CN106575549A - Self-bonding insulated wire and wire for coil - Google Patents

Self-bonding insulated wire and wire for coil Download PDF

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Publication number
CN106575549A
CN106575549A CN201580036005.2A CN201580036005A CN106575549A CN 106575549 A CN106575549 A CN 106575549A CN 201580036005 A CN201580036005 A CN 201580036005A CN 106575549 A CN106575549 A CN 106575549A
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CN
China
Prior art keywords
self
layer
adhesive layer
thermal adhesive
insulated wire
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Granted
Application number
CN201580036005.2A
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Chinese (zh)
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CN106575549B (en
Inventor
斋藤秀明
前田修平
菅原润
吉田健吾
田村康
山内雅晃
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Sumitomo Electric Industries Ltd
Sumitomo Electric Wintec Inc
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Sumitomo Electric Industries Ltd
Sumitomo Electric Wintec Inc
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Priority claimed from JP2014158213A external-priority patent/JP6059690B2/en
Priority claimed from JP2014208142A external-priority patent/JP6059701B2/en
Application filed by Sumitomo Electric Industries Ltd, Sumitomo Electric Wintec Inc filed Critical Sumitomo Electric Industries Ltd
Priority to CN201910416927.6A priority Critical patent/CN110164605A/en
Publication of CN106575549A publication Critical patent/CN106575549A/en
Application granted granted Critical
Publication of CN106575549B publication Critical patent/CN106575549B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/02—Disposition of insulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00—Coils
    • H01F5/06—Insulation of windings

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Insulation, Fastening Of Motor, Generator Windings (AREA)
  • Insulated Conductors (AREA)

Abstract

The present invention addresses the problem of providing a self-bonding insulated wire that makes it easy to fasten wires together and that is unlikely to generate dust. A self-bonding insulated wire according to one embodiment of the present invention is provided with a linear metal conductor, an insulating layer that is layered on the outer circumferential side of the metal conductor, an expansion layer that is layered on the outer circumferential side of the insulating layer and that expands as a result of being heated, and a thermal bonding layer that is layered on the outer circumferential side of the expansion layer. The expansion layer may comprise: a matrix having a synthetic resin as a main component; and thermally expandable microcapsules or a chemical foaming agent that are dispersed in the matrix. The average thickness expansion rate of the expansion layer after heating is preferably 1.1 to 5 times. The porosity of the expansion layer after heating is preferably 10 to 80%. The average thickness of the thermal bonding layer is preferably 5 to 200 [mu]m.

Description

Self-bonding insulated wire and coil electric wire
Technical field
The present invention relates to self-bonding insulated wire and coil electric wire.
Background technology
When by using insulated electric conductor so as to manufacture (such as) motor coil, it is common practice to by wire intertwist On core body, then with the gap and the gap between core body and electric wire between varnish impregnation electric wire winding, to make electric wire winding Fix and electric wire is fixed on core body.However, the thorough impregnation due to being difficult to ensure that varnish, therefore still may have part electricity Line is fixed insufficient.Additionally, the step of varnish impregnation causes operation increases, consequently, it is possible to improving the price of coil.
In order to solve the production technology of this problem and simplified motor, use self adhesion exhausted in some cases Edge electric wire, it has the periphery for being arranged at conductor and the thermal adhesive layer for being capable of autoadhesion.When being insulated using this self adhesion When the winding density of electric wire and electric wire is relatively low, the bonding between bonding and electric wire and core body between electric wire winding may become not Fully.If increasing the thickness of thermal adhesive layer improving cohesive, then winding line density reduce and coil volume efficiency May reduce.In addition, the thickness increase of electric wire overlay film reduces may operability when electric wire to be inserted motor.
In this case, it has been proposed that such technology, foaming agent is added in thermal adhesive layer, is twined in electric wire by it Thermal adhesive layer is set to foam so as to improve the cohesive between electric wire winding (referring to Japanese Unexamined Patent Application Publication No.4- after 87214)。
Reference listing
Patent documentation
Patent documentation 1：Japanese Unexamined Patent Application Publication No.4-87214
The content of the invention
Technical problem
According to disclosed self-bonding insulated wire in the above documents, because the caused expansion of thermal adhesive layer foaming can To increase the contact pressure between thermal adhesive layer adjacent part；But, the foaming agent being contained in thermal adhesive layer makes thermal adhesive layer phase Contact area between adjacent part is reduced, thus possibly cannot fully improve cohesive.In addition, according to disclosing in the above documents Self-bonding insulated wire, foaming agent may depart from from thermal adhesive layer, or because foaming may make thermal adhesive layer Part becomes fragile.
In the above documents the thermal adhesive layer of disclosed self-bonding insulated wire has too high mobility, thus melts It is uneven that the distribution of resin becomes local.As a result, the distance between electric wire circle (turns) changes, it may not be possible to fill Ground is divided to obtain insulation voltage (that is, the partial discharge inception voltage) improvement initially expected for auto-adhesive layer.
The present invention being completed in view of the foregoing, its object is to provide a kind of self-bonding insulated wire, utilizing should be certainly Cohesive insulated electric conductor, electric wire winding can be easy to interfix and adhesive layer has enough intensity, present invention also offers Coil electric wire, by using the coil electric wire, can make electric wire winding height reliably interfix and suppress dust Generation.
The solution of problem
In order to solve the above problems, the self-bonding insulated wire of embodiment of the invention is led including metallic threadlike Body, be stacked on the metallic conductor outer circumferential side insulating barrier, be stacked on the outer circumferential side of the insulating barrier and the expansion of heat-swellable Layer and be stacked on the expanding layer outer circumferential side thermal adhesive layer.
Beneficial effects of the present invention
Self-bonding insulated wire according to embodiments of the present invention and coil electric wire, electric wire winding can be easy to mutually solid Determine and adhesive layer has sufficiently high intensity.
Description of the drawings
[Fig. 1] Fig. 1 is the schematic cross sectional views of the self-bonding insulated wire according to embodiment of the present invention.
[Fig. 2] Fig. 2 be according to embodiment of the present invention and the self-bonding insulated wire different from shown in Fig. 1 it is schematic Sectional view.
Specific embodiment
[explanation of embodiment of the present invention]
The self-bonding insulated wire of an embodiment of the invention includes metallic threadlike conductor, is stacked on the gold The insulating barrier of the outer circumferential side of category conductor, it is stacked on the outer circumferential side of the insulating barrier and the expanding layer of heat-swellable and is stacked on The thermal adhesive layer of the outer circumferential side of the expanding layer.
In the self-bonding insulated wire, thermal adhesive layer is stacked on the outer circumferential side of expanding layer.Therefore, by heat bonding So as to obtain high adherence, the thermal adhesive layer contributes to expanding but hindering bonding the autoadhesion of layer without foaming agent etc. Composition.This is conducive to the fixation between electric wire winding, and because thermal adhesive layer encapsulates expanding layer so as to inhibit the generation of dust.
Expanding layer preferably has the chemical blowing containing synthetic resin as the matrix of main component and dispersion in the base Agent or thermal expansivity microcapsule.It is swollen when expanding layer is that the layer of CBA or thermal expansivity microcapsule is dispersed with this matrix Swollen rate can be increased.As a result, thermal adhesive layer more firmly can be crimped mutually, and between electric wire winding and electric wire and core Fixation between body can become relatively reliable.
Average thickness expansion rate after expanding layer heating is preferably less than more than 1.1 5.When the expansion rate of expanding layer is in this model When enclosing interior, the neighbouring part of thermal adhesive layer can be crimped more reliably so as to realize bonding, and can suppress the fracture of thermal adhesive layer.
Porosity after the heating of expanding layer is preferably less than more than 10% 80%.The porosity after heating of expanding layer When within the range, while certain expansion rate is realized, it can be ensured that the seriality of the matrix of expanding layer, and expanding layer Can more uniformly expand；Therefore, thermal adhesive layer more reliably can be bonded mutually.
The average thickness of thermal adhesive layer is preferably less than more than 5 μm 200 μm.When the average thickness of thermal adhesive layer is in this scope When interior, it can be ensured that cohesive, and can prevent unnecessary thickness from increasing (diameter increase).
The coil of an embodiment of the invention is wired through following methods and is formed：By self adhesion insulated electro Line is wound up as coil, then makes intumescent layers.
Make because the coil is wired through following methods, will wire intertwist then make intumescent layers for coil, So that the thermal adhesive layer of self-bonding insulated wire is mutually bonded, therefore, between electric wire winding and between electric wire and core body Fixed reliability is high.
The self-bonding insulated wire of another embodiment of the invention includes metallic threadlike conductor, is stacked on this The thermal adhesive layer of the insulating barrier of the outer circumferential side of metallic conductor, the outer circumferential side for being stacked on the insulating barrier and heat-swellable, wherein should Thermal adhesive layer is with containing synthetic resin is as the matrix of main component and disperses CBA in the base or thermal expansion Property microcapsule, and heat after the thermal adhesive layer average thickness expansion rate be less than more than 1.1 5.
According to the self-bonding insulated wire, thermal adhesive layer is by the way that CBA or thermal expansivity microcapsule to be dispersed in and contain Synthetic resin in the matrix of main component used as forming, and the average thickness expansion rate after heating is less than more than 1.1 5； Thus, particularly when coil is formed, while the autoadhesion reliability of thermal adhesive layer is guaranteed, it is possible to increase exhausted after bonding Edge.
Under the foaming started temperature of CBA or thermal expansivity microcapsule, the elastic modelling quantity of the matrix of thermal adhesive layer is excellent Elect more than 1kPa as.When thermal adhesive layer matrix elastic modelling quantity within this range when, the substantially equal of thermal adhesive layer can be promoted Even expansion and the reliable autoadhesion of thermal adhesive layer.
The containing ratio of CBA or thermal expansivity microcapsule in thermal adhesive layer is preferably more than 1 mass % 15 mass % Below.When CBA or thermal expansivity microcapsule containing ratio within this range when, thermal adhesive layer can more uniformly expand.
The average pore size of the emptying aperture formed in thermal adhesive layer by the foaming of CBA or thermal expansivity microcapsule Preferably less than 300 μm.Formed in thermal adhesive layer by the foaming of CBA or thermal expansivity microcapsule upon inflation Emptying aperture, when the average pore size of the emptying aperture is less than above-mentioned higher limit, thermal expansivity microcapsule will not hinder the bonding of thermal adhesive layer And thermal adhesive layer can more uniformly expand.
The porosity of the thermal adhesive layer after heating is preferably less than more than 10% 80%.The hole of thermal adhesive layer after heating Gap rate within this range when, while thermal adhesive layer reaches above-mentioned expansion rate, heat bonding can be reliably obtained during expansion The seriality of the matrix of layer, and the autoadhesion reliability of thermal adhesive layer can be further improved.
The coil of another embodiment of the invention is wired through following methods and is formed：Self adhesion is insulated Wire intertwist, and expand thermal adhesive layer.
According to the coil electric wire, due to the expansion of the thermal adhesive layer after the winding of self-bonding insulated wire so that from There is autoadhesion in the thermal adhesive layer of cohesive insulated electric conductor, this can be conducive to the fixation between electric wire winding, and the fixation can It is high by property.
The electromagnetism wire harness (magnet wire bundle) of an embodiment of the invention be by by many from Cohesive insulated electric conductor is wound up as wire harness so as to the electromagnetism wire harness for being formed.
Due to the reliability of the heat bonding of self-bonding insulated wire is high and heat bonding after insulating properties it is high, therefore the electricity Magnet-wire beam can form motor of high reliability etc..
" average thickness expansion rate " refers to add the average thickness of expanding layer after thermal expansion average with the front expanding layer of heating The ratio of thickness." porosity " of expanding layer refers to the apparent body of the volume relative to expanding layer in the hole (gas) in expanding layer Long-pending percentage ratio.It is assumed that being calculated by the quality and density of the shell of the matrix and thermal expansivity microcapsule that are contained in expanding layer The actual volume for arriving is V0, and the volume of the expanding layer containing space is V1, then porosity serve as reasons (V1-V0)/V1 × 100 calculate and The amount for obtaining." average pore size " is by using pore-size distribution analyser (for example, " porous of Porous Materials Inc. The automatic aperture profiling systems of material ") determine section and the numerical value that obtains." elastic modelling quantity of matrix " is referred to according to JIS- The coefficient of rigidity that K-6868-2 (1999) is determined." foaming started temperature " refers to confirm that oily CBA produces gas When temperature or when being that the volume of thermal expansivity microcapsule increases to 1.05 times of (room temperature, specially 25 DEG C) volume before expansion Temperature.
[detailed description of embodiment of the present invention]
An embodiment of self-bonding insulated wire of the invention is described in detail referring to the drawings.
[the first embodiment]
Self-bonding insulated wire shown in Fig. 1 includes metallic threadlike conductor 1, is stacked on the periphery of the metallic conductor 1 The insulating barrier 2 of side, the expanding layer 3 of the outer circumferential side for being stacked on the insulating barrier 2 and heat-swellable and it is stacked on the expanding layer 3 Outer circumferential side thermal adhesive layer 4.
<Metallic conductor>
Metallic conductor 1 is (for example) the solid heart yearn with circular cross section.Or, it can have square or square The rectangular lines of shape cross section or the twisted wire by strands together.
Material for metallic conductor 1 preferably has the metal of high conductivity and high mechanical properties.The example of this metal Attached bag includes copper, copper alloy, aluminum, nickel, silver, ferrum, steel and rustless steel.By any one wire rod for being formed in these metals or pass through Multilayer material (such as nickel copper-clad line, silver-colored copper-clad line, copper-clad aluminum conductor or the copper-clad prepared with another kind of metallic cover wire rod Steel wire) can be used as (such as) metallic conductor 1.
The lower limit of the average traversal area of metallic conductor 1 is preferably 0.01mm2, and more preferably 0.1mm2.Metallic conductor The upper limit of 1 average traversal area is preferably 100mm2, and more preferably 50mm2.When the average traversal area of metallic conductor 1 During less than the lower limit, expanding layer 3 increases relative to the volume of metallic conductor 1, and by using self-bonding insulated wire Made by the volume efficiency of coil etc. may decline.On the contrary, when the average traversal area of metallic conductor 1 exceedes the upper limit When, relatively easily and with lower cost coil can be obtained by adopting the conventional method of varnish impregnation insulated electric conductor；Cause This, may be relative to the advantageous effects of Conventional insulation electric wire.
<Insulating barrier>
Insulating barrier 2 is formed by the resin combination with insulating properties.For the no spy of the resin combination for constituting insulating barrier 2 Other restriction.Its example includes the resin combination containing following material as main component：Thermosetting resin, such as polyvinyl alcohol Formal, heat-curable urethane, thermoset acrylics, epoxy resin, thermosetting polyester, thermosetting polyester acid imide, thermosetting Imide, aromatic polyamide, thermosetting polyamide acid imide and Thermocurable polyimide；And thermoplastic resin Fat, such as TPI, Polyphenylene Sulfone, polyphenylene sulfide, Polyetherimide, polyether-ether-ketone and polyether sulfone.Insulating resin layer can Be two or more resins complex or polylayer forest or be thermosetting resin and thermoplastic resin complex or multilamellar Body.
The glass transition temperature of resin combination of insulating barrier 2 is constituted (if using the thermoplasticity with melt temperature Resin, then be melt temperature) higher than the matrix 5 and the glass transition temperature of thermal adhesive layer 4 of following expanding layers 3.
The lower limit of the average thickness of insulating barrier 2 is preferably 5 μm, and more preferably 10 μm.The average thickness of insulating barrier 2 The upper limit is preferably 200 μm, and more preferably 150 μm.When the average thickness of insulating barrier 2 is less than the lower limit, insulating barrier 2 may Can rupture, and the insulating properties of metallic conductor 1 may become not enough.When the average thickness of insulating barrier 2 exceedes the upper limit, pass through May be reduced using the volume efficiency of coil obtained in self-bonding insulated wire etc..
<Expanding layer>
Expanding layer 3 is included containing synthetic resin as the matrix 5 of main component and the foaming agent 6 being dispersed in matrix 5.
When foaming agent 6 expands under heating, expanding layer 3 is overall to be expanded.
The lower limit of the average thickness of the expanding layer 3 before heating is preferably 10 μm, and more preferably 20 μm.It is swollen before heating The upper limit of the average thickness of swollen layer 3 is preferably 300 μm, and more preferably 200 μm.When the average thickness of the expanding layer 3 before heating When degree is less than the lower limit, the winding of self-bonding insulated wire fully may not be bonded mutually.On the contrary, when before heating When the average thickness of expanding layer 3 exceedes the upper limit, by using the volume efficiency of coil obtained in self-bonding insulated wire etc. May reduce.
The lower limit of the average thickness expansion rate after the heating of expanding layer 3 is 1.1, and preferably 2.After expanding layer 3 is heated The upper limit of average thickness expansion rate is 5, and preferably 4.Average thickness expansion rate after expanding layer 3 is heated is less than the lower limit When, the bonding between the adjacent part of the thermal adhesive layer 4 formed by winding self-bonding insulated wire may be insufficient.On the contrary Ground, when the average thickness expansion rate after the heating of expanding layer 3 exceedes the upper limit, the density of expanding layer 3 may be inadequate, and from The intensity of cohesive insulated electric conductor may be not enough.The expansion rate of expanding layer 3 can pass through adjust foaming agent 6 species and consumption, with And the glass transition temperature (Tg) of matrix 5 is selected controlling.
The lower limit of the porosity after the heating of expanding layer 3 is preferably 10%, and more preferably 50%.After expanding layer 3 is heated The upper limit of porosity be preferably 80%, and more preferably 70%.Porosity after expanding layer 3 is heated is less than the lower limit When, the contact pressure between the adjacent part of thermal adhesive layer 4 may be not enough, and bonding may be caused insufficient.After expanding layer 3 is heated Porosity when exceeding the upper limit, the intensity of the expanding layer 3 after expansion may become not enough.
(matrix)
The matrix 5 of expanding layer 3 is formed by the resin combination that mobility is shown under the decomposition temperature of foaming agent 6.Change Sentence talk about, constitute matrix 5 resin combination glass transition temperature close to foaming agent 6 decomposition temperature, the vitrification Transition temperature is (for example) less than more than 50 DEG C 250 DEG C.When the resin of composition matrix 5 is in the foaming temperature range of foaming agent 6 When showing mobility, then expanding layer 3 can be made to expand uniformly, and can be easy to for expansion rate to be controlled to required value." expansion The expansion starting temperature of layer " refers to the apparent volume of expanding layer and increases to (room temperature before expansion：25 DEG C) 1.05 times of volume when Temperature." decomposition temperature " of foaming agent 6 refers to confirm the body of temperature or foaming agent 6 when gas is produced by foaming agent 6 Product increases to (room temperature before expansion：25 DEG C) 1.05 times of volume when temperature.
Constituting the example of the main component of the resin combination of matrix 5 includes such as phenoxy resin, polyamide and contracting fourth The thermoplastic resins such as urea formaldehyde.Wherein, phenoxy resin is preferably used.These thermoplastic resins can be by adding asphalt mixtures modified by epoxy resin Fat, melmac, phenolic resin, isocyanates etc. are crosslinked, so that thermoplastic resin is changed into part thermosetting tree Fat.Thermosetting resin can become semi-cured state by adjusting condition of cure, so that it can serve as constituting matrix 5 Resin combination key component.Thermosetting resin can be used, as long as control solid state makes it in the foaming temperature of foaming agent 6 Mobility is shown in degree.The resin combination for constituting matrix 5 can also be comprising additives such as bonding improvers.
The example of phenoxy resin includes：Resin, Yi Jigai containing bisphenol-A, bisphenol S or Bisphenol F as key component The phenoxy resin of property.Because phenoxy resin can be solidified after melt binding process by adding firming agent, therefore i.e. Make when use can form the thermal expansivity microcapsule in relatively large hole, it is also possible to fully guarantee the intensity of expanding layer.
The example of polyamide includes various copolymer polyamide, 6- nylon, 6,6- nylon and 6,10- nylon.
The example of butyral resin is polyvinyl butyral resin.
Can be used as the example of other thermoplastic resins of the key component of the resin combination of composition matrix 5 includes copolymer Polyester, polybutylene terephthalate (PBT), polyethylene terephthalate, thermoplastic polyurethane, Merlon, polyphenylene oxide, Polyphenylene sulfide, polysulfones, Polyetherimide, polyether-ether-ketone, polyether-ketone, polyether sulfone, Polyphenylene Sulfone, semiaromatic polyamide composition, thermoplasticity Polyamidoimide and TPI.
(foaming agent)
Can use chemically or physically foaming agent as foaming agent 6.
<CBA>
CBA as foaming agent 6 heating when decompose, and produce (such as) nitrogen, carbon dioxide, one Carbon oxide gas or ammonia.Can be using organic foaming agent or inorganic foaming agent.
The example of organic foaming agent includes azo system foaming agent, such as azodicarbonamide (ADCA) and azodiisobutyronitrile (AIBN)；Nitrous base system foaming agent, such as dinitrosopentamethylene tetramine (DPT) and N, N'- dinitroso-N, N'- dimethyl Terephthalamide (DNDMTA)；Hydrazides system foaming agent, such as unifor (TSH), P, P- oxybis-benzenesulfonyl hydrazides (OBSH) With benzene sulfonyl hydrazide (BSH)；And other organic foaming agents, such as trihydrazinotriazine (THT) and acetone-P- sulfonyl hydrazones.These can To be used singly or in combination.
The example of inorganic foaming agent includes sodium bicarbonate, ammonium carbonate, ammonium hydrogen carbonate, sodium borohydride, sodium borohydride and hydrogen-oxygen SiClx.Generally, inorganic foaming agent has the gas production rate lower than organic foaming agent, and is difficult to control to gas generation. Therefore, CBA is preferably organic foaming agent.
Relative to the containing ratio of the matrix 5 in expanding layer 3, the lower limit of the containing ratio of CBA is preferably 0.1 matter Amount %, and more preferably 1 mass %.The upper limit of the containing ratio of CBA is preferably 35 mass %, and is more preferably 20 mass %.When the containing ratio of CBA is less than the lower limit, the expansion rate of expanding layer 3 may become not enough.On the contrary, When the containing ratio of CBA exceedes the upper limit, the mechanical strength of expanding layer 3 may be not enough.
The lower limit of the decomposition temperature of CBA is preferably 60 DEG C, and more preferably 70 DEG C.CBA point The upper limit of solution temperature is preferably 250 DEG C, and more preferably 200 DEG C.When the decomposition temperature of CBA is less than the lower limit, CBA may surprisingly foam in the preparation of self-bonding insulated wire, transport or during storing.When CBA When decomposition temperature exceedes the upper limit, excessive thermic load is applied with to the motor component beyond coil in expansion step.Make For as a result, undesirable effect may be produced, and may excessively increase the cost of energy needed for foaming agent foam.
Expanding layer 3 can also include blowing promotor in addition to CBA.Blowing promotor can accelerate chemical blowing The arbitrary substance of the thermal decomposition of agent, and its example includes vulcanization accelerator, filler, vulcanization aid, PVC stabilizer, antioxidation Agent, vulcanizing agent and carbamide compound.These blowing promotors accelerate the decomposition of CBA and reduce blowing temperature.
The example of vulcanization accelerator includes that guanidine system vulcanization accelerator, aldehyde-ammonia system vulcanization accelerator, the sulfuration of sulfenyl amine system promote Enter agent, thiuram system vulcanization, xanthate system vulcanization accelerator, aldehyde amine system vulcanization accelerator, thiazole system sulfuration promotion Agent, thiocarbamide system vulcanization accelerator and dithiocarbamate system vulcanization accelerator.The example of filler includes silicon dioxide, carbonic acid Magnesium, Calcium Carbonate, magnesium silicate, aluminium carbonate, Talcum, barium sulfate, aluminum sulfate and calcium sulfate.The example of vulcanization aid includes zinc white, work Property zinc white, zinc carbonate, magnesium oxide, lead monoxide, C.I. 77597, calcium hydroxide, stearic acid, Oleic acid, lauric acid, diethylene glycol, Di-n-butylamine, hexanamine, diethanolamine and organic amine.The example of PVC stabilizer includes tribasic lead sulfate, tin dilaurate two Fourth stannum, dibutyl dimaleate, zinc stearate, cadmium stearate, barium stearate and calcium stearate.The example of antioxidant includes Naphthylamines system antioxidant, hexichol amine system antioxidant, to phenylene system antioxidant, quinoline system antioxidant, single phenol system antioxygen Agent, many phenol antioxidants, thiobiss phenol antioxidant and phosphite ester system antioxidant.The example of vulcanizing agent includes TAIC and sulfosalicylic acid ammonium.The example of other chemicals includes phthalic anhydride, salicylic acid, benzoic acid, antimony trioxide, white Vaseline, titanium oxide, Aska-Rid., Borax, glycerol and dibutyl dimaleate.The preferred example of blowing promotor is oxidation Zinc, tribasic lead sulfate and various vulcanization accelerators.
Relative to the CBA of 100 mass parts, the lower limit of the content of blowing promotor is preferably 5 mass parts, and more Preferably 50 mass parts.The upper limit of the content of blowing promotor is preferably 200 mass parts, and more preferably 150 mass parts.When send out When the content of bubble auxiliary agent is less than the lower limit, the effect that CBA decomposes is caused to become not enough.On the contrary, when foaming is helped When the content of agent exceedes the upper limit, then during the preparation and storage of (such as) self-bonding insulated wire, expanding layer 3 may meaning Other places expansion.
<Physical blowing agent>
The example of the physical blowing agent as foaming agent 6 includes thermal expansivity microcapsule and microsphere.Thermal expansivity microcapsule is by core The shell of material (interior bag thing) and cladding core and constitute, wherein core is made up of internal foaming agent and shell is swollen by core It is swollen and expand.Microsphere includes being located at the compressed gas of inside the shell, and as shell thermal decomposition under heating is so as to discharging gas Body.
Especially, the physical blowing agent as foaming agent 6 is preferably due to forming closed pore so as to promote the phase of expanding layer 3 Thermal expansivity microcapsule to even inflation.
The inside foaming agent of thermal expansivity microcapsule can expand or produce any of gas in heating with any principle Material.The example of the inside foaming agent of thermal expansivity microcapsule include with lower boiling liquid, CBA and they Mixture.
Example with lower boiling liquid includes the alkane of butane, iso-butane, pentane, isopentane and neopentane etc. The freon of hydrocarbon and Arcton 11 etc..
CBA is preferably thermal decomposition material, and the azodiisobutyronitrile of nitrogen is produced when such as heating.
Decomposition temperature (that is, the boiling point of low-boiling point liquid or the CBA of the inside foaming agent of thermal expansivity microcapsule Heat decomposition temperature) be equal to or higher than following thermal expansivity microcapsules shell softening temperature.
Specifically, the lower limit of the decomposition temperature of the inside foaming agent of thermal expansivity microcapsule is preferably 60 DEG C, and more excellent Elect 70 DEG C as.The upper limit of the decomposition temperature of the inside foaming agent of thermal expansivity microcapsule is preferably 250 DEG C, and more preferably 200 ℃.When the decomposition temperature of the inside foaming agent of thermal expansivity microcapsule is less than the lower limit, preparation in self-bonding insulated wire, During transport or storage, thermal expansivity microcapsule may unexpectedly expand.On the contrary, when the inside foaming agent of thermal expansivity microcapsule When decomposition temperature exceedes the upper limit, excessive thermic load is applied with to the motor component beyond coil in expansion step.Make For as a result, undesirable effect may be produced, and the cost of energy needed for expanding thermal expansivity microcapsule excessively increases Plus.
The shell of thermal expansivity microcapsule is formed by Stretch material, this Stretch material internally foaming agent it is expanded In journey expand and do not rupture and can be formed encapsulating produced by gas microsphere.The sheathing material of thermal expansivity microcapsule is usual It is resin combination of the polymer containing thermoplastic resin etc. as main component.
The preferred example of the thermoplastic resin of the main component of the shell as thermal expansivity microcapsule includes：By using all Such as vinyl chloride, vinylidene chloride, acrylonitrile, acrylic acid, methacrylic acid, acrylate, methacrylate and styrene Polymer or the copolymer by using two or more monomer formation that monomer is formed.The one of preferred thermoplastic resin Individual example is acrylonitrile copolymer, and in this case, the decomposition temperature of internal foaming agent be more than 70 DEG C 250 DEG C with Under.
The lower limit of the average diameter of the thermal expansivity microcapsule before heating is preferably 1 μm, and more preferably 5 μm.Before heating The upper limit of average diameter of thermal expansivity microcapsule be preferably 50 μm, and more preferably 40 μm.When the thermal expansivity before heating When the average diameter of microcapsule is less than the lower limit, enough expansion rates may be cannot get.On the contrary, when the thermal expansivity before heating is micro- When the average diameter of capsule exceedes the upper limit, then expanding layer 3 is unnecessarily thickening, and the expansion of expanding layer 3 becomes uneven.Heat " average diameter " of dilatancy microcapsule determine by the following method, i.e.,：In the thermal expansivity using micro- sem observation more than 10 In the plan view of microencapsulated sample, the average of maximum gauge in the plan view and the diameter orthogonal with the maximum gauge is taken Value.
Relative to the resinous principle of the matrix 5 of expanding layer, the lower limit of the containing ratio of the thermal expansivity microcapsule of expanding layer 3 is preferred For 0.5 mass %, and more preferably 1 mass %.The upper limit of the containing ratio of the thermal expansivity microcapsule of expanding layer 3 is preferably 10 matter Amount %, and more preferably 6 mass %.When the containing ratio of the thermal expansivity microcapsule in expanding layer 3 is less than the lower limit, expanding layer 3 expansion rate is little, and the fixation between the winding of self-bonding insulated wire may become insufficient.On the contrary, working as expanding layer 3 Thermal expansivity microcapsule containing ratio exceed the upper limit when, matrix 5 is relatively small, thus the intensity and cohesive of expanding layer 3 can Can become not enough.
The lower limit of the ratio of the average diameter of thermal expansivity microcapsule and the average thickness of expanding layer 3 is preferably 1/16, and More preferably 1/8.The average diameter of thermal expansivity microcapsule is preferably 9/10 with the upper limit of the ratio of the average thickness of expanding layer 3, And more preferably 8/10.When the average diameter of thermal expansivity microcapsule is less than the lower limit, because thickness deficiency may be caused outward Shell ruptures during expanding, or because internal volume is little and foaming agent is not enough causes that sufficiently expansion can not be obtained.On the contrary, When the average diameter of thermal expansivity microcapsule exceedes the upper limit, thermal expansivity microcapsule may be projected from substrate 5, and expanding layer 3 may not fully expand.Additionally, expanding layer 3 may partly expand, consequently, it is possible to even inflation cannot be realized.
The lower limit of the expansion rate of thermal expansivity microcapsule is preferably 3, and more preferably 5.The expansion rate of thermal expansivity microcapsule The upper limit be preferably 20, and more preferably 10.When thermal expansivity microcapsule expansion rate be less than the lower limit when, expanding layer 3 it is swollen Swollen rate may become not enough.On the contrary, when the expansion rate of thermal expansivity microcapsule exceedes the upper limit, then the matrix 5 of expanding layer 3 is not Laminating (follow) thermal expansivity microcapsule, expanding layer 3 may not bulk expansion." expansion rate " of thermal expansivity microcapsule is referred to The ratio of the average diameter of the maximum of the average diameter of thermal expansivity microcapsule and heating front thermal expansivity microcapsule during heating.
<Thermal adhesive layer>
Thermal adhesive layer 4 is by the resin combination that mobility and cohesive are shown at a temperature of can expanding in expanding layer 3 Constitute.The main component for constituting the resin combination of thermal adhesive layer 4 can be the identical resin of matrix 5 with expanding layer 3.
The lower limit of the average thickness of thermal adhesive layer 4 is preferably 5 μm, and more preferably 10 μm.The average thickness of thermal adhesive layer 4 The upper limit of degree is preferably 200 μm, and more preferably 150 μm.When the average thickness of thermal adhesive layer 4 is less than the lower limit, self-adhesion Fixation between the circle of conjunction property insulated electric conductor may become insufficient.On the contrary, when the average thickness of thermal adhesive layer 4 exceedes on this In limited time, the diameter of self-bonding insulated wire unnecessarily becomes big, and by using the line obtained in autoadhesion insulated electric conductor The volume efficiency of circle etc. may be reduced.
[manufacture method of self-bonding insulated wire]
When self-bonding insulated wire include containing thermosetting resin as main component insulating barrier 2 when, can by with Lower section legal system makes self-bonding insulated wire, and the method is comprised the following steps：By insulating barrier formation compositions of thermosetting resin The step of being applied to the outer circumferential side of metallic conductor 1；Be coated with insulating barrier formation compositions of thermosetting resin is made by heating The step of solidification；Expanding layer formation compositionss are applied to the step of the outer circumferential side of insulating barrier formation compositions of thermosetting resin Suddenly, the expanding layer formation compositionss include the matrix 5 diluted using solvent and the foaming agent 6 being dispersed therein；By making The step of solvent volatilizees so as to dry expansion layer formation compositions；By the thermal adhesive layer formation compositionss diluted using solvent The step of being applied to the outer circumferential side of dry expanding layer formation compositionss；And by making solvent volatilization so as to drying is hot sticky The step of closing layer formation compositions.
<The application step of insulating barrier formation compositions of thermosetting resin>
In the application step of insulating barrier formation compositions of thermosetting resin, by insulating barrier formation thermosetting resin group Compound is applied to the outer circumferential side of metallic conductor 1.Insulating barrier formation compositions of thermosetting resin is applied to into the outer of metallic conductor 1 One example of the method for the week side of boss is such method, and the method is using being furnished with storing liquid insulating barrier formation thermosetting resin The fluid composition container and the apparatus for coating of coating die of compositionss.According to the apparatus for coating, when conductor passes through liquid compositions During thing container, fluid composition is attached to the outer circumferential side of conductor, subsequently while conductor passes through coating die, makes what is be coated with Fluid composition has substantially uniform thickness.Before layer of cloth formation compositions of thermosetting resin is applied, can pass through Known method forms prime treatment layer on the periphery of metallic conductor 1.
<Insulating barrier is formed and uses compositions of thermosetting resin curing schedule>
In insulating barrier formation with compositions of thermosetting resin curing schedule, by heating with by insulating barrier formation thermosetting Property resin composition, so as to form insulating barrier 2.For the device for heating, there is no particular limitation, for example, can use In the upwardly extending cylindrical shape oven in side that conductor is advanced.For heating means have no particular limits, and can appoint What known method, such as hot air, Infrared Heating or high-frequency heating.Heating-up temperature is (for example) more than 300 DEG C 600 DEG C Below.
Insulating barrier is formed with compositions of thermosetting resin application step and insulating barrier formation compositions of thermosetting resin Curing schedule can be repeated twice or more times.When these steps are repeated, can gradually increase the thickness of insulating barrier.According to conductor Diameter and desired insulating barrier coating thickness adjust coating die aperture and these steps number of repetition.
<The application step of expanding layer formation compositionss>
In the application step of expanding layer formation compositionss, the resin combination for constituting matrix 5 is diluted using solvent, and Wherein dispersing blowing agent 6, so as to prepare expanding layer formation compositionss, and are applied to the periphery of insulating barrier 2 by said composition Side.Coating process can be identical with the method used in the application step of insulating barrier formation compositions of thermosetting resin.
<The drying steps of expanding layer formation compositionss>
In the drying steps of expanding layer formation compositionss, make at a temperature of the decomposition temperature less than foaming agent 6 molten Agent is volatilized, and so as to dry expansion layer formation compositionss and forms expanding layer 3.Drying meanss can be such as hot air, Method known to Infrared Heating or high-frequency heating etc..
<The application step of thermal adhesive layer formation compositionss>
In the application step of thermal adhesive layer formation compositionss, the tree for constituting thermal adhesive layer 4 is diluted by using solvent Oil/fat composition, so as to prepare thermal adhesive layer formation compositionss, and is applied to the outer circumferential side of expanding layer 3 by said composition.Coating Method can be with the coating of the application step in insulating barrier formation compositions of thermosetting resin and expanding layer formation compositionss Method used in step is identical.
<The drying steps of thermal adhesive layer formation compositionss>
In the drying steps of thermal adhesive layer formation compositionss, make at a temperature of the decomposition temperature less than foaming agent 6 Solvent volatilizees, so as to being dried thermal adhesive layer formation compositionss and forming thermal adhesive layer 4.Drying meanss can be such as hot-air The known method such as heating, Infrared Heating or high-frequency heating.
[coil electric wire]
The coil of another embodiment of the invention is wired through winding above-mentioned self-bonding insulated wire And expanding layer 3 is expanded and is formed.
Heating means for expanding expanding layer 3 are (for example) such as hot air, Infrared Heating or high-frequency heating Deng known method, or it is using the hot method produced when powering to metallic conductor 1.
[advantage]
Because self-bonding insulated wire has the thermal adhesive layer 4 of the outer circumferential side for being stacked on expanding layer 3, therefore with expansion The expansion of layer 3, thermal adhesive layer 4 has reached mutual crimping and the crimping between thermal adhesive layer 4 and core body.Due to heat bonding Layer 4 do not contain foaming agent, therefore show abundance intensity, and can be reliably achieved between the winding of electric wire and electric wire and Fixation between core body.
In self-bonding insulated wire, due to thermal adhesive layer 4 cover expanding layer 3, therefore can prevent foaming agent etc. with it is swollen Swollen layer 3 departs from, and can suppress the generation of dust.
Therefore, according to by winding self-bonding insulated wire and making the coil electric wire that expanding layer 3 expands and formed, can Easily and reliably to realize the autoadhesion of thermal adhesive layer 4 and the bonding between thermal adhesive layer 4 and core body, and the winding of electric wire Between and fixation between electric wire and core body reliability it is high.
[the second embodiment]
Self-bonding insulated wire shown in Fig. 2 includes metallic threadlike conductor 1, is stacked on the periphery of the metallic conductor 1 The insulating barrier 2 of side, the outer circumferential side for being stacked on the insulating barrier 2 and thermal adhesive layer 4a that can be expanded by heating.
The metallic conductor 1 and insulating barrier 2 of the self-bonding insulated wire shown in Fig. 2 can be with the self-adhesion shown in Fig. 1 The metallic conductor 1 of conjunction property insulated electric conductor is identical with insulating barrier 2.
<Thermal adhesive layer>
Thermal adhesive layer 4a is included containing synthetic resin as the matrix 5a of main component and the foaming being dispersed in matrix 5a Agent 6.
When foaming agent 6 is by adding thermal expansion, thermal adhesive layer 4a foams and bulk expansion.
The foaming agent 6 of thermal adhesive layer 4a in self-bonding insulated wire shown in Fig. 2 can with shown in Fig. 1 from The foaming agent 6 of expanding layer 3 is identical in cohesive insulated electric conductor.
The lower limit of the average thickness of thermal adhesive layer 4a is preferably 10 μm, and more preferably 20 μm before heating.Heat before heating The upper limit of the average thickness of adhesive layer 4a is preferably 300 μm, and more preferably 200 μm.Thermal adhesive layer 4a is flat before heating When thickness is less than the lower limit, the winding of self-bonding insulated wire may not fully interfix.On the contrary, when heating When the average thickness of front thermal adhesive layer 4a exceedes the upper limit, by using the volume of coil obtained in self-bonding insulated wire etc. Efficiency may be reduced.
The lower limit of the average thickness expansion rate of thermal adhesive layer 4a is 1.1, and preferably 2 after heating.Heat bonding after heating The upper limit of the average thickness expansion rate of layer 4a is 5, and preferably 4.The average thickness expansion rate of thermal adhesive layer 4a after heating Less than the lower limit and when self-bonding insulated wire is wound, the bonding between the adjacent part of thermal adhesive layer 4a may become not Fully.On the contrary, when the average thickness expansion rate of thermal adhesive layer 4a after heating exceedes the upper limit, the density of thermal adhesive layer 4a May become not enough, and the intensity of self-bonding insulated wire may become not enough.The expansion rate of thermal adhesive layer 4a can pass through Adjust the species and consumption of foaming agent 6 and select elastic modelling quantity of the matrix 5a under the foaming started temperature of foaming agent to control System.
The lower limit of the average diameter of the emptying aperture for making foaming agent 6 foam by heating and being formed in thermal adhesive layer 4a is preferably 1 μm, and more preferably 5 μm.The upper limit of the average diameter of the emptying aperture formed in thermal adhesive layer 4a is preferably 300 μm, and More preferably 200 μm.When the average diameter of the emptying aperture formed in thermal adhesive layer 4a is less than the lower limit, it may not be possible to filled The expansion rate divided.On the contrary, when the average diameter of the emptying aperture formed in thermal adhesive layer 4a exceedes the upper limit, thermal adhesive layer 4a can Can be unnecessarily thickening, and the expansion of thermal adhesive layer 4a may become uneven.
The lower limit of the porosity of thermal adhesive layer 4a is preferably 10%, and more preferably 50% after heating.It is hot sticky after heating The upper limit for closing the porosity of layer 4a is preferably 80%, and more preferably 70%.The porosity of thermal adhesive layer 4a is low after heating When lower limit, the contact pressure between the adjacent part of thermal adhesive layer 4a becomes not enough, and this may cause insufficient bonding.On the contrary Ground, when the porosity of thermal adhesive layer 4a after heating exceedes the upper limit, the intensity of thermal adhesive layer 4a after expansion may become not Foot.
(matrix)
The lower limit of elastic modelling quantity of the matrix 5a under the foaming started temperature of foaming agent 6 is preferably 1kPa.When matrix 5a exists When elastic modelling quantity under the foaming started temperature of foaming agent 6 is less than the lower limit, thermal adhesive layer 4a excess flow during expanding, and And the formation of adhesive layer may become uneven.
Constituting the example of the main component of the resin combination of matrix 5a includes such as phenoxy resin, polyamide and contracting fourth The thermoplastic resins such as urea formaldehyde.Wherein, phenoxy resin is preferably used.These thermoplastic resins can be by adding asphalt mixtures modified by epoxy resin Fat, melmac, phenolic resin, isocyanates etc. are crosslinked, so that thermoplastic resin becomes part thermosetting tree Fat.When using thermosetting resin, it can be applied in combination with firming agent, so that thermosetting resin is in semi-solid preparation or solid Change state.Constituting the resin combination of matrix 5a can contain the additive of such as bonding improver etc.
When the combination using thermosetting resin and firming agent is used as the resin combination for constituting matrix 5a, due to hot sticky Heat produced in the forming process of layer 4a is closed, so that the matrix 5a of thermal adhesive layer 4a is in semi-cured state or solidification State.Resin is fully cured by the heating carried out during foaming is processed.If matrix is in its uncured state, matrix Elastic modelling quantity reduce with the rising of temperature, but if temperature is further raised and carries out curing reaction, then base The elastic modelling quantity of body will increase.Due to can easily control frothing percentage and foam diameter, therefore preferably in the springform of matrix Amount carries out foamable reaction when being increased to more than 1kPa.
The example of phenoxy resin is included containing bisphenol-A, bisphenol S or Bisphenol F as the resin of key component and modified Phenoxy resin.Because phenoxy resin can be solidified after adhesion process by adding firming agent, even if therefore ought make During with the thermal expansivity microcapsule for forming relatively large emptying aperture, it is also possible to substantially ensure that the intensity of expanding layer.
The example of polyamide includes the various copolymers such as polyamide, 6- nylon, 6,6- nylon and 6,10- nylon.
The example of butyral resin is polyvinyl butyral resin.
Can be used as the example of other thermoplastic resins of the key component of the resin combination of composition matrix 5a includes copolymerization Thing polyester, polybutylene terephthalate (PBT), polyethylene terephthalate, thermoplastic polyurethane, Merlon, polyphenyl Ether, polyphenylene sulfide, polysulfones, Polyetherimide, polyether-ether-ketone, polyether-ketone, polyether sulfone, Polyphenylene Sulfone, semiaromatic polyamide composition, thermoplastic Property polyamidoimide and TPI.
[manufacture method of self-bonding insulated wire]
When self-bonding insulated wire include containing thermosetting resin as main component insulating barrier 2 when, can by with Lower section legal system makes self-bonding insulated wire, and the method is comprised the following steps：By insulating barrier formation compositions of thermosetting resin The step of being applied to the outer circumferential side of metallic conductor 1；Be coated with insulating barrier formation compositions of thermosetting resin is made by heating The step of solidification；Thermal adhesive layer formation compositionss are applied to the outer circumferential side of insulating barrier formation compositions of thermosetting resin Step, the thermal adhesive layer formation compositionss include the matrix 5a diluted using solvent and the foaming agent 6 being dispersed therein；It is logical Cross the step of making solvent volatilization so as to be dried thermal adhesive layer formation compositionss.
<The application step of insulating barrier formation compositions of thermosetting resin>
In the application step of insulating barrier formation compositions of thermosetting resin, by insulating barrier formation thermosetting resin group Compound is applied to the outer circumferential side of metallic conductor 1.Insulating barrier formation compositions of thermosetting resin is applied to into the outer of metallic conductor 1 One example of the method for the week side of boss is such method, and the method is using being furnished with storing liquid insulating barrier formation thermosetting resin The fluid composition container and the apparatus for coating of coating die of compositionss.According to the apparatus for coating, when conductor passes through liquid compositions During thing container, fluid composition is attached to the outer circumferential side of metallic conductor, subsequently while metallic conductor passes through coating die, makes The fluid composition being coated with has substantially uniform thickness.Before layer of cloth formation compositions of thermosetting resin is applied, Prime treatment layer can be formed on the outer peripheral face of metallic conductor 1 by known method.
<Insulating barrier is formed and uses compositions of thermosetting resin curing schedule>
In insulating barrier formation with compositions of thermosetting resin curing schedule, insulating barrier formation thermosetting is made by heating Resin composition, so as to form insulating barrier 2.For the device for heating has no particular limits, for example, it is usable in The upwardly extending cylindrical shape oven in side that metallic conductor 1 is advanced.Heating means have no particular limits, and can be any Known method, such as hot air, Infrared Heating or high-frequency heating.Heating-up temperature be (for example) more than 300 DEG C 600 DEG C with Under.
The application step and insulating barrier formation compositions of thermosetting resin of insulating barrier formation compositions of thermosetting resin Curing schedule can be repeated twice or more times.When these steps are repeated, can gradually increase the thickness of insulating barrier.According to gold Belong to the diameter of conductor and the coating thickness of desired insulating barrier to adjust the aperture of coating die and the repetition time of these steps Number.
<The application step of thermal adhesive layer formation compositionss>
In the application step of thermal adhesive layer formation compositionss, the resin group for constituting matrix 5a is diluted by using solvent Compound, and wherein disperse foaming agent 6 so as to thermal adhesive layer formation compositionss are obtained, and said composition is applied to into insulation The outer circumferential side of layer 2.The coating process of thermal adhesive layer formation compositionss can be with insulating barrier formation compositions of thermosetting resin Application step used in method it is identical.
<The drying steps of thermal adhesive layer formation compositionss>
In the drying steps of thermal adhesive layer formation compositionss, in the temperature of the expansion starting temperature less than foaming agent 6 Under make solvent volatilize, so as to being dried thermal adhesive layer formation compositionss and forming thermal adhesive layer 4a.Drying meanss can be with (such as) It is method known to hot air, Infrared Heating or high-frequency heating etc..
[coil electric wire]
The coil electric wire of another embodiment of the invention is by winding above-mentioned self adhesion insulated electro Line and make thermal adhesive layer 4a expand and formed.
Heating means for expanding thermal adhesive layer 4a are that (for example) such as hot air, Infrared Heating or high frequency add Method known to heat etc., or be using the hot method produced when powering to metallic conductor 1.
[electromagnetism wire harness]
The electromagnetism wire harness of another embodiment of the invention is by the way that multiple self-bonding insulated wires are wound Bunchy and formed.
[advantage]
According to self-bonding insulated wire, due to by the way that foaming agent 6 is dispersed in containing synthetic resin as main component Be obtained thermal adhesive layer 4a in matrix 5a, thus due to the expansion of foaming agent 6 make it possible to achieve it is reliable and relatively uniform swollen It is swollen.
The average thickness expansion rate of thermal adhesive layer 4a of self-bonding insulated wire is less than more than 1.1 5.Therefore, especially When coil is formed, due to the autoadhesion of thermal adhesive layer 4a, the winding of self-bonding insulated wire can to easily and reliably that This bonding, the distance between the winding of the metallic conductor 1 during bonding will not reduce, and can be between the winding of metallic conductor 1 Form the emptying aperture of specified quantitative.
Therefore, for by winding self-bonding insulated wire and expanding thermal adhesive layer 4a so as to prepare for coil Electric wire, it provides the highly reliable autoadhesion of thermal adhesive layer 4a, and realizes between the winding of metallic conductor 1 high absolutely Edge.
According to the electromagnetism wire harness formed by the way that many self-bonding insulated wires are wound into bunchy, electromagnetism wire harness itself jail Admittedly it is bonded to each other, additionally, electromagnetism wire harness can securely be bonded with supporter (support) and its peripheral parts.Its result It is that self-bonding insulated wire is reliably bonded to each other, and can be with improve mechanical strength and electrical insulating property.
[other embodiments]
Embodiment disclosed herein is in all respects illustrative, and is not necessarily to be construed as restricted.This The scope of invention is not limited to the structure of the embodiment above, but is limited only by the claims that follow, and is intended to include right Claim and all modifications in the implication and scope of the equivalent of claims and change.
For example, in self-bonding insulated wire, can between metallic conductor and insulating barrier, insulating barrier and expanding layer it Between, arrange between insulating barrier and thermal adhesive layer or between expanding layer and thermal adhesive layer such as prime treatment layer etc other Layer.
(prime treatment layer)
Prime treatment layer is the layer arranged to improve the adaptation of interlayer, can by known to (such as) resin combination Formed.
When prime treatment layer is arranged in metallic conductor and insulation interlayer, the resin combination for constituting prime treatment layer is preferred Containing at least one resin in polyimides, polyamidoimide, polyesterimide, polyester and phenoxy resin.Structure Resin combination into prime treatment layer can contain the additive of bonding improver etc..When by metallic conductor and absolutely When forming prime treatment layer using this resin combination between edge layer, the adaptation of metallic conductor and insulation interlayer can be improved. As a result, flexibility, wearability, marresistance and resist processing of self-bonding insulated wire etc. can be effectively improved Performance.
In addition to above-mentioned resin, constituting the resin combination of prime treatment layer can also include other resins, such as ring Oxygen tree fat, phenoxy resin or melmac.
Commercially available fluid composition (insulating varnish) can be used as institute in the resin combination for constituting prime treatment layer The resin for containing.
The lower limit of the average thickness of prime treatment layer is preferably 1 μm, and more preferably 2 μm.Primary coat process layer it is average The upper limit of thickness is preferably 20 μm, and more preferably 10 μm.When the average thickness of prime treatment layer is less than the lower limit, may The sufficient adaptation to metallic conductor can not be obtained.On the contrary, when the average thickness of prime treatment layer exceedes the upper limit, from Cohesive insulated electric conductor may be unnecessarily thickening.
When in insulating barrier and expansion interlayer, bottom being formed between insulating barrier and thermal adhesive layer or between expanding layer and thermal adhesive layer During paint process layer, based on the resin combination that known technology selects to have high adhesion to other layers.In order to improve expanding layer and Adaptation between thermal adhesive layer, more preferably uses the main component identical resin in the matrix with expanding layer as thermal adhesive layer Main component, rather than formed prime treatment layer.
Method for manufacturing self-bonding insulated wire is not limited to said method.For example, when being made using thermoplastic resin For insulating barrier main component when, as the stacking method of expanding layer and thermal adhesive layer, can using use solvent letdown resin And the method for being dried resulting solution；Or using molten resin compositionss are coated with by using coating die and can pass through cold But the method for being solidified.The additive method that spraying etc. can be passed through stacks insulating barrier, expanding layer and thermal adhesive layer.
Self-bonding insulated wire cannot be only used for being formed coil, and can also be used to needing that many insulated electric conductors are parallel puts Other purposes put.
Embodiment
To be described the present invention by embodiment now.It should be appreciated that the description of embodiment is not to this The understanding of invention constitutes any restriction.
<Self-bonding insulated wire No.1 to 18>
It it is 12.5 μm by insulating barrier, the expanding layer that average thickness is 15 μm and average thickness that average thickness is 40 μm Thermal adhesive layer is sequentially stacked on the copper cash of a diameter of 1.0mm, so as to form self-bonding insulated wire No.1 to 18.By making It is coated with the resin combination constituted described in table 1 and 2 with coating die, and (baking is dried in furnace superintendent is for the horizontal chamber furnace (oven) of 3m It is roasting) resin combination that is coated with, so as to prepare insulating barrier, expanding layer and thermal adhesive layer respectively.By expanding layer and thermal adhesive layer Baking temperature be set as that the foaming agent in expanding layer can be maintained the temperature below decomposition temperature.
[table 1]
[table 2]
(insulating barrier formation resin combination)
Using one of Resin A 1 to A7 as insulating barrier formation resin.Resin A 1 is as main comprising polyesterimide The varnish (Dainichiseika Color＆Chemicals Mfg.Co., Ltd. systems) of composition.Resin A 2 is comprising polyamide acyl Varnish of the imines as main component.Resin A 3 is the varnish comprising polyimides as main component.Resin A 4 is comprising poly- Varnish of the ether ketone as main component.Resin A 5 is the varnish comprising polyphenylene sulfide as main component.Resin A 6 is with polyphenyl Sulfone is the varnish of main component.Resin A 7 is the varnish with Polyetherimide as main component.
(expanding layer formation resin combination)
By the mixing of the one kind in resin B 1 to B3, the one kind in foaming agent 1 to 7 and firming agent, the mixture is dissolved in By in the solvent " Hisolve DM " of TOHO Chemical Industry Co., Ltd.s so that solid content is 25 matter Amount %, and resulting solution is used as into expanding layer formation resin combination.Resin B 1 is by NIPPON STEEL＆SUMITOMO The phenoxy resin " YPS-007A30 " of METAL CORPORATION.Resin B 2 is by Denka Company Limited systems Butyral resin " Denka Butyral#3000 ".Resin B 3 is by the copolymer nylon of Daicel-Evonik Ltd. “DIAMIDE T-251”.Foaming agent B1 is by Eiwa Chemical Industry Co., the CBA of Ltd. " NEOCELLBORN N#1000M " (decomposition temperature：160℃).Foaming agent B2 be by Eiwa Chemical Industry Co., Ltd. CBA " VINYFOR the AC#3C-K2 " (decomposition temperature made：200℃).Foaming agent B3 is thermal expansivity microcapsule " Matsumoto Microsphere FN-100SD " (decomposition temperature：130 DEG C, Matsumoto Yushi-Seiyaku Co., Ltd. make).Foaming agent B4 is by Matsumoto Yushi-Seiyaku Co., the thermal expansivity microcapsule of Ltd. " Matsumoto Microsphere FN-180SD " (decomposition temperature：150℃).Foaming agent B5 is by Matsumoto Yushi- Thermal expansivity microcapsule " Matsumoto Microsphere the FN-260D " (decomposition temperature of Seiyaku Co., Ltd.：195 ℃).Foaming agent B6 is that, by Japan Fillite Co., the thermal expansivity microcapsule " Expancel 920DU40 " of Ltd. (decomposes Temperature：128℃).Foaming agent B7 is by SEKISUI CHEMICAL CO., the thermal expansivity microcapsule " ADVANCELL of LTD. EM501 " (decomposition temperatures：170℃).Firming agent is that Ltd.'s is more by Nippon Polyurethane Industry Co. Isocyanates " MILLIONATE MS-50 ".
(thermal adhesive layer formation resin combination)
Resin C and firming agent are mixed, and the mixture of gained is dissolved in by TOHO Chemical Industry In the solvent " Hisolve DM " of Co., Ltd. so that solid content is 25 mass %, and using resulting solution as heat Adhesive layer formation resin combination.Resin C is by the benzene of NIPPON STEEL＆SUMITOMO METAL CORPORATION Oxygen tree fat " YPS-007A30 ", firming agent is by many isocyanides of Nippon Polyurethane Industry Co., Ltd.s Acid esters " MILLIONATE MS-50 ".
<Evaluate>
For self-bonding insulated wire No.1 to 18 obtained above, carry out expanding the flexible and insulation of front expanding layer Property, the expansion rate of expanding layer and expansion after expanding layer fixing intensity evaluation.Evaluation result is shown in Tables 1 and 2.
(flexibility)
After by each self-bonding insulated wire pre-stretching 10%, self-bonding insulated wire is wrapped in a diameter of On the clavas of 3 times (diameter 3mm) of copper wire diameter, so as to prepare cored screw coil.Range estimation is confirmed in the overlay film of 30 circles Whether crackle (crackle that in thermal adhesive layer occur) there is.The sample for not finding cracks of cladding layer is evaluated as " A ", coating is found The sample of crackle is evaluated as " B ".
(insulating properties)
According to JIS-C 3003, the dielectric breakdown electricity of the electric wire by two panels method (two-piece method) manufacture is determined Pressure.The sample of 12cm length is reversed into stipulated number, and alternating voltage is applied to the line with the rate of pressure rise of 500V/ seconds.Measure is hit Voltage when wearing.The sample that dielectric breakdown voltage is equal to or higher than assigned voltage is assessed as into " A ", and dielectric breakdown voltage is low It is evaluated as " B " in the sample of assigned voltage.
(expansion rate)
Spiral winding is made according to identical method in soft evaluation.To the heat treatment spiral of 20 minutes at 180 DEG C Coil and do not carry out the spiral winding of heat treatment and cut, and cutting with observation by light microscope self-bonding insulated wire Face.In the thickness of multiple position measurement expanding layers, and determine its meansigma methods.Then expansion rate is calculated by following formula：
Expansion rate=(average thickness of expanding layer after heat treatment)/(not carrying out the average thickness of the expanding layer of heat treatment)
(fixing intensity)
Self-bonding insulated wire is wrapped on the stainless steel bar of a diameter of 6.4mm, to prepare cored screw coil.When When applying the compression stress of 400gf to cored screw coil in the axial direction, to cored screw under the decomposition temperature of foaming agent Coil carries out heat treatment 20 minutes.Then, three point bending test is carried out according to JIS-K 7171 (2008), to determine air core coil Bending stress.
Self-bonding insulated wire No.1 to 18 has sufficient insulating properties before intumescent layers, and in intumescent layers There is afterwards sufficient fixing intensity.Self-bonding insulated wire No.1 to 18 has good flexibility before intumescent layers.
<Self-bonding insulated wire No.19 to 26>
The insulating barrier that average thickness is 40 μm and the thermal adhesive layer that average thickness is 40 μm are sequentially stacked on a diameter of On the copper cash of 1.0mm, so as to form self-bonding insulated wire No.19 to 26.Have in table 1 by using coating die coating The resin combination of the composition, and in furnace superintendent is for the horizontal chamber furnace (oven) of 3m, furnace temperature be 200 DEG C and linear velocity be 4.8m/ minutes Under conditions of be dried (baking) resin combination for being coated with, so as to prepared insulating barrier and thermal adhesive layer respectively.
(insulating barrier formation resin combination)
As insulating barrier formation resin combination, using comprising polyesterimide as main component varnish, include Polyamidoimide as the varnish of main component, comprising polyimides as the varnish of main component or comprising polyether-ether-ketone As the varnish of main component.
(thermal adhesive layer formation compositionss)
Using multi-hydroxy polyether (phenoxy resin) that glass transition temperature is 130 DEG C (" YPS-007A30 ", by NIPPON STEEL＆SUMITOMO METAL CORPORATION systems), polyamidoimide, polyesterimide or the ammonia of resistance to hot polymerization Resin Composition of the ester as the matrix of thermal adhesive layer formation compositionss.Using phenolic resin varnish type epoxy resin (by NIPPON " YDCN-704 " of STEEL＆SUMITOMO METAL CORPORATION) or polyisocyanates (by Nippon " the MILLIONATE MS-50 " of Polyurethane Industry Co., Ltd.) as thermal adhesive layer formation compositionss Matrix firming agent.Using CBA (the Eiwa Chemical Industry that foaming started temperature is 190 DEG C Co., " the VINYFOR AC#3C-K2 " of Ltd.) or foaming started temperature be 180 DEG C of thermal expansivity microcapsule (by SEKISUI " EM501 " of CHEMICAL CO., LTD.) as the foaming agent of thermal adhesive layer formation compositionss.
(temperature dependencies of matrix elastic modulus)
For the matrix of self-bonding insulated wire No.19 to 26, prepare be dried in the case where there is no foaming agent and The matrix of solidification.The temperature when elastic modelling quantity is 1kPa is determined by gradually heating up.For self-bonding insulated wire The matrix of No.19 to 22, the temperature is 137 DEG C；For the matrix of self-bonding insulated wire No.23, the temperature is 116 DEG C； For the matrix of self-bonding insulated wire No.24, the temperature is 181 DEG C；For the base of self-bonding insulated wire No.25 Body, the temperature is 143 DEG C；And for the matrix of self-bonding insulated wire No.26, the temperature is 241 DEG C.By by UBM The viscoelasticity instrument of Kabushiki Kaisha " temperature when elastic modelling quantity is 1kPa " determining.
(evaluation of flexible and insulating properties)
For self-bonding insulated wire No.19 to 26, have studied by heating make the flexibility before thermal adhesive layer expansion and Insulating properties.Sample with good flexibility and insulating properties is evaluated as into " A ", by the sample with bad flexibility and insulating properties It is evaluated as " B ".When evaluating flexible, by enclosing winding wire winding 30 from winding after 20% percentage elongation, and confirmation is estimated Whether crackle or stripping there is.To be evaluated as well without crackle or the sample of stripping.According to JIS-C3003-5 (2011), lead to Cross and apply alternating voltage between two panels twisted wire, and high voltage is risen with the 500V/ seconds, determine voltage when there is dielectric breakdown, So as to evaluate insulating properties.The sample that dielectric breakdown voltage is equal to or higher than standard value is evaluated as well.As a result, such as table 1 Shown, all self-bonding insulated wire No.19 to 26 are respectively provided with good flexibility and good insulating properties.
(the average thickness expansion rate of thermal adhesive layer)
By heating self-bonding insulated wire No.19 to 26, so as to determine the thermal adhesive layer before and after thermal adhesive layer expands Average thickness, calculate average thickness expansion rate.Specifically, by the way that heating 2 is little at 180 DEG C in hot air circulation constant temperature oven When, the heat foamable layer expansion of every self-bonding insulated wire is made, then the line footpath before expansion and swollen is measured respectively with micrometer Line footpath after swollen, to determine the average ratio of thermal adhesive layer.As shown in table 1, the heat of self-bonding insulated wire No.19 to 25 Adhesive layer suitably expands, but self-bonding insulated wire No.26 does not then expand completely.This is possibly due to self adhesion insulation The temperature when elastic modelling quantity of the matrix of the thermal adhesive layer of electric wire No.26 increases to more than 1kPa starts higher than the expansion of foaming agent Temperature.
(mean porosities)
For the self-bonding insulated wire No.19 to 26 after heating, the average of the emptying aperture that formed in thermal adhesive layer is determined Diameter.By " the automatic aperture profiling systems of porous material " by Porous Materials Inc., heat bonding is measured The average diameter of the emptying aperture in the section of layer.As shown in table 1, in the thermal adhesive layer of self-bonding insulated wire No.19 to 25 The average diameter of the emptying aperture of formation is in the range of 100 μm to 130 μm.However, can not be swollen by heating for as mentioned above Swollen self-bonding insulated wire No.26, does not form emptying aperture, therefore can not measure the average diameter of emptying aperture.
(porosity)
For the self-bonding insulated wire No.19 to 26 after heating, based on the average thickness before and after the expansion observed, Determine the porosity of thermal adhesive layer.As shown in table 1, thermal adhesive layer after the expansion of self-bonding insulated wire No.19 to 25 Porosity is in the range of 65% to 76%.However, for the self adhesion insulation that can not be expanded by heating as mentioned above Electric wire No.26, due to not forming emptying aperture, therefore porosity is 0%.
(fixing intensity)
Each self-bonding insulated wire No.19 to 26 is wrapped on the stainless steel bar of a diameter of 6.4mm, is made hollow Spiral winding.When the compression stress of 400gf is applied to hollow spiral winding in the axial direction, under the decomposition temperature of foaming agent Heat treatment is carried out 20 minutes to cored screw coil.Then, three-point bending is carried out at 180 DEG C according to JIS-K 7171 (2008) Test, to determine the bending stress of air core coil.Using the result as the fixing intensity between the winding of self-bonding insulated wire Index.As shown in table 1, all self-bonding insulated wire No.19 to 26 are respectively provided with the fixing intensity of abundance.
[table 3]
Because the matrix resin of sample No.26 shows the elastic modelling quantity of more than 1kPa at a temperature of up to 241 DEG C, because This elastic modelling quantity of prediction at a temperature of close blowing temperature (180 DEG C) is less than 1kPa.Therefore, although there occurs foaming agent Decomposition reaction, but made due to the mobility of matrix resin bubble from resin surface escape, and can not in adhesive layer shape Into emptying aperture.
Industrial applicibility
Self-bonding insulated wire of the invention is suitable for forming coil, motor etc..
Reference numerals list
1 metallic conductor
2 insulating barriers
3 expanding layers
4,4a thermal adhesive layers
5,5a matrixes
6 foaming agent

Claims (6)

1. a kind of self-bonding insulated wire, it include metallic threadlike conductor, be stacked on the metallic conductor outer circumferential side it is exhausted Edge layer, the expanding layer of the outer circumferential side for being stacked on the insulating barrier and heat-swellable and it is stacked on the periphery of the expanding layer The thermal adhesive layer of side.
2. self-bonding insulated wire according to claim 1, wherein the expanding layer is included containing synthetic resin conduct The matrix of main component and the CBA being dispersed in the matrix or thermal expansivity microcapsule.
3. self-bonding insulated wire according to claim 1 and 2, wherein the average thickness of the expanding layer is swollen after heating Swollen rate is less than more than 1.1 5.
4. self-bonding insulated wire according to any one of claim 1 to 3, wherein after heating the expanding layer hole Gap rate is less than more than 10% 80%.
5. self-bonding insulated wire according to any one of claim 1 to 4, wherein the average thickness of the thermal adhesive layer Spend for less than more than 5 μm 200 μm.
6. a kind of coil electric wire, it passes through to wind self-bonding insulated wire according to any one of claim 1 to 5 And make the intumescent layers and manufacture.
CN201580036005.2A 2014-08-01 2015-07-28 Self-bonding insulated wire and coil electric wire Active CN106575549B (en)

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JP2014158213A JP6059690B2 (en) 2014-08-01 2014-08-01 Self-bonding insulated wire and coil wire
JP2014-208142 2014-10-09
JP2014208142A JP6059701B2 (en) 2014-10-09 2014-10-09 Self-bonding insulated wire, coil wire and winding bundle
PCT/JP2015/071397 WO2016017648A1 (en) 2014-08-01 2015-07-28 Self-bonding insulated wire and wire for coil

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JP2017157491A (en) * 2016-03-04 2017-09-07 日立金属株式会社 Insulation wire and manufacturing method therefor
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JP2023047361A (en) * 2021-09-27 2023-04-06 東特塗料株式会社 electric insulated wire

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5437289A (en) * 1977-08-29 1979-03-19 Nippon Telegr & Teleph Corp <Ntt> Manufacture of communication cable
CN87108306A (en) * 1986-12-11 1988-08-24 兰托公司 Cable and expandable tape for cables and application thereof
JPH04245110A (en) * 1991-01-30 1992-09-01 Sumitomo Electric Ind Ltd Self-fusible insulative electric wire and coil using the same
CN1244282A (en) * 1997-10-24 2000-02-09 古河电气工业株式会社 Multilayer insulated wire and transformers made thereby
JP2006031980A (en) * 2004-07-13 2006-02-02 Sumitomo Electric Wintec Inc Heat-resistant insulated wire and fusing method using it
CN201281970Y (en) * 2008-10-22 2009-07-29 上海川叶电子科技有限公司 Self viscous insulated winding line for high-frequency sphaerocollina coil
CN103650065A (en) * 2012-03-07 2014-03-19 古河电气工业株式会社 Insulated electric wire having bubble layer therein, electric device, and method for producing insulated electric wire having bubble layer therein
WO2014103665A1 (en) * 2012-12-28 2014-07-03 古河電気工業株式会社 Insulated wire, electrical device, and method for producing insulated wire

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5700004B2 (en) * 2012-09-04 2015-04-15 日立金属株式会社 Insulated wire and coil using the same

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5437289A (en) * 1977-08-29 1979-03-19 Nippon Telegr & Teleph Corp <Ntt> Manufacture of communication cable
CN87108306A (en) * 1986-12-11 1988-08-24 兰托公司 Cable and expandable tape for cables and application thereof
JPH04245110A (en) * 1991-01-30 1992-09-01 Sumitomo Electric Ind Ltd Self-fusible insulative electric wire and coil using the same
CN1244282A (en) * 1997-10-24 2000-02-09 古河电气工业株式会社 Multilayer insulated wire and transformers made thereby
JP2006031980A (en) * 2004-07-13 2006-02-02 Sumitomo Electric Wintec Inc Heat-resistant insulated wire and fusing method using it
CN201281970Y (en) * 2008-10-22 2009-07-29 上海川叶电子科技有限公司 Self viscous insulated winding line for high-frequency sphaerocollina coil
CN103650065A (en) * 2012-03-07 2014-03-19 古河电气工业株式会社 Insulated electric wire having bubble layer therein, electric device, and method for producing insulated electric wire having bubble layer therein
WO2014103665A1 (en) * 2012-12-28 2014-07-03 古河電気工業株式会社 Insulated wire, electrical device, and method for producing insulated wire

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