CN106558766A - Metamaterial composite structure and its manufacture method and antenna house - Google Patents
Metamaterial composite structure and its manufacture method and antenna house Download PDFInfo
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Abstract
The invention discloses metamaterial composite structure and its manufacture method and antenna house.The metamaterial composite structure includes：Cellular board, the cellular board are made up of dielectric material, and have multiple cellular units, and each cellular unit has multiple honeycomb walls；And the multiple conductive geometry unit being attached on the plurality of honeycomb wall, wherein, the plurality of conductive geometry unit is located on the honeycomb wall of different orientation, so as to form the multiple micro structure arrays with different orientation.Intermediate layer of the metamaterial composite structure as antenna house, not only acts as the effect of improve mechanical strength, and as the wave transparent performance of the electromagnetic wave for further improving large angle incidence.
Description
Technical field
The present invention relates to artificial composite material field, more particularly, to metamaterial composite structure and its manufacture method and antenna house.
Background technology
In recent years, the research of Meta Materials and application has attracted extensive attention.Meta Materials are the artificial composite structures or composite of specific microstructure.Designed by the structure ordering on the physical size of material, the restriction of some natural laws can be broken through, so as to show the extraordinary physical property not available for natural material.The physical property of Meta Materials depends not only on the intrinsic properties of material, and depending on the micro structure for wherein being formed.
Meta Materials can be laminated by multiple Meta Materials feature boards or be combined by other regular arrays.Meta Materials feature board includes medium substrate and the multiple conductive geometry of array is formed on medium substrate.Meta Materials feature board shows Meta Materials characteristic.In order to further enhance mechanical strength, can also will be Meta Materials feature board and honeycomb panel stacked together.
One kind application of Meta Materials is for manufacturing antenna house.Existing antenna house is substantially pure material antenna house, is merely able to play a part of to protect antenna, the performance of antenna can be affected in admissible scope.General Physics material use half-wavelength or quarter-wave are theoretical, corresponding to different antenna frequencies, change its thickness.When material thickness is the 1/2 of working frequency range electromagnetic wavelength, electromagnetic wave penetrance is best.However, if operation wavelength were long, will be blocked up according to the antenna house of half-wavelength Design Theory.Not only the weight of antenna house is bigger than normal, and can not meet the demand of wide-angle Electromgnetically-transparent.Additionally, the filtering characteristic of pure material antenna house is poor, easily disturbed by successive bands.Meta Materials include the conductive geometry on medium substrate, produce electromagnetic response, the electromagnetic property different so as to show conventional material to electric field and magnetic field.Relative to pure material antenna house, metamaterial antenna cover can be with reduce thickness and mitigation weight.
Expect further to improve the structure design of Meta Materials so that antenna house can also show excellent wave transmission effect to the electromagnetic wave of large angle incidence.
The content of the invention
In view of foregoing problems, it is an object of the invention to provide a kind of metamaterial composite structure and its manufacture method and antenna house that can improve wave transmission effect.
According to an aspect of the present invention, there is provided a kind of metamaterial composite structure, including：Cellular board, the cellular board are made up of dielectric material, and have multiple cellular units, and each cellular unit has multiple honeycomb walls；And the multiple conductive geometry unit being attached on the plurality of honeycomb wall, wherein, the plurality of conductive geometry unit is located on the honeycomb wall of different orientation, so as to form the multiple micro structure arrays with different orientation.
Preferably, the cellular unit cycle arrangement, and the cellular unit is uniformly distributed on the cellular board, and adjacent cellular unit has public honeycomb wall.
Preferably, the shape being shaped as selected from one of polygon, waveform, zigzag of the plurality of cellular unit.
Preferably, the polygon for being shaped as closing of the plurality of cellular unit.
Preferably, the plurality of cellular unit is shaped as regular hexagon.
Preferably, at least one conductive geometry unit is set in each honeycomb wall.
Preferably, multiple conductive geometry units are set in each honeycomb wall, the plurality of conductive geometry unit cycle is arranged into array.
Preferably, the metamaterial composite structure has relative first surface and second surface, and the plurality of cellular unit is respectively provided with opening in the first surface and the second surface.
Preferably, the plurality of conductive geometry unit includes first group of conductive geometry unit and/or second group of conductive geometry unit, and described first group conductive geometry unit is different with the pattern and/or size of described second group conductive geometry unit.
Preferably, the plurality of conductive geometry unit includes the Part II of the Part I and the block shape inside the Part I of closed circular respectively.
Preferably, the Part I is square shape, and the Part II is box-shaped.
Preferably, the outside of the Part I is a length of 4.8 to 9.2 millimeters, and live width is 0.05 to 1.2 millimeter.
According to a further aspect in the invention, there is provided a kind of antenna house, including：Above-mentioned metamaterial composite structure；And first eyelid covering and the second eyelid covering, wherein the metamaterial composite structure is clipped between first eyelid covering and second eyelid covering.
Preferably, one kind being shaped as selected from following shape of the antenna house：Plane, curved surface, the conical surface, sphere, shaped face.
Preferably, the surface of first eyelid covering and second eyelid covering is mutually perpendicular to the surface of the plurality of honeycomb wall.
According to another aspect of the invention, there is provided it is a kind of manufacture metamaterial composite structure method, including：The first micro structure array and the second micro structure array are formed respectively in the relative first surface and second surface of medium substrate；And by medium substrate together with the first micro structure array and the second micro structure array together as honeycomb board member, it is assembled into metamaterial composite structure, wherein described first micro structure array includes the multiple first groups conductive geometry units separated by multiple first adhesion zones, second micro structure array includes the multiple second groups conductive geometry units separated by multiple second adhesion zones, and the number of assembling steps includes：The adjacent honeycomb board member is bonded together using the adhesive linkage at least one the first adhesion zone and the second adhesion zone.
Preferably, the first micro structure array of the formation and it is selected from the step of second micro structure array：Combined using photosensitive-ink and thermoprint, using photoetching and etching combine, and using electrically conductive ink printing in one.
Preferably, hot pressing is adopted to bend medium substrate to form honeycomb board member.
Preferably, include the step of the bending medium substrate：For the plurality of first group conductive geometry unit, first group of conductive geometry unit is folded upward at respectively, to form multiple first group of honeycomb wall of described first group conductive geometry unit attachment, and for the plurality of second group conductive geometry unit, second group of conductive geometry unit is bent separately down, to form multiple second group of honeycomb wall of described second group conductive geometry unit attachment.
Preferably, all conductive geometry unit on a honeycomb wall is located in described first group conductive geometry unit and second group of conductive geometry unit in approximately the same plane.
Preferably, in the step of the bending medium substrate, bending angle is 120 degree.
Preferably, the medium substrate is smooth medium substrate, and the metamaterial composite structure that is assembled into includes：After multiple honeycomb board members are bonded together, all of medium substrate is stretched so that adjacent medium substrate is spaced from each other, to form the space of cellular unit.
The metamaterial composite structure manufactured according to above-mentioned steps includes the cellular board with cellular unit, and the conductive geometry unit being attached on the honeycomb wall of cellular unit.Intermediate layer of the metamaterial composite structure as antenna house, not only acts as the effect of improve mechanical strength, and can improve the electromagnetic wave penetrance of working frequency range.
Additionally, the plurality of conductive geometry unit is located on the honeycomb wall of different orientation, so as to form the multiple micro structure arrays with different orientation.Even if not perpendicular to the first type surface (i.e. the first type surface of antenna house eyelid covering) of metamaterial composite structure, metamaterial composite structure is it is also possible that the electromagnetic wave of working frequency range is easier to penetrate the incident angle of electromagnetic wave.Therefore, the metamaterial composite structure can improve the incident angle of electromagnetic wave.
Description of the drawings
By description referring to the drawings to the embodiment of the present invention, the above-mentioned and other objects, features and advantages of the present invention will be apparent from, in the accompanying drawings：
Fig. 1 is the schematic perspective view of the metamaterial composite structure according to the first embodiment of the present invention；
Fig. 2 is the schematic perspective view of the metamaterial composite structure according to the second embodiment of the present invention；
Fig. 3 to 7 is the schematic diagram of each step of the antenna house manufacture method according to the third embodiment of the present invention, wherein Fig. 3,5 and 7 are shown respectively schematic perspective view, Fig. 4 a, 4b and 4c respectively illustrate the schematic perspective view and top view of both direction, and Fig. 6 a and 6b respectively illustrate schematic perspective view and sectional view；
Fig. 8 is the schematic perspective view of the antenna house according to the fourth embodiment of the present invention；
Fig. 9 illustrates the electromagnetic wave transmission characteristic curve of the antenna house shown in Fig. 8.
Specific embodiment
The present invention is more fully described hereinafter with reference to accompanying drawing.In various figures, identical element is represented using similar reference.For the sake of clarity, the various pieces in accompanying drawing are not necessarily to scale.Furthermore, it is possible to not shown part known to some.For brevity, the structure that can be obtained after several steps described in a width figure.
It should be understood that, in the structure of outlines device, when by one layer, region referred to as positioned at another layer, another region " above " or when " top ", can refer to above another layer, another region, or other layers or region are also included between another layer, another region at which.Also, if device is overturn, this layer, a region will be positioned at another layer, another region " below " or " lower section ".
If in order to describe located immediately at another layer, another region above scenario, herein will be using " A is directly on B " or the form of presentation of " A is on B and adjoins therewith ".In this application, " A is in B " represents A in B, rather than in the doped region formed during A is located at B.
Describe hereinafter many specific details of the present invention, such as micro structure, material, size, handling process and technology, to be more clearly understood that the present invention.But just as the skilled person will understand, the present invention can not be realized according to these specific details.
The present invention can be presented in a variety of manners, some of them example explained below.
Fig. 1 is the schematic perspective view of the metamaterial composite structure according to the first embodiment of the present invention.The conductive geometry unit 120 that metamaterial composite structure 100 includes the cellular board 110 formed by dielectric material and formed by conductive material.
Cellular board 110 includes cellular unit.The shape in the section of cellular unit can be the shape of one of polygon, waveform, zigzag.In a preferred embodiment, the shape in the section of cellular unit is the polygon of closing, and in another preferred embodiment, the section of cellular unit is regular hexagon.Cellular unit includes multiple honeycomb walls, and there is place plane the honeycomb wall of different normal vectors to have different orientations.The cellular unit of such as V-shaped can provide the honeycomb wall that the cellular unit of the honeycomb wall of 2 orientations, triangular-section and regular hexagonal section can provide 3 orientations.
The cellular unit cycle arranges, and cellular unit is uniformly distributed on cellular board.Such as cellular unit is arranged in periodic ranks.
Cellular unit includes multiple honeycomb walls, and adjacent cellular unit has public honeycomb wall, and two surfaces of the public cellular wall are belonging respectively to the adjacent cellular unit.
Cellular board 110 can be made up of any suitable dielectric material, for example：Glass fibre, ceramics, aramid fiber, politef, Polymethacrylimide (polymethacrylimide, PMI), ferroelectric material, ferrite material.Cellular board 110 needs to meet the requirement for providing mechanical support and thermoprint.Preferably, cellular board 110 is made up of aramid fiber.
Conductive geometry unit 120 is located on the honeycomb wall of cellular unit in cellular board.Conductive geometry unit 120 includes the Part I of closed circular, and the Part II in Part I.The size of Part I depends on the size of honeycomb wall, specifically, the size being smaller in size than equal to honeycomb wall of Part I.In the embodiment shown in fig. 1, each cellular unit is shaped as regular hexagon, including six honeycomb walls, and each honeycomb wall adheres to a conductive geometry unit 120.The angle of adjacent honeycomb wall is, for example, that the conductive geometry unit 120 on 120 degree, and adjacent honeycomb wall is adjacent to each other.Conductive geometry unit 120 is made up of conductive material, for example, constitute by the such as metal material of gold, silver, copper etc or by electrically conductive ink.
Conductive geometry unit 120 for example includes the Part II 122 of the Part I 121 and the box-shaped inside Part I of square shape (rectangle of hollow out).Rectangle of the Part I 121 for hollow out, the live width of Part I 121 is 4.8-9.2 millimeters.Part II 122 is located at the rectangle openwork part central authorities of Part I 121.It is appreciated that the conductive geometry unit 120 on the honeycomb wall of cellular unit is not limited to above-mentioned pattern, and can be the arbitrary graphic pattern based on simulation result.
In another example, the Part I of the conductive geometry unit 120 on adjacent honeycomb wall contacts with each other.
In the present embodiment, as each honeycomb wall adheres to a conductive geometry unit, therefore, the length of side of the size of cellular unit, i.e. hexagon, and honeycomb plate thickness, it is roughly the same with the size of conductive geometry unit 120.The pattern and size of conductive geometry unit 120 depends on desired electromagnetic performance.The size of the thickness and cellular unit of cellular board 110 is correspondingly determined after the pattern and size of design conduction geometry unit 120.
In this embodiment, the honeycomb wall of cellular unit provides the attaching surface of conductive geometry unit.Six honeycomb wall surfaces of cellular unit are parallel two-by-two in three directions, therefore the conductive geometry unit 120 of whole cellular board 110 correspondingly forms the micro structure array of three different orientations.
Above-mentioned metamaterial composite structure provides mechanical strength using cellular board 110 and reduces weight.Three different micro structure array orientations are formed using the conductive geometry unit 120 on honeycomb wall, it is possible to achieve wide-angle Electromgnetically-transparent.
In the embodiment, cellular unit is shaped as regular hexagon, and adjacent honeycomb wall angle is 120 degree.In an alternative embodiment, the shape of cellular unit can be the polygonal shape of any enclosed for including multiple honeycomb walls, and the angle of adjacent honeycomb wall is not limited to 120 degree.The pattern of the conductive geometry unit on adjacent honeycomb wall, size can be with identical or different.
In a preferred embodiment, metamaterial composite structure has relative first surface and second surface, and multiple cellular units are respectively provided with opening in first surface and second surface.
In another preferred embodiment, the multiple conductive geometry unit of metamaterial composite structure includes first group of conductive geometry unit and/or second group of conductive geometry unit, wherein, the pattern and/or size of first group of conductive geometry unit and second group of conductive geometry unit are different.
Fig. 2 is the schematic perspective view of the metamaterial composite structure according to the second embodiment of the present invention.The conductive geometry unit 220 that metamaterial composite structure 200 includes the cellular board 210 formed by dielectric material and formed by conductive material.
Metamaterial composite structure according to second embodiment with the difference of the metamaterial composite structure according to first embodiment is, in metamaterial composite structure 200, adhere to 9 conductive geometry units on each honeycomb wall, form the array of 3 × 3 conductive geometry unit compositions.
The length of side of the size of cellular unit, i.e. hexagon, the quantity of the conductive geometry unit 220 of size and the direction arrangement depending on conductive geometry unit 220.Honeycomb plate thickness then depends on the quantity of the size of conductive geometry unit 220 and the conductive geometry unit 220 of direction arrangement.
The pattern and size of conductive geometry unit 220 depends on desired electromagnetic performance.After the pattern and size of design conduction geometry unit 220, the quantity of the conductive geometry unit 220 of length of side arrangement along cellular unit can be calculated according to the demand of mechanical strength further, and along cellular board 210 thickness arrange conductive geometry unit 220 quantity, so as to correspondingly determine the size of the thickness and cellular unit of cellular board 210.
According to the metamaterial composite structure and micro structure array not only including different orientation of second embodiment, such that it is able to realize wide-angle Electromgnetically-transparent, and the pattern and/or size of conductive geometry unit and cellular unit can be separately designed, so as to be separately optimized the mechanical strength of the electromagnetic performance and cellular unit of conductive geometry unit.
In this embodiment, cellular unit is shaped as regular hexagon, and each honeycomb wall adhere to multiple conductive geometry units quantity it is equal.In an alternative embodiment, the shape of cellular unit can be the polygonal shape of any enclosed for including multiple honeycomb walls, and the angle of adjacent honeycomb wall is not limited to 120 degree.The pattern of the conductive geometry unit on adjacent honeycomb wall, size, quantity can be with identical or different.For example, the quantity of the conductive geometry unit on a honeycomb wall is 2 × 3, and the quantity of the conductive geometry unit on another adjacent honeycomb wall is 4 × 3.
Fig. 3 to 7 is the schematic diagram of each step of the metamaterial composite structure manufacture method according to the third embodiment of the present invention, and wherein Fig. 3 and 5-8 is shown respectively schematic perspective view, and Fig. 4 a, 4b and 4c respectively illustrate the schematic perspective view of both direction and a top view.The method is used to manufacture metamaterial composite structure 100 as shown in Figure 1.
Before manufacture metamaterial composite structure, according to required electromagnetic wave transmission characteristic, shape and the distribution of conductive geometry unit 120 are obtained using design of Simulation.Micro structure array includes multiple conductive geometry units 120.Each conductive geometry unit 120 can be square shape, hexagon, box-shaped, cross, snowflake shape or its combination in any.According to actual needs, the size of the conductive geometry unit 120 in micro structure array can be with identical or different.
In this embodiment, conductive geometry unit 120 for example includes the Part II 122 of the Part I 121 and the box-shaped inside Part I of square shape.
As shown in figure 3, the method starts from smooth medium substrate 101.Medium substrate 101 can be made up of any suitable dielectric material, for example：Glass fibre, ceramics, aramid fiber, politef, Polymethacrylimide (polymethacrylimide, PMI), ferroelectric material, ferrite material.Medium substrate 101 needs to meet the requirement for providing mechanical support and thermoprint.Preferably, medium substrate 101 is made up of aramid fiber.
Using silk screen or spray gun, the full version on medium substrate 101 is evenly coated with photosensitive-ink.Photosensitive-ink can be any type of ink.Should typically have excellent photosensitive property and graphics resolution.In the present embodiment, the photosensitive-ink has used transparent ultraviolet (UV) curable ink, and its photosensitive property is excellent, and minimum feature is up to 0.05mm.After photosensitive-ink to be coated on medium substrate 101 using silk screen, in time silk screen should be removed.
If desired, before coating photosensitive-ink, can also carry out pretreatment, such as surface cleaning processing to medium substrate 101, its method has mechanical cleaning, Chemical cleaning and electrolytic cleaned etc..
After coating photosensitive-ink, process is dried to photosensitive-ink so that photosensitive-ink mummification, adhesive layer is formed on the surface of medium substrate 101.Such as when photosensitive-ink is coated with silk screen, it is possible to use silk screen baking box is dried the photosensitive-ink.If in addition, being dried using hot blast during the photosensitive-ink, depending on its mummification temperature can be according to practical situation, but the photosensitive-ink and the vitrification point for manufacturing the material of medium substrate 101 should be less than.In the present embodiment, the mummification temperature is at 40 degree or so.
It is possible if desired to repetitive coatings photosensitive-ink and to the withering step of photosensitive-ink, to increase the thickness of adhesive layer.
Then, make with the egative film with micro structure array identical pattern, and egative film is covered on adhesive layer.Specifically, design the pattern of micro structure array by computer software such as CST etc., and be actually needed detecting whether which meets by emulation testing.The shape of micro structure array, size and arrangement mode related data are passed to into camera installation, by camera installation export with the egative film of micro structure array identical image (i.e. film).
Then, adhesive layer is exposed via egative film, makes the light without image section of correspondence egative film partially cured.In the present embodiment, the light for irradiating egative film is the ultraviolet sent by such as ultraviolet (UV) fluorescent tube.As adhesive layer is formed by photosensitive-ink, therefore expose so that the pattern of egative film is transferred in adhesive layer.The exposed portion light of adhesive layer and solidify (be changed into thermosetting), the property retention of unexposed portion is constant, still keeps thermoplasticity.After completion of the exposure, you can remove egative film.Photosensitive-ink in the present embodiment is negative photosensitive ink, and certainly, photosensitive-ink can also select positive type light sensitive ink, as long as the shading of egative film and light leak portion are exchanged.
Then, conductive layer of the covering with adhesive linkage on adhesive layer.Conductive layer can be aluminium foil, or Copper Foil.An adhesive linkage, such as glue or other bonding agents are coated on the electrically conductive, and this is primarily to increase the cohesive force between conductive layer and adhesive layer.Laminated construction to being made up of medium substrate 101, adhesive layer and conductive layer is heated and is pressurizeed so that the unexposed portion hot melt of adhesive layer, and corresponding Conductive layer portions are bonded on medium substrate 101.
For example, in the present embodiment, medium substrate 101 is positioned on the electric heating base plate of thermoprinting machine.Heat up to heat adhesive layer using the electric heating base plate of thermoprinting machine, heat the unexposed portion of adhesive layer.Using the pressure roll of thermoprinting machine come roll-in conductive layer.After the heat-fused portion of adhesive layer solidifies, appropriate section of the non-light part of the adhesive layer by medium substrate 101 with conductive layer will be corresponded to and be bonded together.Photosensitive-ink should be less than to the heating-up temperature of adhesive layer and the vitrification point for manufacturing the material of medium substrate 101, for example, heating-up temperature is between 100-130 degree.
Then, the part that conductive layer is not bonded together with medium substrate 101 is removed, the remainder of conductive layer forms micro structure array.
The step of micro structure array is formed by the above-mentioned utilization photosensitive-ink of repetition and thermoprint, form the first micro structure array and the second micro structure array being made up of conductive geometry unit 120 on two relative surface 101a and surface 101b of medium substrate 101 respectively, as shown in Fig. 4 a, 4b and 4c.In Fig. 4 c for the sake of clarity, the conductive layer pattern formed on medium substrate 101 is represented using oblique line.
As shown in fig. 4 a, on the surface 101a of substrate 101, the conductive geometry unit of the first micro structure array is divided into multigroup conductive geometry unit, per group of conductive geometry unit includes that three are in line and conductive geometry unit 120a, 120b, 120c adjacent to each other, and different group conduction geometry units separate its size first adhesion zone 125 corresponding with the size of a conductive geometry unit 120.
As shown in Figure 4 b, on the surface 101b of substrate 101, the conductive geometry unit of the second micro structure array is divided into multigroup conductive geometry unit, per group of conductive geometry unit includes that three are in line and conductive geometry unit 120d, 120e, 120f adjacent to each other, and different group conduction geometry units separate size second adhesion zone 126 corresponding with the size of a conductive geometry unit 120.Second adhesion zone 126 is overlapped in the projection of surface 101a with conduction geometry unit 120b.In this embodiment, as will be described, medium substrate 101 will be used to form cellular board.Each conductive geometry unit 120 will be attached respectively on a honeycomb wall of cellular unit.First adhesion zone 125 is offset one from another with the second adhesion zone 126 so that the first adhesion zone 125 is corresponding with the positions and dimensions of a conductive geometry unit 120, and the second adhesion zone 126 is corresponding with the positions and dimensions of a conductive geometry unit 120.
Then, the mechanical property according to medium substrate 101, is bent using heat pressing process bending medium substrate 101, as shown in Figure 5.In this embodiment, per group of conduction geometry unit 120a, 120b, 120c of the first micro structure array is folded upward at, and per group of conduction geometry unit 120d, 120e, 120f of the second micro structure array are bent downwards.
Per group of conduction geometry unit 120a, 120b, 120c will form three honeycomb walls adjacent to each other in six honeycomb walls of a cellular unit, be folded upward at into the shape of 120 degree of mutual angle.Three honeycomb walls adjacent to each other in six honeycomb walls of another adjacent cellular unit of formation are bent into downwards the shape of 120 degree of mutual angle by per group of conduction geometry unit 120d, 120e, 120f.
In the first surface of medium substrate 101, each first adhesion zone 125 connects adjacent two group conduction geometry unit 120a, 120b, 120c of the first micro structure array.In the relative second surface of medium substrate 101, each second adhesion zone 126 connects adjacent two group conduction geometry unit 120d, 120e, 120f of the second micro structure array.
The first micro structure array and the second micro structure array on medium substrate 101 and its two relative surface constitutes honeycomb board member 102 together.
Then, honeycomb board member 102 and honeycomb board member 103 are fitted together, as shown in Fig. 6 a and 6b.Honeycomb board member 102 has identical structure as shown in Figure 5 respectively with honeycomb board member 103.Fig. 6 a and 6b are the schematic diagram that cellular unit is formed by bonding honeycomb board member 102 and 103, and wherein Fig. 6 b are the sectional view of dashed region in Fig. 6 a.
In assembling, bonding agent is smeared at least one first adhesion zone 125 of the first adhesion zone 125 of honeycomb board member 102 and honeycomb board member 103, so as to form adhesive linkage.Adhesive linkage can be made up of the bonding agent of any conventional heat cure or photocuring, such as epoxy resin.Will be the first adhesion zone 125 of the first adhesion zone 125 of honeycomb board member 102 and honeycomb board member 103 relatively close, honeycomb board member 102 and honeycomb board member 103 are bonded together using adhesive linkage, so as to form cellular board lamination.According to the property of binding agent, binding agent can be solidified by heating or light irradiation.
The conductive geometry unit of per group of first micro structure array of honeycomb board member 102 forms adjacent to each other six honeycomb wall of a cellular unit together with the corresponding set of conductive geometry unit of the first micro structure array of honeycomb board member 103.120 degree of adjacent honeycomb wall mutual angle.
Together with first adhesion zone 125, first adhesion zone 125 corresponding to honeycomb board member 103 of honeycomb board member 102, connect two adjacent cellular units.
In a preferred embodiment, the first adhesion zone 125 and the second adhesion zone 126 are by pressing bonding.
Then, honeycomb board member 102 and 103 is bonded together successively with honeycomb board member 104-106, forms metamaterial composite structure 100, as shown in Figure 7.
In each honeycomb board member of bonding, two adjacent honeycomb board members are combined using the first adhesion zone and the second adhesion zone alternately.
The medium substrate of above-mentioned all of honeycomb board member 102-106 bonds together.Medium substrate forms cellular board together.On six honeycomb walls of each cellular unit of cellular board, adhere to a conductive geometry unit 120 respectively,
In this embodiment, micro structure array is formed using photosensitive-ink and thermoprint on two apparent surfaces of medium substrate 101.
In an alternative embodiment, can adopt electrically conductive ink that the pattern of microstructure unit is directly formed on medium substrate 101, now electrically conductive ink is directly as conductive layer.In another alternative embodiment, the method that photoetching and etching can be adopted, by the metal layer pattern chemical conversion microstructure unit on medium substrate 101.
Additionally, in this embodiment, 101 hot pressing of medium substrate is bent into into honeycomb board member 102, the angle of adjacent conductive geometry unit is 120 degree, and multiple honeycomb board members are fitted together by bonding.
In an alternative embodiment, in above-mentioned heat-press step, the angle of the adjacent conductive geometry unit of medium substrate 101 can be arbitrary.As long as the hexagon that the cellular unit for ultimately forming can form closure both may be used.
In another alternative embodiment, according to the mechanical property of medium substrate 101, the step of 101 hot pressing of medium substrate is bent into into honeycomb board member 102 can be saved.For example, in the case of medium substrate 101 is made up of aramid fiber, smooth medium substrate can be bonded together, and all of medium substrate is stretched together so that adjacent medium substrate is spaced from each other, to form the space of cellular unit.
Fig. 8 is the schematic perspective view of the antenna house according to the fourth embodiment of the present invention.Antenna house 105 includes the first eyelid covering 150, the second eyelid covering 160, and the metamaterial composite structure 100 being clipped between the first eyelid covering 150 and the second eyelid covering 160.Metamaterial composite structure 100 is for example with the structure shown in Fig. 1.
First eyelid covering 150, the second eyelid covering 160 are for example made up of glass fibre or epoxy resin as sheathing material.Metamaterial composite structure 100 provides mechanical strength.It is additionally, since metamaterial composite structure 100 to be more easy to penetrate metamaterial composite structure 100 comprising conductive geometry, therefore the electromagnetic wave of large angle incidence.
In a preferred embodiment, in order to protect antenna house that the protective layer of acid-proof, anti-corrosion, wear-resistant etc. can be also coated on the first eyelid covering 150, the outer surface of the second eyelid covering 160.
In this embodiment, antenna house 105 is flat shape.In alternate embodiments, the metamaterial composite structure of antenna house of the invention can be the layer material of the arbitrary shapes such as plane, curved surface, the conical surface, sphere, shaped face, also may include the thin film of softness, different because of application demand.
Fig. 9 illustrates the electromagnetic wave transmission characteristic curve of the antenna house shown in Fig. 8.In the preferred embodiment, the relative dielectric constant of first eyelid covering 150 and the second eyelid covering 160 of the antenna house is respectively 2.85, is lost as 0.005, and thickness is 0.6 millimeter.The relative dielectric constant of cellular board 110 is 1.05, is lost as 0.0045.The outside of the Part I 122 of the square shape of conductive geometry unit is a length of 7 millimeters, and live width is 0.8 millimeter；The length and width of the Part II 122 of box-shaped, thickness are respectively 1.4 millimeters, 1.4 millimeters, 0.018 millimeter, and the Part II 122 of box-shaped is silver.
As shown in Figure 9, simulation result when electromagnetic wave (TE moulds, TM moulds) is irradiated to the antenna house shows that the electromagnetic wave to 12.5GHz-17.5GHz, the electromagnetic transmission coefficient value of the antenna house are close to 1, represent that electromagnetic wave wave transmission rate is very high, play similar solid air effect.The metamaterial composite structure 100 of the present invention not only ensure that high wave transparent in working frequency range, and to working frequency range outside signal serve the effect of filtration, the normal work for antenna provides more excellent environmental protection.
Antenna of the invention is covered with certain mechanical strength and protects antenna therein, and ensure that the high wave transparent in working frequency range, and to working frequency range outside signal serve the effect of filtration, the normal work for antenna provides more excellent environmental protection.
The ins and outs such as patterning in the above description, for each layer, etching are described in detail.It should be appreciated to those skilled in the art that layer, region of required form etc. can be formed by various technological means.In addition, in order to form same structure, those skilled in the art can be devised by and process as described above not fully identical method.Although in addition, each embodiment is respectively described more than, but it is not intended that the measure in each embodiment can not be advantageously combined use.
Above embodiments of the invention are described.But, the purpose that these embodiments are merely to illustrate that, and be not intended to limit the scope of the present invention.The scope of the present invention is limited by claims and its equivalent.Without departing from the scope of the present invention, those skilled in the art can make various alternatives and modifications, and these alternatives and modifications should all fall within the scope of the present invention.
Claims (22)
1. a kind of metamaterial composite structure, including：
Cellular board, the cellular board are made up of dielectric material, and have multiple cellular units, often
Individual cellular unit has multiple honeycomb walls；And
The multiple conductive geometry unit being attached on the plurality of honeycomb wall,
Wherein, the plurality of conductive geometry unit is located at the honeycomb wall of at least two different orientations
On, so as to form the multiple micro structure arrays with different orientation.
2. metamaterial composite structure according to claim 1, wherein, the cellular unit week
Phase arranges, and the cellular unit is uniformly distributed on the cellular board, adjacent cellular unit
With public honeycomb wall.
3. metamaterial composite structure according to claim 2, wherein, the plurality of honeycomb list
The shape of cross section of unit is the shape selected from one of polygon, waveform, zigzag.
4. metamaterial composite structure according to claim 3, wherein, the plurality of honeycomb list
The shape of cross section of unit is the polygon of closing.
5. metamaterial composite structure according to claim 4, wherein, the plurality of honeycomb list
The shape of cross section of unit is regular hexagon.
6. the metamaterial composite structure according to any one of claim 1-5, wherein, each
Individual honeycomb wall arranges at least one conductive geometry unit.
7. metamaterial composite structure according to claim 6, wherein, in each honeycomb wall
Multiple conductive geometry units are set, and the plurality of conductive geometry unit cycle is arranged into battle array
Row.
8. metamaterial composite structure according to claim 1, wherein, the Meta Materials are combined
Structure has relative first surface and a second surface, and the plurality of cellular unit is described
One surface and the second surface are respectively provided with opening.
9. metamaterial composite structure according to claim 8, wherein, the plurality of conduction is several
What construction unit includes first group of conductive geometry unit and/or second group of conductive geometry list
The figure of unit, described first group conductive geometry unit and second group of conductive geometry unit
Case and/or size are different.
10. metamaterial composite structure according to claim 7, wherein, the plurality of conduction
Geometry unit includes the Part I of closed circular and inside the Part I respectively
The Part II of block shape.
11. metamaterial composite structures according to claim 10, wherein, the Part I
For square shape, the Part II is box-shaped.
12. metamaterial composite structures according to claim 11, wherein, the Part I
Outside it is a length of 4.8 to 9.2 millimeters, live width be 0.05 to 1.2 millimeter.
A kind of 13. antenna houses, including：
Metamaterial composite structure according to any one of claim 1 to 12；And
First eyelid covering and the second eyelid covering,
Wherein described metamaterial composite structure is clipped between first eyelid covering and second eyelid covering.
14. antenna houses according to claim 13, wherein, the antenna house be shaped as choosing
From one kind of following shape：Plane, curved surface, the conical surface, sphere, shaped face.
15. antenna houses according to claim 13 or 14, wherein, first eyelid covering and
The surface of second eyelid covering is mutually perpendicular to the surface of the plurality of honeycomb wall.
A kind of 16. methods of manufacture metamaterial composite structure, including：
The first micro structure array is formed respectively in the relative first surface and second surface of medium substrate
With the second micro structure array；And
By medium substrate together with the first micro structure array and the second micro structure array together as cellular board
Component, is assembled into metamaterial composite structure,
Wherein described first micro structure array includes multiple first groups separated by multiple first adhesion zones
Conductive geometry unit, second micro structure array include what is separated by multiple second adhesion zones
Multiple second groups conductive geometry units, and
The number of assembling steps includes：Using viscous at least one the first adhesion zone and the second adhesion zone
Connect layer the adjacent honeycomb board member bonds together.
17. methods according to claim 16, wherein, the first micro structure array of the formation
The step of with second micro structure array, is selected from：Combine, adopt using photosensitive-ink and thermoprint
Photoetching and etching combine, and using electrically conductive ink printing in one.
18. methods according to claim 16, wherein, adopt hot pressing bending medium substrate with
Form honeycomb board member.
19. methods according to claim 18, wherein, it is described bending medium substrate the step of
Including：
For the plurality of first group conductive geometry unit, be folded upward at respectively first group it is conductive
Geometry unit, to form multiple first groups of described first group conductive geometry unit attachment
Honeycomb wall, and
For the plurality of second group conductive geometry unit, bend separately down second group it is conductive
Geometry unit, to form multiple second groups of described second group conductive geometry unit attachment
Honeycomb wall.
20. methods according to claim 19, wherein, described first group conductive geometry
The all conductions being located on a honeycomb wall in unit and second group of conductive geometry unit are several
What construction unit is in approximately the same plane.
21. methods according to claim 20, wherein, in the step of the bending medium substrate
In rapid, bending angle is 120 degree.
22. methods according to claim 16, wherein, the medium substrate is smooth Jie
Matter substrate, the metamaterial composite structure that is assembled into include：
After multiple honeycomb board members are bonded together, all of medium substrate is stretched,
So that adjacent medium substrate is spaced from each other, to form the space of cellular unit.
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| WO2019134599A1 (en) * | 2018-01-08 | 2019-07-11 | 深圳光启尖端技术有限责任公司 | Antenna cover |
| WO2020000978A1 (en) * | 2018-06-26 | 2020-01-02 | 深圳光启尖端技术有限责任公司 | Metamaterial with three-dimensional structure |
| CN112670719A (en) * | 2020-12-15 | 2021-04-16 | 华南理工大学 | Four-dimensional stealth wave-absorbing structure and preparation method thereof |
| CN117341288A (en) * | 2023-11-29 | 2024-01-05 | 嘉兴雅港复合材料有限公司 | Three-dimensional wave-absorbing frequency selecting material and manufacturing method thereof |
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