CN106583940A - OGS touch screen silver paste laser etching method capable of eliminating micro short circuit - Google Patents

OGS touch screen silver paste laser etching method capable of eliminating micro short circuit Download PDF

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Publication number
CN106583940A
CN106583940A CN201611140190.2A CN201611140190A CN106583940A CN 106583940 A CN106583940 A CN 106583940A CN 201611140190 A CN201611140190 A CN 201611140190A CN 106583940 A CN106583940 A CN 106583940A
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CN
China
Prior art keywords
silver paste
film layer
dielectric ink
optimum
short circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201611140190.2A
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Chinese (zh)
Inventor
肖新煌
刘甲定
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SUNOPTIC TECHNOLOGY Co Ltd
Original Assignee
SUNOPTIC TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SUNOPTIC TECHNOLOGY Co Ltd filed Critical SUNOPTIC TECHNOLOGY Co Ltd
Priority to CN201611140190.2A priority Critical patent/CN106583940A/en
Publication of CN106583940A publication Critical patent/CN106583940A/en
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/361Removing material for deburring or mechanical trimming
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/60Preliminary treatment
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Abstract

The invention discloses an OGS touch screen silver paste laser etching method capable of eliminating a micro short circuit. The method comprises the steps that a tempered glass substrate is coated with a BM film layer at first, and needed patterns are exposed, developed and cured; a black insulation ink film layer, a white insulation ink film layer, a gray insulation ink film layer and a silver paste film layer are sequentially arranged on the BM film layer through silk printing; two rows of laser rays with low frequency and high power are adopted for forming a silver paste circuit through laser dry etching; and finally a cover bottom and other film layers are arranged on the silver paste circuit through silk printing. The marks left through laser dry etching of silver paste in the ink region can be eliminated, the micro short circuit problem is avoided, and the OGS product exterior quality is improved.

Description

A kind of OGS touch screen silver paste laser etching method for eliminating micro-short circuit
Technical field
The present invention relates to OGS touch screen processing method field, specifically a kind of OGS touch screen silver paste for eliminating micro-short circuit Laser etching method.
Background technology
OGS products are capable of achieving multiple spot and accurate touch sensible, and simple structure, light transmittance >=88%, only use a piece of glass Glass is alternative original sensor and cover plate two parts, is the important component part of currently displaying touch technology development.
The OGS products of silk-screen route are walked at present, after the silver paste circuit that silk-screen goes out general, need to use laser dry carving technology Silver paste circuit is separated according to design drawing, to realize the function of product.Prior art is typically lost using single line laser line Carve, in etching process, if single line laser linear heat generation rate is little, have the presence of micro-short circuit problem, affect product function.If single line laser When linear heat generation rate is big, ink film layer printing opacity can be caused, however it remains micro-short circuit problem.
The content of the invention is it is an object of the invention to provide a kind of OGS touch screen silver paste laser ablation side for eliminating micro-short circuit Method, to solve the problems, such as the micro-short circuit that the single laser dry etching of prior art OGS product is present.
In order to achieve the above object, the technical solution adopted in the present invention is:
A kind of OGS touch screen silver paste laser etching method for eliminating micro-short circuit, it is characterised in that:Comprise the following steps:
(1), on the reinforced glass substrate for producing ITO pattern be coated with BM film layers, and exposure imaging solidify required for Pattern, BM thicknesses of layers is 2 ~ 3um, and solidification temperature is maintained at 210 DEG C -230 DEG C, and hardening time is 50 min -70min;
(2), using polyester web plate on BM films silk-screen black dielectric ink film layer, black dielectric ink thicknesses of layers be 8 ~ 10um, is then solidified, and solidification temperature is maintained at 140 DEG C -160 DEG C, and hardening time is 20 min -40min;
(3), using polyester web plate in black dielectric ink film layer silk-screen white dielectric ink film layer, white dielectric ink film layer Thickness is 10 ~ 12um, is then solidified, and solidification temperature is maintained at 140 DEG C -160 DEG C, hardening time be 20 min - 40min;
(4), using polyester web plate in white dielectric ink film layer silk-screen grey dielectric ink film layer, grey dielectric ink film layer Thickness is 6 ~ 8um, is then solidified, and solidification temperature is maintained at 140 DEG C -160 DEG C, and hardening time is 20 min -40min;
(5), using web plate in grey dielectric ink film layer silk-screen silver paste film layer, silver paste thicknesses of layers be 4 ~ 6um, then carry out Solidification, solidification temperature is maintained at 140 DEG C -160 DEG C, and hardening time is 20 min -40min;
(6), go out using the double laser line laser dry etching of low frequency high power silver paste circuit, the power of double laser rays is 80% ~ 100%, frequency is 100kHz, and scanning times are 2 ~ 4;
(7), last silk-screen base and other film layers on silver paste circuit.
A kind of described OGS touch screen silver paste laser etching method for eliminating micro-short circuit, it is characterised in that:Step(1) In, it is 220 DEG C that solidification temperature is optimum, and it is 60min that hardening time is optimum.
A kind of described OGS touch screen silver paste laser etching method for eliminating micro-short circuit, it is characterised in that:Step(2) In, black dielectric ink film layer model GKL-5600D, polyester webs plate gauge lattice are 100T, and it is 150 DEG C that solidification temperature is optimum, Gu Change time optimal is 30min.
A kind of described OGS touch screen silver paste laser etching method for eliminating micro-short circuit, it is characterised in that:Step(3) In, white dielectric ink model 1506-128H, polyester webs plate gauge lattice are 90T, and it is 150 DEG C that solidification temperature is optimum, hardening time Optimum is 30min.
A kind of described OGS touch screen silver paste laser etching method for eliminating micro-short circuit, it is characterised in that:Step(4) In, grey dielectric ink is by the white dielectric ink of model 1506-128H and the black dielectric ink of model GKL-5600D Mix, wherein the ratio of white dielectric ink and black dielectric ink is 50:1, polyester webs plate gauge lattice are 120T, and solidification is warm It is 150 DEG C that degree is optimum, and it is 30min that hardening time is optimum.
A kind of described OGS touch screen silver paste laser etching method for eliminating micro-short circuit, it is characterised in that:Step(5) In, web plate is the V net web plates of 420 mesh, and it is 150 DEG C that solidification temperature is optimum, and it is 30min that hardening time is optimum.
A kind of described OGS touch screen silver paste laser etching method for eliminating micro-short circuit, it is characterised in that:Step(6) In, spacing is 0.02mm between double laser rays.
Compared with the prior art, beneficial effects of the present invention are embodied in:
In the present invention, the white dielectric ink of one layer of print is added on black dielectric ink before silk-screen silver paste, one layer of ash of print is then added again Color dielectric ink.On the one hand this two-layer ink play insulating effect, on the other hand white dielectric ink to the tolerance of laser compared with By force, larger energy will not puncture ink, can suitably tune up the energy of laser rays in laser dry etching.
Simultaneously double laser path is adopted in the present invention, and using low frequency high power laser, using low frequency lasers penetrability Poor characteristic, reduces laser frequency, improves energy, it is ensured that can completely destroy silver paste and will not puncture ink, increase in addition One laser path for being separated by 0.02mm, the effect for being further ensured that laser-induced thermal etching ensures silver paste noresidue, and product will not printing opacity.
The present invention can eliminate ink area because of the vestige left by laser dry etching silver paste, and be not in micro-short circuit problem, Improve OGS product appearance qualities.
Description of the drawings
Fig. 1 is principle of the invention schematic diagram.
Specific embodiment
As shown in figure 1, a kind of OGS touch screen silver paste laser etching method for eliminating micro-short circuit, comprises the following steps:
(1), on the reinforced glass substrate for producing ITO pattern be coated with BM film layers, and exposure imaging solidify required for Pattern, BM thicknesses of layers is 2 ~ 3um, and solidification temperature is maintained at 210 DEG C -230 DEG C, and hardening time is 50 min -70min;
(2), using polyester web plate on BM films silk-screen black dielectric ink film layer, black dielectric ink thicknesses of layers be 8 ~ 10um, is then solidified, and solidification temperature is maintained at 140 DEG C -160 DEG C, and hardening time is 20 min -40min;
(3), using polyester web plate in black dielectric ink film layer silk-screen white dielectric ink film layer, white dielectric ink film layer Thickness is 10 ~ 12um, is then solidified, and solidification temperature is maintained at 140 DEG C -160 DEG C, hardening time be 20 min - 40min;
(4), using polyester web plate in white dielectric ink film layer silk-screen grey dielectric ink film layer, grey dielectric ink film layer Thickness is 6 ~ 8um, is then solidified, and solidification temperature is maintained at 140 DEG C -160 DEG C, and hardening time is 20 min -40min;
(5), using web plate in grey dielectric ink film layer silk-screen silver paste film layer, silver paste thicknesses of layers be 4 ~ 6um, then carry out Solidification, solidification temperature is maintained at 140 DEG C -160 DEG C, and hardening time is 20 min -40min;
(6), go out using the double laser line laser dry etching of low frequency high power silver paste circuit, the power of double laser rays is 80% ~ 100%, frequency is 100kHz, and scanning times are 2 ~ 4;
(7), last silk-screen base and other film layers on silver paste circuit.
Step(1)In, it is 220 DEG C that solidification temperature is optimum, and it is 60min that hardening time is optimum.
Step(2)In, black dielectric ink film layer model GKL-5600D, polyester webs plate gauge lattice be 100T, solidification temperature Optimum is 150 DEG C, and it is 30min that hardening time is optimum.
Step(3)In, white dielectric ink model 1506-128H, polyester webs plate gauge lattice are 90T, and solidification temperature is optimum For 150 DEG C, it is 30min that hardening time is optimum.
Step(4)In, grey dielectric ink by model 1506-128H white dielectric ink and model GKL- The black dielectric ink of 5600D is mixed, wherein the ratio of white dielectric ink and black dielectric ink is 50:1, polyester webs Plate gauge lattice are 120T, and it is 150 DEG C that solidification temperature is optimum, and it is 30min that hardening time is optimum.
Step(5)In, web plate is the V net web plates of 420 mesh, and it is 150 DEG C that solidification temperature is optimum, and hardening time optimum is 30min。
Step(6)In, spacing is 0.02mm between double laser rays.

Claims (7)

1. a kind of OGS touch screen silver paste laser etching method for eliminating micro-short circuit, it is characterised in that:Comprise the following steps:
(1), on the reinforced glass substrate for producing ITO pattern be coated with BM film layers, and exposure imaging solidify required for Pattern, BM thicknesses of layers is 2 ~ 3um, and solidification temperature is maintained at 210 DEG C -230 DEG C, and hardening time is 50 min -70min;
(2), using polyester web plate on BM films silk-screen black dielectric ink film layer, black dielectric ink thicknesses of layers be 8 ~ 10um, is then solidified, and solidification temperature is maintained at 140 DEG C -160 DEG C, and hardening time is 20 min -40min;
(3), using polyester web plate in black dielectric ink film layer silk-screen white dielectric ink film layer, white dielectric ink film layer Thickness is 10 ~ 12um, is then solidified, and solidification temperature is maintained at 140 DEG C -160 DEG C, hardening time be 20 min - 40min;
(4), using polyester web plate in white dielectric ink film layer silk-screen grey dielectric ink film layer, grey dielectric ink film layer Thickness is 6 ~ 8um, is then solidified, and solidification temperature is maintained at 140 DEG C -160 DEG C, and hardening time is 20 min -40min;
(5), using web plate in grey dielectric ink film layer silk-screen silver paste film layer, silver paste thicknesses of layers be 4 ~ 6um, then carry out Solidification, solidification temperature is maintained at 140 DEG C -160 DEG C, and hardening time is 20 min -40min;
(6), go out using the double laser line laser dry etching of low frequency high power silver paste circuit, the power of double laser rays is 80% ~ 100%, frequency is 100kHz, and scanning times are 2 ~ 4;
(7), last silk-screen base and other film layers on silver paste circuit.
2. a kind of OGS touch screen silver paste laser etching method for eliminating micro-short circuit according to claim 1, its feature exists In:Step(1)In, it is 220 DEG C that solidification temperature is optimum, and it is 60min that hardening time is optimum.
3. a kind of OGS touch screen silver paste laser etching method for eliminating micro-short circuit according to claim 1, its feature exists In:Step(2)In, black dielectric ink film layer model GKL-5600D, polyester webs plate gauge lattice are 100T, and solidification temperature is optimum For 150 DEG C, it is 30min that hardening time is optimum.
4. a kind of OGS touch screen silver paste laser etching method for eliminating micro-short circuit according to claim 1, its feature exists In:Step(3)In, white dielectric ink model 1506-128H, polyester webs plate gauge lattice are 90T, and it is 150 that solidification temperature is optimum DEG C, it is 30min that hardening time is optimum.
5. a kind of OGS touch screen silver paste laser etching method for eliminating micro-short circuit according to claim 1, its feature exists In:Step(4)In, grey dielectric ink by model 1506-128H white dielectric ink and model GKL-5600D it is black Color dielectric ink is mixed, wherein the ratio of white dielectric ink and black dielectric ink is 50:1, polyester webs plate gauge lattice are 120T, it is 150 DEG C that solidification temperature is optimum, and it is 30min that hardening time is optimum.
6. a kind of OGS touch screen silver paste laser etching method for eliminating micro-short circuit according to claim 1, its feature exists In:Step(5)In, web plate is the V net web plates of 420 mesh, and it is 150 DEG C that solidification temperature is optimum, and it is 30min that hardening time is optimum.
7. a kind of OGS touch screen silver paste laser etching method for eliminating micro-short circuit according to claim 1, its feature exists In:Step(6)In, spacing is 0.02mm between double laser rays.
CN201611140190.2A 2016-12-12 2016-12-12 OGS touch screen silver paste laser etching method capable of eliminating micro short circuit Pending CN106583940A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109240540A (en) * 2018-09-07 2019-01-18 深圳市骏达光电股份有限公司 The manufacturing process of touch module device
CN111845141A (en) * 2019-04-25 2020-10-30 深圳正峰印刷有限公司 Black-blending-retaining printing ink and printing ink layer structure and laser code engraving method
CN114654910A (en) * 2020-12-23 2022-06-24 掌阅科技股份有限公司 Ink silk-screen preparation process of electronic equipment cover plate and electronic equipment cover plate

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CN104317464A (en) * 2014-10-24 2015-01-28 深圳爱商精密电子有限公司 Laser engraving method for capacitive touch screen
CN104820534A (en) * 2015-05-27 2015-08-05 广东泰通科技股份有限公司 Membrane structure single-layer multi-point capacitive touch screen sensor manufacturing technology
CN104881168A (en) * 2015-04-02 2015-09-02 东莞市胜大光电科技有限公司 Silk-screen printing type multi-point OGS (one glass solution) touch screen manufacturing method
CN105138196A (en) * 2015-07-20 2015-12-09 山东华芯富创电子科技有限公司 OGS (One Glass Solution) touch screen structure and electronic device
CN105335026A (en) * 2014-05-30 2016-02-17 深圳市比亚迪电子部品件有限公司 Piece type OGS touch screen and manufacturing method therefor
CN106033271A (en) * 2015-03-17 2016-10-19 南昌欧菲光学技术有限公司 Touch screen cover plate and manufacturing method thereof

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105335026A (en) * 2014-05-30 2016-02-17 深圳市比亚迪电子部品件有限公司 Piece type OGS touch screen and manufacturing method therefor
CN104317464A (en) * 2014-10-24 2015-01-28 深圳爱商精密电子有限公司 Laser engraving method for capacitive touch screen
CN106033271A (en) * 2015-03-17 2016-10-19 南昌欧菲光学技术有限公司 Touch screen cover plate and manufacturing method thereof
CN104881168A (en) * 2015-04-02 2015-09-02 东莞市胜大光电科技有限公司 Silk-screen printing type multi-point OGS (one glass solution) touch screen manufacturing method
CN104820534A (en) * 2015-05-27 2015-08-05 广东泰通科技股份有限公司 Membrane structure single-layer multi-point capacitive touch screen sensor manufacturing technology
CN105138196A (en) * 2015-07-20 2015-12-09 山东华芯富创电子科技有限公司 OGS (One Glass Solution) touch screen structure and electronic device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109240540A (en) * 2018-09-07 2019-01-18 深圳市骏达光电股份有限公司 The manufacturing process of touch module device
CN109240540B (en) * 2018-09-07 2022-04-26 深圳市骏达光电股份有限公司 Manufacturing process of touch module device
CN111845141A (en) * 2019-04-25 2020-10-30 深圳正峰印刷有限公司 Black-blending-retaining printing ink and printing ink layer structure and laser code engraving method
CN114654910A (en) * 2020-12-23 2022-06-24 掌阅科技股份有限公司 Ink silk-screen preparation process of electronic equipment cover plate and electronic equipment cover plate
CN114654910B (en) * 2020-12-23 2023-08-01 掌阅科技股份有限公司 Ink silk-screen printing preparation process of electronic equipment cover plate and electronic equipment cover plate

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Application publication date: 20170426