CN106572590A - Printed circuit board, manufacturing method thereof and electronic device - Google Patents
Printed circuit board, manufacturing method thereof and electronic device Download PDFInfo
- Publication number
- CN106572590A CN106572590A CN201610974338.6A CN201610974338A CN106572590A CN 106572590 A CN106572590 A CN 106572590A CN 201610974338 A CN201610974338 A CN 201610974338A CN 106572590 A CN106572590 A CN 106572590A
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- China
- Prior art keywords
- circuit board
- hole
- conducting terminal
- printed circuit
- pcb
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0257—Overvoltage protection
- H05K1/0259—Electrostatic discharge [ESD] protection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention discloses a printed circuit board, a manufacturing method thereof and an electronic device. The printed circuit board comprises a circuit board body, a circuit requiring electrostatic protection, and an electrostatic discharge circuit; a hole penetrating the circuit board body is formed in the circuit board body; a first conductive terminal and a second conductive terminal which are located at two ends of the hole respectively and are separated from each other by a certain distance, and an insulating filler are arranged in the hole; the first conductive terminal is connected with the circuit requiring electrostatic protection; the second conductive terminal is connected with the electrostatic discharge circuit; the first conductive terminal and the second conductive terminal are properly shaped so that a point discharge effect can be realized between the first conductive terminal and the second conductive terminal; and therefore, a three-dimensional point discharge structure can be formed on the printed circuit board, so that electrostatic protection for the printed circuit board can be realized. With the printed circuit board provided by the embodiments of the present invention adopted, processing costs, material costs and design costs can be reduced, and therefore, production costs can be greatly reduced, and an electrostatic protection effect can be improved.
Description
Technical field
The present invention relates to electronic technology field, especially relates to a kind of printed circuit and preparation method thereof and electronics sets
It is standby.
Background technology
With on printed circuit board (PCB) (Printed Circuit Board, PCB) in various electronic equipments components and parts it is integrated
Degree more and more higher, the electronic failure caused due to electrostatic leakage (Electro-Static discharge, ESD) is increasingly
It is many.Electrostatic leakage problem does not only result in electronic equipment misoperation or failure, when situation is serious, or even can puncture ic core
Piece and other precision electronic elements and cause equipment scrapping.It is therefore prevented that the electrostatic defending scheme of above-mentioned electrostatic leakage problem is then
Arise at the historic moment.
Existing electrostatic defending scheme mainly has following two：
Scheme one, electrostatic protection device in parallel is introduced on the circuit of IC chip (such as TVS pipe, pressure in interface signal
Quick resistance etc.).When there are moment high energy impact events on holding wire, the impedance of electrostatic protection device is reduced suddenly, while absorbing
Current energy on holding wire, by the voltage clamp at its two ends on a magnitude of voltage, to ensure IC chip not by quiet
The impact of surge.
Scheme two, build a kind of special electrostatic defending pad (isosceles triangle pad), profit on printed circuit board (PCB) top layer
The purpose of electrostatic defending is realized with the point discharge phenomenon of pad.
Wherein, scheme one is the method being most widely used in current hardware circuit, but it has following defect：
1st, need the extra entity components and parts that increase to carry out electrostatic defending, increased BOM (Bill of
Materials, BOM) cost, for the numerous multimedia of external interface and portable mobile termianl, electrostatic is prevented
The BOM costs increase of shield part will be very notable；
2nd, numerous electrostatic protection devices takes the valuable components' placement area of printed circuit board surface, especially increasingly
In compact handset printed circuit board layout, electrostatic protection device occupies substantial amounts of layout area, causes mobile phone printed circuit
Plate layout area is nervous, or even whole machine function is deleted to save layout area；
3rd, due to the requirement of the welding procedures such as surface mounting technology (Surface Mount Technology, SMT), electrostatic
Protective device needs to isolate a certain distance placement with the signal pad of the circuit (such as peripheral interface) for needing electrostatic defending, and this is just
External interface signals are caused not protected to this section of printed circuit board (PCB) cabling of electrostatic protection device, when other signal leads and this section
When cable run distance is nearer, electrostatic may be released in other signal leads, and other circuits are interfered and destroyed.
In scheme two, although pad does not increase BOM costs, but still need layout on the surface of printed circuit board (PCB), take
PCB top layers layout area, therefore equally exist defect 2 and 3 in scheme one.Additionally, also there is following defect in scheme two：
4th, the distance between discharge tip of two triangle protection pads, by printed circuit board (PCB) manufacturing processing technic
Minimum line is away from restriction, if that what is done is too near, may short circuit or printed circuit board (PCB) etching difficulty；
5th, because the circuit in printed circuit board (PCB) is generated using the etchant solution etch copper such as acid face, therefore, in printing
Acute angle tip is generated in circuit board line plane can be presented arc-shaped, cause point discharge effect undesirable.
Understand in sum, using existing electrostatic defending scheme, printed circuit board (PCB) production cost height, electrostatic can be caused to put
The problems such as electric effect on driving birds is not good.
The content of the invention
The main object of the present invention is a kind of printed circuit board (PCB) of offer and preparation method thereof and electronic equipment, it is intended to reduce print
The production cost of printed circuit board, improves the static discharge effect of printed circuit board (PCB).
To achieve these objectives, the present invention proposes a kind of printed circuit board (PCB), and the printed circuit board (PCB) includes circuit board body, needs
The circuit and static release circuit of electrostatic defending are wanted, have one in the circuit board body through the hole of the circuit board body,
Include being located at the hole two ends respectively in the hole and the first conducting terminal for keeping at a certain distance away and the second conducting terminal and
The insulation filler in the hole is filled, first conducting terminal needs the circuit of electrostatic defending to be connected with described, described second
Conducting terminal is connected with the static release circuit, and the shape of first conducting terminal and second conducting terminal can make
Obtain and formed between the two point discharge effect.
Alternatively, first conducting terminal and second conducting terminal are tapered, and the tip of the two is oppositely arranged.
Alternatively, described to need the circuit of electrostatic defending to include a signal pad, the signal pad layout is in the electricity
On the plate body of road, first conducting terminal is connected with the signal pad.
Alternatively, a part for the signal pad is covered in first electrical contact surfaces.
Alternatively, the static release circuit layout is in the circuit board body.
Alternatively, a part for the static release circuit is covered in second electrical contact surfaces.
Alternatively, the insulation filler is heat reactive resin.
Alternatively, first conducting terminal and second conducting terminal are made by process for filling hole.
Alternatively, the process for filling hole is to fill out process for copper in hole.
Alternatively, the hole is cylindrical hole.
The present invention proposes a kind of manufacture method of printed circuit board (PCB) simultaneously, the method comprising the steps of：
Processing one is through the hole of the circuit board in circuit board body；
Insulation filler is filled in the hole；
The first conducting terminal and for keeping at a certain distance away is respectively provided with the hole two ends for being filled with the insulation filler
The shape of two conducting terminals, first conducting terminal and second conducting terminal enables to form tip between the two puts
Electrical effect；
First conducting terminal is connected with the circuit for needing electrostatic defending, second conducting terminal is released with electrostatic
The connection of electric discharge road.
Alternatively, it is described to be respectively provided with first leading of keeping at a certain distance away at the hole two ends for being filled with the insulation filler
The step of electric terminal and the second conducting terminal, includes：
Two blind holes for keeping at a certain distance away are processed at the hole two ends for being filled with the insulation filler；
Conductive materials are inserted into two blind holes by process for filling hole, first conducting terminal and described the is formed
Two conducting terminals.
Alternatively, the insulation filler is heat reactive resin, described at the hole two ends for being filled with the insulation filler
The step of two blind holes for keeping at a certain distance away of processing, includes：
Two shaping columns for keeping at a certain distance away are filled at the hole two ends for being filled with the thermosetting resin, it is described to extrude
The thermosetting resin at hole two ends；
Thermosetting resin in the hole is heated, after the thermosetting resin in the hole solidifies, two is taken out
The shaping column, so as to leave two blind holes at the two ends in the hole for being filled with the thermosetting resin.
Alternatively, the process for filling hole is to fill out process for copper in hole.
Alternatively, described to need the circuit of electrostatic defending to include a signal pad, the signal pad layout is in the electricity
It is described to include the step of first conducting terminal is connected with the circuit for needing electrostatic defending on the plate body of road：By described
One conducting terminal is connected with the signal pad.
Alternatively, it is described to include the step of first conducting terminal is connected with the signal pad：
A part for the signal pad is covered in into first electrical contact surfaces.
Alternatively, the static release circuit layout is in the circuit board body.
Alternatively, it is described to include the step of second conducting terminal is connected with static release circuit：
A part for the static release circuit is covered in into second electrical contact surfaces.
The present invention also proposes a kind of electronic equipment, and the electronic equipment includes printed circuit board (PCB), the printed circuit board (PCB) bag
Include circuit board body, need the circuit and static release circuit of electrostatic defending, have one in the circuit board body through described
The hole of circuit board body, includes being located at the hole two ends respectively and the first conducting terminal for keeping at a certain distance away and the in the hole
Two conducting terminals and the insulation filler in the hole is filled, first conducting terminal and the circuit for needing electrostatic defending
Connection, second conducting terminal is connected with the static release circuit, first conducting terminal and second conducting end
The shape of son enables to form point discharge effect between the two.
A kind of printed circuit board (PCB) that the embodiment of the present invention is provided, by arranging a through hole in circuit board body, and
Filling insulation filler and two conducting terminals that can form point discharge effect are set at through hole two ends in through hole, two
Conducting terminal connects respectively the circuit and static release circuit for needing electrostatic defending, so as to define a kind of point discharge of solid
Structure, realizes the electrostatic defending to printed circuit board (PCB).Manufacture method and the printing of existing standard due to the printed circuit board (PCB)
Circuit board processing technology thereof flow process is mutually compatible, reduces processing cost；Due to hardware need not be increased so that electrostatic defending
Any BOM costs need not be increased, Material Cost is reduced；Due to two conducting terminals be arranged on printed circuit intralaminar part rather than
Surface, it is not necessary to take the layout area of printed circuit board surface, reduce design cost；Finally greatly reduce printed circuit board (PCB)
Production cost.Simultaneously as the point discharge structure is arranged on printed circuit intralaminar part, therefore its distance between two tips is not printed
In circuit board processing minimum line away from restriction, by make more sharp of two tips and can be more nearly, make discharge effect
More preferably, so as to improve electrostatic protection effect.
Directly being produced on it is possible to further the point discharge structure needs the circuit of electrostatic defending (such as peripheral interface device
Part) signal pad on, electrostatic leakage path is reduced to greatest extent, prevent electrostatic leakage to other signal lines, therefore
Improve electrostatic protection effect and reliability.
Description of the drawings
Fig. 1 is the structural representation (sectional view) of the printed circuit board (PCB) of first embodiment of the invention；
Fig. 2 is the flow chart of the manufacture method of the printed circuit board (PCB) of second embodiment of the invention；
Fig. 3 is the structural representation after processing hole in circuit board body in the embodiment of the present invention；
Fig. 4 is that the structural representation after filling insulation filler in the hole of circuit board body in the embodiment of the present invention (is cutd open
View)；
Fig. 5 is in the structural representation being filled with when shaping column is filled at the two ends in hole of insulation filler in the embodiment of the present invention
Figure (sectional view)；
Fig. 6 is to be filled with the structural representation after the two ends in the hole of insulation filler process blind hole in the embodiment of the present invention
Figure (sectional view)；
The flow chart of the manufacture method of the printed circuit board (PCB) of Fig. 7 third embodiment of the invention.
The realization of the object of the invention, functional characteristics and advantage will be described further referring to the drawings in conjunction with the embodiments.
Specific embodiment
It should be appreciated that specific embodiment described herein is not intended to limit the present invention only to explain the present invention.
Embodiments of the invention are described below in detail, the example of the embodiment is shown in the drawings, wherein from start to finish
Same or similar label represents same or similar element or the element with same or like function.Below with reference to attached
The embodiment of figure description is exemplary, is only used for explaining the present invention, and is not construed as limiting the claims.
Those skilled in the art of the present technique are appreciated that unless expressly stated, singulative " " used herein, "
It is individual ", " described " and " being somebody's turn to do " may also comprise plural form.It is to be further understood that arranging used in the description of the present invention
Diction " including " refers to there is the feature, integer, step, operation, element and/or component, but it is not excluded that existing or adding
One or more other features, integer, step, operation, element, component and/or their group.It should be understood that when we claim unit
Part is " connected " or during " coupled " to another element, and it can be directly connected or coupled to other elements, or can also exist
Intermediary element.Additionally, " connection " used herein or " coupling " can include wireless connection or wireless coupling.It is used herein to arrange
Diction "and/or" includes the one or more associated wholes or any cell of listing item and all combination.
Those skilled in the art of the present technique are appreciated that unless otherwise defined all terms used herein are (including technology art
Language and scientific terminology), with art of the present invention in those of ordinary skill general understanding identical meaning.Should also
It is understood by, those terms defined in such as general dictionary, it should be understood that with the context with prior art
The consistent meaning of meaning, and unless by specific definitions as here, will not otherwise use idealization or excessively formal implication
To explain.
Embodiment one
With reference to Fig. 1, the printed circuit board (PCB) of first embodiment of the invention is proposed, the printed circuit board (PCB) includes circuit board body
10th, the circuit (not shown) and static release circuit 40 of electrostatic defending are needed., wherein it is desired to the circuit of electrostatic defending can be outer
Interface device (such as button) or other components are enclosed, static release circuit 40 refers to the circuit that electrostatic can be imported the earth.
In the embodiment of the present invention, circuit board body 10 is made up of multiple structure sheafs, including top (top) layer 101, flame resistant material
(FR4) layer 102, copper sheet layer 103, bottom (bottom) layer 104 etc..
Have one in circuit board body 10 through the hole of circuit board body 10, the preferably cylindrical hole in the hole also may be used certainly
To be other shapes of hole, the present invention is without limitation.Include in hole respectively positioned at the He of the first conducting terminal 21 at hole two ends
Of second conducting end 22 and the insulation filler 23 in filling hole, wherein, the first conducting terminal 21 is located at circuit board body 10
Top layer 101, the second conducting terminal 22 is located at the bottom 104 of circuit board body 10.
Insulation filler 23 is preferably heat reactive resin, naturally it is also possible to be other insulation filler 23, and the present invention is right
This is not restricted.First conducting terminal 21 and the second conducting terminal 22 are preferably made by process for filling hole, the filling perforation work
Skill will fluid conductors material insert Kong Zhonghou cool and solidify molding technique.In the embodiment of the present invention, process for filling hole is preferably
Process for copper is filled out in hole, will liquid copper insert Kong Zhonghou cool and solidify molding technique.It is of course also possible to use other making
Technique makes the first conducting terminal 21 and the second conducting terminal 22, the invention is not limited in this regard.
First conducting terminal 21 and the second conducting terminal 22 keep at a certain distance away, preferably little in theory apart from the smaller the better
In or equal to 0.1mm.First conducting terminal 21 is connected (electric connection) with the circuit for needing electrostatic defending, the second conducting terminal 22
It is connected with static release circuit 40 (electric connection), the shape of the first conducting terminal 21 and the second conducting terminal 22 enables to two
Point discharge effect is formed between person.As shown in figure 1, the first conducting terminal 21 and the second conducting terminal 22 are tapered, each have
There is a cone shape tip, and the tip of the two is oppositely arranged, naturally it is also possible to can form point discharge effect in other
The shape answered, the invention is not limited in this regard.
Point discharge effect, under referring to forceful electric power field action, a kind of electric discharge phenomena that object sharp parts occur, it belongs to one
Plant corona discharge.Its principle is that object sharply locates curvature greatly, and electric lines of force is intensive, thus potential gradient is big, causes its neighbouring portion
Divide gas breakdown and discharge.So as to the first conducting terminal 21 can will get to the electrostatic of the circuit for needing electrostatic defending
Second conducting terminal 22 is discharged into by point discharge effect, and then static release circuit is discharged into by the second conducting terminal 22
In 40, the effect of electrostatic defending is served.
Further, in the embodiment of the present invention, needing the circuit of electrostatic defending includes a signal pad 31, the signal pad
31 layouts are connected by pin 32 on the top layer 101 of circuit board body 10 with main circuit, and the signal pad 31 is preferably applied
It is plated in the copper plate on the upper surface of circuit board body 10 (i.e. the surface of top layer 101).First conducting terminal 21 by with signal pad 31
Connect to be connected with the circuit for needing electrostatic defending, the first conducting terminal 21 can be connected with signal pad 31 by wire or bonding wire
Connect, such that it is able to shorten electrostatic leakage path as far as possible, prevent electrostatic leakage to other signal lines.Further, the present invention
In embodiment, a part for signal pad 31 directly overlays the surface of the first conducting terminal 21 and realizes the connection of the two, this
Mode is not only reliable and stable but also facilitates processing and fabricating.
Further, in the embodiment of the present invention, bottom 104 of the direct layout of static release circuit 40 in circuit board body 10
On, earth signal network is constituted, the static release circuit 40 is preferably painting and is plated in the lower surface of circuit board body 10 (i.e. bottom 104
Surface) copper plate.Second conducting terminal 22 can be connected with static release circuit 40 by wire or bonding wire.Further
Ground, in the embodiment of the present invention, a part for static release circuit 40 is covered in the surface of the second conducting terminal 22 and realizes the two
Connection, this mode is not only reliable and stable but also facilitates processing and fabricating.
When the printed circuit board (PCB) of the embodiment of the present invention works：When peripheral interface device etc. needs to go out on the circuit of electrostatic defending
Existing electrostatic leakage impact so that when there are high energy impact events on the pin 32 of peripheral interface device, dash current passes through peripheral device
The pin 32 of part enters its signal pad 31, then flows into the first conducting terminal 21 by signal pad 31.Imitated by point discharge
Should, dash current flows into the second conducting terminal 22 from the first conducting terminal 21, releases and enters what is be connected with the second conducting terminal 22
Earth signal network copper face (static release circuit 40).So as to realize the electrostatic defending to peripheral interface device, it is ensured that integrated
Circuit chip is not affected by electrostatic impact.
Embodiment two
With reference to Fig. 2, the manufacture method for proposing the printed circuit board (PCB) of second embodiment of the invention, the printed circuit board (PCB) is the
Printed circuit board (PCB) in one embodiment, the method comprising the steps of：
S11, in circuit board body processing one through circuit board hole.
It is as shown in figure 3, in the embodiment of the present invention, circuit board body 10 is made up of multiple structure sheafs including top layer 101, resistance to
The fuel wood bed of material 102, copper sheet layer 103, bottom (bottom) layer 104 etc..
In the PCB design stage, the point discharge structure encapsulation of this printed circuit board (PCB) is designed, the encapsulation is preferably
The cylinder of one a diameter of D, naturally it is also possible to be other shapes, the invention is not limited in this regard.This is encapsulated in except the He of top layer 101
Outside bottom 104, remainder layer is that conductor (such as copper) prohibits cloth region.During draw PCB, the circuit region of electrostatic defending is being needed
The construction packages are placed in domain (such as signal pad or circuit), the presence due to prohibiting cloth region, the encapsulation region, except top layer
101 and bottom 104 outside, remainder layer is without conductor (such as copper).Wherein, earth signal network can be designed on bottom 104 to release as electrostatic
Electric discharge road 40.
In the printed circuit board (PCB) fabrication stage, according to the electricity of standard multi-layer plate process for machining and manufacturing flow manufacturing printed circuit board (PCB)
Road plate body 10, until the top layer of circuit board body 10 (top layer 101 and bottom 104) circuit completes, can adopt standard
SMT welding procedures carry out device welding.After circuit completes, then from the drill bit of a diameter of D, using printed circuit board (PCB) mark
Accurate bore process, the central point processing one of the displacement structure encapsulation in circuit board body 10 runs through the through hole of circuit board body 10
11。
S12, fill in hole insulation filler.
This step S12 is consent step, as shown in figure 4, insulation filler 23 is filled into the hole of circuit board body 10, should
Insulation filler 23 is preferably thermosetting resin, naturally it is also possible to be other insulant.
S13, the first conducting terminal and for keeping at a certain distance away is respectively provided with the hole two ends for being filled with insulation filler
Two conducting terminals, and the shape of the first conducting terminal and the second conducting terminal enables to be formed between the two point discharge effect
Should.
First conducting terminal and the second conducting terminal are spaced apart, the smaller the better in theory, preferably lower than or equal to
0.1mm.First conducting terminal and the second conducting terminal are preferably tapered, each with a cone shape tip, and the two
Tip is oppositely arranged, naturally it is also possible in other shapes that can form point discharge effect, the invention is not limited in this regard.
It is alternatively possible to first two blind holes for keeping at a certain distance away are processed at the hole two ends for being filled with insulation filler,
Two blind holes have tip, and tip is corresponding；Then conductive materials are inserted into two blind holes by process for filling hole, forms the
One conducting terminal and the second conducting terminal.The process for filling hole will fluid conductors materials insert Kong Zhonghou cooling and solidifying molding
Technique, process for filling hole is preferably in hole fills out process for copper, will liquid copper insert Kong Zhonghou cool and solidify molding technique.Certainly,
The first conducting terminal and the second conducting terminal, the invention is not limited in this regard can also be made using other processing technology.
Because the insulation filler in the embodiment of the present invention is thermosetting resin, therefore in processing blind hole, first such as Fig. 5
It is shown, two shaping columns for keeping at a certain distance away (such as steel column) 50 are filled at the hole two ends for being filled with thermosetting resin 23, to squeeze
Portal the thermosetting resin 23 at two ends, and the end of shaping column 50 has tip, preferably tapered；Then the thermosetting resin in device to hole
23 are heated, and after the thermosetting resin 23 in hole solidifies, two shaping columns 50 are taken out, so as to as shown in fig. 6, being filled with
The two ends in the hole of thermosetting resin 23 leave two and have cuspidated tapered blind hole 111.
For example：First with two a diameter of D and one end be cone steel column from the upper and lower of circuit board body 10
Two surfaces are filled in and are filled with the through hole of thermosetting resin 23, and the distance between two steel column tips are d (as shown in Figure 5), by
There is plasticity in now thermosetting resin 23, unnecessary resin 23 overflows from through hole two ends, and it is right after the resin 23 for overflowing to remove
Overall structure is heated, and solidifies the thermosetting resin 23 in hole, and the conical steel column at two ends in hole is removed when cured, is remained
The structure of thermosetting resin 23 after remaining solidification is as shown in fig. 6, define two cone-shaped blind holes 111 opposing upper and lower.
Then using process for copper is filled out in the hole of standard, liquid copper is injected in two blind holes 111, treats the liquid in blind hole 111
After state copper curing molding, then two coniform steel structures (as shown in Figure 1) opposing upper and lower are formed in hole, respectively first leads
The conducting terminal 22 of electric terminal 21 and second.Further, before carrying out filling out copper in hole, the printed circuit of standard can also be adopted
Plate plated hole technique carries out hole wall copper facing to cone-shaped blind hole 111, to increase the compactness and reliability of two conducting terminals.
Due to the embodiment of the present invention two conducting terminals (21,22) be arranged at printed circuit intralaminar part, and by drilling,
Minimum line during process for filling hole is made, therefore distance between two tips d (distance of two conducting terminals) is not processed by printed circuit board (PCB)
Away from restriction, by make more sharp of two tips and can be more nearly, discharge effect is made more preferably, to improve electrostatic defending
Effect.
S14, the first conducting terminal is connected with the circuit for needing electrostatic defending, by the second conducting terminal and Electro-static Driven Comb electricity
Road connects.
The circuit for needing electrostatic defending can be peripheral interface device (such as button) or other components, Electro-static Driven Comb
Circuit refers to the circuit that electrostatic can be imported the earth.
Further, as shown in figure 1, in the embodiment of the present invention, needing the circuit of electrostatic defending includes a signal pad 31,
The layout of signal pad 31 is connected by pin 32 on the top layer 101 of circuit board body 10 with main circuit, the signal pad
31 are preferably the copper plate that painting is plated in the upper surface of circuit board body 10 (i.e. the surface of top layer 101).First conducting terminal 21 by with
Signal pad 31 connects to be connected with the circuit for needing electrostatic defending, can connect the first conducting terminal 21 by wire or bonding wire
Can with signal pad 31.Further, in the embodiment of the present invention, a part for signal pad 31 can be directly overlayed
The surface of one conducting terminal 21 and realize the connection of the two, this mode is not only reliable and stable but also facilitates processing and fabricating.For example, to circuit
The copper of the upper surface of plate body 10 carries out copper facing and thickens process, makes the signal of the first conducting terminal 21 and the circuit for needing electrostatic defending
Pad 31 is connected.
Further, as shown in figure 1, in the embodiment of the present invention, the direct layout of static release circuit 40 is in circuit board body
On 10 bottom 104, earth signal network is constituted, the static release circuit 40 is preferably painting and is plated in the lower surface of circuit board body 10
The copper plate on (i.e. the surface of bottom 104).The second conducting terminal can be connected with static release circuit 40 by wire or bonding wire.
Further, in the embodiment of the present invention, a part for static release circuit 40 can be covered in the table of the second conducting terminal 22
Face and realize the connection of the two, this mode is not only reliable and stable but also facilitates processing and fabricating.For example, to the lower surface of circuit board body 10
Copper carry out copper facing and thicken process, make the second conducting terminal 22 with static release circuit 40 (the copper plane of earth signal network) phase
Even.
Embodiment three
With reference to Fig. 7, the printed circuit manufacture method of third embodiment of the invention is proposed, be the method comprising the steps of：
S21, processed in circuit board body using the drill bit of a diameter of D one through circuit board hole.
It is as shown in figure 3, in the embodiment of the present invention, circuit board body 10 is made up of multiple structure sheafs including top layer 101, resistance to
The fuel wood bed of material 102, copper sheet layer 103, bottom 104 etc..
Specifically, according to the circuit board body 10 of standard multi-layer plate process for machining and manufacturing flow manufacturing printed circuit board (PCB), directly
Complete to the top layer of circuit board body 10 (top layer 101 and bottom 104) circuit, the SMT welding procedures of standard can be adopted to enter
Row device is welded.After circuit completes, then from the drill bit of a diameter of D, using the bore process of printed circuit board (PCB) standard,
Through hole 11 of the central point processing one of the displacement structure encapsulation in circuit board body 10 through circuit board body.
S22, in hole filled thermoset resin.
S23, the circular cone for filling in two a diameter of D for keeping at a certain distance away at the hole two ends for being filled with thermosetting resin are formed
Type post.
Specifically, using two a diameter of D and one end is the shaping column 50 of cone from up and down the two of circuit board body 10
Individual surface is filled in and is filled with the through hole of thermosetting resin 23, and the distance between tip of two shaping column 40 is d (as shown in Figure 5),
Because now thermosetting resin 23 has plasticity, unnecessary resin 23 then overflows from through hole two ends, removes the resin 23 for overflowing.
Wherein, d is the smaller the better in theory, preferably lower than or equal to 0.1mm.
Thermosetting resin in S24, bottoming hole, after thermosetting resin solidifies, takes out two shaping columns, leaves two circles
The blind hole of taper.
Specifically, overall structure is heated, solidifies the thermosetting resin 23 in hole, removed when cured two in hole
The conical shaping column 50 at end, the structure of thermosetting resin 23 after residue solidification is as shown in fig. 6, define two opposing upper and lower
Cone-shaped blind hole 111.
S25, generate coniform steel structure in two blind holes using filling out process for copper in hole, respectively the first conducting terminal and
Second conducting terminal.
Specifically, using process for copper is filled out in the hole of standard, liquid copper is injected in two blind holes 111, is treated in blind hole 111
After liquid copper curing molding, then in hole formed two coniform steel structures (as shown in Figure 1) opposing upper and lower, respectively first
The conducting terminal 22 of conducting terminal 21 and second.Further, before carrying out filling out copper in hole, the printing electricity of standard can also be adopted
Road plate plated hole technique carries out hole wall copper facing to cone-shaped blind hole 111, to increase the compactness and reliability of two conducting terminals.
S26, the copper to circuit board body upper and lower surface carry out copper facing and thicken process, make the first conducting terminal with layout in electricity
Road plate body upper surface need electrostatic defending circuit signal pad connection, make the second conducting terminal and layout in circuit board
The static release circuit connection of plate body lower surface.
Printed circuit board (PCB) of the embodiment of the present invention and preparation method thereof, using the drilling in printed circuit board production technology,
Process for filling hole, defines on a printed circuit a kind of point discharge structure of solid, realizes the electrostatic to printed circuit board (PCB)
Protection.Printed circuit board (PCB) using the embodiment of the present invention and preparation method thereof, with advantages below：
1) manufacture method is mutually compatible with the printed circuit board (PCB) processing technology thereof flow process of existing standard, reduces and is processed into
This；
2) hardware need not be increased so that electrostatic defending need not increase any BOM costs, reduce Material Cost；
3) two conducting terminals (21,22) be arranged on printed circuit intralaminar part rather than surface, it is not necessary to take printed circuit board (PCB)
The layout area on surface, reduces design cost；
4) point discharge structure can directly be produced on the signal of the circuit (such as peripheral interface device) for needing electrostatic defending
On pad 31, electrostatic leakage path is reduced to greatest extent, prevent electrostatic leakage to other signal lines, improve electrostatic and prevent
Shield effect and reliability；
5) distance between two tips (i.e. the distance of the first conducting terminal 21 and the second conducting terminal 22) of the point discharge structure are no
Minimum line can more sharply be more nearly away from being limited by what two tips made in being processed by printed circuit board (PCB), make electric discharge
It is better, so as to improve electrostatic protection effect.
The present invention proposes a kind of electronic equipment simultaneously, and the electronic equipment can be the mobile terminals such as mobile phone, flat board, also may be used
Being the fixed terminals such as PC, television set.The electronic equipment includes a printed circuit board (PCB), and the printed circuit board (PCB) includes
Circuit board body, the circuit and static release circuit that need electrostatic defending, have one to run through the electricity in the circuit board body
The hole of road plate body, includes being located at the hole two ends and the first conducting terminal and second for keeping at a certain distance away respectively in the hole
Conducting terminal and the insulation filler in the filling hole, first conducting terminal needs the circuit of electrostatic defending to connect with described
Connect, second conducting terminal is connected with the static release circuit, first conducting terminal and second conducting terminal
Shape enable to form point discharge effect between the two.Printed circuit board (PCB) described in the present embodiment is in the present invention
Printed circuit board (PCB) involved by above-described embodiment, will not be described here.
The electronic equipment of the embodiment of the present invention, using the drilling in printed circuit board production technology, process for filling hole, in printing
A kind of point discharge structure of solid is defined on circuit board, the electrostatic defending to printed circuit board (PCB) is realized.Due to the printing
The manufacture method of circuit board is mutually compatible with the printed circuit board (PCB) processing technology thereof flow process of existing standard, therefore reduces and be processed into
This；Due to hardware need not be increased so that electrostatic defending need not increase any BOM costs, therefore reduce Material Cost；
Because two conducting terminals are arranged on printed circuit intralaminar part rather than surface, it is not necessary to take the range of distribution of printed circuit board surface
Product, therefore reduce design cost；Because the point discharge structure can directly be produced on the circuit for needing electrostatic defending (such as periphery
Interface device) signal pad on, electrostatic leakage path is reduced to greatest extent, prevent electrostatic leakage to other holding wires
Road, therefore improve electrostatic protection effect and reliability；Because the distance between two tips of the point discharge structure do not receive printed circuit board (PCB)
In processing minimum line away from restriction, can by two tip make more sharply be more nearly, make discharge effect more preferably, therefore
Improve electrostatic protection effect.
The preferred embodiments of the present invention are the foregoing is only, the scope of the claims of the present invention, every utilization is not thereby limited
Equivalent structure or equivalent flow conversion that description of the invention and accompanying drawing content are made, or directly or indirectly it is used in other correlations
Technical field, be included within the scope of the present invention.
Claims (10)
1. a kind of printed circuit board (PCB), including circuit board body, the circuit and static release circuit that need electrostatic defending, its feature exists
In, have one in the circuit board body through the hole of the circuit board body, include being located at the hole two respectively in the hole
End and the first conducting terminal for keeping at a certain distance away and the second conducting terminal and the insulation filler in the hole is filled, described the
One conducting terminal needs the circuit of electrostatic defending to be connected with described, and second conducting terminal connects with the static release circuit
Connect, the shape of first conducting terminal and second conducting terminal enables to form point discharge effect between the two.
2. printed circuit board (PCB) according to claim 1, it is characterised in that first conducting terminal and described second conductive
Terminal is tapered, and the tip of the two is oppositely arranged.
3. printed circuit board (PCB) according to claim 1, it is characterised in that described to need the circuit of electrostatic defending to include a letter
Number pad, in the circuit board body, first conducting terminal is connected the signal pad layout with the signal pad.
4. printed circuit board (PCB) according to claim 3 a, it is characterised in that part for the signal pad is covered in described
First electrical contact surfaces.
5. printed circuit board (PCB) according to claim 1, it is characterised in that the static release circuit layout is in the circuit
On plate body.
6. a kind of manufacture method of printed circuit board (PCB), it is characterised in that comprise the following steps：
Processing one is through the hole of the circuit board in circuit board body；
Insulation filler is filled in the hole；
The first conducting terminal and second for keeping at a certain distance away is respectively provided with the hole two ends for being filled with the insulation filler to lead
The shape of electric terminal, first conducting terminal and second conducting terminal enables to form point discharge effect between the two
Should；
First conducting terminal is connected with the circuit for needing electrostatic defending, by second conducting terminal and Electro-static Driven Comb electricity
Road connects.
7. the manufacture method of printed circuit board (PCB) according to claim 6, it is characterised in that described to be filled with the insulation
The step of hole two ends of implant are respectively provided with the first conducting terminal and the second conducting terminal that keep at a certain distance away includes：
Two blind holes for keeping at a certain distance away are processed at the hole two ends for being filled with the insulation filler；
Conductive materials are inserted into two blind holes by process for filling hole, first conducting terminal and described second is formed and is led
Electric terminal.
8. the manufacture method of printed circuit board (PCB) according to claim 7, it is characterised in that the insulation filler is thermosetting
Change resin, it is described to wrap the step of the blind hole that the hole two ends processing two for being filled with the insulation filler keeps at a certain distance away
Include：
Two shaping columns for keeping at a certain distance away are filled at the hole two ends for being filled with the thermosetting resin, to extrude the hole two
The thermosetting resin at end；
Thermosetting resin in the hole is heated, after the thermosetting resin in the hole solidifies, is taken out described in two
Shaping column, so as to leave two blind holes at the two ends in the hole for being filled with the thermosetting resin.
9. the manufacture method of printed circuit board (PCB) according to claim 7, it is characterised in that the process for filling hole is to fill out in hole
Process for copper.
10. a kind of electronic equipment, it is characterised in that include the printed circuit board (PCB) as described in any one of claim 1-5.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610974338.6A CN106572590B (en) | 2016-11-03 | 2016-11-03 | Printed circuit board and preparation method thereof and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610974338.6A CN106572590B (en) | 2016-11-03 | 2016-11-03 | Printed circuit board and preparation method thereof and electronic equipment |
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| CN106572590A true CN106572590A (en) | 2017-04-19 |
| CN106572590B CN106572590B (en) | 2019-05-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610974338.6A Expired - Fee Related CN106572590B (en) | 2016-11-03 | 2016-11-03 | Printed circuit board and preparation method thereof and electronic equipment |
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| CN108901127A (en) * | 2018-08-24 | 2018-11-27 | 珠海格力电器股份有限公司 | Printed wiring board, control device and its application in high defense controls devices field |
| CN109905960A (en) * | 2019-01-07 | 2019-06-18 | 深圳欣旺达智能科技有限公司 | Battery protecting plate and antistatic device |
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|---|---|
| CN106572590B (en) | 2019-05-24 |
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