CN106583918B - 基于激光改变硅基表面形态并控制成型技术的研究方法 - Google Patents
基于激光改变硅基表面形态并控制成型技术的研究方法 Download PDFInfo
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- CN106583918B CN106583918B CN201611090441.0A CN201611090441A CN106583918B CN 106583918 B CN106583918 B CN 106583918B CN 201611090441 A CN201611090441 A CN 201611090441A CN 106583918 B CN106583918 B CN 106583918B
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- silicon substrate
- laser
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 73
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 73
- 239000010703 silicon Substances 0.000 title claims abstract description 72
- 239000000758 substrate Substances 0.000 title claims abstract description 72
- 238000000034 method Methods 0.000 title claims abstract description 32
- 238000011160 research Methods 0.000 title claims abstract description 12
- 230000007547 defect Effects 0.000 abstract description 5
- 239000012535 impurity Substances 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 description 9
- 230000003287 optical effect Effects 0.000 description 8
- 238000012545 processing Methods 0.000 description 5
- 238000002474 experimental method Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000007493 shaping process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000001473 noxious effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/355—Texturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/3568—Modifying rugosity
- B23K26/3584—Increasing rugosity, e.g. roughening
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Laser Beam Processing (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201611090441.0A CN106583918B (zh) | 2016-11-30 | 2016-11-30 | 基于激光改变硅基表面形态并控制成型技术的研究方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201611090441.0A CN106583918B (zh) | 2016-11-30 | 2016-11-30 | 基于激光改变硅基表面形态并控制成型技术的研究方法 |
Publications (2)
Publication Number | Publication Date |
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CN106583918A CN106583918A (zh) | 2017-04-26 |
CN106583918B true CN106583918B (zh) | 2018-04-20 |
Family
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Family Applications (1)
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CN201611090441.0A Active CN106583918B (zh) | 2016-11-30 | 2016-11-30 | 基于激光改变硅基表面形态并控制成型技术的研究方法 |
Country Status (1)
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CN (1) | CN106583918B (zh) |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998053949A1 (en) * | 1997-05-27 | 1998-12-03 | Sdl, Inc. | Laser marking system and method of energy control |
CN101285209A (zh) * | 2008-04-15 | 2008-10-15 | 长春理工大学 | n型硅光辅助电化学腐蚀装置 |
CN100576439C (zh) * | 2008-06-16 | 2009-12-30 | 吉林大学 | 在基底表面构筑抗反射结构的方法 |
CN101476157A (zh) * | 2008-12-31 | 2009-07-08 | 南京航空航天大学 | 激光照射纳米碳化硅粉末材料制备碳化硅晶须的方法 |
CN102277623B (zh) * | 2010-12-27 | 2013-07-31 | 横店集团东磁股份有限公司 | 一种对单晶硅表面进行微结构化的方法 |
CN102351569B (zh) * | 2011-07-08 | 2013-03-27 | 中国科学院物理研究所 | 一种硅表面抗反射纳米阵列结构的制备方法 |
JP5610356B2 (ja) * | 2011-10-25 | 2014-10-22 | 公益財団法人若狭湾エネルギー研究センター | レーザー除染装置 |
US9352539B2 (en) * | 2013-03-12 | 2016-05-31 | Trillion Science, Inc. | Microcavity carrier with image enhancement for laser ablation |
JP2016172273A (ja) * | 2015-03-17 | 2016-09-29 | 武二 新井 | レーザ照射による部材または製品の表面処理方法及び表面処理済部材 |
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2016
- 2016-11-30 CN CN201611090441.0A patent/CN106583918B/zh active Active
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Effective date of registration: 20201111 Address after: 310012 room 2603, building 8, No. 2, xiyuanba Road, Sandun Town, Xihu District, Hangzhou City, Zhejiang Province Patentee after: HANGZHOU ZHUILIE TECHNOLOGY Co.,Ltd. Address before: 310018, No. 1, No. 2, Poplar Street, Hangzhou economic and Technological Development Zone, Hangzhou, Zhejiang Patentee before: HANGZHOU DIANZI University |
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Application publication date: 20170426 Assignee: ZHEJIANG QIPINTONG NETWORK TECHNOLOGY CO.,LTD. Assignor: Wuhu Digital Information Industrial Park Co.,Ltd. Contract record no.: X2021330000733 Denomination of invention: Research method of changing silicon substrate surface morphology and controlling molding technology based on laser Granted publication date: 20180420 License type: Common License Record date: 20211109 |
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