference to described by the one embodiment in above embodiment
Feature or step also can be used in combination with other features of other embodiment described above or step.Right
Reference in requirement can not be treated in a limiting fashion.
Claims (10)
1. it is used for manufacturing electronic module（10）Method, methods described has step：Printed circuit board component is provided（14）；And
Using assembling device（30）By sensor element（18）It is placed in the printed circuit board component（14）Outer surface（16）Place, its
Described in sensor element（18）With basal plane（19）Abut against the printed circuit board component（14）Outer surface（16）On, wherein
The sensor element（18）With sensor region（22）With the base regions of at least part of region plasticization（20）,
Characterized in that, the placement sensor element（18）The step of there is following sub-step：
Plastify the base regions（20）Until following plasticizing length（44）：The plasticizing length is from the sensor element（18）
Basal plane（19）Rise in the z-direction（24）To measure, the z is oriented parallel to the printed circuit board component（14）Outer surface
（16）Normal vector；
The base regions of plasticizing will be passed through（20）With the printed circuit board component（14）Outer surface（16）Connect in the following manner
It is combined：So that with the positioning precision of regulation relative to reference point（36a）With specified spacing（50）To arrange the sensor
Region（22）, wherein the reference point（36a）Relative to the outer surface（16）It is fixed, and be subsequently cured described through plasticizing
Base regions（20）, wherein the positioning precision is less than the plasticizing length（44）.
2. the method as described in claim 1, wherein the positioning precision is only by the assembling device（30）Precision determine.
3. the method as described in claim 1 or 2, wherein the positioning precision is independently of the printed circuit board component（14）Edge
Z directions（24）Thickness and/or the sensor element（18）In the z-direction（24）Length determining.
4. the method as any one of claims 1 to 3, wherein the positioning precision is less than 1mm, preferably smaller than 0.5mm.
5. the method as any one of the claims, wherein the sensor element（18）Base regions（20）Profit
Use steam（46）To plastify.
6. the method as any one of the claims, wherein having steps of the step of the plasticizing：Determine institute
State printed circuit board component（14）Along the z directions（24）Thickness；Determine the sensor element（18）Along the z directions
（24）Length；And it is based on the printed circuit board component（14）In the z-direction（24）Thickness and/or the sensor element
（18）In the z-direction（24）Length adjusting the plasticizing length（44）.
7. the method as described in claim 6, wherein the plasticizing length（44）By adjusting plasticization temperature and/or passing through adjustment
The plasticizing persistent period adjusts.
8. the method as any one of the claims, methods described additionally have step：Filled using the assembling
Put（30）Clamping device（34）The reference for each direction in space is respectively relative to along three mutually orthogonal direction in spaces
Point（36a、36b、36c）To position the sensor element（18）, wherein each reference point（36a、36b、36c）Both relative to institute
State printed circuit board component（14）It is fixed.
9. the method as any one of the claims, wherein the base regions through plasticizing（20）With the print
Printed circuit board element（14）Outer surface（16）Subregion（48）It is bonded together, the subregion is using recess come micro-
Structuring.
10. the method as described in claim 9, wherein through the subregion of micro-structural（48）Recess by using laser
To irradiate generation.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102014217866.5A DE102014217866A1 (en) | 2014-09-08 | 2014-09-08 | Method for producing an electronic module, in particular for a vehicle transmission control unit |
| DE102014217866.5 | 2014-09-08 | ||
| PCT/EP2015/066131 WO2016037738A1 (en) | 2014-09-08 | 2015-07-15 | Method for producing an electronic module in particular for a motor vehicle transmission control unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106605456A true CN106605456A (en) | 2017-04-26 |
Family
ID=53610885
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580048346.1A Pending CN106605456A (en) | 2014-09-08 | 2015-07-15 | Method for producing an electronic module in particular for a motor vehicle transmission control unit |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP3192335A1 (en) |
| CN (1) | CN106605456A (en) |
| DE (1) | DE102014217866A1 (en) |
| WO (1) | WO2016037738A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115024024A (en) * | 2020-02-05 | 2022-09-06 | 浩亭股份有限公司 | Component carrier for arranging electrical components on a printed circuit board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5220724A (en) * | 1990-09-08 | 1993-06-22 | Robert Bosch Gmbh | Method of securing surface-mounted devices to a substrate |
| US5406459A (en) * | 1991-09-05 | 1995-04-11 | Matsushita Electric Industrial Co., Ltd. | Surface mounting module for an electric circuit board |
| CN102055456A (en) * | 2009-10-28 | 2011-05-11 | 迪尔阿扣基金两合公司 | Operating device of an electronic domestic appliance |
| CN102845140A (en) * | 2010-04-13 | 2012-12-26 | At&S奥地利科技及系统技术股份公司 | Method for integrating an electronic component into a printed circuit board, and printed circuit board comprising an electronic component integrated therein |
| DE102012213917A1 (en) * | 2012-08-06 | 2014-02-20 | Robert Bosch Gmbh | Component sheath for an electronics module |
-
2014
- 2014-09-08 DE DE102014217866.5A patent/DE102014217866A1/en not_active Withdrawn
-
2015
- 2015-07-15 CN CN201580048346.1A patent/CN106605456A/en active Pending
- 2015-07-15 WO PCT/EP2015/066131 patent/WO2016037738A1/en active Application Filing
- 2015-07-15 EP EP15738329.0A patent/EP3192335A1/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5220724A (en) * | 1990-09-08 | 1993-06-22 | Robert Bosch Gmbh | Method of securing surface-mounted devices to a substrate |
| US5406459A (en) * | 1991-09-05 | 1995-04-11 | Matsushita Electric Industrial Co., Ltd. | Surface mounting module for an electric circuit board |
| CN102055456A (en) * | 2009-10-28 | 2011-05-11 | 迪尔阿扣基金两合公司 | Operating device of an electronic domestic appliance |
| CN102845140A (en) * | 2010-04-13 | 2012-12-26 | At&S奥地利科技及系统技术股份公司 | Method for integrating an electronic component into a printed circuit board, and printed circuit board comprising an electronic component integrated therein |
| DE102012213917A1 (en) * | 2012-08-06 | 2014-02-20 | Robert Bosch Gmbh | Component sheath for an electronics module |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115024024A (en) * | 2020-02-05 | 2022-09-06 | 浩亭股份有限公司 | Component carrier for arranging electrical components on a printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102014217866A1 (en) | 2016-03-10 |
| WO2016037738A1 (en) | 2016-03-17 |
| EP3192335A1 (en) | 2017-07-19 |
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Application publication date: 20170426 |