CN106589221A - High temperature and die cutting resistant pressure-sensitive adhesive and preparation method thereof - Google Patents
High temperature and die cutting resistant pressure-sensitive adhesive and preparation method thereof Download PDFInfo
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- CN106589221A CN106589221A CN201611257737.7A CN201611257737A CN106589221A CN 106589221 A CN106589221 A CN 106589221A CN 201611257737 A CN201611257737 A CN 201611257737A CN 106589221 A CN106589221 A CN 106589221A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J143/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing boron, silicon, phosphorus, selenium, tellurium, or a metal; Adhesives based on derivatives of such polymers
- C09J143/04—Homopolymers or copolymers of monomers containing silicon
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1804—C4-(meth)acrylate, e.g. butyl (meth)acrylate, isobutyl (meth)acrylate or tert-butyl (meth)acrylate
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- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
The invention relates to a high temperature and die cutting resistant pressure-sensitive adhesive. The adhesive is characterized in that adhesive comprises, by mass, 100 parts of a main monomer, 0.1-1.0 part of an initiator, 0.1-5.0 parts of a cross-linking agent, and 40-60 parts of an organic solvent, wherein the main monomer comprises a soft monomer, a hard monomer, a cross-linking monomer and organic silicon resin, and a mass ratio of the soft monomer to the hard monomer to the cross-linking monomer to the organic silicon resin is (60-80):(8-35):(5-15):(1-10). The invention also relates to a preparation method of the pressure-sensitive adhesive. The pressure-sensitive adhesive has the advantages of excellent high temperature resistance, good die cutting performance, and no die cleaning after 20,000 or above time die cutting. The pressure-sensitive adhesive has the common characteristics of an organosilicone adhesive and an acrylic acid adhesive, has good film forming property, has good adhesion strength (1000-2000g/25mm), and has good adhesion to a substrate. A preparation method of the pressure-sensitive adhesive has the advantages of simplicity, easiness in control, and facilitation of reduction of the production cost of the pressure-sensitive adhesive.
Description
Technical field
The present invention relates to pressure sensitive adhesive field, more particularly to a kind of high temperature resistant, the pressure sensitive adhesive of resistance to cross cutting and preparation method thereof.
Background technology
Smart mobile phone, palm PC etc. become in our daily life indispensable one instrument, and wherein HOME keys are to be permitted
An accessory for being used for operation on many smart mobile phones and palm PC.HOME keys are a very complicated assemblies, and one of them is matched somebody with somebody
Part is after pressure sensitive adhesive is die cut to form circulus, and which plays a part of bonding buffering FPC pieces.It is excellent with cell phone mainboard
Change, the expansion of internal memory, cell phone software developer also cell phone software is made it is very gorgeous, this cause mobile phone play some big games or
Mobile phone can be caused substantially to generate heat when opening many money softwares simultaneously, therefore the thermostability to pressure sensitive adhesive proposes new requirement.
Additionally, traditional acrylic acid adhesive great majority are linear structure, adhesive layer is softer, and mould cross cutting back edge is easy
Excessive glue, overflows collodion silk and can stick on mould, take care of the pence, and must unload cleaning once secondary mould after being die cut thousands of times or so,
This greatly reduces production efficiency, and acrylate adhesive layer can be reacted with hand perspiration, after long-time use, can corrode FPC,
Cause HOME key failures.
Organosiloxane contains Si-O keys, and its bond energy is high, and cohesive strength is high, and surface energy is low, with excellent weatherability, resistance to
The features such as dirt, heat-resisting quantity and film property, and it is good to the wettability and cohesive force of most of base materials.Although individually having
The problems such as adhesive tape made by machine silicon adhesive is not die cut excessive glue, but individually organosilicon adhesive has high cost, applies
After cloth the problems such as difficult cleaning, it is impossible in pressure sensitive adhesive industry large-scale use.
The content of the invention
First technical problem to be solved by this invention is to provide a kind of high temperature resistant and resistance to cross cutting for prior art
Pressure sensitive adhesive.
Second technical problem to be solved by this invention is to provide a kind of system of above-mentioned pressure sensitive adhesive for prior art
Preparation Method.
The present invention solve the technical scheme that adopted of above-mentioned technical problem for：A kind of pressure sensitive adhesive of high temperature resistant, resistance to cross cutting, its
It is characterised by including following components and its mass fraction：
Wherein, above-mentioned main monomer includes soft monomer, hard monomer, cross-linking monomer and organic siliconresin, and the soft monomer, hard
The mass ratio of monomer, cross-linking monomer and organic siliconresin is：60～80:8～35:5～15:1～10.
Preferably, the organic siliconresin is vinyltrimethoxy silane, acrylic trimethoxy silane or 3- (first
Base acryloyl-oxy) at least one in propyl trimethoxy silicane.Organic siliconresin selected by the present invention is containing double bond
Siloxane oligomer, its can carry out in the presence of catalyst with acrylic ester monomer it is free-radical polymerized, generate side chain contain
The copolymer or main chain of siloxanes contain the copolymer of siloxanes.Its formula is as follows：
With the increase of organic siliconresin amount, the crosslinking points increasing number of system, when which exceedes above-mentioned quality ratio, can lead
The cause system degree of cross linking is excessive, and copolymer Tg raises (molecule chain rigidity is excessive), causes the peel strength of pressure sensitive adhesive to be decreased obviously, this
Outward, in system, organic siliconresin is excessive, and the system viscosity of causing rises sharply, easy gel.
Preferably, the soft monomer is the acrylate containing 4～16 carbon atoms, its glass transition temperature Tg for-
70 DEG C～-20 DEG C.Further, it is preferable that the soft monomer is butyl acrylate.Soft monomer is good with affixed object surface wettability
(i.e. adhesiveness is preferable), but its cohesiveness is low.If the content of soft monomer is less than above-mentioned mass ratio, the adhesion strength of pressure sensitive adhesive will be little
In 1000g/25mm, effect on driving birds is not good of fitting is also easy to produce bubble, and higher than above-mentioned mass ratio, then pressure sensitive adhesive is partially soft, is unfavorable for cross cutting.
Preferably, the hard monomer is methyl methacrylate.Hard monomer is the framework ingredient of pressure sensitive adhesive, its vitrification
Transition temperature Tg is higher, and the addition of hard monomer not only causes pressure sensitive adhesive cohesiveness to improve, at the same can also make the adhesion strength of pressure sensitive adhesive,
The transparency and processability are also improved.
Preferably, the cross-linking monomer is acrylic acid.The viscosity of cross-linking monomer scalable pressure sensitive adhesive, just glues and adheres
Power.
Preferably, the initiator is dibenzoyl peroxide.
Preferably, during the cross-linking agent is isocyanates cross-linking agent, metallic salt cross-linking agent or epoxiess cross-linking agent
One kind, further, preferably isocyanates cross-linking agent, the cross-linking agent discharge isocyanates (- NCO) group and above-mentioned copolymerization
The radical reactions such as hydroxyl, carboxyl on thing strand form cross-linked structure, and can strengthen the adhesive force between pressure sensitive adhesive and base material.
When the amount of cross-linking agent is less than above-mentioned mass fraction, the adhesive force between glue-line and base material is poor, when more than above-mentioned mass fraction
When, appeal copolymer can produce gel at short notice, affect coating performance.
Preferably, the organic solvent is toluene.Various organic solvents have its characteristic, during the course of the reaction, solvent
Different impacts are produced because of its different activity to free radical, initiator and polymer.
The present invention solve technical scheme that second technical problem adopted for：A kind of preparation side of above-mentioned pressure sensitive adhesive
Method, which comprises the following steps：Main monomer is configured by above-mentioned mass ratio, then the main monomer of 100 parts of configurations, 0.1～1.0 part are drawn
Send out in agent and 0.1～5.0 part of cross-linking agent input one-pot, stir when feeding intake, after stirring, obtain mixed material；
Take 10～15 parts of organic solvents to be added in reactor, stirring is warming up to 78～82 DEG C, add 1/4 above-mentioned mixing
Material, reacts 1.5～2.0h at 78～82 DEG C；
To the remaining said mixture material of reactor Deca, time for adding is controlled after 1.5～2.0h, completion of dropping, and 78
Continue 2.0～2.5h of isothermal reaction at～82 DEG C, reactor be cooled to into 40～45 DEG C then, add remaining organic solvent,
Discharge after 4～5min of stirring, the pressure sensitive adhesive needed for obtaining final product.
Compared with prior art, it is an advantage of the current invention that：Add organic siliconresin in the pressure sensitive adhesive of the present invention, this is organic
Silicones under promoter effect with acrylic ester monomer copolymerization, acquisition weight average molecular weight be 100,000g/mol～1,500,
000 acrylate copolymer, improves the degree of cross linking between molecule, and bond energy increase, heat-resisting quantity are excellent, and die-cutting performance is good, punching
Cut more than 20,000 and need not clean mould.Additionally, the pressure sensitive adhesive in the present invention has organosilicon adhesive and acrylic acid gluing
The common feature of agent, good film-forming property, adhesion strength are good (1000～2000g/25mm), have good adhesive force to base material.Separately
Outward, the pressure sensitive adhesive preparation method in the present invention is simple, easily-controllable, advantageously reduces the production cost of pressure sensitive adhesive.
Specific embodiment
With reference to embodiments the present invention is described in further detail.
Pressure sensitive adhesive in the present invention is formed by the component copolymerization of following mass fraction：
Wherein, above-mentioned main monomer includes soft monomer, hard monomer, cross-linking monomer and organic siliconresin, and the soft monomer, hard
The mass ratio of monomer, cross-linking monomer and organic siliconresin is：60～80:8～35:5～15:1～10.
Specifically, soft monomer is butyl acrylate, and hard monomer is methyl methacrylate, and cross-linking monomer is acrylic acid.
Initiator is oxidation dibenzoyl BPO (Taizhou City Hai Xiang Chemical Co., Ltd.s produce, similarly hereinafter), cross-linking agent (L-75,
Bayer (China) Co., Ltd.), organic solvent is toluene.
Above-mentioned organic siliconresin is vinyltrimethoxy silane (Shanghai Gui Pu Chemical Companies, similarly hereinafter), propylene
Base trimethoxy silane (Shanghai Gui Pu Chemical Companies, similarly hereinafter) or 3- (methacryloxypropyl) propyl trimethoxy silicane
At least one in (Shanghai Gui Pu Chemical Companies, similarly hereinafter).
The preparation method of the pressure sensitive adhesive in the present invention is as follows：Main monomer is configured by above-mentioned mass ratio, then 100 parts are configured
Main monomer, in 0.1～1.0 part of initiator and 0.1～5.0 part of cross-linking agent input one-pot, stir when feeding intake, stir
Mixed material is obtained afterwards；
Take 10～15 parts of organic solvents to be added in reactor, stirring is warming up to 78～82 DEG C (preferably 82 DEG C), add 1/4
Said mixture material, under 78～82 DEG C (preferably 82 DEG C) react 1.5～2.0h (preferred 1.5h)；
To the remaining said mixture material of reactor Deca, time for adding is controlled in 1.5～2.0h (preferred 2.0h), Deca
After finishing, continue 2.0～2.5h of isothermal reaction (preferred 2.0h) under 78～82 DEG C (preferably 82 DEG C), then reactor is cooled to
40～45 DEG C (preferably 40 DEG C), add remaining organic solvent, discharge after 4～5min of stirring, the pressure sensitive adhesive needed for obtaining final product.
The performance test of the pressure sensitive adhesive of above-mentioned preparation is as follows：
【Thermal performance test】
The sample (pressure sensitive adhesive of i.e. above-mentioned preparation, similarly hereinafter) of 2mg or so is weighed, using the thermal analyzer test of TA companies of the U.S.
Polymer heat-resistant.With nitrogen as protective gas, heating rate is 20 DEG C/min, according to collection of illustrative plates, polymer when measuring 490 DEG C
Weight-loss ratio, weight-loss ratio are bigger, and thermostability is poorer.
【High temperature resistant cull is tested】
Using coating blade equipment, the gluing in 25 μm of PET films, heat cure 100s at 80 DEG C, the adhesive tape is cut into into 25mm
Wide adhesive tape, attaches on PI films surface, is placed in 150 DEG C of baking ovens after 2h and takes out, is cooled to room temperature, and stripping tape sees whether
There is glue residua on PI films surface.If there is residual, represent that glue-line heat-resisting quantity is not good, Jing after high temperature, polymer segment goes to pot, and leads
Cause has residual.OK is represented without glue residua, and temperature tolerance is good.NG represents glue residual, and temperature tolerance is poor.
【Shearing storage elastic modulus】
By the pressure-sensitive adhesive coating 1.5mm of the present invention thick glue-line, under shear mode, frequency be 1Hz, temperature be -70
Under conditions of DEG C being 5 DEG C/min to 200 DEG C, heating rate, by Rheomertric Scientific Co., the height of Ltd manufactures
Level flow measurement extends system (ARES) to measure.
【Adhesion strength】
Using coating blade equipment, the gluing in 25 μm of PET films, heat cure 100s at 80 DEG C, the adhesive tape is cut into into 25mm
Wide adhesive tape, attaches the buffed surface in SUS (304) plate, and is rolled back and forth 3 times, after 20min with 2kg roller bearings, by extension test
Instrument, with the speed of 300mm/min in the case where 180 ° of angle is peeled off, record peels off required power (unit from SUS plates：g/
25mm)。
【Die cuttability】
Using coating blade equipment, the gluing in 25 μm of PET films, 10 to 50 μm of rubberization thickness, with die-cutting device in adhesive tape
On be punched into the disk of a diameter of 1cm, till being stained with glue on mould cutter head, whether statistics punching number of times reaches 20,000 time
More than.OK is represented and can be reached more than 20,000 time, and NG is represented and can not be reached more than 20,000 time.
【It is die cut appearance yield in blocks】
In 1000 punching finished products, warp yield rate of the height less than 2mm, and warping, it is unqualified to be highly considered as more than 2mm,
Qualification rate is asked to be more than 95%.OK represents qualification rate and represents qualification rate less than or equal to 95% more than 95%, NG.
By the following examples 1～10 and 1～4 couple of present invention of comparative example be described in further detail, wherein performance test knot
Structure is as described in Table 1.
Embodiment 1：
In the present embodiment, the component and its mass fraction of pressure sensitive adhesive are as follows：
60 parts of butyl acrylate, 30 parts of methyl methacrylate, 6 parts of acrylic acid, 4 parts of vinyltrimethoxy silane, mistake
0.5 part of dibenzoyl of oxidation, 40 parts of toluene, 2 parts of cross-linking agent.
Embodiment 2：
In the present embodiment, the component and its mass fraction of pressure sensitive adhesive are as follows：
80 parts of butyl acrylate, 10 parts of methyl methacrylate, 6 parts of acrylic acid, 4 parts of acrylic trimethoxy silane, mistake
0.5 part of dibenzoyl of oxidation, 50 parts of toluene, 1 part of cross-linking agent.
Embodiment 3：
In the present embodiment, the component and its mass fraction of pressure sensitive adhesive are as follows：
75 parts of butyl acrylate, 8 parts of methyl methacrylate, 10 parts of acrylic acid, 3- (methacryloxypropyl) propyl group front three
7 parts of TMOS, 0.5 part of dibenzoyl peroxide, 50 parts of toluene, 3 parts of cross-linking agent.
Embodiment 4：
In the present embodiment, the component and its mass fraction of pressure sensitive adhesive are as follows：
63 parts of butyl acrylate, 30 parts of methyl methacrylate, 10 parts of acrylic acid, 7 parts of vinyltrimethoxy silane, mistake
0.5 part of dibenzoyl of oxidation, 60 parts of toluene, 3 parts of cross-linking agent.
Embodiment 5：
In the present embodiment, the component and its mass fraction of pressure sensitive adhesive are as follows：
70 parts of butyl acrylate, 21 parts of methyl methacrylate, 5 parts of acrylic acid, 4 parts of acrylic trimethoxy silane, mistake
0.5 part of dibenzoyl of oxidation, 50 parts of toluene, 2 parts of cross-linking agent.
Embodiment 6：
In the present embodiment, the component and its mass fraction of pressure sensitive adhesive are as follows：
66 parts of butyl acrylate, 16 parts of methyl methacrylate, 14 parts of acrylic acid, 4 parts of acrylic trimethoxy silane, mistake
0.1 part of dibenzoyl of oxidation, 50 parts of toluene, 2 parts of cross-linking agent.
Embodiment 7：
In the present embodiment, the component and its mass fraction of pressure sensitive adhesive are as follows：
70 parts of butyl acrylate, 19 parts of methyl methacrylate, 10 parts of acrylic acid, 3- (methacryloxypropyl) propyl group front three
1 part of TMOS, 0.5 part of dibenzoyl peroxide, 50 parts of toluene, 3 parts of cross-linking agent.
Embodiment 8：
In the present embodiment, the component and its mass fraction of pressure sensitive adhesive are as follows：
70 parts of butyl acrylate, 10 parts of methyl methacrylate, 10 parts of acrylic acid, 3- (methacryloxypropyl) propyl group front three
10 parts of TMOS, 0.5 part of dibenzoyl peroxide, 50 parts of toluene, 1 part of cross-linking agent.
Embodiment 9：
In the present embodiment, the component and its mass fraction of pressure sensitive adhesive are as follows：
70 parts of butyl acrylate, 12 parts of methyl methacrylate, 12 parts of acrylic acid, 6 parts of acrylic trimethoxy silane, mistake
1.0 parts of dibenzoyl of oxidation, 50 parts of toluene, 0.1 part of cross-linking agent.
Embodiment 10：
In the present embodiment, the component and its mass fraction of pressure sensitive adhesive are as follows：
70 parts of butyl acrylate, 12 parts of methyl methacrylate, 12 parts of acrylic acid, 6 parts of acrylic trimethoxy silane, mistake
0.5 part of dibenzoyl of oxidation, 50 parts of toluene, 5 parts of cross-linking agent.
Comparative example 1
In this comparative example, the component and its mass fraction of pressure sensitive adhesive are as follows：
55 parts of butyl acrylate, 28 parts of methyl methacrylate, 10 parts of acrylic acid, 7 parts of acrylic trimethoxy silane, mistake
0.5 part of dibenzoyl of oxidation, 50 parts of toluene, 2 parts of cross-linking agent.
Comparative example 2：
In this comparative example, the component and its mass fraction of pressure sensitive adhesive are as follows：
82 parts of butyl acrylate, 10 parts of methyl methacrylate, 6 parts of acrylic acid, 2 parts of vinyltrimethoxy silane, mistake
0.5 part of dibenzoyl of oxidation, 50 parts of toluene, 1 part of cross-linking agent.
Comparative example 3：
In this comparative example, the component and its mass fraction of pressure sensitive adhesive are as follows：
70 parts of butyl acrylate, 20 parts of methyl methacrylate, 10 parts of acrylic acid, 0.5 part of dibenzoyl peroxide, toluene
50 parts, 3 parts of cross-linking agent.
Comparative example 4：
In this comparative example, the component and its mass fraction of pressure sensitive adhesive are as follows：
65 parts of butyl acrylate, 12 parts of methyl methacrylate, 8 parts of acrylic acid, 3- (methacryloxypropyl) propyl group front three
15 parts of TMOS, 0.5 part of dibenzoyl peroxide, 50 parts of toluene, 1 part of cross-linking agent.
The performance test results of above-described embodiment 1～10 and comparative example 1～4 are as described in Table 1, from table 1, comparative example 1
Although in pressure sensitive adhesive die cuttability and temperature tolerance it is relatively preferable, adhesion strength is poor；Although the pressure sensitive adhesive in comparative example 2 and 3 glues
Put forth effort preferably, but die cuttability and temperature tolerance are poor, especially comparative example 3；4 temperature tolerance of comparative example is projected, but die cuttability can not reach
To requiring.
Rationally assembling by organic siliconresin and other components in the present invention so that the pressure sensitive adhesive heat-resisting quantity of preparation is excellent
Different, die-cutting performance is good, good film-forming property, and adhesion strength is good (1000～2000g/25mm), has good adhesive force to base material.
The performance test results of 1 each embodiment of table and comparative example
Claims (10)
1. a kind of high temperature resistant, the pressure sensitive adhesive of resistance to cross cutting, it is characterised in that including following components and its mass fraction：
Wherein, above-mentioned main monomer includes soft monomer, hard monomer, cross-linking monomer and organic siliconresin, and the soft monomer, hard list
The mass ratio of body, cross-linking monomer and organic siliconresin is：60～80:8～35:5～15:1～10.
2. pressure sensitive adhesive as claimed in claim 1, it is characterised in that the organic siliconresin be vinyltrimethoxy silane,
At least one in acrylic trimethoxy silane or 3- (methacryloxypropyl) propyl trimethoxy silicane.
3. pressure sensitive adhesive as claimed in claim 1, it is characterised in that the soft monomer is the acrylic acid containing 4～16 carbon atoms
Ester, its glass transition temperature Tg are -70 DEG C～-20 DEG C.
4. pressure sensitive adhesive as claimed in claim 3, it is characterised in that the soft monomer is butyl acrylate.
5. pressure sensitive adhesive as claimed in claim 1, it is characterised in that the hard monomer is methyl methacrylate.
6. pressure sensitive adhesive as claimed in claim 1, it is characterised in that the cross-linking monomer is acrylic acid.
7. pressure sensitive adhesive as claimed in claim 1, it is characterised in that the initiator is dibenzoyl peroxide.
8. pressure sensitive adhesive as claimed in claim 1, it is characterised in that the cross-linking agent is isocyanates cross-linking agent, slaine
One kind in class cross-linking agent or epoxiess cross-linking agent.
9. pressure sensitive adhesive as claimed in claim 1, it is characterised in that the organic solvent is toluene.
10. a kind of preparation method of the pressure sensitive adhesive as described in any one of claim 1～9, it is characterised in that comprise the following steps：
Main monomer is configured by above-mentioned mass ratio, then by the main monomer of 100 parts of configurations, 0.1～1.0 part of initiator and 0.1～5.0 part
In cross-linking agent input one-pot, stir when feeding intake, after stirring, obtain mixed material；
Take 10～15 parts of organic solvents to be added in reactor, stirring is warming up to 78～82 DEG C, add 1/4 said mixture
Material, reacts 1.5～2.0h at 78～82 DEG C；
To the remaining said mixture material of reactor Deca, time for adding is controlled after 1.5～2.0h, completion of dropping, and 78～82
Continue 2.0～2.5h of isothermal reaction at DEG C, reactor is cooled to into 40～45 DEG C then, add remaining organic solvent, stirring 4
Discharge after～5min, the pressure sensitive adhesive needed for obtaining final product.
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| CN109536085A (en) * | 2018-10-18 | 2019-03-29 | 深圳市益达兴科技股份有限公司 | A kind of silicone-modified polyacrylate pressure sensitive adhesive preparation method and gained pressure sensitive adhesive |
| CN110607145A (en) * | 2019-09-18 | 2019-12-24 | 广东东立新材料科技股份有限公司 | Pressure-sensitive adhesive for high-temperature-resistant functional film and preparation method thereof |
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| CN115044329A (en) * | 2022-06-28 | 2022-09-13 | 四川轻化工大学 | Special high-performance fluorine-containing silicon pressure-sensitive adhesive and preparation method thereof |
| CN117304835A (en) * | 2023-09-28 | 2023-12-29 | 惠州市欣洋电子材料有限公司 | Lifting strip for cooperation with automatic operation and application method |
| WO2024131556A1 (en) * | 2022-12-22 | 2024-06-27 | 湖北亿纬动力有限公司 | High-adhesion conductive adhesive, preparation method therefor and use thereof |
| US12037523B2 (en) | 2018-11-08 | 2024-07-16 | Avery Dennison Corporation | Yellowing resistant PSA |
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Application publication date: 20170426 |