CN106547330A - A kind of CPU heat dissipating methods - Google Patents
A kind of CPU heat dissipating methods Download PDFInfo
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- CN106547330A CN106547330A CN201710021629.8A CN201710021629A CN106547330A CN 106547330 A CN106547330 A CN 106547330A CN 201710021629 A CN201710021629 A CN 201710021629A CN 106547330 A CN106547330 A CN 106547330A
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- cpu
- powder
- heat dissipating
- heat
- dissipating methods
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention belongs to central processor radiating technical field, and in particular to a kind of CPU heat dissipating methods.The present invention is the metal powder layer in the uniform coating thickness in CPU surfaces between 1 100 microns, is sintered using laser scanning, and CPU surfaces are all metallized, by the CPU of surface metalation at 200 300 DEG C, integral with fin soldering, forms CPU cooling systems.The inventive method instead of heat-conducting silicone grease glue bonding using the mode of Welding, chemistry is changed into by physical mechanical connection between material bonded, metallurgical connection, heat are transmitted to brazing metal by CPU and are transmitted to the heat dispersion that fin can greatly improve CPU again.
Description
Technical field
The invention belongs to central processor radiating technical field, and in particular to a kind of CPU heat dissipating methods.
Background technology
The PC and its server for having witnessed modern electronics industry in past 30 years make rapid progress.Meanwhile, by
The development of super high performance CPU is hindered seriously in the heat dissipation problem of increased hot fluid.Traditional cooling technology, such as wind
Cold, water-cooled and heat pipe still play main role in CPU field of radiating.But its radiating effect can not increasingly meet big work(
The radiating requirements of rate cpu chip.
It is well known that current cooling system is mainly made up of CPU, heat-conducting silicone grease, fin and fan, heat transfer according to
It is secondary by CPU-heat-conducting silicone grease-fin.Thermal conductivity factor is to weigh a kind of physical quantity of material conducts heat effect, wherein CPU（Monocrystalline
Silicon）, heat-conducting silicone grease and fin（Copper）Thermal conductivity factor be respectively：150 W/ (mK), 0.6-3 W/ (mK) and 300-
400 W/ (mK), although the thermal conductivity factor of monocrystalline silicon and fin is good, but due to centre it is very poor containing one layer of thermal conductivity
Heat-conducting silicone grease so that the thermal conductivity factor of whole cooling system is reduced to the level of heat-conducting silicone grease, i.e. 0.6-3 W/ (mK), heat conduction
Silicone grease becomes the radiating bottleneck of whole system.Therefore need to develop a kind of new technology to solve this problem.
The content of the invention
For the problem that prior art is present, the present invention provides a kind of CPU heat dissipating methods, it is therefore an objective to by CPU surfaces
Inexpensive fast laser scanning metallization is carried out, the CPU surfaces after metallization carry out soldering with radiator, improve CPU radiatings
The heat dispersion of system.
Realize that the technical scheme of the object of the invention is followed the steps below：
（1）According to the surface size of pending CPU, the metallization pattern of corresponding size is drawn out in graphics editing software；
（2）On CPU surfaces, metal powder layer of the uniform coating thickness between 1-100 microns, is dried place in being put into baking oven
Reason；
（3）The CPU of coating metal powder layer is placed on laser work platform after drying, is entered according to drawn metallization pattern
Row laser scanning is sintered, and CPU surfaces are all metallized；
（4）It is by the CPU of surface metalation at 200-300 DEG C, integral with fin soldering, form CPU cooling systems.
Wherein, described metal dust is copper powder, molybdenum powder, silver powder, tungsten powder, chromium powder or titanium valve, and powder size is in 0.3-10 μ
Between m.
The laser that described laser scanning sintering is adopted is for CO2Laser, wavelength are 10.6 μm.
Compared with prior art, the characteristics of of the invention and beneficial effect are：
（1）CPU elements are silicon cells, are transmitted to heat-conducting silicone grease again to fin phase by CPU with heat in traditional heat dissipating method
Than the inventive method instead of heat-conducting silicone grease glue bonding using the mode of Welding, be connected by physical mechanical between material
Change into chemistry bonded, metallurgical connection, heat are transmitted to brazing metal by CPU and are transmitted to fin again and can greatly improve
The heat dispersion of CPU；
（2）Laser scanning sintering, the i.e. mode of local heating are used to carrying out surface metalation in invention to CPU, therefore
CPU elements entirety other parts are in normal temperature state, do not affect to destroy the function of other parts, and conventional metallization mode,
CPU elements are put in heating furnace and are heated so that CPU elements generally in same high temperature, if element other parts
Non-refractory, its function will be lost.Obviously, CPU is heated to 1000 DEG C or so in can not possibly being put into heating furnace, and CPU will be unable to make
With.
Specific embodiment
With reference to specific embodiment, the present invention will be further described.
Embodiment 1
The CPU heat dissipating methods of the present embodiment, follow the steps below：
（1）The size of pending CPU is 50*50*1mm, and thermal conductivity 150W/ms is drawn out in Coredraw softwares corresponding
The metallization pattern of size；
（2）On CPU surfaces, the aluminium powder last layer of 50 microns of uniform coating thickness, is dried process in being put into baking oven；
（3）The CPU of coated with aluminum powder bed is placed on laser work platform after drying, is carried out according to drawn metallization pattern
Laser scanning is sintered, and sweep speed is 80mm/s, and CPU surfaces are all metallized；
（4）The CPU of surface metalation is carried out into Reflow Soldering at 260 DEG C, it is integral with copper radiating rib soldering, form CPU radiatings
System.
Using the heat dissipating method of the present embodiment, the thermal conductivity factor of whole CPU cooling systems is 150 W/ (mK).
Embodiment 2
The CPU heat dissipating methods of the present embodiment, follow the steps below：
（1）The size of pending CPU is 50*50*1mm, and thermal conductivity 150W/ms is drawn out in Coredraw softwares corresponding
The metallization pattern of size；
（2）On CPU surfaces, the tungsten powder last layer of 80 microns of uniform coating thickness, is dried process in being put into baking oven；
（3）The CPU of coated with tungsten powder bed is placed on laser work platform after drying, is carried out according to drawn metallization pattern
Laser scanning is sintered, and sweep speed is 80mm/s, and CPU surfaces are all metallized；
（4）The CPU of surface metalation is carried out into Reflow Soldering at 280 DEG C, it is integral with copper radiating rib soldering, form CPU radiatings
System.
Using the heat dissipating method of the present embodiment, the thermal conductivity factor of whole CPU cooling systems is 160 W/ (mK).
Embodiment 3
The CPU heat dissipating methods of the present embodiment, follow the steps below：
（1）The size of pending CPU is 50*50*1mm, and thermal conductivity 150W/ms is drawn out in Coredraw softwares corresponding
The metallization pattern of size；
（2）On CPU surfaces, the molybdenum powder last layer of 10 microns of uniform coating thickness, is dried process in being put into baking oven；
（3）The CPU of coating molybdenum powder last layer is placed on laser work platform after drying, is carried out according to drawn metallization pattern
Laser scanning is sintered, and sweep speed is 80mm/s, and CPU surfaces are all metallized；
（4）The CPU of surface metalation is carried out into Reflow Soldering at 270 DEG C, it is integral with copper radiating rib soldering, form CPU radiatings
System.
Using the heat dissipating method of the present embodiment, the thermal conductivity factor of whole CPU cooling systems is 148 W/ (mK).
Embodiment 4
The CPU heat dissipating methods of the present embodiment, follow the steps below：
（1）The size of pending CPU is 50*50*1mm, and thermal conductivity 150W/ms is drawn out in Coredraw softwares corresponding
The metallization pattern of size；
（2）On CPU surfaces, the copper powder last layer of 1 micron of uniform coating thickness, is dried process in being put into baking oven；
（3）The CPU of coated copper powder bed is placed on laser work platform after drying, is carried out according to drawn metallization pattern
Laser scanning is sintered, and sweep speed is 80mm/s, and CPU surfaces are all metallized；
（4）The CPU of surface metalation is carried out into Reflow Soldering at 300 DEG C, it is integral with copper radiating rib soldering, form CPU radiatings
System.
Using the heat dissipating method of the present embodiment, the thermal conductivity factor of whole CPU cooling systems is 150 W/ (mK).
Claims (3)
1. a kind of CPU heat dissipating methods, it is characterised in that follow the steps below：
（1）According to the surface size of pending CPU, the metallization pattern of corresponding size is drawn out in graphics editing software；
（2）On CPU surfaces, metal powder layer of the uniform coating thickness between 1-100 microns, is dried place in being put into baking oven
Reason；
（3）The CPU of coating metal powder layer is placed on laser work platform after drying, is entered according to drawn metallization pattern
Row laser scanning is sintered, and CPU surfaces are all metallized；
（4）It is by the CPU of surface metalation at 200-300 DEG C, integral with fin soldering, form CPU cooling systems.
2. a kind of CPU heat dissipating methods according to claim 1, it is characterised in that described metal dust be copper powder, molybdenum powder,
Silver powder, tungsten powder, chromium powder or titanium valve, powder size is between 0.3-10 μm.
3. a kind of CPU heat dissipating methods according to claim 1, it is characterised in that what described laser scanning sintering was adopted swashs
Light is CO2Laser, wavelength are 10.6 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710021629.8A CN106547330A (en) | 2017-01-12 | 2017-01-12 | A kind of CPU heat dissipating methods |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710021629.8A CN106547330A (en) | 2017-01-12 | 2017-01-12 | A kind of CPU heat dissipating methods |
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| Publication Number | Publication Date |
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| CN106547330A true CN106547330A (en) | 2017-03-29 |
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| CN201710021629.8A Pending CN106547330A (en) | 2017-01-12 | 2017-01-12 | A kind of CPU heat dissipating methods |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114237368A (en) * | 2021-12-13 | 2022-03-25 | 大连大学 | Heat radiation method for central processing unit |
-
2017
- 2017-01-12 CN CN201710021629.8A patent/CN106547330A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114237368A (en) * | 2021-12-13 | 2022-03-25 | 大连大学 | Heat radiation method for central processing unit |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170329 |
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| WD01 | Invention patent application deemed withdrawn after publication |