CN106590530A - Water-soluble polymer coated special-shaped silica sol, preparation method and application - Google Patents
Water-soluble polymer coated special-shaped silica sol, preparation method and application Download PDFInfo
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- CN106590530A CN106590530A CN201611157145.8A CN201611157145A CN106590530A CN 106590530 A CN106590530 A CN 106590530A CN 201611157145 A CN201611157145 A CN 201611157145A CN 106590530 A CN106590530 A CN 106590530A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1436—Composite particles, e.g. coated particles
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
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Abstract
The invention relates to water-soluble polymer coated special-shaped silica sol, a preparation method and an application. The special-shaped silica sol is prepared from raw materials in percentage by weight as follows: 0.01wt%-1wt% of polyalcohol with molecular weight of 200-20,000, 0.01wt%-5wt% of water-soluble polymers with molecular weight of 10,000-500,000, 5wt%-50wt% of a silica sol raw material and the balance of deionized water. A physical structure of the special-shaped silica sol is irregularly special-shaped and is formed by the water-soluble polymers through coating. According to a polishing solution prepared from the silica sol, a protective film can be formed on the surface of a chip through addition of the water-soluble polymers including polyacrylamide, sodium polyacrylate and polyacrylic acid, microdefects of the surface of the chip in a polishing process are effectively reduced, so that the surface roughness of the chip is obviously reduced, and a relatively high polishing removal rate can be guaranteed.
Description
Technical field
The present invention relates to Ludox and Sapphire Substrate polishing technology field, and in particular to a kind of water soluble polymer bag
Cover special-shaped Ludox, preparation method and application.
Background technology
Ludox is dispersion liquid of the nano level silicon dioxide in water or in solvent.Due to the SiO in Ludox2Contain
Substantial amounts of water and hydroxyl, therefore Ludox can also be expressed as SiO2.nH2O.Preparing Ludox has different approach.The most frequently used side
Method has ion exchange, one one-step hydrolysis method of silica flour, silane hydrolyzate method etc..NALCO of the ion-exchange process of Ludox for the U.S.
Company was developed in the forties in last century, after by du pont company etc. five, the sixties are perfect, at present for it is most ripe be also most
For widely used process.The technique has certain requirement to the materials such as waterglass, ion exchange resin and operating procedure, and
The weak tendency of these exactly home products.Comparatively, the technics comparing of one one-step hydrolysis method of silica flour is simple, extensive at home at present
Use.Although however, higher with the Ludox purity of method preparation, granular size is in 10-20 rans, therefore is generally only
It is widely used in industries such as castings, and in the higher field of many requirements such as precise polished, catalyst then without extensively application.Silicon
Although Ludox sphericity prepared by alkane Hydrolyze method is homogeneous, granule is softer, and cost is too high, it is also difficult to be applied to precise polished
Field.At present, each scholar has had certain research for special-shaped Ludox, but because of the heterogeneity of its granule, if being answered
For precise polished field, although improve polish removal rate, but also bring along polished wafer surface blemish and increase, surface
The elevated problem of roughness.
With the development of LED substrate technology, sapphire wafer replaces 2 inches by 4 inches becomes main flow, and to 6 inches
Even more large scale development.When wafer size is 2-4 inches, by ultra-smooth crystal column surface (general surface roughness Ra
≤ 0.3nm) growth transition zone, gallium nitride can be overcome in Al2O3Lattice mismatch issue during substrate growth, but as wafer is to 6
How inch even more large scale development, and requirements at the higher level (surface roughness Ra≤0.2nm) of the device to flatness, reduce
Sapphire substrate surface microdefect improves polishing wafer speed, working (machining) efficiency simultaneously becomes problem demanding prompt solution.
At present, chemical Mechanical Polishing Technique is carried out using the polishing fluid of Ludox abrasive material to Sapphire Substrate generally, is polished
Back substrate surface roughness industry standard is Ra≤0.3nm, and the requirement of polish removal rate general enterprises is 3-4 μm/h.Wherein, silicon
Colloidal sol abrasive material accounts for more than the 90% of polishing fluid solid content.Ludox is main during polishing sapphire as the polishing fluid of abrasive material
There is a problem of that polishing speed is low, surface roughness is higher.Using abrasive material be also spherical abrasive material, for water soluble polymer
The special-shaped Ludox of cladding has no report as abrasive material.
The Chinese patent of Application No. 201410838043.7 discloses a kind of polishing fluid containing porous silica abrasive material
And preparation method thereof, the porous silica abrasive material is prepared via a method which to obtain for porous silica silicon grain：Using poly-
Vinylpyrrolidone is adsorbed in silicon dioxide medicine ball particle surface as protective agent, recycles sodium hydroxide to etch to form surface
Porous silica silicon grain with loose structure.The method is that surface modification is carried out to silica solid granule, is prepared many
Hole silica dioxide granule, prepared silica solid granule is porous particle, is not that water soluble polymer cladding is special-shaped
Ludox.The polishing speed of the polishing fluid is 80-100nm/min, and surface of polished roughness is 0.19-0.25nm.
The content of the invention
For the deficiencies in the prior art, the technical problem that the present invention is intended to solve is to provide a kind of water soluble polymer cladding
Special-shaped Ludox, preparation method and application.The physical arrangement of the special-shaped Ludox is irregular abnormal shape, and by water soluble polymer
Cladding is constituted.Using polishing fluid made by the Ludox, due to water soluble polymer (polyacrylamide, sodium polyacrylate, poly- third
Olefin(e) acid) addition can form protecting film in wafer surface, effectively reduce the microdefect of wafer surface in polishing process, so as to notable
Wafer surface roughness is reduced, while ensure that higher polish removal rate.
The present invention solves the technical scheme of the technical problem employing：
A kind of water soluble polymer cladding abnormal shape Ludox, the raw material weight percentage ratio of the special-shaped Ludox are consisted of：
A, polyvalent alcohol, 0.01-1wt%, molecular weight is between 200-20000；The polyvalent alcohol be Polyethylene Glycol and/
Or polypropylene glycol；
B, water soluble polymer, 0.01-5wt%, molecular weight is between 10000-500000；The water soluble polymer is
At least one in polyacrylamide, sodium polyacrylate, polyacrylic acid；
C, raw materials of silica sol, 5-50wt%；
D, balance of deionized water.
The step of a kind of preparation method of the special-shaped Ludox of water soluble polymer cladding, the method is：
1), under stirring more than 30rpm rotating speeds, respectively polyvalent alcohol is completely dissolved with water soluble polymer pressed powder
In deionized water, respectively obtain the aqueous solution of polyvalent alcohol and water soluble polymer；
2), under stirring more than 30rpm rotating speeds, raw materials of silica sol is added dropwise in the aqueous solution of polyvalent alcohol；
3) under stirring more than the 30rpm rotating speeds, then to step 2) water soluble polymer is added dropwise in the solution that obtains
Aqueous solution, and persistently stir 60-80 minutes；
4) by step 3) solution that obtains, with 1 μm of filter element filtering, filters off more than 1 micron bulky grain solid phase, that is, obtains water
The special-shaped Ludox of soluble macromolecular cladding.
A kind of sapphire substrate polishing solution, the polishing fluid is using the above-mentioned special-shaped Ludox conduct of water soluble polymer cladding
Abrasive material.
Compared with prior art, the raw materials of silica sol extra-granular of present invention abnormal shape Ludox is by water soluble polymer bag
Cover, be coated togather by water soluble polymer by spherical colloidal silica feed particles and constituted, in dispersed in water, and physics
Structure is irregular special-shaped.Using the special-shaped Ludox as polishing fluid made by abrasive material, surface can be increased in polishing process
Mechanical friction, significantly improves polish removal rate 30-50% (between 6-8 μm/h).Generally, mechanical friction effect
Increase can bring the increase of surface microdefect, but because the water soluble polymer being dissolved in water in the present invention is in Sapphire Substrate
Surface defines soft protective layer, and the formation to surface microdefect has good inhibiting effect, can effectively improve surface smoothness, brilliant
The roughness Ra on piece surface can reduce by 50% (can be down to below 0.15nm).
Description of the drawings
Transmission electron microscope photos of the Fig. 1 for raw materials of silica sol；
Fig. 2 is the transmission electron microscope photo of the special-shaped Ludox of water soluble polymer cladding of the present invention.
Specific embodiment
The present invention is explained further with reference to embodiment and accompanying drawing, but not in this, as to the application claim guarantor
The restriction of shield scope.
The raw material weight percentage ratio composition of water soluble polymer cladding abnormal shape Ludox (referred to as special-shaped Ludox) of the present invention
For：
A, polyvalent alcohol, 0.01-1wt%, molecular weight between 200-20000, the polyvalent alcohol be Polyethylene Glycol and/
Or polypropylene glycol, act on while dispersed silica sol granule can be played；
B, water soluble polymer, 0.01-5wt%, between 10000-500000, the water soluble polymer is molecular weight
At least one in polyacrylamide, sodium polyacrylate, polyacrylic acid；The water soluble polymer can coat 2-3 Ludox
Granule, and polymer protective film can be formed in polished wafer surface, significantly reduce the microdefect of wafer surface in polishing process；
C, raw materials of silica sol, 5-50wt%；The Ludox for herein referring to is commercially available Ludox；
D, balance of deionized water.
The mean diameter of the raw materials of silica sol is 10-150nm, and solid content is 5-50wt%.
The physical arrangement of the water soluble polymer cladding abnormal shape Ludox is irregular special-shaped, is usually two or three
The physical arrangement that spheroidal particle or spherical part are combined together is special-shaped.
Water soluble polymer of the present invention coats the preparation method of special-shaped Ludox：
1), under stirring more than 30rpm rotating speeds, respectively polyvalent alcohol is completely dissolved with water soluble polymer pressed powder
In deionized water, respectively obtain the aqueous solution of polyvalent alcohol and water soluble polymer；
2), under stirring more than 30rpm rotating speeds, raw materials of silica sol is added dropwise in the aqueous solution of polyvalent alcohol；
3) under stirring more than the 30rpm rotating speeds, then to step 2) water soluble polymer is added dropwise in the solution that obtains
Aqueous solution, and persistently stir 60-80 minutes, it is ensured that water soluble polymer is fully dispersed with Ludox, cladding；Step 2) and step
3) in by the way of being added dropwise over, Ludox can be prevented effectively from and is excessively reunited, and rate of addition is controlled in 1-2 drops/s；
4) by step 3) solution that obtains, with 1 micron of filter element filtering, filters off more than 1 micron bulky grain solid phase, that is, obtains
The special-shaped Ludox of water soluble polymer cladding.The purpose of the step be filter off reunite bulky grain Ludox with it is therein other
Impurity, these bulky grains may cause to scratch to follow-up polishing process.Our experiments show that the amount that the step is filtered off is little, every time
With 1 micron of PTEF membrane filtration of import, granule on filter membrane, is with the naked eye hardly visible, so to the process in overall Ludox
The impact of solid content can be ignored.
Step 1 in preparation method of the present invention)-step 3) in rotating speed be preferably 150-200rpm, it is ensured that water solublity is high
Molecule and polyvalent alcohol fully can dissolve.
The present invention also protects a kind of sapphire substrate polishing solution, and the polishing fluid is different using above-mentioned water soluble polymer cladding
Type Ludox is used as abrasive material.
The sapphire substrate polishing solution includes the special-shaped Ludox of water soluble polymer cladding that content is 1-50wt%, contains
Measure the deionized water of the potassium hydroxide and surplus for 0.01-5wt%；The pH value of polishing fluid is 9.5-12.5.
Embodiment 1
The raw material weight percentage ratio of the special-shaped Ludox of the present embodiment water soluble polymer cladding is consisted of：
A, polyvalent alcohol, 0.01g, molecular weight is between 200-400；The polyvalent alcohol is Polyethylene Glycol；
B, water soluble polymer, 0.01g, molecular weight is between 10000-10200；The water soluble polymer is polypropylene
Amide；
C, raw materials of silica sol, 20g；The mean diameter of the raw materials of silica sol is 55nm, and solid content is 5wt%, and the silicon is molten
The transmission electron microscope photo of collagen material is as shown in Figure 1；
D, balance of deionized water.
Preparation process is as follows：
1) under the stirring of 150rpm rotating speeds, respectively polyvalent alcohol is dissolved completely in water soluble polymer pressed powder
In ionized water, the aqueous solution of polyvalent alcohol and water soluble polymer is respectively obtained；
2) under the stirring of 200rpm rotating speeds, raw materials of silica sol is added dropwise in the aqueous solution of Polyethylene Glycol；
3) under the stirring of 200rpm rotating speeds, then to step 2) the water-soluble of polyacrylamide is added dropwise in the solution that obtains
Liquid, and whole solution is complemented to 100g by deionized water, and persistently stir 60 minutes；Step 2) and step 3) in be added dropwise over
Rate of addition be 1 drop/s.
4) by step 3) solution that obtains, with 1 micron of filter element filtering, filters off more than 1 micron bulky grain solid phase, that is, obtains
The special-shaped Ludox (transmission electron microscope photo is referring to Fig. 2) of water soluble polymer cladding.Can be seen that from the transmission electron microscope photo
The physical arrangement that the Ludox obtained through the preparation process is is the physics knot that two or three spherical parts are combined together
Structure is special-shaped.
Sapphire substrate polishing solution is prepared as abrasive material using the above-mentioned special-shaped Ludox of water soluble polymer cladding, it is concrete to make
Standby process is as follows：The special-shaped Ludox abrasive material 40g of water soluble polymer cladding obtained in the present embodiment is taken, under 60rpm stirrings
The potassium hydroxide solution 3g that mass fraction is 1% is added thereto, and adds 57g deionized waters, water soluble polymer bag is obtained
The sapphire substrate polishing solution that special-shaped Ludox does abrasive material is covered, the pH value of the polishing fluid is 10.25.
Sapphire Substrate polishing experiments
Sapphire Substrate is polished using above-mentioned polishing fluid, process conditions are as follows：
Buffing machine：Wound skill 50B single side polishing machine
Wafer polishing：6 inches sapphire substrates
Polishing pad：Subaru 800
Polish pressure：5kg
Lower wall rotating speed：45rpm
Upper disk rotating speed：40rpm
Polishing time：90min
Through pickling, alkali cleaning in automatic rinser after sapphire wafer polishing, then the drying of automatic spin-drying machine, uses electronics
5 points of average polished removal rates of miking are 6.25 μm/h, are Ra=with atomic force microscope measurement surface roughness
0.15nm(50μm*50μm)。
Embodiment 2
The raw material weight percentage ratio of the special-shaped Ludox of the present embodiment water soluble polymer cladding is consisted of：0.1g Polyethylene Glycol
(molecular weight 5000-5500), 0.10g polyacrylamides (molecular weight 250000-250200), 20g raw materials of silica sol (mean diameters
100nm, solid content are 50wt%) and surplus deionized water.
With embodiment 1, difference is to control rotating speed in whole preparation process all the time for 200rpm to preparation process, and is walked
It is rapid 2) in raw materials of silica sol is added dropwise to need before the aqueous solution of Polyethylene Glycol raw materials of silica sol is diluted 2 times, Ran Houzai
It is added dropwise in the aqueous solution of Polyethylene Glycol.
Abrasive material is done with the special-shaped Ludox of the present embodiment water soluble polymer cladding and prepares sapphire substrate polishing solution, prepared
Journey is as follows：The special-shaped Ludox 50g of above-mentioned water soluble polymer cladding is taken, in the case where 60rpm is stirred by hydrogen that mass concentration is 5%
Potassium oxide solution 2g is added thereto, and adds 48g deionized waters, the special-shaped Ludox of water soluble polymer cladding is obtained and does abrasive material
Sapphire substrate polishing solution, measures its pH value for 10.40.
Sapphire Substrate polishing experiments
Sapphire Substrate is polished using above-mentioned polishing fluid, process conditions are as follows：
Buffing machine：Wound skill 50B single side polishing machine
Wafer polishing：4 inches sapphire substrates
Polishing pad：Subaru 600
Polish pressure：5.5kg
Lower wall rotating speed：45rpm
Upper disk rotating speed：40rpm
Polishing time：90min
Through pickling, alkali cleaning in automatic rinser after sapphire wafer polishing, then the drying of automatic spin-drying machine, uses electronics
5 points of average polished removal rates of miking are 7.1 μm/h, are Ra=with atomic force microscope measurement surface roughness
0.11nm(50μm*50μm)。
Embodiment 3
The raw material weight percentage ratio of the special-shaped Ludox of the present embodiment water soluble polymer cladding is consisted of：1g polypropylene glycols
(molecular weight 19000-20000), 5g polyacrylamides (molecular weight 491000-500000), 20g raw materials of silica sol (mean diameters
150nm, solid content are 20wt%) and surplus deionized water.
With embodiment 2, difference is step 2 to preparation process) in raw materials of silica sol is added dropwise to into Polyethylene Glycol
Aqueous solution before need by raw materials of silica sol dilute 1 times, be then added dropwise to again in the aqueous solution of Polyethylene Glycol.
Abrasive material is done with the special-shaped Ludox of the present embodiment water soluble polymer cladding and prepares sapphire substrate polishing solution, prepared
Journey is as follows：The special-shaped Ludox 50g of above-mentioned water soluble polymer cladding is taken, by the hydrogen of mass concentration 0.1% under 60rpm stirrings
Potassium oxide solution 15g is added thereto, and adds 35g deionized waters, the special-shaped Ludox of water soluble polymer cladding is obtained and does abrasive material
Sapphire substrate polishing solution, measure its pH value for 10.45.
Sapphire Substrate polishing experiments
Sapphire Substrate is polished using above-mentioned polishing fluid, process conditions are as follows：
Buffing machine：Wound skill 50B single side polishing machine
Wafer polishing：4 inches sapphire wafers
Polishing pad：Subaru 600
Polish pressure：5.5kg
Lower wall rotating speed：45rpm
Upper disk rotating speed：40rpm
Polishing time：90min
Through pickling, alkali cleaning in automatic rinser after sapphire wafer polishing, then the drying of automatic spin-drying machine, uses electronics
5 points of average polished removal rates of miking are 7.5 μm/h, are Ra=with atomic force microscope measurement surface roughness
0.14nm(50μm*50μm)。
Embodiment 4
The raw material weight percentage ratio of the special-shaped Ludox of the present embodiment water soluble polymer cladding is consisted of：0.25g poly- the third two
Alcohol (molecular weight 5000), 0.05g polyacrylic acid and 0.05g sodium polyacrylate pressed powders (mean molecule quantity 250000), 30g silicon
The deionized water of colloidal sol raw material (mean diameter 50nm, solid content are 20wt%) and surplus.
Preparation process is with embodiment 3.
Abrasive material is done with the special-shaped Ludox of the present embodiment water soluble polymer cladding and prepares sapphire substrate polishing solution, prepared
Journey is as follows：The special-shaped Ludox 50g of above-mentioned water soluble polymer cladding is taken, in the case where 60rpm is stirred by hydrogen that mass concentration is 5%
Potassium oxide solution 2g is added thereto, and adds 48g deionized waters, the special-shaped Ludox of water soluble polymer cladding is obtained and does abrasive material
Sapphire substrate polishing solution, measures its pH value for 10.50.
Sapphire Substrate polishing experiments
Sapphire Substrate is polished using above-mentioned polishing fluid, process conditions are as follows：
Buffing machine：Wound skill 50B single side polishing machine
Wafer polishing：4 inches sapphire wafers
Polishing pad：Subaru 600
Polish pressure：5.5kg
Lower wall rotating speed：45rpm
Upper disk rotating speed：40rpm
Polishing time：90min
Through pickling, alkali cleaning in automatic rinser after sapphire wafer polishing, then the drying of automatic spin-drying machine, uses electronics
5 points of average removal rates of miking are 7.6 μm/h, with atomic force microscope measurement surface roughness Ra=0.11nm (50
μm*50μm)。
Embodiment 5
The raw material weight percentage ratio of the special-shaped Ludox of the present embodiment water soluble polymer cladding is consisted of：0.25g poly- the third two
Alcohol and 0.25g Polyethylene Glycol (mean molecule quantity 5000-5500), 0.05g polyacrylic acid, 0.05g sodium polyacrylate, 1g polypropylene
Amide pressed powder (mean molecule quantity 250000), 30g raw materials of silica sol (mean diameter 50nm, solid content are 20wt%) and remaining
The deionized water of amount.
Preparation process is with embodiment 3.
The process conditions of Sapphire Substrate polishing experiments with embodiment 4, experimental result are, with 5 points of electronics miking
Average removal rate is 7.5 μm/h, with atomic force microscope measurement surface roughness Ra=0.12nm (50 μm * 50 μm).
In above-described embodiment 1-5, its average polished removal rate is significantly higher than general enterprises requirement between 6-8 μm/h
(3-4 μm/h), while also compared with the removal rate (4.8-6 μm/h) being previously mentioned in the patent of Application No. 201410838043.7
It is high.Additionally, the 4-6 inches sapphires wafer surface roughness polished using this polishing fluid is between 0.11-0.15nm, significantly
Less than the 0.3nm of national standard, also below 0.19-0.25nm disclosed in patent 201410838043.7.
Claims (6)
1. a kind of water soluble polymer coats special-shaped Ludox, and the raw material weight percentage ratio of the special-shaped Ludox is consisted of：
A, polyvalent alcohol, 0.01-1wt%, molecular weight is between 200-20000；The polyvalent alcohol is Polyethylene Glycol and/or gathers
Propylene Glycol；
B, water soluble polymer, 0.01-5wt%, molecular weight is between 10000-500000；The water soluble polymer is poly- third
At least one in acrylamide, sodium polyacrylate, polyacrylic acid；
C, raw materials of silica sol, 5-50wt%；
D, balance of deionized water.
2. water soluble polymer according to claim 1 coats special-shaped Ludox, it is characterised in that the raw materials of silica sol
Mean diameter be 10-150nm, solid content is 5-50wt%.
3. water soluble polymer according to claim 1 coats special-shaped Ludox, it is characterised in that the water solublity high score
Attached bag covers the physics knot that the physical arrangement of special-shaped Ludox is that two or three spheroidal particle or spherical part are combined together
Structure is special-shaped.
4. a kind of arbitrary described water soluble polymer of claim 1 or 3 coats the preparation method of special-shaped Ludox, the method
Step is：
1）Under stirring more than 30rpm rotating speeds, respectively polyvalent alcohol is dissolved completely in water soluble polymer pressed powder
In ionized water, the aqueous solution of polyvalent alcohol and water soluble polymer is respectively obtained；
2）Under stirring more than 30rpm rotating speeds, raw materials of silica sol is added dropwise in the aqueous solution of polyvalent alcohol；
3）Under stirring more than 30rpm rotating speeds, then to step 2）The water-soluble of water soluble polymer is added dropwise in the solution for obtaining
Liquid, and persistently stir 60-80 minutes；
4）By step 3）The solution for obtaining is filtered off more than 1 micron bulky grain solid phase, that is, is obtained water-soluble with 1 micron of filter element filtering
The special-shaped Ludox of property polymeric PTC materials.
5. a kind of sapphire substrate polishing solution, it is characterised in that the polishing fluid is using the arbitrary described water solublity of claim 1-4
Polymeric PTC materials abnormal shape Ludox is used as abrasive material.
6. sapphire substrate polishing solution according to claim 5, it is characterised in that the polishing fluid includes that content is 1-50wt%
The special-shaped Ludox of water soluble polymer cladding, content for the potassium hydroxide and surplus of 0.01-5wt% deionized water；Polishing fluid
PH value be 9.5-12.5.
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| CN111362273A (en) * | 2020-03-18 | 2020-07-03 | 昆山捷纳电子材料有限公司 | Method for preparing irregular nano silica sol polishing abrasive particles by polymer template method |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1654585A (en) * | 2005-01-17 | 2005-08-17 | 上海大学 | Core/shell nano particle grinding agent polishing solution composition and method for preparing same |
| US20100239853A1 (en) * | 2007-07-14 | 2010-09-23 | Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. | Object comprising an adhesive layer, and composition and method of coating thereof |
| CN101974296A (en) * | 2010-11-12 | 2011-02-16 | 大连三达奥克化学股份有限公司 | Core/shell type composite nano abrasive silicon slice polishing liquid |
| CN101974294A (en) * | 2010-09-08 | 2011-02-16 | 沈阳建筑大学 | High-abrasive resistance polishing grinding material and preparation method thereof |
| CN102115619A (en) * | 2009-12-31 | 2011-07-06 | 中国科学院化学研究所 | Surface treatment method for aluminum oxide |
| CN102352186A (en) * | 2011-06-24 | 2012-02-15 | 安徽工业大学 | Nanometer polishing solution used for microcrystalline glass and preparation method thereof |
| CN104559796A (en) * | 2013-10-14 | 2015-04-29 | 天津西美半导体材料有限公司 | Preparation method of surface modification aluminium oxide polishing solution applied to ultra-hard surfaces |
-
2016
- 2016-12-15 CN CN201611157145.8A patent/CN106590530B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1654585A (en) * | 2005-01-17 | 2005-08-17 | 上海大学 | Core/shell nano particle grinding agent polishing solution composition and method for preparing same |
| US20100239853A1 (en) * | 2007-07-14 | 2010-09-23 | Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. | Object comprising an adhesive layer, and composition and method of coating thereof |
| CN102115619A (en) * | 2009-12-31 | 2011-07-06 | 中国科学院化学研究所 | Surface treatment method for aluminum oxide |
| CN101974294A (en) * | 2010-09-08 | 2011-02-16 | 沈阳建筑大学 | High-abrasive resistance polishing grinding material and preparation method thereof |
| CN101974296A (en) * | 2010-11-12 | 2011-02-16 | 大连三达奥克化学股份有限公司 | Core/shell type composite nano abrasive silicon slice polishing liquid |
| CN102352186A (en) * | 2011-06-24 | 2012-02-15 | 安徽工业大学 | Nanometer polishing solution used for microcrystalline glass and preparation method thereof |
| CN104559796A (en) * | 2013-10-14 | 2015-04-29 | 天津西美半导体材料有限公司 | Preparation method of surface modification aluminium oxide polishing solution applied to ultra-hard surfaces |
Non-Patent Citations (3)
| Title |
|---|
| 刘付胜聪，等: "纳米SiO2表面吸附聚丙烯酰胺及其液相分散稳定性", 《硅酸盐学报》 * |
| 杨秀菊，等: "聚丙烯酸钠-硅溶胶的合成及其对阳离子金黄染料的吸附", 《化工环保》 * |
| 王国祥，等: "SiO2/聚丙烯酰胺类杂化材料的合成研究进展", 《有机硅材料》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111362273A (en) * | 2020-03-18 | 2020-07-03 | 昆山捷纳电子材料有限公司 | Method for preparing irregular nano silica sol polishing abrasive particles by polymer template method |
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Inventor after: He Yangang Inventor after: Zhou Jianwei Inventor after: Wang Ru Inventor after: Gao Baohong Inventor after: Zhang Yajie Inventor before: He Yangang Inventor before: Zhou Jianwei Inventor before: Wang Ru Inventor before: Gao Baohong |