CN103660128B - LED integrated forming technique - Google Patents

Abstract

The invention discloses an LED lamp integrated molding process, comprising the following process steps: welding a metal connector and a drive circuit board to form a drive assembly, reserving slots on the drive circuit board, and reserving vacancies on the LED lamp board; Connect the lens and the LED light board with a buckle or heat welding, insert the aforementioned drive assembly into the reserved hole of the LED light board through the reserved slot for tight fit; connect the lens, LED light board and drive circuit The board is pre-assembled into an assembly; the aforementioned assembly is put into the mold as an insert and then the mold is closed, and the pressure exerted on the insert by the clamping mold is greater than the injection molding pressure, so that the Helf thermally conductive plastic completely covers the drive circuit board And the light board, the molding temperature is 150-160 ℃. The invention is suitable for the packaging of individual electronic drives, so that modularization of the electronic drives increases structural feasibility.

Description

LED lamp integrated molding process

technical field

The invention belongs to the technical field of circuit board packaging, and in particular relates to an LED lamp integrated molding process.

Background information

At present, the competition in the LED lamp market is fierce. How to use new technologies to achieve low-cost, high-output production efficiency, thereby reducing costs and occupying the market is a topic that every manufacturer must face.

At present, the structure of Gu10/Mr16 LED lamp is basically shown in Figure 1. The main components are lens ①, LED lamp board ②, driving circuit board ③, heat sink ④ and metal connector ⑤. After completing these 5 main parts individually, they will be assembled. During the assembly process, gluing or buckles, screws and other assembly processes will be used, including logistics costs and various inspection links, which will account for 20% of the entire cost. In addition, in order to improve its heat dissipation capacity , most manufacturers will fill the gap between the heat sink ④ and the drive circuit board ⑤ with thermal grease, which will increase the production cost and increase the quality standard of the product.

As shown in Figure 2, during the entire assembly process, the pin (metal connector) 11 needs to be welded with the drive circuit board 13, and must withstand a certain impact force, and the drive circuit board 13 and the LED lamp board 16 are welded by the connecting wire 18 , The LED lamp board 16 is connected to the lamp holder 12 by screws 19, thereby fixing the heat dissipation body 15. The lens 17 and the radiator body 15 are connected by glue or buckle. The entire assembly craftsman completes through several small assemblies, and any assembly fails to meet the inspection requirements, which will affect the quality of the whole lamp. Moreover, the main thermal components and the radiator body 15 have a certain hollow space 14, which has a great adverse effect on the heat dissipation performance.

Contents of the invention

In view of the above-mentioned shortcomings of the existing technology, the technical problem to be solved by the present invention is based on the unique processing data requirements of Helf heat-conducting plastics. We have developed a revolutionary integrated molding process for LED lamps.

According to an embodiment, the LED lamp integrated molding process provided by the present invention includes the following process steps:

Weld the metal connector and the drive circuit board to form the drive assembly. There are slots reserved on the drive circuit board and vacancies on the LED light board;

Connect the lens and the LED light board with a buckle or heat welding, and insert the aforementioned drive assembly into the reserved hole of the LED light board through the reserved slot for tight fit;

Pre-assemble the lens, LED light board and driver circuit board into an assembly;

Put the aforementioned assembly as an insert into the mold and then close the mold, and inject molding under the condition that the pressure exerted on the insert by the clamping mold is greater than the injection pressure, so that the Helf heat-conducting plastic completely covers the driver circuit board and the lamp board, and the molding temperature is 150-160°C.

According to one embodiment, in the aforementioned LED lamp integrated molding process of the present invention, when inserting the drive assembly through the reserved slot into the reserved hole of the LED lamp board for tight fit, a silicone pad is added between the slot and the hole Used to increase tightness.

The aforementioned Helf heat-conducting plastic of the present invention has the same components as the heat-conducting and electrically insulating composite material disclosed in Chinese patent CN101787178A, and its manufacturing method is also the same as the manufacturing method disclosed in Chinese patent CN101787178A.

Compared with the prior art, the present invention is based on the unique processing characteristics of Helf heat-conducting plastics, that is, its molding temperature is in the range of 150-160°C and its appearance shrinkage will not occur if the material thickness changes too much, making it suitable for circuit boards encapsulation. Helf thermally conductive plastic can avoid damage to electronic components during low temperature processing, so as to achieve the purpose of encapsulating the driver circuit board and LED light board in its material. In addition, Helf thermally conductive plastic will not cause product appearance due to different wall thicknesses during molding. Defective, so that the molding process of the present invention can have no influence factors of appearance in the molding of product structure. The new molding process of Gu10&Mr16 LED lamps provided by the present invention is suitable for the packaging of a single electronic drive, so that the modularization of the electronic drive increases the structural feasibility. The main advantages of the present invention are as follows:

(1) Since the temperature of the integral molding process of the present invention is lower than 150-160°C, it will not affect the soldering of the components of the drive circuit board, which cannot be accomplished by ordinary thermoplastic materials.

(2) Since Helf thermally conductive plastic can avoid the impact on the appearance due to the thickness of the structural material, there will be no appearance defects such as shrinkage.

(3) Helf heat-conducting plastic completely wraps the drive circuit board, so that the heat dissipation of the drive circuit board does not need to use heat-conducting silicone grease, and the heat dissipation capability is also greatly improved.

(4) Because of the integrated molding, the structural strength of the product is more reliable than the previous packaging.

(5) Reduce the assembly dimensional tolerances of other components that are tightened due to assembly, which greatly reduces the machining accuracy of other components.

Description of drawings

Figure 1 is a schematic diagram of the basic structure of an LED lamp.

Fig. 2 is a schematic diagram of the assembly of the LED lamp.

Fig. 3 is a schematic diagram of the pre-assembly of the lens, the LED lamp board and the driving circuit board of the LED lamp of the present invention.

Fig. 4 is a schematic diagram of the assembly of the LED lamp of the present invention.

Among them: 1 is a metal connector; 2 is a radiator; 3 is a driving circuit board; 4 is an LED light board; 5 is a lens.

detailed description

The present invention will be further elaborated below in conjunction with the accompanying drawings and specific embodiments. These examples should be understood as only for illustrating the present invention but not for limiting the protection scope of the present invention. After reading the contents of the present invention, those skilled in the art can make various changes or modifications to the present invention, and these equivalent changes and modifications also fall within the scope defined by the claims of the present invention.

First, the pin pin (metal connector) 1 and the driver circuit board 3 are fixed by welding to form a driver assembly. There are slots reserved on the driver circuit board 3 and holes are reserved on the LED lamp board 4 .

Secondly, connect the lens 5 and the LED light board 4 with buckles, it would be better if heat welding can be used, try to ensure the airtightness between the lens 5 and the LED light board 4, and then insert the drive assembly through the reserved slot The reserved holes of the LED light board are tightly fitted. If the space permits, a silicone pad can be added between the slot and the hole to improve the sealing.

Again, the lens 5, the LED lamp board 4 and the driving circuit board 3 are pre-assembled into an assembly, as shown in FIG. 3 .

Finally, put the above-mentioned assembly as an insert into the mold and close the mold to ensure that the pressure applied by the mold clamping on the insert is greater than the injection pressure for injection molding, so that the Helf thermally conductive plastic completely covers the driver circuit board and the lamp board, forming The temperature is 150-160°C. In the injection molding process, when the mold is closed, the upper and lower molds need to give a certain pressure to the assembly to ensure the sealing between the lens 5 and the LED light board 4, so as to prevent the raw materials from penetrating into the LED light board under the influence of pressure during the injection molding process In 4, it affects the effect of the whole lamp, so be sure to pay attention when adjusting the mold, the pressure applied to the insert by mold clamping is greater than the injection pressure.

In addition, during the injection molding process, the exposed surface of the product must be protected in the cavity to ensure that no raw materials will overflow on the exposed surface during production and processing.

In the molded product, the Helf heat-conducting plastic completely covers the driver circuit board and the LED light board, so that the heat generated by the LED passes through the Helf heat-conducting plastic in the first time (after injection molding to form the heat sink 2 shown in Figure 4 main structure) conduction and emission. In addition, due to the seamless connection, the creepage phenomenon is also avoided, making the LED lamp safer.

Claims (2)

1. An integrated molding process for LED lamps, characterized in that it comprises the following process steps: Weld the metal connector and the drive circuit board to form the drive assembly. There are slots reserved on the drive circuit board and holes on the LED light board; Connect the lens and the LED light board with a buckle or heat welding, and insert the aforementioned drive assembly into the reserved hole of the LED light board through the reserved slot for tight fit; Pre-assemble the lens, LED light board and driver circuit board into an assembly; Put the aforementioned assembly as an insert into the mold and close the mold, and inject molding under the condition that the pressure exerted on the insert by the clamping mold is greater than the injection pressure, so that the heat-conducting plastic completely covers the driving circuit board and the lamp board, and the molding temperature is 150 -160°C; The heat-conducting plastic, its characteristic components are: 1) Highly crystalline spherical metal oxide powders of at least two sizes, with a thermal conductivity greater than or equal to 10 W/m·degree Celsius, and with electrical insulation properties; the metal oxide powders include alumina, zirconia, magnesia, Zinc oxide; 2) At least one flaky heat-conducting powder with a thermal conductivity greater than or equal to 30 W/m·C; the flaky heat-conducting powder includes scaly graphite powder and boron nitride powder; 3) Thermosetting resins, including one or more mixtures of epoxy resins, silicone resins, and phenolic resins. 2. The LED lamp integrated molding process according to claim 1, characterized in that, when inserting the drive assembly into the reserved hole of the LED lamp board through the reserved slot for tight fit, there is a gap between the slot and the hole. Add silicone pads between them.